CN106405829A - Laser structure light 3D imaging method - Google Patents
Laser structure light 3D imaging method Download PDFInfo
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- CN106405829A CN106405829A CN201611046961.1A CN201611046961A CN106405829A CN 106405829 A CN106405829 A CN 106405829A CN 201611046961 A CN201611046961 A CN 201611046961A CN 106405829 A CN106405829 A CN 106405829A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/095—Refractive optical elements
- G02B27/0955—Lenses
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B30/00—Optical systems or apparatus for producing three-dimensional [3D] effects, e.g. stereoscopic images
- G02B30/50—Optical systems or apparatus for producing three-dimensional [3D] effects, e.g. stereoscopic images the image being built up from image elements distributed over a 3D volume, e.g. voxels
- G02B30/54—Optical systems or apparatus for producing three-dimensional [3D] effects, e.g. stereoscopic images the image being built up from image elements distributed over a 3D volume, e.g. voxels the 3D volume being generated by moving a 2D surface, e.g. by vibrating or rotating the 2D surface
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to the technical field of 3D imaging, and particularly relates to a laser structure light 3D imaging method. An optical module which is used for generating structure light, a camera, an upper computer and a hardware control circuit are comprised. The optical module comprises an optical path which is formed by successively arranging a laser, a lens and an MEMS galvanometer. The hardware control circuit is composed of an ARM module, an FPGA module, a galvanometer drive circuit module, a laser drive module, an MEMS galvanometer photoelectric detector module and an LD photoelectric detector module. The laser structure light 3D imaging method provided by the invention has the advantages that the requirement of chip resources in operation is reduced; the operation speed and precision are improved; the image processing algorithm of the upper computer is convenient and efficient, and has a great visualization effect; and the method has a great application prospect in various fields such as laser projection, reality enhancement, structure light scanning, laser radar and medical imaging and scanning.
Description
Technical field
The present invention relates to 3D imaging technique field, particularly to a kind of laser structure light 3D imaging method.
Background technology
Current 3D imaging and 3D projection etc. are all to be imaged with speckle light source or LED light source mostly.But it is traditional
Speckle is imaged, and due to the problem of high spatial coherence, can produce speckle random in a large number or granular pattern, have a strong impact on into
As effect；Although LED light source is imaged it can be avoided that this distortion, for high speed imaging, the brightness due to itself is inadequate
Its application is made to have certain limitation.Because the brightness of laser is high, coherence is good, and flash time is short, energy density
Greatly the advantages of, so that the application of laser is more and more extensive, is widely applied to various fields.The micro- galvanometer of MEMS is inclined
Turn when laser beam because the difference of deflection centerline velocities is so that the width of the grating obtaining is different and brightness disproportionation
Even, so that its application is subject to one the problems such as the image energy skewness even noise obtaining in 3D modeling imaging process
Definite limitation.
Content of the invention
In order to solve the problems, such as foregoing invention, a kind of laser structure light 3D imaging method, including the light for generating structure light
Learn module, video camera, host computer and hardware control circuit, described optics module is included by laser instrument, lens and the micro- galvanometer of MEMS
It is arranged in order the light path of composition；Described hardware control circuit is by ARM module, FPGA module, galvanometer drive circuit module, laser instrument
Drive module, MEMS galvanometer photodetector module and LD photodetector module composition.Comprise the steps：
Step one, calculate the laser instrument equidistantly waiting brightness laser mechanism light by ARM module goes out light moment point；
Step 2, ARM module sends result of calculation to FPGA module, and FPGA module is according to the result of calculation in step one
By Laser Drive module, laser instrument is controlled, by galvanometer drive module, to MEMS, micro- galvanometer is controlled；
Step 3, laser instrument under the control of FPGA module outgoing laser beams to lens；
Step 4, the incident beam modulated of laser instrument is become to scatter uniform laser lines by lens, and is incident to that MEMS is micro- to shake
Mirror；
Step 5, MEMS galvanometer photodetector module is acquired to the phase information of MEMS galvanometer, and will collect
Information transmission to ARM module；LD photodetector module is acquired to by the electric current of LD laser instrument, and collection is anti-
Feedforward information passes to ARM module, controls LD laser instrument to always work in more than threshold current with this；ARM module is according to reception
What information recalculated laser instrument goes out light moment point, and this is gone out light moment point information transmission to FPGA module；
Step 6, the laser instrument timing point information that FPGA module is transmitted according to ARM module, real-time adjustment control laser instrument and
The rotation of MEMS galvanometer, incident laser lines are output as equidistantly waiting the structure light of brightness by MEMS galvanometer；
Step 7, with described structure light scan object to be detected, ccd video camera is under the control of ARM module to detected
Object is shot, and records the structure light image being reflected by this object, and by image storage module, image is returned to ARM mould
Block；
Step 8, ARM module is transferred to host computer by obtaining image information, and by host computer, image is processed, and leads to
Cross and demarcate the three-dimensional coordinate that contrast obtains detected material swept-volume, host computer is processed again to three-dimensional coordinate, is obtained with this
The 3-D view of object.
