CN106410571A - Potting method for improving reliability of connector - Google Patents
Potting method for improving reliability of connector Download PDFInfo
- Publication number
- CN106410571A CN106410571A CN201610793468.XA CN201610793468A CN106410571A CN 106410571 A CN106410571 A CN 106410571A CN 201610793468 A CN201610793468 A CN 201610793468A CN 106410571 A CN106410571 A CN 106410571A
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- Prior art keywords
- mixture
- mould
- connector
- described step
- vacuum
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/26—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for engaging or disengaging the two parts of a coupling device
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Sealing Material Composition (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Processing Of Terminals (AREA)
Abstract
The invention provides a potting method for improving the reliability of a connector. The potting method comprises the following steps of: (1), decontaminating; (2), removing moisture; (3), batching; (4), adding a diluents; (5), drying; (6), stirring; (7), processing in vacuum; (8), potting glue; (9), curing; and (10), demoulding. According to the potting method provided by the invention, due to addition of a catalyst, the cross-linking reaction speed of a sizing material is greatly shortened; therefore, the curing period is shortened to one half; the finally obtained sizing material is transparent, elastic, impact-resistant and wearable; because the curing time is shortened, the production efficiency is at least increased by above 50%; after being potted and cured, if having a quality problem, the interior of the connector also can be reworked and repaired; the disadvantage that the traditional connector cannot be repaired after being potted by glue and cured can be overcome; and thus, the cost is reduced.
Description
Technical field
The present invention relates to a kind of encapsulating method improving connector reliability.
Background technology
Connector is the indispensable ingredient of electronic product, with high-tech electronic product work frequency increasingly
Height, in order to reduce the interference between each combination frequency, each combination has all been installed shell additional, has been had a style of one's own, and passes through cable between each combination
Or semi-steel high frequency cable is realizing signal communication, this is just carried with the quality of connection of adapter to cable or semi-steel high frequency cable
Go out higher requirement, in order to ensure quality of connection, be typically employed in junction encapsulating and fix to ensure.Up to the present, connect
The embedding of plug-in unit carries out embedding using sizing materials such as epoxy resin, polyurethane resin and fixes.
Embedding is carried out using epoxide-resin glue, but causes the disconnected of connecting wire because epoxy resin cure meeting stress is larger
Split, and hardening time is long, embedding solidification sizing material is hard, fragility is big, and no reworkability, using conventional treatment polyurethane rubber performed polymer
Carry out embedding, cure cycle is long, embedding body has the defects such as pore, impact bonding strength and presentation quality.
Content of the invention
For solving above-mentioned technical problem, the invention provides a kind of encapsulating method improving connector reliability, this raising
The encapsulating method of connector reliability can shorten hardening time, and embedding body pore-free, reworkable after solidifying, and can be used for
The various encapsulation process increasing mechanical strength.
The present invention is achieved by the following technical programs.
A kind of encapsulating method of raising connector reliability that the present invention provides, comprises the steps：
1. decontamination：Treat patching wire and patching mould of embedding with washes of absolute alcohol；
2. remove moisture：So that wire will be patched and patches mould and removes moisture 4 hours in vacuum drying oven, wire insertion will be patched and install
In mould and fixing in patching；
3. dispensing：By two component mixing of polyurethane, and add liquid aminated compoundss as catalyst；
Plus diluent 4.：Add ester type compound as diluent in polyurethane mixture, and mixed with Glass rod stirring
Close；
5. it is dried：Mixture is put into vacuum drying oven, is incubated 20～30 minutes, is evacuated to 0.08MPa；
6. stir：Mixture is heated fusing, adds MOCA and stir；
7. application of vacuum：Mixture is put in vacuum pump, is evacuated to 0.08MPa, continue 10min and release vacuum and take
Go out；
8. encapsulating：Mixture edge is patched mould inner wall and pours into or be injected into and fills, and choose bubble in 30 minutes；
9. solidify：Thing solidification to be mixed in the environment of 25～30 DEG C of temperature, humidity are less than 80%；
10. the demoulding：Take off and patch mould fixture, take out connector.
