CN106426568A - Ceramic plate cutting and punching mechanism - Google Patents

Ceramic plate cutting and punching mechanism Download PDF

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Publication number
CN106426568A
CN106426568A CN201610797707.9A CN201610797707A CN106426568A CN 106426568 A CN106426568 A CN 106426568A CN 201610797707 A CN201610797707 A CN 201610797707A CN 106426568 A CN106426568 A CN 106426568A
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CN
China
Prior art keywords
sensor
ceramic wafer
baffle plate
slide rail
motor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610797707.9A
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Chinese (zh)
Other versions
CN106426568B (en
Inventor
吴金明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiashan Jinyi Precision Casting Co Ltd
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Jiashan Jinyi Precision Casting Co Ltd
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Application filed by Jiashan Jinyi Precision Casting Co Ltd filed Critical Jiashan Jinyi Precision Casting Co Ltd
Priority to CN201610797707.9A priority Critical patent/CN106426568B/en
Publication of CN106426568A publication Critical patent/CN106426568A/en
Application granted granted Critical
Publication of CN106426568B publication Critical patent/CN106426568B/en
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/003Multipurpose machines; Equipment therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00Accessories specially adapted for use with machines or devices of the preceding groups
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work

Abstract

The invention discloses a ceramic plate cutting and punching mechanism. The ceramic plate cutting and punching mechanism comprises an isolation cover and a control system which are erected on a workbench; a sliding rail performs penetration from the bottom of the isolation cover; a through groove is formed above the penetrating position; a height sensor is arranged on the top of the through groove; a movable base and a base position sensor are erected on the sliding rail; two baffles are arranged on the base; a positioning mechanism and an executing mechanism which are correspondingly arranged at the two ends of the sliding rail are matched with the baffles to absorb vibration of cutting and punching; and the rate of finished products is increased.

