CN106409731A - Nitrogen cooling system of furnace tube, and cooling method for wafer and wafer boat - Google Patents
Nitrogen cooling system of furnace tube, and cooling method for wafer and wafer boat Download PDFInfo
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- CN106409731A CN106409731A CN201610983199.3A CN201610983199A CN106409731A CN 106409731 A CN106409731 A CN 106409731A CN 201610983199 A CN201610983199 A CN 201610983199A CN 106409731 A CN106409731 A CN 106409731A
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- cooling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D9/00—Cooling of furnaces or of charges therein
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D9/00—Cooling of furnaces or of charges therein
- F27D2009/0002—Cooling of furnaces
- F27D2009/0005—Cooling of furnaces the cooling medium being a gas
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D9/00—Cooling of furnaces or of charges therein
- F27D2009/0002—Cooling of furnaces
- F27D2009/0005—Cooling of furnaces the cooling medium being a gas
- F27D2009/0008—Ways to inject gases against surfaces
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a nitrogen cooling system of a furnace tube, and a cooling method for a wafer and a wafer boat. The cooling method comprises the steps of: setting two paths of cooling pipelines in the nitrogen cooling system, wherein each path of cooling pipeline adopts a quality flow controller for controlling a nitrogen flow; and setting different nitrogen flows in the two paths of cooling pipelines, so that the nitrogen flow ejected out from each gas outlet of a first cooling pipe for cooling the wafer boat is less than the nitrogen flow ejected out from each gas outlet of a second cooling pipe for cooling the wafer, thus particles generated at the boat foot part of the wafer boat are blown off by the small-flow nitrogen ejected from the first cooling pipe and then blown away by the large-flow nitrogen ejected from the second cooling pipe. Therefore, the wafer boat and the wafer on the wafer boat can be effectively cooled, and the particles at the boat foot part of the wafer boat can be prevented from being blown onto the wafer.
Description
Technical field
The present invention relates to semiconductor integrated circuit processing technique field, more particularly, to a kind of nitrogen cooling of boiler tube
System and method wafer and cassette being cooled down using this system.
Background technology
Integrated circuit continues to develop toward high density direction, on one piece of less and less chip, incorporates increasing
So that chip is more and more lower to the tolerance of defect, more smaller size of defects have been increasingly becoming yield killer to assembly.
The defect of integrated circuit is tangible pollution and flaw present on wafer, main inclusion：Foreign matter on wafer is (micro-
Dirt, process residues, bad reaction product etc.), graphic defects (the exception imaging that photoetching or etching cause, mechanical scratch
Deformation, color exception causing in uneven thickness etc.), chemical contamination (residual chemicals, organic solvent etc.), material defect
(lattice defect causing in wafer itself or manufacture process).
Integrated circuit fabrication process is carried out in dust free room, and the main source of defect includes：
1) board equipment：The defect of the aging generation that is in operation with unit exception of part；
2) process：Before technique final optimization pass processing procedure reaction in produced pair product；
3) production environment：Comprise toilet's particle level, humiture, electrostatic degree, content of organics；
4) material itself：Including wafer material, process gas, technique pure water, chemicals；
5) operating personnel：Comprise dust-free clothes, gloves.
Wherein, about 80% defect is to produce in process optimization engineering, and about 15% defect is derived from board equipment, and this
A little defect major parts can affect the yield of wafer.
Boiler tube is used for carrying out high-temperature operation to wafer.Many pieces of wafers are loaded on the boat pin in cassette in a horizontal manner,
Cassette can preloaded area below boiler tube vertically into boiler tube, make wafer accept technique in boiler tube, and will after technique
Wafer is transferred to preloaded area again and is cooled down.The nitrogen cooling system (NBS) of boiler tube is arranged on the preloaded area below boiler tube,
For completing to operation but wafer and cassette still in high temperature cool down.
Refer to Fig. 1, Fig. 1 is a kind of nitrogen cooling system structural representation of existing boiler tube.As shown in figure 1, boiler tube
Nitrogen cooling system 20 be arranged on preloaded area below boiler tube, and be located at cassette 10 side dropping to during preloaded area.
