CN106410343A - Surface-mounted microstrip ferrite circulator - Google Patents
Surface-mounted microstrip ferrite circulator Download PDFInfo
- Publication number
- CN106410343A CN106410343A CN201610933733.XA CN201610933733A CN106410343A CN 106410343 A CN106410343 A CN 106410343A CN 201610933733 A CN201610933733 A CN 201610933733A CN 106410343 A CN106410343 A CN 106410343A
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- CN
- China
- Prior art keywords
- microstrip circuit
- gyromagnetic ferrite
- permanent magnet
- circulator
- ferrite substrate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/32—Non-reciprocal transmission devices
- H01P1/38—Circulators
- H01P1/383—Junction circulators, e.g. Y-circulators
- H01P1/387—Strip line circulators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/32—Non-reciprocal transmission devices
- H01P1/38—Circulators
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- Non-Reversible Transmitting Devices (AREA)
Abstract
The invention discloses a surface-mounted microstrip ferrite circulator, which comprises a gyromagnetic ferrite substrate, a microstrip circuit arranged at the upper surface of the gyromagnetic ferrite substrate and a permanent magnet arranged on the microstrip circuit, and is characterized in that the gyromagnetic ferrite substrate is provided with through holes or openings penetrating through the upper and lower surfaces, pins of the microstrip circuit extend to the lower surface of the gyromagnetic ferrite substrate through the through holes or the openings and form a chip mounting area at the lower surface of the gyromagnetic ferrite substrate, the lower surface of the gyromagnetic ferrite substrate is further provided with a grounding area, and an isolation strip is arranged between the grounding area and the chip mounting area. According to the invention, the through holes or the openings are set so as to enable the microstrip circuit to extend from the upper surface of the gyromagnetic ferrite surface to the lower surface of the gyromagnetic ferrite surface, and the pins of the microstrip circuit are enabled to be located at the same horizontal plane with the grounding area, so that the microstrip ferrite circulator is enabled to be assembled with a PCB (Printed Circuit board) by using an SMT (Surface Mount Technology).
Description
Technical field
The present invention relates to micro-strip ferrite circulator, more particularly to a kind of surface-mount type micro-strip ferrite circulator.
Background technology
With developing rapidly of microwave integrated circuit and microstrip antenna T/R assembly, communication products have to microstrip circulator
How higher requirement, make that microstrip circulator volume is less, weight is lighter, integration degree is higher, production cost is lower, make
The problems such as operation is easier, have become the focus of microstrip circulator research.
Traditional micro-strip ferrite circulator is all embedded (Drop-in) structure, and micro-strip ferrite circulator is embedded in
On pcb board, " T " font pin stretches out from gyromagnetic ferrite upper surface of base plate, then passes through manual welding or gold wire bonding will
Pin is electrically connected with the circuit on pcb board.Because human weld's efficiency is low, be unfavorable for cost control；Gold wire bonding needs to increase
Extra equipment and technique, can increase the cost of the system integration, so, the micro-strip ferrite circulator of this structure can not
Adapt to the growth requirement of modernization integrated technology.
At present, SMT (Surface Mount Technology, surface mounting technology) is a kind of conventional integrated technology,
If can apply it on microstrip ferrite ring and pcb board assembling procedure, it will produce huge economic benefit.
It is therefore desirable to providing a kind of suitable surface-pasted micro-strip ferrite circulator.
Content of the invention
The technical problem to be solved is：A kind of surface-mount type micro-strip ferrite circulator is provided.
In order to solve above-mentioned technical problem, the technical solution used in the present invention is：A kind of surface-mount type microstrip ferrite is gone in ring
Device, the microstrip circuit including gyromagnetic ferrite substrate, being arranged on described gyromagnetic ferrite upper surface of base plate and be arranged on described micro-
With the permanent magnet on circuit, described gyromagnetic ferrite substrate is provided with the through hole running through upper and lower surface or gap, described microstrip circuit
Pin described gyromagnetic ferrite base lower surface is extended to and in described gyromagnetic ferrite by described through hole or described gap
The lower surface of substrate forms Chip Area, and described gyromagnetic ferrite base lower surface is additionally provided with access area, described access area with described
It is provided with isolation strip between Chip Area.
The beneficial effects of the present invention is：Microstrip circuit is arranged through hole or gap prolongs from gyromagnetic ferrite upper surface of base plate
Reach gyromagnetic ferrite base lower surface so that the pin of microstrip circuit and access area are in same plane, thus allowing micro-strip ferrum
Oxysome circulator and pcb board can be assembled using SMT, substantially increase packaging efficiency, simplify production process, reduce
Production cost.
