CN106425934A - Cooling shaping clamp of LED substrate - Google Patents
Cooling shaping clamp of LED substrate Download PDFInfo
- Publication number
- CN106425934A CN106425934A CN201611124368.4A CN201611124368A CN106425934A CN 106425934 A CN106425934 A CN 106425934A CN 201611124368 A CN201611124368 A CN 201611124368A CN 106425934 A CN106425934 A CN 106425934A
- Authority
- CN
- China
- Prior art keywords
- led substrate
- posting
- cover plate
- upper cover
- shaping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 46
- 238000007493 shaping process Methods 0.000 title claims abstract description 34
- 238000001816 cooling Methods 0.000 title claims abstract description 32
- 238000004513 sizing Methods 0.000 claims description 25
- 210000003437 trachea Anatomy 0.000 claims description 15
- 239000011148 porous material Substances 0.000 claims description 3
- 208000003643 Callosities Diseases 0.000 claims description 2
- 206010020649 Hyperkeratosis Diseases 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 8
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 238000003825 pressing Methods 0.000 abstract description 2
- 238000012545 processing Methods 0.000 abstract description 2
- 229910000831 Steel Inorganic materials 0.000 description 6
- 239000010959 steel Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 210000004247 hand Anatomy 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/16—Cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/16—Cooling
- B29C2035/1658—Cooling using gas
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The invention discloses a cooling shaping clamp of an LED substrate, and relates to the technical field of the semiconductor package scribing processing. The cooling shaping clamp of the LED substrate comprises an upper die module. The upper die module is provided with a plurality of groups of uniformly distributed shaping block modules. The upper die module is connected with a positioning frame module by upper and lower hinges. The lower side of the positioning frame module is provided with a lower die module. The lower side of the lower die module is provided with four rubber foot pads for supporting. The LED substrate is installed in a groove formed by the lower die module and the positioning frame. The cooling shaping clamp of the LED substrate is capable of cooling and shaping the warped and deformed LED substrate after the pressed film of a laminator so as to achieve the surface leveling effect, and reducing the effect of the unfairness LED substrate to the follow-up scribing process. The cooling shaping clamp of the LED substrate is capable of cooling and shaping 100 pieces of the LED substrates by one time of clamping, the structure is simple, and the shaping efficiency is high. Compared with the traditional artificial hand-pressing gas cooling and shaping, the labor cost is reduced, and the shaping effect is stable.
Description
Technical field：
The present invention relates to semiconductor packages processing technique field, more particularly, to a kind of LED substrate cooling and shaping fixture.
Background technology：
In recent years, LED uses more and more extensively as a kind of green light source product of new energy-saving and environmental protection, necessarily
The trend of future development.LED manufactures mainly three links：The growth of emitting semiconductor epitaxial wafer, chip manufacturing and encapsulation.Half
Conductor cutting is one important procedure in encapsulation link.
Traditional cutting technique flow process includes：First the LED substrate after press mold is baked to deliquescing, becomes after then taking out baking
Soft material handss pressing makes it smooth, is manually blown sizing using air gun, then LED material is carried out being installed on after pad pasting posts
Film collapse on frame, finally the LED substrate posting film is installed on scribing workbench, then is cut after being aligned by image recognition
Cut.
The flatness that LED substrate is installed on workbench directly affects follow-up scribing process, and factory is mainly at this stage
Using traditional artificial hand pressure and artificial air gun air blowing cooling and shaping, high labor intensive, efficiency is low and flatness it is difficult to ensure that.
Therefore need badly and improve further it is necessary to design a kind of LED substrate cooling and shaping fixture.
Content of the invention：
It is an object of the invention to provide a kind of LED substrate cooling and shaping fixture, can will be sent out after film laminator press mold
The LED substrate cooling and shaping of raw buckling deformation, reaches surfacing effect, reduces LED-baseplate out-of-flatness to follow-up scribing process
Impact.Clamped one time of the present invention can be with 100 LED substrates of cooling and shaping, efficiency high of shaping, effect stability, and process is simple becomes
This is cheap.
For achieving the above object, the present invention employs the following technical solutions realization：
A kind of LED substrate cooling and shaping fixture it is characterised in that：Including upper die component, described upper die component is provided with
Sizing block assembly, is provided with posting assembly, described upper die component is connected with posting member hinges on the downside of described upper die component,
It is provided with lower module, described LED substrate is installed in the groove that lower module is formed with posting on the downside of described posting assembly；Described
Posting assembly is provided with trachea；Air-vent is provided with trachea, for cooling down LED substrate.
