CN104293280A - Preparation method of double-component condensed type LED (light-emitting diode) organic silicon pouring sealant - Google Patents
Preparation method of double-component condensed type LED (light-emitting diode) organic silicon pouring sealant Download PDFInfo
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Abstract
The invention discloses double-component condensed type LED (light-emitting diode) organic silicon pouring sealant and a preparation method thereof. The organic silicon pouring sealant comprises the following raw materials in parts by weight: a component A including 100-190 parts of alpha, omega-dyhydroxyl polydimethylsiloxane, 100-180 parts of a plasticizer, 0.1-5 parts of a colorant and 0.5-5 parts of a deep curing agent, a component B including 1-10 parts of a cross-linking agent, 1-5 parts of a silane coupling agent, 0.5-3 parts of a catalyst, wherein a weight ratio of the component A to the component B is (10:1) to (2:1). The preparation method of the organic silicon pouring sealant comprises the following steps: before use, mixing the component A with the component B, defoaming and curing to obtain the organic silicon pouring sealant. The LED organic silicon pouring sealant provided by the invention adopts an improved organic tin catalyst, avoids corrosion of organic tin on electronic parts and components, circuit boards, and the like due to acidity to achieve the characteristics of no corrosion, good adhesion, quick curing and quick surface drying, so that the requirements of quickly curing and shortening the production time for electron sealing are satisfied.
Description
Technical field
The present invention relates to field of organic silicon, particularly relate to the preparation of a kind of pair of component condensed type LED organic silicon potting adhesive.
Background technology
Organic silicon potting adhesive refers to the electron-like joint sealant made of silicon rubber, comprises mono-component organic silicone joint sealant glue and two-pack organic silicon potting adhesive.Organic silicon potting adhesive is all generally softer, elastic.The kind of organic silicon potting adhesive is a lot, and different types of organic silicon potting adhesive is in heat resistance, water resistance, insulating property, optical property, have very big-difference in the bonding adhesion property of unlike material and soft durometer etc.
LED (light emitting diode) is encapsulated in various element, sends the light of particular color.In order to strengthen and direct light flux, protection LED exempts from dust, moisture and mechanical damage, and LED matrix must carry out embedding process.In LED use procedure, the loss that the photon that radiative recombination produces produces when outwards launching, mainly comprises three aspects: the absorption of chip internal structure defect and material; The reflection loss that photon causes due to refringence at outgoing interface; And the total reflection loss to cause because input angle is greater than the cirtical angle of total reflection.Therefore, a lot of light cannot shine outside from chip.By applying the relatively high glue-line-LED joint sealant of one deck specific refractory power at chip surface, the loss of photon at interface can be effectively reduced, improve and get optical efficiency.
Joint sealant conventional at present comprises epoxy resin and silica gel.But the high thermal resistance of epoxy resin, wet fastness are poor, cause element work-ing life to shorten, or aqueous vapor enter element internal and easily cause short circuit, is not easy problems such as reprocessing.Silica gel is large owing to having specific refractory power, and Heat stability is good, the features such as stress is little, and water absorbability is low, are obviously better than epoxy resin, are used widely in high-power LED encapsulation.But, silica gel performance is influenced by environmental temperature, along with temperature raises, the thermal stresses of silica gel inside strengthens, and causes the specific refractory power of silica gel to reduce, thus affect LED light effect and light distribution, and the embedding of part silicon rubber in LED display carry out aging after, cementability is inadequate, have impact on the water-proof function of LED display, also there will be the phenomenons such as contraction, bleed, corrosion, have a strong impact on the use of LED display.
Summary of the invention
For solving the problem, an object of the present invention is to provide a kind of two component condensed type LED organic silicon potting adhesive.LED organic silicon potting adhesive of the present invention adopts the organotin catalysts improved, avoid organotin because acidity is to the corrosion of electronic devices and components, wiring board etc., reach corrosion-free, cementability is good, quick solidifying, surface drying are fast feature, meet electronics embedding fast setting, shorten the requirement of production time.