Nitrogen cooling system 20 is provided with a cooling line 23, and cooling line 23 connects air supply system, and vertically sets in its termini in apposition
There is the cooling tube 22,25 of two different lengths；Tube wall along each cooling tube 22,25 is respectively equipped with multiple ventholes 21,26, can
Nitrogen is sprayed by these ventholes, wafer and cassette 10 are cooled down.One of them shorter cooling tube 22 is used for crystalline substance
Boat 10 is cooled down；Another longer cooling tube 25 is used for each layer crystal circle placed in cassette 10 is cooled down.Cooling tube
Road 23 is provided with mass flow controller (MFC) 24, for controlling the nitrogen total flow in cooling line.
In above-mentioned existing nitrogen cooling system structure, nitrogen is to flow to two not through same mass flow controller
Ejected with the cooling tube of length and by the venthole of varying number on two cooling tubes.Therefore, from shorter cooling tube
The nitrogen flow that each venthole ejects will be significantly greater than the nitrogen flow ejecting from each venthole of longer cooling tube.
Wafer can deform in high-temperature operation.After the completion of operation, cassette drops to preloaded area, by above-mentioned nitrogen
During air cooling system cooling, wafer will restore to the original state, and rub with the life of cassette boat human hair combing waste and produce particle.
Because the nitrogen flow ejecting from each venthole of shorter cooling tube is more than from longer cooling tube, each goes out
The nitrogen flow that pore ejects, thus the particle that the friction of cassette boat foot position produces can be blown on wafer, and be difficult to again by
The nitrogen of the relatively low discharge ejecting from longer cooling tube blows away, thus have impact on the yield of wafer.
Accordingly, it would be desirable to improve to existing nitrogen cooling system, to avoid blowing to the particle of boat foot position on wafer.
Content of the invention
It is an object of the invention to the drawbacks described above overcoming prior art to exist, provide a kind of nitrogen cooling system of boiler tube
And the cooling means of wafer and cassette, the wafer in cassette can either be cooled down well, can prevent again by cassette boat pin
Grain blows on wafer.
For achieving the above object, technical scheme is as follows：
A kind of nitrogen cooling system of boiler tube, is arranged on the preloaded area below boiler tube, and be located at drop to preloaded area
When cassette sidepiece, described cassette has some layer crystals circle by boat pin horizontal load, and described nitrogen cooling system includes：
First, second cooling line, it is respectively equipped with mass flow controller；
First, second cooling tube, is respectively perpendicular located at first, second cooling line end, along first, second cooling tube
Tube wall is respectively equipped with multiple ventholes, from sidepiece, the wafer cassette and cassette is cooled down respectively for spraying nitrogen；
Wherein, the nitrogen being imported by air supply system, the tune through the respective mass flow controller of first, second cooling line
Section, with different setting flux and flow direction first, second cooling tubes, makes the nitrogen stream ejecting from each venthole of the first cooling tube
Amount less than the nitrogen flow that ejects from each venthole of the second cooling tube, with the particle that produces in cassette boat foot position by first
When the relatively low discharge nitrogen that cooling tube ejects blows off, the larger flow nitrogen being ejected by the second cooling tube is blown away, thus
Prevent particle from falling on wafer.
Preferably, described first, second cooling tube is located at the different lateral attitudes of cassette homonymy.
Preferably, described first, second cooling line is respectively provided with one to several, and is respectively equipped with mass flow control
Device, each first cooling line is provided with one to several the first cooling tubes, each second cooling line be provided with one to several
Two cooling tubes, described first, second cooling tube is arranged in pairs in cassette sidepiece.
Preferably, the length of described second cooling tube be more than the first cooling tube, the venthole on described second cooling tube with
In cassette, the position of wafer corresponds.
Preferably, also include a control unit, it connects the mass flow controller on first, second cooling line, use
In being set by mass flow controller and adjust the nitrogen flow flowing through in first, second cooling line.
Preferably, also include first, second temperature sensing unit, for sensing the temperature of cassette and wafer respectively, described
First, second temperature sensing unit connects control unit respectively.
A kind of wafer and the cooling means of cassette, using the nitrogen cooling system of above-mentioned boiler tube, comprise the following steps：
Step S01：Set the different nitrogen flows flowing through in first, second cooling line；
Step S02：When cassette drops to preloaded area, open nitrogen cooling system, by first, second cooling tube
Venthole is cooled down to cassette and wafer injection nitrogen from sidepiece respectively, and makes to eject from each venthole of the first cooling tube
Nitrogen flow be less than the nitrogen flow that ejects from each venthole of the second cooling tube, prevent the particle on cassette boat pin from blowing to
On wafer；
Step S03：Cassette and wafer are cooled to after design temperature, close nitrogen cooling system, complete to cassette and crystalline substance
The cooling of circle.