Description

A kind of ceramic wafer cutting and perforating mechanism
Technical field
Patent of the present invention relates to the process equipment of a kind of house finishing ceramic wafer.
Background technology
Porcelain, as the alternative materials of common ceramic tile, owing to having the advantages such as antibacterial, heat-resisting, anticorrosive, is increasingly got home Welcome with finishing material market.But, ceramic wafer itself enbrittles big shortcoming, easily broken in mechanical processing process Broken, percent defective is high.Thus the work such as its punching, cutting typically after production process terminates by manually carrying out, press with satisfied difference Client's decoration requirements, on the one hand inefficient, on the other hand cost of labor is still higher, and yield rate is still difficult to ensure that.
Content of the invention
It is an object of the invention to, for overcoming above-mentioned technical problem, propose a kind of ceramic wafer cutting and perforating mechanism, by gear Plate absorbs cutting and the vibrations of punching, improves yield rate.
Technical scheme includes setting up cage on the table and control system, at the bottom of slide rail self-isolation cover Portion is run through, and through part is provided above groove, groove top rational height sensor, and slide rail sets up moveable pedestal and base Seat position sensor, described pedestal arranges two pieces of baffle plates, and described slide rail two ends are respectively provided with:
I) detent mechanism, including the sensor of one group of working region covering baffle plate, coordinates the height sensor at groove top Can send signal and be received from the signal of baffle plate reflection, detecting is by control system staking-out work area coordinate;During use, pedestal Moving and postponing stopping to specific bit, ceramic wafer is fixed between two pieces of baffle plates by preposition equipment and is close to baffle plate, and edge is concordant, Detent mechanism is used for detecting ceramic wafer or barrier width, coordinates top sensor detecting ceramic wafer height, calculates ceramic plate Amass and provide concrete coordinate;
Ii) executing agency, including be arranged on single guide pillar, the slide mechanism that can vertically move, described slide mechanism bag Include respectively by different motor-driven a) steering mechanism, arrange some groups, including connect gear and the counterpart of motor respectively;With And b) telescoping mechanism, including cylinder and the bracket being arranged on its push rod;Wherein, steering mechanism passes through c) by motor-driven rotation Gear shaft connect, its other end is fixed on counterpart;Cutting machine or puncher are installed on bracket.Control system utilizes positioning Coordinate that mechanism is given and default cutting or puncturing schemes, determine target, specifically cut or punched by executing agency. It should be noted that slide mechanism can be vertically moved by asessory shaft driving by motor or cylinder.
Further, in order to improve coordinate accuracy, described detent mechanism is arranged on rotating disk, and described rotating disk is led to by motor Crossing gear and coordinating rotation, disc surfaces arranges the interface of sensor.In the process that pedestal enters cage and reaches appointment position In, the sensor of two groups of rotating disks gathers at least two group side-informations respectively, and system detects and utilizes function to calculate two pieces of baffle plates Between the concrete thickness of ceramic wafer, determine the concrete power output of executing agency;Reaching after specifying station, rotating disk rotates some angles Degree, the width before and after sensor detection is mobile is averaged, and reduces error, improves precision.
Further, for the ease of design and installation, described baffle plate outer application has coating of titanium dioxide, described localization machine Structure at least includes one group of infrared reflection type sensor, and its reflected signal receiving terminal is arranged on disc surfaces, to detect baffle plate width Degree, determines material width or thickness by infrared sensor, and precision is higher.
Further, for the ease of subsequent production, the cage base plate of slide rail both sides arranges opening, has below opening part Recovery frame on a moving belt is set.As pedestal is advanced, removal in the groove of the ceramic wafer self-isolation cover above pedestal drive, And the baffle plate contact cage groove wall of both sides, fall into recovery frame from the opening of slide rail both sides.
Further, for the ease of mounting design, base-plates surface is provided with mounting bracket, and baffle plate is movably connected in bracket slot In.
Brief description
Fig. 1 is the structural representation of the present invention.
Fig. 2 is the top view of the present invention.
Detailed description of the invention
In order to make the present invention realize technological means, creation characteristic, reach purpose and be easy to understand with effect, tie below Close diagram and specific embodiment, the present invention is expanded on further.
As it is shown in figure 1, a kind of ceramic wafer cutting and perforating mechanism, including set up cage 1 on the table and control System processed, runs through bottom slide rail 2 self-isolation cover 1, and through part is provided above groove 3, groove 3 top rational height sensor 4, slides Set up moveable pedestal 16 and base position sensor on rail 2, described pedestal 16 arranges two pieces of baffle plates, described slide rail 2 Two ends are respectively provided with:
Detent mechanism, including the sensor 5 of one group of working region covering baffle plate, coordinates the height sensor at groove 3 top Signal can be sent and be received from the signal of baffle plate reflection, by control system staking-out work area coordinate;
Executing agency, including be arranged on single guide pillar 6, the slide mechanism that can vertically move, described slide mechanism includes Motor-driven by difference respectively
A) steering mechanism, arranges some groups, including connect gear 7 and the counterpart 8 of motor respectively;And
B) telescoping mechanism, including cylinder 9 and the bracket 10 being arranged on its push rod;Wherein, steering mechanism passes through
C) being connected by the gear shaft 11 of motor-driven rotation, its other end is fixed on counterpart 8;Cutting is installed on bracket Machine or puncher.
Described detent mechanism arranges on a turntable 12, and described rotating disk 12 is passed through to rotate with gear from motor 13, turntable sheet Face arranges the interface 14 of sensor.
Described baffle plate outer application has coating of titanium dioxide, and described detent mechanism at least includes that one group of infrared reflection type passes Sensor, its reflected signal receiving terminal 15 is arranged on rotating disk 12 surface.
Cage 1 base plate of slide rail 2 both sides arranges opening, has the recovery frame arranging on a moving belt below opening part.
Pedestal 16 surface is provided with mounting bracket, and baffle plate is movably connected in bracket slot.
General principle, principal character and the advantages of the present invention of the present invention have more than been shown and described.The technology of the industry Personnel are it should be appreciated that the present invention is not restricted to the described embodiments, and the simply explanation described in above-described embodiment and specification is originally The principle of invention, the present invention also has various changes and modifications without departing from the spirit and scope of the present invention, and these become Change and improvement both falls within scope of the claimed invention.Claimed scope by appending claims and Equivalent defines.

