CN106455459A - Microwave modular structure - Google Patents
Microwave modular structure Download PDFInfo
- Publication number
- CN106455459A CN106455459A CN201611183741.3A CN201611183741A CN106455459A CN 106455459 A CN106455459 A CN 106455459A CN 201611183741 A CN201611183741 A CN 201611183741A CN 106455459 A CN106455459 A CN 106455459A
- Authority
- CN
- China
- Prior art keywords
- boss
- microwave module
- microwave
- conduction
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a microwave modular structure. A connector is welded inside a microwave module, sealing glue is poured in a position where the connector is welded with the microwave module, the microwave module is mounted on a cold plate, a boss is arranged on a wall, which is fixed with the cold plate, of the microwave module, the surface of the boss is subjected to electroplating treatment, and the surface, except the boss, of the wall is sprayed with paint. By the structural design of the boss of a heat-conduction surface and a surface treating process, the adhesive force of a coating layer of the surface of a connecting face can be enhanced effectively while heat-conduction and electric-conduction properties of the heat-conduction surface are guaranteed and the heat-conduction surface is isolated from other surfaces, and peeling, bubbling or dropping of the coating layer are avoided.
Description
Technical field
The present invention relates to microwave module structure-design technique field, particularly to a kind of microwave module structure.
Background technology
Microwave module structure design is the key that " three prevent " design, good " three prevent " design be electronic product reliably and with long-term
The key of steady operation.High-power high density microwave module, on the basis of satisfaction electricity, the performance requirement such as heat, structure, also will be expired
The requirement of foot welding, airtight, technique such as " three prevent " or reliability aspect, and radiate, weld, airtight, " three is anti-" etc. to structural member
The requirement of surface treatment is not quite similar, therefore, appropriate design microwave module version, simplify process of surface treatment or operation,
It is allowed to meet the requirement of environmental test, be the importance of microwave module design.
Content of the invention
For overcoming at least one defect of above-mentioned prior art presence, the invention provides a kind of microwave module structure, micro-
Be welded with adapter in ripple module, adapter has fluid sealant with the weld embedding of microwave module, by fluid sealant prevent scolding tin with
The corrosion that atmospheric environment contact leads to, microwave module is arranged on cold drawing, and the wall fixing with cold drawing phase of microwave module sets
There is boss, boss surface carries out electroplating processes, it would however also be possible to employ electric conductive oxidation or plating apply the good coating of heat conductivity, for increasing
Plus heat conductivity, the surface beyond the boss of described wall carries out spray painting process, is used for preventing from corroding.
A kind of microwave module structure that the present invention provides, is designed and process of surface treatment by thermal conductive surface boss structure,
Ensure thermal conductive surface thermal and electric conductivity properties, realize thermal conductive surface with while other surface isolation, can effectively strengthen interface surface
The adhesive force of coat, it is to avoid coat peeling, bubble or come off.
Brief description
Fig. 1 is microwave mode block structured schematic diagram.
Reference：Microwave module 1, adapter 2, fluid sealant 3, boss 4.
Specific embodiment
For making purpose, technical scheme and advantage that the present invention is implemented clearer, below in conjunction with the embodiment of the present invention
Accompanying drawing, the technical scheme in the embodiment of the present invention is further described in more detail.In the accompanying drawings, identical from start to finish or class
As the label element that represents same or similar element or there is same or like function.Described embodiment is the present invention
A part of embodiment, rather than whole embodiments.Embodiment below with reference to Description of Drawings is exemplary it is intended to use
In the explanation present invention, and it is not considered as limiting the invention.Based on the embodiment in the present invention, ordinary skill people
The every other embodiment that member is obtained under the premise of not making creative work, broadly falls into the scope of protection of the invention.
In describing the invention it is to be understood that term " " center ", " longitudinal ", " horizontal ", "front", "rear",
The orientation of instruction such as "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outward " or position relationship are based on accompanying drawing institute
The orientation showing or position relationship, are all for only for ease of and describe the present invention and simplify description, rather than indicate or imply indication
Device or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that protecting to the present invention
The restriction of shield scope.
Below by specific embodiment, the present invention is described in further detail.
Specific embodiment：
As shown in figure 1, the invention provides a kind of microwave module structure, being welded with adapter 2, adapter 2 in microwave module 1
Weld embedding with microwave module 1 has fluid sealant 3, prevents scolding tin from contacting, with atmospheric environment, the corrosion leading to by fluid sealant 3,
Microwave module 1 is arranged on cold drawing, and the wall fixing with cold drawing phase of microwave module 1 is provided with boss 4, and boss 4 surface is carried out
Electroplating processes, for increasing heat conductivity, the surface beyond the boss 4 of described wall carries out spray painting process, is used for preventing from corroding.