Preferably, in step S02, make cassette be in rotation status and cooled down.
Preferably, in step S02, the temperature of cassette and wafer is detected, to control cool time.
Preferably, the cassette according to detection and wafer temperature, adjustment makes to flow through first, second cooling in different cooling stages
Nitrogen in pipeline has different size of flow, to strengthen cooling effect.
From technique scheme as can be seen that the present invention passes through to arrange two-way cooling line nitrogen cooling system, often
Road cooling line is respectively adopted mass flow controller and controls nitrogen flow, and different by arranging in two-way cooling line
Nitrogen flow, makes the nitrogen flow ejecting from each venthole of the first cooling tube of cooling cassette be less than from cool wafers
The nitrogen flow ejecting in each venthole of second cooling tube, with the particle in the position generation of cassette boat foot by the first cooling tube
When the relatively low discharge nitrogen ejecting blows off, the larger flow nitrogen being ejected by the second cooling tube is blown away, thus can either
Cool down the wafer in cassette and cassette well, can prevent from blowing to the particle on cassette boat pin on wafer again.
Brief description
Fig. 1 is a kind of nitrogen cooling system structural representation of existing boiler tube；
Fig. 2 is a kind of nitrogen cooling system structural representation of boiler tube of a preferred embodiment of the present invention.
Specific embodiment
Below in conjunction with the accompanying drawings, the specific embodiment of the present invention is described in further detail.
It should be noted that in following specific embodiments, when describing embodiments of the present invention in detail, in order to clear
Ground represents the structure of the present invention in order to illustrate, special to the structure in accompanying drawing not according to general scale, and carried out local
Amplify, deformation and simplification are processed, therefore, should avoid being understood in this, as limitation of the invention.
In specific embodiment of the invention below, refer to Fig. 2, Fig. 2 is one kind of a preferred embodiment of the present invention
The nitrogen cooling system structural representation of boiler tube.As shown in Fig. 2 a kind of nitrogen cooling system 30 of boiler tube of the present invention, setting
Preloaded area below boiler tube (figure is slightly), and it is located at cassette 10 sidepiece dropping to during preloaded area.Described cassette passes through boat
Pin horizontal load has some layer crystal circles (figure slightly, refers to prior art and understood).
Refer to Fig. 2.Described nitrogen cooling system 30 includes first, second cooling line 33,35, respectively connect first,
First, second cooling tube 32,37 of the second cooling line 33,35, and each self installation on first, second cooling line 33,35
The part such as mass flow controller (MFC) 34,36.
First, second cooling line 33,35 can be set up in parallel, and is separately installed with first, second cooling line 33,35
Mass flow controller 34,36, for controlling the nitrogen flow size flowing through first, second cooling line 33,35 respectively.Logical
Often, nitrogen as cooling cassette and cassette in wafer cooling medium but it is also possible to using other be suitable for cooling medium, this
Bright not limited to this.The source of first, second cooling line 33,35 can connect factory service air supply system respectively, also can be in its quality stream
Merge after amount controller 34,36 and connect factory service air supply system.
In the end (left-hand end of diagram) of the first cooling line 33 vertically equipped with the first cooling tube 32, along the first cooling tube
32 tube wall is machined with the multiple ventholes 31 being distributed up and down, and venthole 31 is arranged towards cassette 10 direction.Led by air supply system
The nitrogen entering, after the Flow-rate adjustment through the first cooling line mass flow controller 34, flows to the first cooling tube 32, then by
Each venthole 31 on one cooling tube wall sprays, and from sidepiece, cassette 10 can be cooled down.
Similarly, the second cooling line 35 ending vertical equipped with the second cooling tube 37, along the pipe of the second cooling tube 37
Wall is equally machined with the multiple ventholes 38 being distributed up and down, and each venthole 38 is arranged towards cassette 10 direction, and every with cassette
The position of layer crystal circle corresponds.Namely a venthole 38 is responsible for purging one piece of wafer of corresponding layer, and by whole
Venthole form the radiation upper and lower uniform cooling air-flow layer of cassette.The nitrogen being imported by air supply system, through the second cooling tube
After the Flow-rate adjustment of road mass flow controller 36, flow to the second cooling tube 37, then by each on the second cooling tube wall
Venthole 38 sprays, and from sidepiece, the wafer cassette 10 can be cooled down.The distribution density of venthole 31,38 can also enter one
Step increaseds or decreases, and this can throughput as needed be configured.
