CN106449568A - 三极管和散热片的二合一料件组装结构 - Google Patents
三极管和散热片的二合一料件组装结构 Download PDFInfo
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- CN106449568A CN106449568A CN201610860624.XA CN201610860624A CN106449568A CN 106449568 A CN106449568 A CN 106449568A CN 201610860624 A CN201610860624 A CN 201610860624A CN 106449568 A CN106449568 A CN 106449568A
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- 239000000463 material Substances 0.000 title claims abstract description 18
- 238000001816 cooling Methods 0.000 title abstract 9
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000000047 product Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 10
- BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical compound N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 description 8
- 238000012536 packaging technology Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
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- 238000003032 molecular docking Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000012827 research and development Methods 0.000 description 2
- 230000000739 chaotic effect Effects 0.000 description 1
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- 239000007787 solid Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201610860624.XA CN106449568B (zh) | 2016-09-28 | 2016-09-28 | 三极管和散热片的二合一料件组装结构 |
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CN201610860624.XA CN106449568B (zh) | 2016-09-28 | 2016-09-28 | 三极管和散热片的二合一料件组装结构 |
Publications (2)
Publication Number | Publication Date |
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CN106449568A true CN106449568A (zh) | 2017-02-22 |
CN106449568B CN106449568B (zh) | 2019-07-05 |
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CN201610860624.XA Active CN106449568B (zh) | 2016-09-28 | 2016-09-28 | 三极管和散热片的二合一料件组装结构 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110280695A (zh) * | 2019-06-26 | 2019-09-27 | 常熟理工学院 | 一种用于裁剪ic引脚的锁定机构 |
CN110280694A (zh) * | 2019-06-26 | 2019-09-27 | 常熟理工学院 | 一种ic引脚裁剪装置 |
CN111010862A (zh) * | 2019-12-09 | 2020-04-14 | 苏州汇川联合动力系统有限公司 | Igbt模块生产辅助工装及igbt模块生产工艺 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100019372A1 (en) * | 2008-07-23 | 2010-01-28 | Samsung Electronics Co., Ltd. | Semiconductor device package and method of fabricating the same |
CN202487561U (zh) * | 2011-12-07 | 2012-10-10 | 深圳市中兴昆腾有限公司 | 倒扣式晶体管安装固定机构 |
CN203301385U (zh) * | 2013-06-07 | 2013-11-20 | 深圳市东圣源电子技术有限公司 | 一种工业电源 |
CN104392977A (zh) * | 2014-10-16 | 2015-03-04 | 东莞市柏尔电子科技有限公司 | 一种封装三极管 |
-
2016
- 2016-09-28 CN CN201610860624.XA patent/CN106449568B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100019372A1 (en) * | 2008-07-23 | 2010-01-28 | Samsung Electronics Co., Ltd. | Semiconductor device package and method of fabricating the same |
CN202487561U (zh) * | 2011-12-07 | 2012-10-10 | 深圳市中兴昆腾有限公司 | 倒扣式晶体管安装固定机构 |
CN203301385U (zh) * | 2013-06-07 | 2013-11-20 | 深圳市东圣源电子技术有限公司 | 一种工业电源 |
CN104392977A (zh) * | 2014-10-16 | 2015-03-04 | 东莞市柏尔电子科技有限公司 | 一种封装三极管 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110280695A (zh) * | 2019-06-26 | 2019-09-27 | 常熟理工学院 | 一种用于裁剪ic引脚的锁定机构 |
CN110280694A (zh) * | 2019-06-26 | 2019-09-27 | 常熟理工学院 | 一种ic引脚裁剪装置 |
CN110280694B (zh) * | 2019-06-26 | 2020-09-01 | 常熟理工学院 | 一种ic引脚裁剪装置 |
CN111010862A (zh) * | 2019-12-09 | 2020-04-14 | 苏州汇川联合动力系统有限公司 | Igbt模块生产辅助工装及igbt模块生产工艺 |
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Publication number | Publication date |
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CN106449568B (zh) | 2019-07-05 |
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Effective date of registration: 20201201 Address after: Room 10242, No. 260, Jiangshu Road, Xixing street, Binjiang District, Hangzhou City, Zhejiang Province Patentee after: Hangzhou Jiji Intellectual Property Operation Co.,Ltd. Address before: 201616 Shanghai city Songjiang District Sixian Road No. 3666 Patentee before: Phicomm (Shanghai) Co.,Ltd. |
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Effective date of registration: 20201225 Address after: 233000 3rd floor, Dong'an Market, Fengyang West Road, Longzihu District, Bengbu City, Anhui Province Patentee after: Bengbu 309 Technology Consulting Co.,Ltd. Address before: Room 10242, No. 260, Jiangshu Road, Xixing street, Binjiang District, Hangzhou City, Zhejiang Province Patentee before: Hangzhou Jiji Intellectual Property Operation Co.,Ltd. |
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Effective date of registration: 20210202 Address after: 313001 room 1019, Xintiandi office building, Yishan street, Wuxing District, Huzhou, Zhejiang, China Patentee after: Huzhou YingLie Intellectual Property Operation Co.,Ltd. Address before: 233000 3rd floor, Dong'an Market, Fengyang West Road, Longzihu District, Bengbu City, Anhui Province Patentee before: Bengbu 309 Technology Consulting Co.,Ltd. |
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Effective date of registration: 20240229 Address after: 518100 Factory Building No.2, No. 349 Pinglong East Road, Lichang Community, Pinghu Street, Longgang District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN DIANTONG WINTRONIC MICROELECTRONICS Co.,Ltd. Country or region after: China Address before: 313001 room 1019, Xintiandi office building, Yishan street, Wuxing District, Huzhou, Zhejiang, China Patentee before: Huzhou YingLie Intellectual Property Operation Co.,Ltd. Country or region before: China |