CN106449474A - 晶圆片边缘清洗处理装置 - Google Patents

晶圆片边缘清洗处理装置 Download PDF

Info

Publication number
CN106449474A
CN106449474A CN201610867025.0A CN201610867025A CN106449474A CN 106449474 A CN106449474 A CN 106449474A CN 201610867025 A CN201610867025 A CN 201610867025A CN 106449474 A CN106449474 A CN 106449474A
Authority
CN
China
Prior art keywords
storage passage
liquid storage
chamber
wafer
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201610867025.0A
Other languages
English (en)
Inventor
吕耀安
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WUXI HI-NANO TECHNOLOGY Co Ltd
Original Assignee
WUXI HI-NANO TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WUXI HI-NANO TECHNOLOGY Co Ltd filed Critical WUXI HI-NANO TECHNOLOGY Co Ltd
Priority to CN201610867025.0A priority Critical patent/CN106449474A/zh
Publication of CN106449474A publication Critical patent/CN106449474A/zh
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

本发明涉及一种晶圆片边缘清洗处理装置，包括箱体，箱体中具有弧形状的储液通道及分别位于储液通道上、下方的清洗腔及废液腔，所述储液通道的内弧侧设有多个与所述清洗腔连通的出液孔，清洗腔中具有与储液通道弯曲方向一致的导向槽，所述储液通道与废液腔之间连通并设置有阀门。本发明专用于晶圆片边缘的清洗处理，采用将晶圆片置入弧形导向槽中，来回滚动的清洗方式，对其便于进行清洗，其操作极为简单，使用方便。

Description

晶圆片边缘清洗处理装置
技术领域
本发明涉及集成电路生产设备领域，特别涉及晶圆片的处理设备。
背景技术
利用传统的清洗设备可以较为便利的清洗晶圆正面和背面的污染，但是晶圆边缘尤其是倒角区的污染常常被忽略或者去除难度较大。
发明内容
针对现有技术存在的上述问题，申请人进行研究及设计，提供一种晶圆片边缘清洗处理装置，专用于晶圆片边缘的清洗处理,其结构合理、使用方便、成本低。
为了解决上述问题，本发明采用如下方案：
一种晶圆片边缘清洗处理装置，包括箱体，箱体中具有弧形状的储液通道及分别位于储液通道上、下方的清洗腔及废液腔，所述储液通道的内弧侧设有多个与所述清洗腔连通的出液孔，清洗腔中具有与储液通道弯曲方向一致的导向槽，所述储液通道与废液腔之间连通并设置有阀门。
本发明的技术效果在于：
本发明专用于晶圆片边缘的清洗处理，采用将晶圆片置入弧形导向槽中，来回滚动的清洗方式，对其便于进行清洗，其操作极为简单，使用方便。
附图说明
图1为本发明的结构示意图。
图中：1、箱体；2、储液通道；3、清洗腔；4、废液腔；5、导向槽；6、晶圆片。
具体实施方式
下面结合附图对本发明的具体实施方式作进一步说明。
如图1所示，本实施例的晶圆片边缘清洗处理装置，包括箱体1，箱体1中具有弧形状的储液通道2及分别位于储液通道2上、下方的清洗腔3及废液腔4，储液通道2的内弧侧设有多个与清洗腔3连通的出液孔，清洗腔3中具有与储液通道2弯曲方向一致的导向槽5，储液通道2与废液腔4之间连通并设置有阀门。使用时，只需将晶圆片6从清洗腔3的一端放入导向槽5中，晶圆片6在弧形导向槽5中来回滚动，由于储液通道2中的清洗液通过出液孔进入清洗腔3的弧形导向槽5中，晶圆片6的边缘处得到清洗。
以上所举实施例为本发明的较佳实施方式，仅用来方便说明本发明，并非对本发明作任何形式上的限制，任何所属技术领域中具有通常知识者，若在不脱离本发明所提技术特征的范围内，利用本发明所揭示技术内容所作出局部改动或修饰的等效实施例，并且未脱离本发明的技术特征内容，均仍属于本发明技术特征的范围内。

Claims (1)