Further improvement, described sizing block assembly passes through adjusting part adjusting position.
Further improvement, described upper die component includes shape block assembly, upper cover plate, and described sizing block assembly is arranged at
Cover plate downside, described upper cover plate is provided with air discharge duct, and described sizing block assembly is installed on the downside of upper cover plate by securing member
Face, is connected with adjusting part between described sizing block assembly and upper cover plate, can adjust on the downside of sizing block assembly and upper cover plate
The relative distance in face.
Further improvement, described upper cover plate trailing flank is provided with hinge；It is provided with lower jaw on posting assembly；On
Cover plate is hinged and connected by upper hinge and lower jaw with posting assembly.
Further improvement, described sizing block assembly includes shaped block, installing plate, described installing plate is provided with sizing
Block, described installing plate is connected by locking member with upper cover plate, and between described installing plate and upper cover plate, distance can be by adjusting
Assembly is adjusted；Described adjusting part is set screw or adjusting screw；Described locking member is lock-screw or lock screw.
Further improve, before described upper cover plate, left and right side be respectively arranged with buckle slot；Before described posting, left,
Right flank is respectively arranged with buckle movable part.
Further improvement, described posting assembly includes posting, the side of described posting interior groove is provided with ten
Two tracheas, described trachea is axially evenly arranged with pore.
Further improvement, described trachea both sides are provided with valve.
Further improvement, described lower module is connected with posting assembly, and described LED substrate is installed on lower module and positioning
In the groove of frame composition.
Further improvement, described upper cover plate upper side is provided with handle；Lower module bottom is fixed with support callosity.
The invention has the beneficial effects as follows：Can be fixed by the LED substrate cooling that buckling deformation occurs after film laminator press mold
Type, reaches surfacing effect, reduces the impact to follow-up scribing process for the LED-baseplate out-of-flatness.Clamped one time can cool down fixed
100 LED substrates of type, structure is simple, efficiency high of shaping, and with respect to traditional artificial hand pressure air blowing cooling and shaping, reduces work
Cost, and fixed effect is stable.
Brief description：
The fixture perspective view of Fig. 1 present invention；
The upper die component structural representation of Fig. 2 present invention, wherein a) be upper die component medial surface structural representation, b) be upper module
Part lateral surface structural representation；
Fig. 3 is the shaped block modular construction schematic diagram of the present invention；
Fig. 4 is the posting modular construction schematic diagram of the present invention；
Fig. 5 is the lower modular structure schematic diagram of the present invention；
In in figure：
1- upper die component；
11- sizing block assembly；110- shaped block；111- installing plate；12- upper cover plate；13- buckle slot；14- shakes hands；Close on 15-
Page；16- adjusting screw；17- lock-screw；18- air discharge duct；
2- posting assembly；
21- posting；22- buckle movable part；23- rustless steel trachea；24- valve；25- lower jaw；26- groove；
Module under 3-；4- rubber mat；5 LED substrates.
Specific embodiment：
To describe the present invention below with reference to the accompanying drawings in detail in conjunction with the embodiments.It should be noted that in situation about not conflicting
Under, embodiment in the present invention and the feature in implementing can be mutually combined.For sake of convenience, appear below " on ", D score,
"left", "right", printed words, only represent consistent with the upper and lower, left and right direction of accompanying drawing itself, do not play restriction effect to structure.
A kind of LED substrate cooling and shaping fixture, as shown in Figures 1 to 5, including upper die component 1, on described upper die component 1
Be provided with some groups of equally distributed sizing block assemblies 11, on the downside of described upper die component 1, be provided with posting assembly 2, described on
Membrane module 1 is connected by upper and lower hinge 15,25 with posting assembly 2, is provided with lower module 3 on the downside of described posting assembly 2,
It is provided for four rubber mats 4 supporting, described LED substrate 5 is installed on lower module 3 and posting on the downside of described lower module 3
In the groove 26 of 21 compositions, described LED substrate 5 is installed on lower module 3.Described sizing block assembly 11 can pass through adjusting screw 16
Adjusting position, described posting assembly 2 is provided with rustless steel trachea 23.
By LED substrate 5 material after overbaking deliquescing after film laminator press mold ten for a batch be clamped in lower module 3 with
Posting 21 combination groove in, then pass through shake hands 14 by 2-in-1 with posting assembly for upper die component 1 hold together, stuck up according to LED substrate 5
Adjusting screw 16 on curvature different adjustment upper die component 1, makes the shaped block 110 on sizing block assembly 11 complete with LED substrate 5
Contact, then four buckle movable parts 22 are locked in buckle slot 13, so that upper die component 1 is stably connected with posting assembly 2,
Pass through valve 24 ventilation afterwards and can complete LED substrate 5 cooling and shaping for a period of time.