Brief description
Fig. 1 is the circulator top view of the embodiment of the present invention one；
Fig. 2 is the circulator left view of the embodiment of the present invention one；
Fig. 3 is the circulator upward view of the embodiment of the present invention one；
Fig. 4 is the top view after permanent magnet hidden by the embodiment of the present invention one circulator；
Label declaration：
1st, magnetic ferrites substrate；
2nd, microstrip circuit；
21st, pin；
3rd, permanent magnet；
4th, gap；
5th, Chip Area；
6th, access area；
7th, isolation strip.
Specific embodiment
By describing the technology contents of the present invention in detail, being realized purpose and effect, below in conjunction with embodiment and coordinate attached
Figure is explained.
The design of most critical of the present invention is：Through hole or gap are set by microstrip circuit from gyromagnetic ferrite upper surface of base plate
Extend to gyromagnetic ferrite base lower surface so that the pin of microstrip circuit and access area are in same plane thus allowing micro-strip ferrum
Oxysome circulator and pcb board can be assembled using SMT.
Refer to Fig. 1 to Fig. 4, a kind of surface-mount type micro-strip ferrite circulator, including gyromagnetic ferrite substrate, it is arranged on institute
State the microstrip circuit of gyromagnetic ferrite upper surface of base plate and be arranged on permanent magnet on described microstrip circuit, described gyromagnetic ferrite
Substrate is provided with the through hole running through upper and lower surface or gap, and the pin of described microstrip circuit passes through described through hole or described gap extends
To described gyromagnetic ferrite base lower surface and described gyromagnetic ferrite substrate lower surface formed Chip Area, described gyromagnet ferrum
Ferrite substrate lower surface is additionally provided with access area, is provided with isolation strip between described access area and described Chip Area.
Knowable to foregoing description, the beneficial effects of the present invention is：Microstrip circuit is arranged through hole or gap from gyromagnet ferrum
Ferrite substrate upper surface extends to gyromagnetic ferrite base lower surface so that the pin of microstrip circuit and access area are in same putting down
Face, thus micro-strip ferrite circulator and pcb board can be assembled using SMT, substantially increases packaging efficiency, reduces
Production cost.
Further, described microstrip circuit is formed on described gyromagnetic ferrite substrate by photoetching technique plating.
Seen from the above description, the microstrip circuit stability that photoetching technique plating is formed is more preferable, more durable.
Further, described permanent magnet is glued on described microstrip circuit by epoxy resin.
Seen from the above description, epoxy resin can make permanent magnet and microstrip circuit bonding more solid and reliable.
Further, the bottom of described permanent magnet is insulation processing layer.
Further, it is additionally provided with insulating barrier between described permanent magnet and described microstrip circuit.
Seen from the above description, between permanent magnet and microstrip circuit, setting insulating barrier or permanent magnet bottom carry out insulation position
Reason is it can be avoided that permanent magnet produces impact to microstrip circuit, and then affects circulator performance.
Further, described permanent magnet is cylindrical rare-earth permanent magnet.
Further, described gyromagnetic ferrite substrate is made using lithium ferrotianium oxysome.
Further, the central area of described microstrip circuit is using double Y section figures.
Further, described microstrip circuit is provided with three pins.
Further, the shape of described Chip Area is rectangle.
Seen from the above description, because the paster region on pcb board is rectangle mostly, the Chip Area of microstrip circuit is set
It is set to rectangle to be conducive to improving the reliability that circulator is electrically connected with pcb board.
Embodiment one
Refer to Fig. 1 to Fig. 4, embodiments of the invention one are：As shown in figure 1, a kind of surface-mount type microstrip ferrite is gone in ring
Device, the microstrip circuit 2 including gyromagnetic ferrite substrate 1, being arranged on described gyromagnetic ferrite substrate 1 upper surface and be arranged on described
Permanent magnet 3 on microstrip circuit 2, described gyromagnetic ferrite substrate 1 is provided with the gap 4 running through upper and lower surface (in other embodiment
In could be arranged to through hole), incorporated by reference to Fig. 2 and Fig. 3, the pin 21 of described microstrip circuit 2 is extended to described by described gap 4
Gyromagnetic ferrite substrate 1 lower surface the lower surface formation Chip Area 5 in described gyromagnetic ferrite substrate 1, described rotation magnetic iron oxide
Structure base board 1 lower surface is additionally provided with access area 6, is provided with isolation strip 7 between described access area 6 and described Chip Area 5.Specific to this reality
Apply example, gyromagnetic ferrite substrate 1 is dielectric constant is 15, saturation magnetic moment Ms is about the lithium ferrotianium oxysome of 2200Gs, revolve magnetic iron oxide
The overall dimensions of structure base board 1 are about 6mm × 6mm × 3.5mm；Described Chip Area 5 can be rectangle it is also possible to be other shapes
, to adapt to pcb board paster region；Described microstrip circuit 2 is provided with three pins 21, and three described pins 21 are by being arranged on rotation
The gap 4 of 1 three different edge of magnetic ferrites substrate extends to the lower surface of gyromagnetic ferrite substrate 1.