Described step 5. in, vacuum drying the temperature inside the box be maintained at 50～60 DEG C.
3. middle liquid aminated compoundss are triethanolamine to described step.
4. middle ester type compound is ethyl acetate or dibutyl phthalate to described step.
6. middle addition MOCA is polyurethane first component according to mass ratio to described step：MOCA=100：13 additions.
The beneficial effects of the present invention is：
(1) process time is short：Add catalyst to substantially reduce the speed of sizing material cross-linking reaction, so that cure cycle is shortened to
Half；
(2) increased the reliability of connector：The sizing material finally giving is transparent flexible, impact resistance, wear-resisting；
(3) improve production efficiency：Due to the shortening of hardening time, production efficiency is at least made to improve more than 50%；
(4) reduce cost：After embedding solidification, such as find connector internal defective in quality moreover it is possible to carry out doing over again reprocessing,
The disadvantage that can not reprocess after overcoming traditional encapsulating solidification, thus reduce cost.
Specific embodiment
Technical scheme be described further below, but claimed scope be not limited to described.
The invention provides a kind of encapsulating method improving connector reliability, comprise the steps：
1. decontamination：Treat patching wire and patching mould of embedding with washes of absolute alcohol；
2. remove moisture：So that wire will be patched and patches mould and removes moisture 4 hours in vacuum drying oven, wire insertion will be patched and install
In mould and fixing in patching；
3. dispensing：By two component mixing of polyurethane, and add liquid aminated compoundss as catalyst；
Plus diluent 4.：Add ester type compound as diluent in polyurethane mixture, and mixed with Glass rod stirring
Close；
5. it is dried：Mixture is put into vacuum drying oven, is incubated 20～30 minutes, is evacuated to 0.08MPa；
6. stir：Mixture is heated fusing, adds MOCA and stir；
7. application of vacuum：Mixture is put in vacuum pump, is evacuated to 0.08MPa, continue 10min and release vacuum and take
Go out；
8. encapsulating：Mixture edge is patched mould inner wall and pours into or be injected into and fills, and choose bubble in 30 minutes；
9. solidify：Thing solidification to be mixed in the environment of 25～30 DEG C of temperature, humidity are less than 80%；
10. the demoulding：Take off and patch mould fixture, take out connector.
Described step 5. in, vacuum drying the temperature inside the box be maintained at 50～60 DEG C.
3. middle liquid aminated compoundss are triethanolamine to described step.
4. middle ester type compound is ethyl acetate or dibutyl phthalate to described step.
6. middle addition MOCA is polyurethane first component according to mass ratio to described step：MOCA=100：13 additions.
One of polyurethane component is the performed polymer of terminal isocyanate group, and another component is aminated compoundss, adds
Suitable amine is made catalyst and can be accelerated cross-linking reaction speed, and reason is that the polarity of triethanolamine is strong, in molecular structure
Alcoholic extract hydroxyl group can be reacted with the NCO in polyurethane performed polymer or with the carboxyl in molecule, esterification occur, and improve and hand over
The speed of connection reaction, thus shorten cure cycle.
Moisture on wire processes and does not only lead to online root during encapsulating to produce bubble, forms pore after sizing material solidification,
Impact bonding strength and outward appearance, are removed moisture and can pole low energy consumption high-efficiency be removed moisture using vacuum.
Suitable interpolation diluent, can reduce the viscosity of glue, and in application of vacuum, bubble can quickly escape, and reduce true
The time of vacancy reason.But should not add in practical operation, diluent is directly proportional to the shrinkage factor of cured glue material, and diluent is got over
Many, shrinkage factor is bigger, and embedding size is wayward.
The mode of evacuation can be very good quickly to go bubble removing.