As one preferred embodiment, as shown in Fig. 2 described upper die component 1 includes shape block assembly 11, upper cover plate
12, described sizing block assembly 11 is arranged at upper cover plate 12 downside, and described upper cover plate 12 is provided with air discharge duct 18, described sizing
Block assembly 11 is installed on upper cover plate downside by lock-screw 17, is connected between described sizing block assembly 11 and upper cover plate 12
There is adjusting screw 16, the relative distance of sizing block assembly 11 and upper cover plate 12 downside can be adjusted, on the upside of described upper cover plate 12
Face is provided with handle 14, and described upper cover plate 12 trailing flank is provided with hinge 15, before described upper cover plate 12, left and right side respectively
It is provided with buckle slot 13.
As one preferred embodiment, as shown in figure 3, described sizing block assembly 11 includes shaped block 110, installs
Plate 111, described installing plate 111 is provided with four equally distributed shaped block 110, and described installing plate 111 and upper cover plate 12 pass through
Lock-screw 17 connects, and between described installing plate 111 and upper cover plate 12, distance can be adjusted by adjusting screw 16.
As one preferred embodiment, as shown in figure 4, described posting assembly 2 includes posting 21, rustless steel gas
Pipe 23, before described posting 21, left and right side be respectively arranged with buckle movable part 22, be provided with down on rear side of described posting 21
Hinge 25, described lower jaw 25 is connected with upper hinge 15, and the side of described posting 21 interior groove is provided with 12 not
Rust steel trachea 23, especially described rustless steel trachea 23 is evenly arranged with pore, 23 liang of described rustless steel trachea vertically
Side is provided with valve 24.
As one preferred embodiment, as shown in figure 5, lower module 3 is connected with posting assembly 2, described LED substrate
5 are installed in the groove 26 that lower module 3 is formed with posting 21.
The content that above-described embodiment illustrates should be understood to that these embodiments are only used for being illustrated more clearly that the present invention, and not
For limiting the scope of the present invention, after having read the present invention, the various equivalent form of values to the present invention for the those skilled in the art
Modification each fall within the application claims limited range.
Claims (10)
1. a kind of LED substrate cooling and shaping fixture it is characterised in that：Including upper die component, it is fixed that described upper die component is provided with
Type block assembly, is provided with posting assembly on the downside of described upper die component, described upper die component is connected with posting member hinges, institute
State and on the downside of posting assembly, be provided with lower module, described LED substrate is installed in the groove that lower module is formed with posting；Described fixed
Position frame assembly is provided with trachea；Air-vent is provided with trachea, for cooling down LED substrate.
2. a kind of LED substrate cooling and shaping fixture according to claim 1 is it is characterised in that described sizing block assembly leads to
Overregulate assembly adjusting position.
3. a kind of LED substrate cooling and shaping fixture according to claim 1 it is characterised in that：Described upper die component includes
Sizing block assembly, upper cover plate, described sizing block assembly is arranged at upper cover plate downside, described upper cover plate is provided with air discharge duct,
Described sizing block assembly is installed on upper cover plate downside by securing member, is connected between described sizing block assembly and upper cover plate
Adjusting part, can adjust the relative distance of sizing block assembly and upper cover plate downside.
4. a kind of LED substrate cooling and shaping fixture according to claim 3 it is characterised in that：Described upper cover plate trailing flank
It is provided with hinge；It is provided with lower jaw on posting assembly；Upper cover plate is cut with scissors by upper hinge and lower jaw with posting assembly
Connect connected.
5. a kind of LED substrate cooling and shaping fixture according to claim 3 it is characterised in that：Described sizing block assembly
Including shaped block, installing plate, described installing plate is provided with shaped block, described installing plate is connected by locking member with upper cover plate,
Between described installing plate and upper cover plate, distance can be adjusted by adjusting part；Described adjusting part is set screw or regulation
Screw；Described locking member is lock-screw or lock screw.
6. according to a kind of arbitrary described LED substrate cooling and shaping fixture of claim 3-5 it is characterised in that：Described upper cover plate
Before, left and right side be respectively arranged with buckle slot；Before described posting, left and right side be respectively arranged with buckle movable part.
7. a kind of LED substrate cooling and shaping fixture according to claim 1 it is characterised in that：Described posting assembly bag
Include posting, the side of described posting interior groove is provided with 12 tracheas, described trachea is axially evenly arranged with pore.
