CN106454032A - Camera lens installation process - Google Patents
Camera lens installation process Download PDFInfo
- Publication number
- CN106454032A CN106454032A CN201610902511.1A CN201610902511A CN106454032A CN 106454032 A CN106454032 A CN 106454032A CN 201610902511 A CN201610902511 A CN 201610902511A CN 106454032 A CN106454032 A CN 106454032A
- Authority
- CN
- China
- Prior art keywords
- camera lens
- camera
- chip
- carried out
- lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Packaging Frangible Articles (AREA)
- Structure And Mechanism Of Cameras (AREA)
Abstract
The present invention provides a camera lens installation process. A camera lens is installed by screening, cleaning, fixing, baking, and fixing for the second time. The camera lens is installed more firmly. Substandard products are screened out through anti-vibration detection, so that the service life of the camera lens is prolonged. The camera lens is fixed for the second time, so that the camera lens that is not well fixed in the first time is firmly fixed.
Description
Technical field
The present invention relates to photographic head manufactures field, more particularly to a kind of cam lens mounting process.
Background technology
At present when manufacturing photographic head, need to install camera lens on camera chip, to ensure that photographic head can shoot prison
The picture controlled, and installing for the chip on photographic head at present, is typically manually installed, and using being dried after gluing
Roasting fixation, but due to artificial misoperation, lead to camera lens to be installed not firm, and then affect the service life of photographic head,
Easily cause camera lens during work to come off.Therefore, solving the problems, such as that cam lens installation is insecure leads to service life just to reduce
It is particularly important.
Content of the invention
It is an object of the invention to provide a kind of cam lens mounting process, by carrying out to the camera lens of photographic head screening,
The processing steps such as cleaning, fixation, baking, secondary fixation, install to camera lens, improve the firmness installed, and pass through
Anti-seismic detection, investigates defective products, solves the problems, such as that cam lens installation is insecure and leads to service life to reduce.
The present invention provides a kind of cam lens mounting process, and described mounting process step is as follows：
Step one：Preliminary detection is carried out to the camera lens of outsourcing, detects its outward appearance, shape and light transmission；
Step 2：It is carried out detecting that qualified camera lens is sent in ultrasonic washing unit；
Step 3：Camera lens after cleaning is air-dried；
Step 4：Removing surface is carried out to camera chip；
Step 5：By chip mounter, camera lens is mounted on camera chip, and gluing connection is carried out to camera lens；
Step 6：The chip posting camera lens is toasted；
Step 7：Secondary fixation is carried out to the camera lens on camera chip, to ensure that camera lens will not fall off；
Step 8：Shockproof test is carried out to camera chip, to detect that the element on camera chip firmly installs；
Step 9：Camera chip is carried out with packaging after light inspection.
Further improvement is that：Baking temperature when chip being toasted in described step 6 is 75 ± 5 DEG C, during baking
Between be 18 ~ 25 minutes.
Further improvement is that：In described step 7, secondary fixation is carried out to camera lens, rapid-curing cutback fixing glue is used as fixation
Medium.
Further improvement is that：The vibrations time of shockproof test in described step 8 is 1 ~ 3 minute.
Beneficial effects of the present invention：By carrying out to the camera lens of photographic head screening, cleaning, fix, toasting, secondary fixation etc.
Processing step, installs to camera lens, improves the firmness installed, and passes through anti-seismic detection, investigates defective products, and prolongation sets
Standby service life, and due to secondary fixation, it is to avoid the fixation occurring in once fixing is bad.
Specific embodiment
In order to deepen the understanding of the present invention, below in conjunction with embodiment, the invention will be further described, this embodiment
It is only used for explaining the present invention, do not constitute limiting the scope of the present invention.
Present embodiments provide a kind of cam lens mounting process, described mounting process step is as follows：
Step one：Preliminary detection is carried out to the camera lens of outsourcing, detects its outward appearance, shape and light transmission；
Step 2：It is carried out detecting that qualified camera lens is sent in ultrasonic washing unit；
Step 3：Camera lens after cleaning is air-dried；
Step 4：Removing surface is carried out to camera chip；
Step 5：By chip mounter, camera lens is mounted on camera chip, and gluing connection is carried out to camera lens；
Step 6：The chip posting camera lens is toasted；
Step 7：Secondary fixation is carried out to the camera lens on camera chip, to ensure that camera lens will not fall off；
Step 8：Shockproof test is carried out to camera chip, to detect that the element on camera chip firmly installs；
Step 9：Camera chip is carried out with packaging after light inspection.
Baking temperature when chip being toasted in described step 6 is 77 DEG C, and baking time is 21 minutes.Described step
In rapid seven, secondary fixation is carried out to camera lens, rapid-curing cutback fixing glue is used as mounting medium.The shake of shockproof test in described step 8
The dynamic time is 2 minutes.By carrying out to the camera lens of photographic head screening, cleaning, fix, toasting, the processing step such as secondary fixation, right
Camera lens is installed, and improves the firmness installed, and passes through anti-seismic detection, investigates defective products, the use longevity of extension device
Life, and due to secondary fixation, it is to avoid the fixation occurring in once fixing is bad.