So, the first cooling line 33 and its first cooling tube 32 and the second cooling line 35 and its second cooling tube 37 be just
Define the cooling line of two-way independence.
When high-temperature operation in boiler tube for the wafer completes, cassette drops to preloaded area and it needs to cassette and wafer
Cooled down.Now, by arranging a control unit (figure is slightly), control unit can be connected on first, second cooling line
Mass flow controller flow control is carried out to it.So, by controlling the mass flow control on first, second cooling line
Device processed, you can set respectively and adjust the nitrogen flow flowing through in first, second cooling line.
When being cooled down, nitrogen is imported by air supply system, through first, second cooling line each mass flow controller
After regulation, in first, second cooling line, first, second cooling tube is flowed to respectively with different setting flows, according to calculating
Set flow, the nitrogen flow ejecting from each venthole of the first cooling tube can be made to be less than, and each is given vent to anger from the second cooling tube
The nitrogen flow that hole is ejected.So, when wafer is cooled recovery deformation, itself and the position friction of cassette boat foot are produced
Even if particle by the first cooling tube eject when blowing off compared with the nitrogen of low discharge with respect to the second cooling tube, also can be by by
The nitrogen with respect to the first cooling tube larger flow that two cooling tubes eject blows away immediately, thus can effectively prevent particle from falling
Defect is produced on wafer.
Described first, second cooling tube may be provided at the different lateral attitudes of cassette homonymy, so can approximately spray in the same direction
Radio-nitrogen gas, action effect during strengthening purging particle.
Described first cooling line can arrange one to several, when it is two or more, every road first cooling line
Mass flow controller can be respectively equipped with；Equally, described second cooling line can also arrange one to several, when it is two
When above, every road second cooling line can be respectively equipped with mass flow controller.And, every road first cooling line also can be arranged side by side
It is provided with one to several the first cooling tubes, every road second cooling line also can be provided with one side by side to several the second cooling tubes.Often
One the first cooling tube and second cooling tube partner, and can be looped around cassette sidepiece and be arranged in pairs, so that can be from crystalline substance
The whole side of boat is quickly cooled down to cassette and wafer.Should set around cassette sidepiece between each pair first, second cooling tube
It is set to asymmetric state, in order to avoid cooling air-flow is concentrated flows to crystal circle center.
When controlling the flow corresponding relation of first, second each venthole of cooling tube, by described second cooling tube
Length is set greater than the length of the first cooling tube, can to cool down to all layers of wafer simultaneously.
First, second temperature sensing unit can also be set, for example, can adopt temperature sensor, for sensing crystalline substance respectively
Boat and the surface temperature of wafer.Described first, second temperature sensing unit is respectively connecting to control unit, such control unit
Can be according to the cassette of temperature sensor detection and wafer temperature, in different cooling stages, adjustment flows through first, second cooling
Nitrogen flow size in pipeline, to strengthen cooling effect.Certainly, still should ensure that the nitrogen flow in the first cooling line is less than
Nitrogen flow in second cooling line.
Can also be by installing flap nozzle at venthole additional, thus the angle of nitrogen jet can be converted in cooling procedure
Degree, strengthens purging effect.And first, second cooling line can be connected mechanical arm, thus nitrogen can be converted in cooling procedure
The distance of gas jet, also can promote purging effect.
With reference to specific embodiment, the present invention is used the nitrogen cooling system of above-mentioned boiler tube a kind of wafer and
The cooling means of cassette is described in detail.
Refer to Fig. 2.A kind of wafer of the present invention and the cooling means of cassette, can be using the nitrogen cooling of above-mentioned boiler tube
System, and may include following steps：
Step S01：Before cooling starts, stream is set on two mass flow controllers 34,36 respectively by control unit
Through the different nitrogen flows in first, second cooling line 33,35, and the nitrogen flow flowing through in the first cooling line 33 is little
In flowing through the nitrogen flow in the second cooling line 35.Specifically can be by calculating the nitrogen flow of respective pipeline.