The size of microstrip circuit 2 can be given according to the result that Electromagnetic Simulation calculates, and described microstrip circuit 2 passes through photoetching technique
Plating is formed on described gyromagnetic ferrite substrate 1.As shown in figure 4, in the present embodiment, described microstrip circuit 2 central area
Figure using double Y section designs, be the outer match circuit of λ/4 outside microstrip circuit 2, so that bandwidth increases.
Described permanent magnet 3 is glued on described microstrip circuit 2 by epoxy resin, and described permanent magnet 3 is the dilute of cylinder
Native permanent magnet, preferably samarium cobalt permanent magnet body.When permanent magnet 3 and microstrip circuit 2 gluing, the midpoint of microstrip circuit 2 should be in permanent magnet 3
Central shaft on.In order to avoid permanent magnet 3 produces impact to microstrip circuit 2, the bottom of permanent magnet 3 also carries out insulation processing, shape
Become insulating barrier.It is of course also possible to directly increase an insulating barrier, this insulating barrier between described permanent magnet 3 and described microstrip circuit 2
Glued with permanent magnet 3, microstrip circuit 2 respectively.
In sum, the surface-mount type micro-strip ferrite circulator that the present invention provides can carry out SMT assembling with pcb board, greatly
Improve greatly packaging efficiency, reduce production cost；The microstrip circuit stability that photoetching technique plating is formed is more preferable, more resistance to
With；Permanent magnet and microstrip circuit bonding are solid and reliable, do not interfere with the performance of circulator；What circulator was electrically connected with pcb board can
High by property.
The foregoing is only embodiments of the invention, not thereby limit the present invention the scope of the claims, every using this
The equivalents that bright description and accompanying drawing content are made, or directly or indirectly it is used in the technical field of correlation, all include in the same manner
In the scope of patent protection of the present invention.
Claims (10)
1. a kind of surface-mount type micro-strip ferrite circulator, including gyromagnetic ferrite substrate, is arranged on described gyromagnetic ferrite substrate
The microstrip circuit of upper surface and be arranged on permanent magnet on described microstrip circuit it is characterised in that：Described gyromagnetic ferrite substrate
It is provided with the through hole running through upper and lower surface or gap, the pin of described microstrip circuit extends to institute by described through hole or described gap
State gyromagnetic ferrite base lower surface and the lower surface in described gyromagnetic ferrite substrate forms Chip Area, described gyromagnetic ferrite
Base lower surface is additionally provided with access area, is provided with isolation strip between described access area and described Chip Area.
2. circulator according to claim 1 it is characterised in that：Described microstrip circuit is formed at by photoetching technique plating
On described gyromagnetic ferrite substrate.
3. circulator according to claim 2 it is characterised in that：Described permanent magnet is glued at described micro- by epoxy resin
On band circuit.
4. circulator according to claim 3 it is characterised in that：The bottom of described permanent magnet is insulation processing layer.
5. circulator according to claim 3 it is characterised in that：It is additionally provided between described permanent magnet and described microstrip circuit
Insulating barrier.
6. the circulator according to claim 4 or 5 it is characterised in that：Described permanent magnet is cylindrical rare-earth permanent magnet.
7. circulator according to claim 6 it is characterised in that：Described gyromagnetic ferrite substrate is using lithium ferrotianium oxysome
Make.
8. the circulator according to claim 1-5 and 7 any one it is characterised in that：The central area of described microstrip circuit
Save figure using double Y.
9. circulator according to claim 8 it is characterised in that：Described microstrip circuit is provided with three pins.