Claims (5)

1. ceramic wafer cutting and a perforating mechanism, including set up cage on the table and control system, its feature Being, running through bottom slide rail self-isolation cover, through part is provided above groove, and groove top rational height sensor, slide rail is added If moveable pedestal and base position sensor, described pedestal arranging two pieces of baffle plates, described slide rail two ends are respectively provided with:
-detent mechanism, including the sensor of one group of working region covering baffle plate, coordinates the height sensor at groove top to send out Go out signal and be received from the signal of baffle plate reflection, by control system staking-out work area coordinate;
-executing agency, including be arranged on single guide pillar, the slide mechanism that can vertically move, described slide mechanism includes respectively By different motor-driven a) steering mechanism, arrange some groups, including connect gear and the counterpart of motor respectively;And b) stretch Contracting mechanism, including cylinder and the bracket being arranged on its push rod;Wherein, steering mechanism passes through c) by the gear of motor-driven rotation Axle connects, and its other end is fixed on counterpart;Cutting machine or puncher are installed on bracket.
2. a kind of ceramic wafer cutting according to claim 1 and perforating mechanism, it is characterised in that:Described detent mechanism is arranged On rotating disk, described rotating disk is passed through to rotate with gear from motor, and disc surfaces arranges the interface of sensor.
3. a kind of ceramic wafer cutting according to claim 2 and perforating mechanism, it is characterised in that:Described baffle plate outer application Having coating of titanium dioxide, described detent mechanism at least includes one group of infrared reflection type sensor, and its reflected signal receiving terminal sets Put in disc surfaces.
4. a kind of ceramic wafer cutting according to claim 1 and perforating mechanism, it is characterised in that:The cage of slide rail both sides Base plate arranges opening, has the recovery frame arranging on a moving belt below opening part.
5. a kind of ceramic wafer cutting according to claim 1 and perforating mechanism, it is characterised in that:Base-plates surface is provided with fixing Bracket, baffle plate is movably connected in bracket slot.
CN201610797707.9A 2016-08-31 2016-08-31 A kind of ceramic wafer cutting and perforating mechanism Active CN106426568B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610797707.9A CN106426568B (en) 2016-08-31 2016-08-31 A kind of ceramic wafer cutting and perforating mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610797707.9A CN106426568B (en) 2016-08-31 2016-08-31 A kind of ceramic wafer cutting and perforating mechanism

Publications (2)

Publication Number Publication Date
CN106426568A true CN106426568A (en) 2017-02-22
CN106426568B CN106426568B (en) 2018-04-03

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610797707.9A Active CN106426568B (en) 2016-08-31 2016-08-31 A kind of ceramic wafer cutting and perforating mechanism

Country Status (1)

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CN (1) CN106426568B (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3912663A1 (en) * 1989-04-18 1990-10-25 Engel Steinbearbeitungsmaschin Stone slab dressing machine - has photo-scanner linked to cutting head and moving over master plan
US5690092A (en) * 1996-06-21 1997-11-25 Ogyu; Shingo Apparatus for cutting a stone member so as to have a curved surface
US20130126574A1 (en) * 2010-04-21 2013-05-23 Benoit Mallet Carriage for cutting a sheet of gypsum board, cutting kit and method for implementing same
CN204773059U (en) * 2015-06-30 2015-11-18 江西高鑫电瓷电器有限公司 Stomidium processing agency of porcelain insulator puncher
CN205238322U (en) * 2015-12-31 2016-05-18 湘潭宏强机械制造有限公司 Inclined removes continuous cutting machine
CN206030250U (en) * 2016-08-31 2017-03-22 嘉善金亿精密铸件有限公司 Ceramic plate cutting and mechanism of punching

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3912663A1 (en) * 1989-04-18 1990-10-25 Engel Steinbearbeitungsmaschin Stone slab dressing machine - has photo-scanner linked to cutting head and moving over master plan
US5690092A (en) * 1996-06-21 1997-11-25 Ogyu; Shingo Apparatus for cutting a stone member so as to have a curved surface
US20130126574A1 (en) * 2010-04-21 2013-05-23 Benoit Mallet Carriage for cutting a sheet of gypsum board, cutting kit and method for implementing same
CN204773059U (en) * 2015-06-30 2015-11-18 江西高鑫电瓷电器有限公司 Stomidium processing agency of porcelain insulator puncher
CN205238322U (en) * 2015-12-31 2016-05-18 湘潭宏强机械制造有限公司 Inclined removes continuous cutting machine
CN206030250U (en) * 2016-08-31 2017-03-22 嘉善金亿精密铸件有限公司 Ceramic plate cutting and mechanism of punching

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