For reaching above-mentioned purpose, the present invention adopts following technical scheme:
A kind of two component condensed type LED organic silicon potting adhesive, comprises following raw material by weight:
Component A comprises 100 ~ 190 parts, be such as the α such as 110 parts, 130 parts, 160 parts, 185 parts, alpha, omega-dihydroxy polydimethyl siloxane, 100 ~ 180 parts, be such as the softening agent such as 110 parts, 130 parts, 160 parts, 175 parts, 0.1 ~ 5 part, be such as the tinting materials such as 0.3 part, 1.2 parts, 2.4 parts, 3.5 parts, 4.6 parts, 0.5 ~ 5 part, be such as the deep cure agent such as 0.7 part, 1.2 parts, 2.4 parts, 3.5 parts, 4.6 parts;
B component comprises 1 ~ 10 part, be such as the linking agents such as 3 parts, 6 parts, 9 parts, 1 ~ 5 part, be such as the silane coupling agents such as 2 parts, 3.5 parts, 4.7 parts, 0.5 ~ 3 part, be such as the catalyzer such as 0.8 part, 1.6 parts, 2.9 parts;
The weight ratio of component A and B component is 10:1 ~ 2:1, such as, be 3:1,5:1,7:1,9.5:1.
Two component condensed type LED organic silicon potting adhesives that the present invention obtains are soft silicone elastomer, have the advantages such as non-corrosiveness, cementability are good, quick solidifying.
For of the present invention pair of component condensed type LED joint sealant, described α, alpha, omega-dihydroxy polydimethyl siloxane is viscosity is 2000 ~ 50000cps, such as, be 107 silicon rubber of 5000cps, 15000cps, 30000cps, 45000cps etc.
For of the present invention pair of component condensed type LED joint sealant, described softening agent is viscosity is 50 ~ 1000cps, such as, be the dimethyl silicone oil of 100cps, 300cps, 700cps, 950cps etc.
For of the present invention pair of component condensed type LED joint sealant, described tinting material is carbon black.
For of the present invention pair of component condensed type LED joint sealant, described deep cure agent be weight percentage concentration be 0.1% ~ 0.5% aqueous phosphatic.
For of the present invention pair of component condensed type LED joint sealant, described linking agent is the alkoxy compound containing alkoxy base.
Preferably, described linking agent is at least two kinds in methyl silicate, tetraethoxy, positive silicic acid propyl ester, methyltrimethoxy silane, Union carbide A-162, vinyltrimethoxy silane, vinyltriethoxysilane, dimethyldiethoxysilane.
For of the present invention pair of component condensed type LED joint sealant, described silane coupling agent is the organoalkoxysilane containing amido, epoxy group(ing) or acyloxy.
Preferably, described silane coupling agent is at least one in γ-aminopropyl triethoxysilane, γ-(2,3-glycidoxy) propyl trimethoxy silicane, γ-(methacryloxypropyl) propyl trimethoxy silicane, N-β-(aminoethyl)-γ-aminopropyltrimethoxysilane, γ-glycydoxy Trimethoxy silane.
For of the present invention pair of component condensed type LED joint sealant, described catalyzer is the neutral organotin catalysts of anacidity alkali-free.
Preferably, described catalyzer is at least one in diacetyl acetone tin, methyl aceto acetate tin.
For of the present invention pair of component condensed type LED joint sealant, described B component is obtained by the mixing under rare gas element is as the protection such as nitrogen, helium of each component.
An object of the present invention is also the preparation method providing of the present invention pair of component condensed type LED joint sealant, comprises the following steps:
(1) by each composition mixing and stirring of component A, component A is obtained;
(2) each composition of B component is mixed to get B component under rare gas element is as the protection such as nitrogen, helium;
(3) before using, the B component that the component A obtain step (1) and step (2) obtain mixes rear deaeration by the weight ratio of 10:1 ~ 2:1, obtains soft two component condensed type non-corrosiveness organosilicon sealants after solidification.
The provided by the invention pair of corrosion-free LED organic silicon potting adhesive of component condensed type, adopt the organotin catalysts improved, avoid organotin because acidity is to the corrosion of electronic devices and components, wiring board etc., reach corrosion-free, cementability is good, quick solidifying, surface drying are fast feature, meet electronics embedding fast setting, shorten the requirement of production time.
Embodiment
For better the present invention being described, be convenient to understand technical scheme of the present invention, typical but non-limiting embodiment of the present invention is as follows:
Embodiment 1
A kind of two component condensed type LED organic silicon potting adhesive, comprises following raw material by weight:
It is the α of 50000cps that component A comprises 190 parts of viscosity, and alpha, omega-dihydroxy polydimethyl siloxane, 100 parts of viscosity are the dimethyl silicone oil of 1000cps, 0.1 part of carbon black, 5 parts of weight percent concentration are the aqueous phosphatic of 0.1%;
B component comprises 10 parts of Union carbide A-162s, 1 part of γ-(methacryloxypropyl) propyl trimethoxy silicane, 0.5 part of diacetyl acetone tin;
The weight ratio of component A and B component is 5:1.