10. the circulator according to any one of claim 1-5,7 and 9 it is characterised in that：The shape of described Chip Area is square
Shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610933733.XA CN106410343A (en) | 2016-10-31 | 2016-10-31 | Surface-mounted microstrip ferrite circulator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610933733.XA CN106410343A (en) | 2016-10-31 | 2016-10-31 | Surface-mounted microstrip ferrite circulator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106410343A true CN106410343A (en) | 2017-02-15 |
Family
ID=58011881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610933733.XA Pending CN106410343A (en) | 2016-10-31 | 2016-10-31 | Surface-mounted microstrip ferrite circulator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106410343A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107317078A (en) * | 2017-06-30 | 2017-11-03 | 杭州电子科技大学 | A kind of Ka wave bands laminated type film ferrite micro-strip circulator |
| CN107346838A (en) * | 2017-04-28 | 2017-11-14 | 南京理工大学 | A kind of broad frequency micro-band circulator |
| CN108631033A (en) * | 2018-06-12 | 2018-10-09 | 西南应用磁学研究所 | Minimize SIW surface-mount type circulators |
| CN109273813A (en) * | 2018-11-15 | 2019-01-25 | 西南应用磁学研究所 | A kind of novel surface-mount type circulator and packaging method |
| CN110676548A (en) * | 2019-11-05 | 2020-01-10 | 成都八九九科技有限公司 | Microstrip circulator, isolator and T/R assembly |
| CN110767973A (en) * | 2019-11-05 | 2020-02-07 | 成都八九九科技有限公司 | Microstrip circulator, isolator and T/R assembly |
| CN113555655A (en) * | 2021-09-03 | 2021-10-26 | 南京机电职业技术学院 | Lumped parameter circulator |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000286612A (en) * | 1999-03-31 | 2000-10-13 | Nec Corp | Circulator for high frequency and its manufacture |
| CN102544663A (en) * | 2012-01-13 | 2012-07-04 | 彭龙 | LTCC (Low Temperature Co-Fired Ceramic) laminated micro-strip ferrite circulator |
| CN203085719U (en) * | 2012-11-28 | 2013-07-24 | 南京广顺电子技术研究所 | High-frequency micro-strip substrate type circulator |
| CN104752798A (en) * | 2015-03-12 | 2015-07-01 | 西安电子科技大学 | Recyclable microwave circulator |
| CN105896010A (en) * | 2016-03-21 | 2016-08-24 | 华为技术有限公司 | Circulator |
-
2016
- 2016-10-31 CN CN201610933733.XA patent/CN106410343A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000286612A (en) * | 1999-03-31 | 2000-10-13 | Nec Corp | Circulator for high frequency and its manufacture |
| CN102544663A (en) * | 2012-01-13 | 2012-07-04 | 彭龙 | LTCC (Low Temperature Co-Fired Ceramic) laminated micro-strip ferrite circulator |
| CN203085719U (en) * | 2012-11-28 | 2013-07-24 | 南京广顺电子技术研究所 | High-frequency micro-strip substrate type circulator |
| CN104752798A (en) * | 2015-03-12 | 2015-07-01 | 西安电子科技大学 | Recyclable microwave circulator |
| CN105896010A (en) * | 2016-03-21 | 2016-08-24 | 华为技术有限公司 | Circulator |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107346838A (en) * | 2017-04-28 | 2017-11-14 | 南京理工大学 | A kind of broad frequency micro-band circulator |
| CN107317078B (en) * | 2017-06-30 | 2021-01-01 | 杭州电子科技大学 | Ka wave band lamination type thin film ferrite micro-strip circulator |
| CN107317078A (en) * | 2017-06-30 | 2017-11-03 | 杭州电子科技大学 | A kind of Ka wave bands laminated type film ferrite micro-strip circulator |
| CN108631033A (en) * | 2018-06-12 | 2018-10-09 | 西南应用磁学研究所 | Minimize SIW surface-mount type circulators |
| CN108631033B (en) * | 2018-06-12 | 2023-08-15 | 西南应用磁学研究所 | Miniaturized SIW surface-mounted circulator |
| CN109273813A (en) * | 2018-11-15 | 2019-01-25 | 西南应用磁学研究所 | A kind of novel surface-mount type circulator and packaging method |
| CN109273813B (en) * | 2018-11-15 | 2023-07-07 | 西南应用磁学研究所 | Novel surface-mounted circulator and packaging method |
| CN110767973A (en) * | 2019-11-05 | 2020-02-07 | 成都八九九科技有限公司 | Microstrip circulator, isolator and T/R assembly |
| CN110676548B (en) * | 2019-11-05 | 2021-06-25 | 成都八九九科技有限公司 | Microstrip circulator, isolator and T/R assembly |
| CN110767973B (en) * | 2019-11-05 | 2021-07-06 | 成都八九九科技有限公司 | Microstrip circulator, isolator and T/R assembly |
| CN110676548A (en) * | 2019-11-05 | 2020-01-10 | 成都八九九科技有限公司 | Microstrip circulator, isolator and T/R assembly |
| CN113555655A (en) * | 2021-09-03 | 2021-10-26 | 南京机电职业技术学院 | Lumped parameter circulator |
| CN113555655B (en) * | 2021-09-03 | 2022-09-02 | 南京机电职业技术学院 | Lumped parameter circulator |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170215 |
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| RJ01 | Rejection of invention patent application after publication |