The above, the only specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, and any
Those familiar with the art the invention discloses technical scope in, the change or replacement that can readily occur in, all answer
It is included within the scope of the present invention.Therefore, protection scope of the present invention with described scope of the claims should be
Accurate.
Claims (1)
1. a kind of microwave module structure is it is characterised in that be welded with adapter (2), adapter (2) and microwave in microwave module (1)
The weld embedding of module (1) has fluid sealant (3), and microwave module (1) is arranged on cold drawing, microwave module (1) with cold drawing phase
Fixing wall is provided with boss (4), and boss (4) surface carries out electroplating processes, and the surface beyond the boss (4) of described wall is entered
Row spray painting is processed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611183741.3A CN106455459A (en) | 2016-12-20 | 2016-12-20 | Microwave modular structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611183741.3A CN106455459A (en) | 2016-12-20 | 2016-12-20 | Microwave modular structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106455459A true CN106455459A (en) | 2017-02-22 |
Family
ID=58215052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611183741.3A Pending CN106455459A (en) | 2016-12-20 | 2016-12-20 | Microwave modular structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106455459A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101378636A (en) * | 2008-10-13 | 2009-03-04 | 北京新雷能有限责任公司 | Technique processing method for plating nickel on the inner and spraying paint on the outer of metal case |
| CN103824781A (en) * | 2013-12-10 | 2014-05-28 | 中国电子科技集团公司第四十一研究所 | Thermal expansion coefficient adaptation microwave and millimeter wave module integrated structure preparation method |
| CN204206174U (en) * | 2014-11-26 | 2015-03-11 | 北京无线电测量研究所 | A kind of integrated box body of T/R module and the assembly apparatus of T/R module |
-
2016
- 2016-12-20 CN CN201611183741.3A patent/CN106455459A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101378636A (en) * | 2008-10-13 | 2009-03-04 | 北京新雷能有限责任公司 | Technique processing method for plating nickel on the inner and spraying paint on the outer of metal case |
| CN103824781A (en) * | 2013-12-10 | 2014-05-28 | 中国电子科技集团公司第四十一研究所 | Thermal expansion coefficient adaptation microwave and millimeter wave module integrated structure preparation method |
| CN204206174U (en) * | 2014-11-26 | 2015-03-11 | 北京无线电测量研究所 | A kind of integrated box body of T/R module and the assembly apparatus of T/R module |
Non-Patent Citations (1)
| Title |
|---|
| 吴强: "《某舰载微波组件结构中的"三防"设计》", 《仪器仪表学报》 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105224926A (en) | Fingerprint recognition module installation method and fingerprint recognition module mounting structure | |
| CN106448473B (en) | Display panel motherboard and display panel preparation method | |
| CN105283013B (en) | The surface treatment method of terminal shell | |
| CN105247737A (en) | Conducting member | |
| CN114914592A (en) | Insulating spraying battery case | |
| CN205378366U (en) | Be used as insulation board of baffle when pressfitting circuit board | |
| CN105900181B (en) | System for making high current busbar insulate | |
| CN106455459A (en) | Microwave modular structure | |
| CN202103988U (en) | Magnesium alloy communication device | |
| CN1937902B (en) | Cooling structure of heating element | |
| CN203610261U (en) | Supersonic atomizing energy conversion sheet | |
| US20120097322A1 (en) | Method for cladding component with self-supporting cladding closed by cold spraying | |
| CN211792231U (en) | Circuit board with good corrosion prevention effect | |
| CN106785244A (en) | A kind of microwave connector attachment structure | |
| CN209659699U (en) | A kind of plasma welding torch | |
| CN205248038U (en) | Heat -proof transformer case anticorrosives | |
| CN203547338U (en) | Corrosion-resistant refrigerator door hinge | |
| CN211047440U (en) | Circuit board with waterproof protection structure | |
| CN216087099U (en) | Precision electronic engineering is with circuit board that corrosion resisting property is good | |
| CN215183984U (en) | High-temperature-resistant diode with good effect | |
| CN206042615U (en) | Printed circuit board mounting and electronic equipment | |
| CN207052938U (en) | Electric discharge device | |
| CN213126606U (en) | Circuit board with long service life | |
| CN106336796A (en) | Solar panel dustproof coating with heat resistant and anti-corrosion property | |
| CN210272257U (en) | Protection structure for producing heat dissipation plate and cover plate in integrated circuit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170222 |