Step S02：Complete high-temperature operation in wafer, when cassette 10 drops to preloaded area or before this default when
Between, nitrogen cooling system 30 can be opened by the control menu of control unit or boiler tube board, and cool down by first, second
The wafer injection nitrogen that the venthole 31,38 of pipe 32,37 loads respectively from sidepiece is to cassette 10 and cassette 10 is cooled down；Cold
Pass through the flow of setting when but, the nitrogen flow ejecting from each venthole 31 of the first cooling tube 32 can be made to be less than from the
The nitrogen flow that each venthole 38 of two cooling tubes 37 ejects, thus the particle producing in cassette boat foot position is cooled down by first
When the relatively low discharge nitrogen that pipe 32 ejects blows off, the larger flow nitrogen that can be ejected by the second cooling tube 37 is immediately by it
Blow away, to prevent the particle on cassette boat pin from blowing on wafer.
Step S03：Cassette and the surface temperature of wafer can constantly be detected by temperature sensor in cooling procedure, control
Unit is known and is cooled to after design temperature by cassette and wafer, you can close nitrogen cooling system 30, complete to cassette and
The cooling of wafer.
In above-mentioned step S02, cassette 10 can be made to be in rotation status and to be cooled down, so that it is uniformly cooled down,
And improve cleaning effect.
Also can be by detecting to the temperature of cassette and wafer, to grasp the state of cooling in time, when controlling cooling
Between, improve operating efficiency.
Particularly according to the cassette constantly detecting and wafer temperature, control unit can understand it is in which kind of rank of cooling
Section, to be required according to the cooling air quantity of different phase, adjustment makes to flow through in first, second cooling line in different cooling stages
Nitrogen there is different size of flow.For example can by cooling procedure be divided into high temperature, in gentle low temperature three phases, in high temperature rank
Section wafer deformation amount of recovery is inconspicuous, and flow is excessive can not to produce corresponding cooling and cleaning effect, can suitably reduce nitrogen
Flow；Maximum in middle thermophase wafer deformation amount of recovery, nitrogen flow can be increased and strengthen convection effects, to reduce rapidly wafer
Temperature simultaneously effectively blows away particle；In cold stage, wafer deformation has substantially been recovered and close to the chilling temperature setting, at this moment can have been subtracted
Little nitrogen flow, to save gas consumption.Cooling effect can be further enhanced by the way, and obtain good particle and go
Except effect.
In sum, the present invention passes through to arrange two-way cooling line in nitrogen cooling system, and every road cooling line is respectively
Nitrogen flow is controlled using mass flow controller, and by arranging different nitrogen flows in two-way cooling line, make from
The second cooling tube that the nitrogen flow ejecting in each venthole of the first cooling tube of cooling cassette is less than from cool wafers is every
The nitrogen flow ejecting in individual venthole, with the particle that produces in cassette boat foot position by the first cooling tube eject less
When flow nitrogen blows off, the larger flow nitrogen being ejected by the second cooling tube is blown away, thus crystalline substance can either be cooled down well
Wafer on boat and cassette, can prevent from blowing to the particle on cassette boat pin on wafer again.
Above-described only the preferred embodiments of the present invention, the patent that described embodiment is simultaneously not used to limit the present invention is protected
The equivalent structure change that shield scope, the specification of therefore every utilization present invention and accompanying drawing content are made, should be included in the same manner
In protection scope of the present invention.
Claims (10)
1. a kind of nitrogen cooling system of boiler tube, is arranged on the preloaded area below boiler tube, and positioned at when dropping to preloaded area
Cassette sidepiece, described cassette has some layer crystals circle by boat pin horizontal load it is characterised in that described nitrogen cooling system bag
Include：
First, second cooling line, it is respectively equipped with mass flow controller；
First, second cooling tube, is respectively perpendicular located at first, second cooling line end, along the tube wall of first, second cooling tube
It is respectively equipped with multiple ventholes, from sidepiece, the wafer cassette and cassette is cooled down respectively for spraying nitrogen；
Wherein, the nitrogen being imported by air supply system, the regulation through the respective mass flow controller of first, second cooling line, with
Different setting flux and flow direction first, second cooling tubes, makes the nitrogen flow ejecting from each venthole of the first cooling tube little
In the nitrogen flow ejecting from each venthole of the second cooling tube, cooled down by first with the particle producing in cassette boat foot position
When the relatively low discharge nitrogen that pipe inspection goes out blows off, the larger flow nitrogen being ejected by the second cooling tube is blown away, thus preventing
Particle is fallen on wafer.
2. the nitrogen cooling system of boiler tube according to claim 1 is it is characterised in that described first, second cooling tube sets
Different lateral attitudes in cassette homonymy.