Preparation method provided by the invention is adopted to be prepared.
Corrosion-free test is carried out to obtained product.
Testing method is: adopt to solidify on copper sheet to do after the thick condensed type LED organic silicon potting adhesive of 5mm solidifies 2 days two 85 aging and positive 80 DEG C bear the thermal shock of 50 DEG C, finally check whether generation verdigris.
Test result is: produce without verdigris, without coming unstuck.
Set time is 1.8h, and surface drying time is 40min.
Embodiment 2
A kind of two component condensed type LED organic silicon potting adhesive, comprises following raw material by weight:
It is the α of 2000cps that component A comprises 100 parts of viscosity, and alpha, omega-dihydroxy polydimethyl siloxane, 180 parts of viscosity are the dimethyl silicone oil of 50cps, 5 parts of titanium dioxide, 0.5 part of weight percent concentration are the aqueous phosphatic of 0.5%;
B component comprises 1 part of dimethyldiethoxysilane, 5 parts of γ-aminopropyl triethoxysilanes, 3 parts of dibutyl tin laurates;
The weight ratio of component A and B component is 2:1.
Preparation method provided by the invention is adopted to be prepared.
Carry out corrosion-free test to obtained product, as shown in Example 1, test result is testing method: produce without verdigris, without coming unstuck.
Set time is 1.8h, and surface drying time is 50min.
Embodiment 3
A kind of two component condensed type LED organic silicon potting adhesive, comprises following raw material by weight:
It is the α of 10000cps that component A comprises 150 parts of viscosity, and alpha, omega-dihydroxy polydimethyl siloxane, 150 parts of viscosity are the dimethyl silicone oil of 500cps, 3 parts of carbon blacks, 3 parts of weight percent concentration are the aqueous phosphatic of 0.2%;
B component comprises 5 parts of vinyltrimethoxy silanes, 2 parts of N-β-(aminoethyl)-γ-aminopropyltrimethoxysilanes, 2 parts of methyl aceto acetate tin;
The weight ratio of component A and B component is 10:1.
Preparation method provided by the invention is adopted to be prepared.
Carry out corrosion-free test to obtained product, as shown in Example 1, test result is testing method: produce without verdigris, without coming unstuck.
Set time is 2.0h, and surface drying time is 43min.
Applicant states, the present invention illustrates method detailed of the present invention by above-described embodiment, but the present invention is not limited to above-mentioned method detailed, does not namely mean that the present invention must rely on above-mentioned method detailed and could implement.Person of ordinary skill in the field should understand, any improvement in the present invention, to equivalence replacement and the interpolation of ancillary component, the concrete way choice etc. of each raw material of product of the present invention, all drops within protection scope of the present invention and open scope.
Claims (10)
1. a two component condensed type LED organic silicon potting adhesive, is characterized in that, comprise following raw material by weight:
Component A comprises 100 ~ 190 parts of α, alpha, omega-dihydroxy polydimethyl siloxane, 100 ~ 180 parts of softening agent, 0.1 ~ 5 part of tinting material, 0.5 ~ 5 part of deep cure agent;
B component comprises 1 ~ 10 part of linking agent, 1 ~ 5 part of silane coupling agent, 0.5 ~ 3 part of catalyzer;
The weight ratio of component A and B component is 10:1 ~ 2:1.
2. according to claim 1 pair of component condensed type LED joint sealant, is characterized in that, described α, 107 silicon rubber of alpha, omega-dihydroxy polydimethyl siloxane to be viscosity be 2000 ~ 50000cps.
3. according to claim 1 pair of component condensed type LED joint sealant, is characterized in that, the dimethyl silicone oil of described softening agent to be viscosity be 50 ~ 1000cps.
4. according to claim 1 pair of component condensed type LED joint sealant, it is characterized in that, described tinting material is carbon black.
5. according to claim 1 pair of component condensed type LED joint sealant, is characterized in that, described deep cure agent be weight percentage concentration be 0.1% ~ 0.5% aqueous phosphatic.
6. according to claim 1 pair of component condensed type LED joint sealant, it is characterized in that, described linking agent is the alkoxy compound containing alkoxy base;
Preferably, described linking agent is at least two kinds in methyl silicate, tetraethoxy, positive silicic acid propyl ester, methyltrimethoxy silane, Union carbide A-162, vinyltrimethoxy silane, vinyltriethoxysilane, dimethyldiethoxysilane.