1.一种晶圆片边缘清洗处理装置，其特征在于：包括箱体(1)，箱体(1)中具有弧形状的储液通道(2)及分别位于储液通道(2)上、下方的清洗腔(3)及废液腔(4)，所述储液通道(2)的内弧侧设有多个与所述清洗腔(3)连通的出液孔，清洗腔(3)中具有与储液通道(2)弯曲方向一致的导向槽(5)，所述储液通道(2)与废液腔(4)之间连通并设置有阀门。
CN201610867025.0A 2016-09-29 2016-09-29 晶圆片边缘清洗处理装置 Withdrawn CN106449474A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610867025.0A CN106449474A (zh) 2016-09-29 2016-09-29 晶圆片边缘清洗处理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610867025.0A CN106449474A (zh) 2016-09-29 2016-09-29 晶圆片边缘清洗处理装置

Publications (1)

Publication Number Publication Date
CN106449474A true CN106449474A (zh) 2017-02-22

Family

ID=58171386

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610867025.0A Withdrawn CN106449474A (zh) 2016-09-29 2016-09-29 晶圆片边缘清洗处理装置

Country Status (1)

Country Link
CN (1) CN106449474A (zh)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030041879A1 (en) * 1999-03-30 2003-03-06 Redeker Fred C. Wafer edge cleaning method and apparatus
KR20080084187A (ko) * 2007-03-15 2008-09-19 주식회사 하이닉스반도체 반도체 기판의 습식 처리 장치 및 이를 이용한 반도체기판의 습식 처리 방법
US20130152964A1 (en) * 2006-03-15 2013-06-20 Tokyo Electron Limited Substrate cleaning method, substrate cleaning system and program storage medium
CN203437362U (zh) * 2013-08-26 2014-02-19 中芯国际集成电路制造(北京)有限公司 晶圆清洗装置
CN104289486A (zh) * 2014-10-14 2015-01-21 中山市吉尔科研技术服务有限公司 一种用于光学镜片的清洗设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030041879A1 (en) * 1999-03-30 2003-03-06 Redeker Fred C. Wafer edge cleaning method and apparatus
US20130152964A1 (en) * 2006-03-15 2013-06-20 Tokyo Electron Limited Substrate cleaning method, substrate cleaning system and program storage medium
KR20080084187A (ko) * 2007-03-15 2008-09-19 주식회사 하이닉스반도체 반도체 기판의 습식 처리 장치 및 이를 이용한 반도체기판의 습식 처리 방법
CN203437362U (zh) * 2013-08-26 2014-02-19 中芯国际集成电路制造(北京)有限公司 晶圆清洗装置
CN104289486A (zh) * 2014-10-14 2015-01-21 中山市吉尔科研技术服务有限公司 一种用于光学镜片的清洗设备

Similar Documents

Publication Publication Date Title
CN105833590A (zh) 负压式自清洗过滤器
CN202199544U (zh) 钛及钛合金管超声波清洗机
CN106449474A (zh) 晶圆片边缘清洗处理装置
CN106269943A (zh) 一种自动拉丝机
CN205042803U (zh) 一种机械零部件清洗装置
CN205803604U (zh) 酸洗装置
CN204399125U (zh) 一种底盘清洗装置
CN205289121U (zh) 一种轴承清洗机的清洗液循环过滤系统
CN205146822U (zh) 可弯曲方管
CN207857429U (zh) 一种加热除锈式的自动清理铁屑装置
CN207430922U (zh) 一种铝丝拉丝成型中的上油装置
CN209565319U (zh) 一种smt贴片清洗机
CN208333247U (zh) 一种油田长输管网换热器除垢装置
CN205155541U (zh) 可弯曲矩管
CN207430925U (zh) 一种铝丝拉丝成型中的涂油结构
CN105344729A (zh) 一种高质量铜合金异型线材轧制成型设备
CN205007699U (zh) 油脂过滤器
CN204935233U (zh) 具有过滤装置的排屑机
CN203944208U (zh) 一种热媒站重油过滤装置
CN106449475A (zh) 晶圆片的导入结构
CN204276429U (zh) 一种洗版专用平台
CN204283896U (zh) 一种橇装式螺杆压缩机及其轴承润滑油排污总成
CN205869024U (zh) 轴承座弹簧快速清洗装置
CN208976323U (zh) 一种测井仪器清洗装置
CN207889178U (zh) 一种茶油过滤装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WW01 Invention patent application withdrawn after publication

Application publication date: 20170222

WW01 Invention patent application withdrawn after publication