8. a kind of LED substrate cooling and shaping fixture according to claim 7 it is characterised in that：Described trachea both sides set
It is equipped with valve.
9. a kind of LED substrate cooling and shaping fixture according to claim 1 it is characterised in that：Described lower module and positioning
Frame assembly connects, and described LED substrate is installed in the groove that lower module is formed with posting.
10. according to a kind of arbitrary described LED substrate cooling and shaping fixture of claim 3-5 it is characterised in that：Described upper cover plate
Upper side is provided with handle；Lower module bottom is fixed with support callosity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611124368.4A CN106425934B (en) | 2016-12-08 | 2016-12-08 | A kind of LED substrates cooling and shaping fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611124368.4A CN106425934B (en) | 2016-12-08 | 2016-12-08 | A kind of LED substrates cooling and shaping fixture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106425934A true CN106425934A (en) | 2017-02-22 |
| CN106425934B CN106425934B (en) | 2018-08-17 |
Family
ID=58216230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611124368.4A Active CN106425934B (en) | 2016-12-08 | 2016-12-08 | A kind of LED substrates cooling and shaping fixture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106425934B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106914931A (en) * | 2017-04-29 | 2017-07-04 | 合肥国轩高科动力能源有限公司 | A kind of lithium ion battery separator cutting clamper |
| CN107116499A (en) * | 2017-04-01 | 2017-09-01 | 苏州含光微纳科技有限公司 | A kind of good airproof performance and change chip efficiently micro-fluidic sample introduction fixture |
| CN107425105A (en) * | 2017-08-17 | 2017-12-01 | 广东聚科照明股份有限公司 | A kind of COB clamp structures of LED sealed in units |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08267479A (en) * | 1995-03-29 | 1996-10-15 | Kasai Kogyo Co Ltd | Method and apparatus for molding laminated molding |
| CN103538190A (en) * | 2013-11-06 | 2014-01-29 | 重庆龙润汽车转向器有限公司 | Cooling and shaping tool of face defrosting air door |
| US20150328814A1 (en) * | 2014-05-19 | 2015-11-19 | Delta Electronics (Dongguan) Co., Ltd. | Mold structure having lightweight module |
| CN106079167A (en) * | 2016-06-24 | 2016-11-09 | 精功（绍兴）复合材料有限公司 | A kind of carbon fiber belt fastener molding die |
| CN206287042U (en) * | 2016-12-08 | 2017-06-30 | 长沙华腾智能装备有限公司 | A kind of LED substrates cooling and shaping fixture |
-
2016
- 2016-12-08 CN CN201611124368.4A patent/CN106425934B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08267479A (en) * | 1995-03-29 | 1996-10-15 | Kasai Kogyo Co Ltd | Method and apparatus for molding laminated molding |
| CN103538190A (en) * | 2013-11-06 | 2014-01-29 | 重庆龙润汽车转向器有限公司 | Cooling and shaping tool of face defrosting air door |
| US20150328814A1 (en) * | 2014-05-19 | 2015-11-19 | Delta Electronics (Dongguan) Co., Ltd. | Mold structure having lightweight module |
| CN106079167A (en) * | 2016-06-24 | 2016-11-09 | 精功（绍兴）复合材料有限公司 | A kind of carbon fiber belt fastener molding die |
| CN206287042U (en) * | 2016-12-08 | 2017-06-30 | 长沙华腾智能装备有限公司 | A kind of LED substrates cooling and shaping fixture |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107116499A (en) * | 2017-04-01 | 2017-09-01 | 苏州含光微纳科技有限公司 | A kind of good airproof performance and change chip efficiently micro-fluidic sample introduction fixture |
| CN106914931A (en) * | 2017-04-29 | 2017-07-04 | 合肥国轩高科动力能源有限公司 | A kind of lithium ion battery separator cutting clamper |
| CN107425105A (en) * | 2017-08-17 | 2017-12-01 | 广东聚科照明股份有限公司 | A kind of COB clamp structures of LED sealed in units |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106425934B (en) | 2018-08-17 |
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Effective date of registration: 20220616 Address after: 518000 room 2, 2 / F, No. 109, building 17, Pingshan Industrial Zone, No. 1201 Liuxian Avenue, Taoyuan Street, Nanshan District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN HI-TEST SEMICONDUCTOR EQUIPMENT Co.,Ltd. Address before: 410000 Hunan University Science Park, 186 Guyuan Road, high tech Development Zone, Changsha City, Hunan Province Patentee before: CHANGSHA HUATENG INTELLIGENT EQUIPMENT Co.,Ltd. |
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