Claims (4)
1. a kind of cam lens mounting process it is characterised in that：Described mounting process step is as follows：
Step one：Preliminary detection is carried out to the camera lens of outsourcing, detects its outward appearance, shape and light transmission；
Step 2：It is carried out detecting that qualified camera lens is sent in ultrasonic washing unit；
Step 3：Camera lens after cleaning is air-dried；
Step 4：Removing surface is carried out to camera chip；
Step 5：By chip mounter, camera lens is mounted on camera chip, and gluing connection is carried out to camera lens；
Step 6：The chip posting camera lens is toasted；
Step 7：Secondary fixation is carried out to the camera lens on camera chip, to ensure that camera lens will not fall off；
Step 8：Shockproof test is carried out to camera chip, to detect that the element on camera chip firmly installs；
Step 9：Camera chip is carried out with packaging after light inspection.
2. as claimed in claim 1 a kind of cam lens mounting process it is characterised in that：In described step 6, chip is entered
Baking temperature during row baking is 75 ± 5 DEG C, and baking time is 18 ~ 25 minutes.
3. as claimed in claim 1 a kind of cam lens mounting process it is characterised in that：In described step 7, camera lens is entered
The secondary fixation of row, is used rapid-curing cutback fixing glue as mounting medium.
4. as claimed in claim 1 a kind of cam lens mounting process it is characterised in that：Shockproof test in described step 8
The vibrations time be 1 ~ 3 minute.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610902511.1A CN106454032A (en) | 2016-10-17 | 2016-10-17 | Camera lens installation process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610902511.1A CN106454032A (en) | 2016-10-17 | 2016-10-17 | Camera lens installation process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106454032A true CN106454032A (en) | 2017-02-22 |
Family
ID=58175139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610902511.1A Pending CN106454032A (en) | 2016-10-17 | 2016-10-17 | Camera lens installation process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106454032A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112571012A (en) * | 2020-12-15 | 2021-03-30 | 宁波爱基因科技有限公司 | Assembly process of light path module and special drying equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101017321A (en) * | 2006-02-10 | 2007-08-15 | 鸿富锦精密工业（深圳）有限公司 | Portable electronic installation having pickup camera |
| CN101393922A (en) * | 2008-10-30 | 2009-03-25 | 旭丽电子(广州)有限公司 | Lens module and manufacturing process thereof |
| CN101675658A (en) * | 2007-09-27 | 2010-03-17 | Lg伊诺特有限公司 | camera module |
| US20160021282A1 (en) * | 2014-07-16 | 2016-01-21 | Larview Technologies Corp. | Image capturing module having a built-in dustproof structure |
| CN105763781A (en) * | 2016-04-12 | 2016-07-13 | 深圳市赋兴光电有限公司 | Camera production method |
-
2016
- 2016-10-17 CN CN201610902511.1A patent/CN106454032A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101017321A (en) * | 2006-02-10 | 2007-08-15 | 鸿富锦精密工业（深圳）有限公司 | Portable electronic installation having pickup camera |
| CN101675658A (en) * | 2007-09-27 | 2010-03-17 | Lg伊诺特有限公司 | camera module |
| CN101393922A (en) * | 2008-10-30 | 2009-03-25 | 旭丽电子(广州)有限公司 | Lens module and manufacturing process thereof |
| US20160021282A1 (en) * | 2014-07-16 | 2016-01-21 | Larview Technologies Corp. | Image capturing module having a built-in dustproof structure |
| CN105763781A (en) * | 2016-04-12 | 2016-07-13 | 深圳市赋兴光电有限公司 | Camera production method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112571012A (en) * | 2020-12-15 | 2021-03-30 | 宁波爱基因科技有限公司 | Assembly process of light path module and special drying equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101883483B1 (en) | System for diagnosiing and estimating facilities disorder of surface mount technology and thereof method | |
| CN106454032A (en) | Camera lens installation process | |
| CN112052745B (en) | Visual test method and system for judging whether watch time-travelling precision is qualified or not | |
| CN104181456A (en) | Method for testing printed circuit board | |
| CN109127527A (en) | A kind of eccentric cleaning technique of eyeglass | |
| CN102305595A (en) | Method for automatically detecting spring pitch by using mechanical vision system | |
| CN105589789A (en) | Method for dynamically adjusting memory monitoring threshold value | |
| CN109870463A (en) | A kind of electronic chip fault detection means | |
| JP6229323B2 (en) | Surface inspection method, surface inspection apparatus, and surface inspection program | |
| TWI670686B (en) | Image capture system and capture process adjusting method thereof | |
| TW201237491A (en) | Camera module and method for assemblying the same | |
| CN207300546U (en) | A kind of light source filtration apparatus of the bright test of LED COB microdots | |
| CN205226959U (en) | Linear light structures of annular | |
| CN108406297A (en) | The positioning system and localization method of multi-cam assembling | |
| CN104954784B (en) | Method for carrying out pressure testing on system reliability of STB (Set Top Box) | |
| CN104656036A (en) | Method for detecting design defects of driving power supplies | |
| CN103831256A (en) | Non-normal temperature test module | |
| US10386404B2 (en) | Device and method for detecting damage of electric product using digital signal | |
| CN105301403B (en) | A kind of timer burn-in test monitoring device | |
| KR101362677B1 (en) | Apparatus for aligning a semiconductor wafer using image of flat zone and method thereof | |
| CN106596578A (en) | Detection method of shooting lens | |
| CN107917913A (en) | A kind of detection method of MWT photovoltaic modulies conduction core plate | |
| US10294037B1 (en) | Carrier monitoring system and method thereof | |
| CN106908749A (en) | The method of testing of batch analog voltage abnormality is serviced based on IPMI | |
| KR101713783B1 (en) | Method of detecting deposition status of device and system thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170222 |
|
| RJ01 | Rejection of invention patent application after publication |