Claims (5)
1. a kind of improve connector reliability encapsulating method it is characterised in that：Comprise the steps：
1. decontamination：Treat patching wire and patching mould of embedding with washes of absolute alcohol；
2. remove moisture：So that wire will be patched and patches mould and removes moisture 4 hours in vacuum drying oven, wire insertion will be patched it will be installed on and connect
In slotting mould and fixing；
3. dispensing：By two component mixing of polyurethane, and add liquid aminated compoundss as catalyst；
Plus diluent 4.：Add ester type compound as diluent in polyurethane mixture, and stir mixing with Glass rod；
5. it is dried：Mixture is put into vacuum drying oven, is incubated 20～30 minutes, is evacuated to 0.08MPa；
6. stir：Mixture is heated fusing, adds MOCA and stir；
7. application of vacuum：Mixture is put in vacuum pump, is evacuated to 0.08MPa, continue 10min and release vacuum and take out；
8. encapsulating：Mixture edge is patched mould inner wall and pours into or be injected into and fills, and choose bubble in 30 minutes；
9. solidify：Thing solidification to be mixed in the environment of 25～30 DEG C of temperature, humidity are less than 80%；
10. the demoulding：Take off and patch mould fixture, take out connector.
2. as claimed in claim 1 improve connector reliability encapsulating method it is characterised in that：Described step 5. in, very
Sky is dried the temperature inside the box and is maintained at 50～60 DEG C.
3. as claimed in claim 1 improve connector reliability encapsulating method it is characterised in that：Described step 3. middle liquid
Aminated compoundss are triethanolamine.
4. as claimed in claim 1 improve connector reliability encapsulating method it is characterised in that：Described step 4. middle esters
Compound is ethyl acetate or dibutyl phthalate.
5. the as claimed in claim 1 encapsulating method improving connector reliability it is characterised in that：The 6. middle addition of described step
MOCA is polyurethane first component according to mass ratio：MOCA=100：13 additions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610793468.XA CN106410571A (en) | 2016-08-31 | 2016-08-31 | Potting method for improving reliability of connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610793468.XA CN106410571A (en) | 2016-08-31 | 2016-08-31 | Potting method for improving reliability of connector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106410571A true CN106410571A (en) | 2017-02-15 |
Family
ID=58000957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610793468.XA Pending CN106410571A (en) | 2016-08-31 | 2016-08-31 | Potting method for improving reliability of connector |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106410571A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109590159A (en) * | 2018-11-05 | 2019-04-09 | 贵州航天电子科技有限公司 | A kind of electronic product encapsulation device and method |
| CN109994915A (en) * | 2019-03-25 | 2019-07-09 | 中国电子科技集团公司第五十二研究所 | A kind of connector encapsulating method |
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| CN1619744A (en) * | 2003-11-18 | 2005-05-25 | 北京北开电气股份有限公司 | Pouring sealing method of vacuum arc quenching chamber |
| CN1817934A (en) * | 2006-03-10 | 2006-08-16 | 广东天银化工实业有限公司 | Self-crosslinked oxidation and high-efficient dispersion with water polyurethane and production thereof |
| CN101439567A (en) * | 2008-12-25 | 2009-05-27 | 麦克奥迪（厦门）电气有限公司 | Vacuum pressure pouring process for epoxy resins insulation pouring piece of high voltage electric appliance |
| CN102391488A (en) * | 2011-09-26 | 2012-03-28 | 四川东方绝缘材料股份有限公司 | Preparation method for fluorine silicon phosphorus-containing anti-dropping flame-retardant polyethylene terephthalate |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109590159A (en) * | 2018-11-05 | 2019-04-09 | 贵州航天电子科技有限公司 | A kind of electronic product encapsulation device and method |
| CN109994915A (en) * | 2019-03-25 | 2019-07-09 | 中国电子科技集团公司第五十二研究所 | A kind of connector encapsulating method |
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Application publication date: 20170215 |
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