7. according to claim 1 pair of component condensed type LED joint sealant, it is characterized in that, described silane coupling agent is the organoalkoxysilane containing amido, epoxy group(ing) or acyloxy;
Preferably, described silane coupling agent is at least one in γ-aminopropyl triethoxysilane, γ-(2,3-glycidoxy) propyl trimethoxy silicane, γ-(methacryloxypropyl) propyl trimethoxy silicane, N-β-(aminoethyl)-γ-aminopropyltrimethoxysilane, γ-glycydoxy Trimethoxy silane.
8. according to claim 1 pair of component condensed type LED joint sealant, is characterized in that, described catalyzer is the neutral organotin catalysts of anacidity alkali-free;
Preferably, described catalyzer is at least one in diacetyl acetone tin, methyl aceto acetate tin, dibutyl tin laurate.
9. according to claim 1 pair of component condensed type LED joint sealant, is characterized in that, described B component is mixed under protection of inert gas by each component to obtain.
10. the preparation method of the two component condensed type LED joint sealants described in any one of claim 1-9, comprises the following steps:
(1) by each composition mixing and stirring of component A, component A is obtained;
(2) each composition of B component is mixed to get B component under protection of inert gas;
(3) before using, the B component that the component A obtain step (1) and step (2) obtain mixes rear deaeration by the weight ratio of 10:1 ~ 2:1, obtains two component condensed type organic silicon seal gum after solidification.
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| CN201410568860.5A CN104293280A (en) | 2014-10-22 | 2014-10-22 | Preparation method of double-component condensed type LED (light-emitting diode) organic silicon pouring sealant |
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| CN201410568860.5A CN104293280A (en) | 2014-10-22 | 2014-10-22 | Preparation method of double-component condensed type LED (light-emitting diode) organic silicon pouring sealant |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105585999A (en) * | 2016-03-02 | 2016-05-18 | 广东杰果新材料有限公司 | Condensed type two-component pouring sealant for LED optical lens and preparation method thereof |
| CN106833501A (en) * | 2016-12-23 | 2017-06-13 | 上海回天新材料有限公司 | Bi-component organic silicon potting adhesive and its production and use |
| CN109096983A (en) * | 2018-07-09 | 2018-12-28 | 广州城建职业学院 | A kind of preparation method of two-component condensed type building structure sealant |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101565600A (en) * | 2008-05-14 | 2009-10-28 | 广州市回天精细化工有限公司 | Low-hardness high-flexibility double-component condensed type organic silicon potting adhesive composition |
| US20110028647A1 (en) * | 2009-07-31 | 2011-02-03 | Wacker Chemie Ag | Silicone Materials Which Crosslink By Condensation At Room Temperature |
| CN103436215A (en) * | 2013-09-05 | 2013-12-11 | 江苏天辰硅材料有限公司 | Condensed-type dual-ingredient organic silica gel for encapsulation |
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2014
- 2014-10-22 CN CN201410568860.5A patent/CN104293280A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101565600A (en) * | 2008-05-14 | 2009-10-28 | 广州市回天精细化工有限公司 | Low-hardness high-flexibility double-component condensed type organic silicon potting adhesive composition |
| US20110028647A1 (en) * | 2009-07-31 | 2011-02-03 | Wacker Chemie Ag | Silicone Materials Which Crosslink By Condensation At Room Temperature |
| CN103436215A (en) * | 2013-09-05 | 2013-12-11 | 江苏天辰硅材料有限公司 | Condensed-type dual-ingredient organic silica gel for encapsulation |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105585999A (en) * | 2016-03-02 | 2016-05-18 | 广东杰果新材料有限公司 | Condensed type two-component pouring sealant for LED optical lens and preparation method thereof |
| CN106833501A (en) * | 2016-12-23 | 2017-06-13 | 上海回天新材料有限公司 | Bi-component organic silicon potting adhesive and its production and use |
| CN106833501B (en) * | 2016-12-23 | 2022-11-15 | 上海回天新材料有限公司 | Bi-component organic silicon pouring sealant as well as preparation method and application thereof |
| CN109096983A (en) * | 2018-07-09 | 2018-12-28 | 广州城建职业学院 | A kind of preparation method of two-component condensed type building structure sealant |
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Address after: Two street 523233 Guangdong province Dongguan City Chudo Zhen Dong Bo Cun Da Xin Wei Lu Daxin Road No. 1 Applicant after: Dongguan million Shun's organosilicon Science and Technology Co., Ltd. Address before: Two street 523233 Guangdong province Dongguan City Chudo Zhen Dong Bo Cun Da Xin Wei Lu Daxin Road No. 1 Applicant before: Dongguan Zhaoshun Organosilicon New Material Technology Co., Ltd . |
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