3. the nitrogen cooling system of boiler tube according to claim 1 is it is characterised in that described first, second cooling line
Be respectively provided with one to several, and be respectively equipped with mass flow controller, each first cooling line be provided with one to several
One cooling tube, each second cooling line is provided with one to several the second cooling tubes, and described first, second cooling tube is in cassette side
Portion is arranged in pairs.
4. the nitrogen cooling system of the boiler tube according to claim 1-3 any one is it is characterised in that described second cools down
The length of pipe is more than the first cooling tube, and the venthole on described second cooling tube is corresponded with the position of wafer in cassette.
5., it is characterised in that also including a control unit, it is even for the nitrogen cooling system of boiler tube according to claim 1
Connect the mass flow controller on first, second cooling line, flow through for setting by mass flow controller and adjusting
First, the nitrogen flow in the second cooling line.
6. the nitrogen cooling system of boiler tube according to claim 5 is it is characterised in that also include first, second temperature sense
Survey unit, for sensing the temperature of cassette and wafer respectively, it is single that described first, second temperature sensing unit connects control respectively
Unit.
7. the cooling means of a kind of wafer and cassette, usage right requires the nitrogen cooling system of the boiler tube described in 1-6 any one
System is it is characterised in that comprise the following steps：
Step S01：Set the different nitrogen flows flowing through in first, second cooling line；
Step S02：When cassette drops to preloaded area, open nitrogen cooling system, by giving vent to anger of first, second cooling tube
Hole is cooled down to cassette and wafer injection nitrogen from sidepiece respectively, and makes the nitrogen ejecting from each venthole of the first cooling tube
Throughput is less than the nitrogen flow ejecting from each venthole of the second cooling tube, prevents the particle on cassette boat pin from blowing to wafer
On；
Step S03：Cassette and wafer are cooled to after design temperature, close nitrogen cooling system, complete to cassette and wafer
Cooling.
8. the cooling means of wafer according to claim 7 and cassette is it is characterised in that in step S02, make cassette be in
Rotation status are cooled down.
9. the cooling means of wafer according to claim 7 and cassette is it is characterised in that in step S02, to cassette and crystalline substance
The temperature of circle is detected, to control cool time.
10. wafer according to claim 9 and cassette cooling means it is characterised in that according to detection cassette and crystalline substance
Circle temperature, adjustment makes the nitrogen flowing through in different cooling stages in first, second cooling line have different size of flow, with
Strengthen cooling effect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610983199.3A CN106409731B (en) | 2016-11-09 | 2016-11-09 | A kind of nitrogen cooling system of boiler tube and the cooling means of wafer and cassette |
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|---|---|---|---|
| CN201610983199.3A CN106409731B (en) | 2016-11-09 | 2016-11-09 | A kind of nitrogen cooling system of boiler tube and the cooling means of wafer and cassette |
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| CN106409731A true CN106409731A (en) | 2017-02-15 |
| CN106409731B CN106409731B (en) | 2019-02-01 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110246791A (en) * | 2019-05-20 | 2019-09-17 | 武汉新芯集成电路制造有限公司 | A kind of wafer handler goes deimpurity equipment and goes deimpurity method |
| CN110739244A (en) * | 2018-07-20 | 2020-01-31 | 东京毅力科创株式会社 | Heat treatment apparatus and heat treatment method |
| CN110864810A (en) * | 2019-11-19 | 2020-03-06 | 上海华力微电子有限公司 | Furnace tube wafer boat temperature detection equipment and furnace tube wafer boat temperature monitoring method |
| CN111834247A (en) * | 2019-04-23 | 2020-10-27 | 北京北方华创微电子装备有限公司 | Cooling device and semiconductor processing equipment |
| CN112349631A (en) * | 2020-11-04 | 2021-02-09 | 长江存储科技有限责任公司 | Gas transmission pipeline and semiconductor machine |
| CN114383426A (en) * | 2022-01-18 | 2022-04-22 | 长鑫存储技术有限公司 | Cooling device, cooling system and diffusion furnace tube device |
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| KR20050015879A (en) * | 2003-08-11 | 2005-02-21 | 삼성전자주식회사 | wafer unloading system of heat setting machine |
| JP2006279055A (en) * | 2006-04-24 | 2006-10-12 | Hitachi Kokusai Electric Inc | Semiconductor manufacturing device |
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