It is preferably, in described step 2, ARM module obtains the maximum deflection angle of the micro- galvanometer of described MEMS according to equation below
Degree and described laser instrument go out light moment point,
Wherein, βiFor the angle away from maximum emergent ray for the i-th moment emergent ray, N is the open-wire line bar in the scanning half period
Or the quantity of concealed wire bar；
Wherein, tiGo out light moment point for laser instrument, f is galvanometer frequency, T is the rotation period of galvanometer；FPGA module control
The micro- galvanometer of MEMS processed carries out resonance；FPGA module controls laser instrument with tiCarry out break-make for going out light moment point.
It is preferably, described laser instrument is LD laser instrument.
It is preferably, described lens are two-sided lens, wherein one side is incident beam can be focused and entering of collimating
Penetrate face, in addition one side is can be by the exit facet of incident beam divergence uniformly lines.
A kind of equidistant LASER Light Source structure light control algolithm of homogeneous energy
During MEMS galvanometer and laser instrument Collaborative Control, the inequality with width and brightness of the structure light obtaining
Even defect, this method passes through the structure light that modeling has obtained equidistantly and waited brightness, overcomes this two defects, obtains uniformly
The equidistant structure light of energy.
Initially set up the reference model of MEMS galvanometer and laser instrument, α is the maximum angle of structure light, βiCarve during for i-th
Penetrate the angle of light line-spacing maximum emergent ray, l1And l2For two diverse locations in galvanometer rotation process.N is the scanning half period
Interior open-wire line bar or the quantity of concealed wire bar.D is the distance at galvanometer center to scan screen.Setting number of scanning lines N=8192, α=
60 °, frequency f=456Hz of MEMS galvanometer, with the maximum angle of the deflection of MEMS galvanometer as reference point, obtain it corresponding
Movement locus expression formula：
According to reference model, it is derived by
The deflection angle of corresponding moment MEMS galvanometer is obtained with this；
Angle will be obtained substitute into following formula obtaining equidistant laser instrument and going out light moment point,
Analysis obtains two moment point t of the maximum time interval of structure brightness8192To t8193, with 0～255 this 256
Number quantifying the energy of each structure light, by calculate each structure light time interval, represent high-high brightness with 255
Structure light, obtains the time difference of high-high brightness, carries out following computing：
Δtmin=t8192-t8193
Δtmin* 255=ξ (constant, the high-high brightness of quantization)
Obtain the corresponding energy of each structure light, you can obtain the structural light stripes of uniform luminance：
Pu(t)=ξ/Δ tmin
Reconstructed with the 16384 equidistant structure lights waiting brightness obtaining and obtain different light and shade fringe number, you can
To the equidistant light and shade striped waiting brightness.
Realize the equidistant structural light stripes waiting brightness obtaining by hardware and software.
A kind of 3D scanning imaging system, including the light path being made up of the laser instrument being arranged in order, lens, galvanometer, galvanometer with
Galvanometer drive circuit module connects, and laser instrument is connected with Laser Drive module, described galvanometer drive circuit module and laser instrument
Drive module is all connected with FPGA module, and FPGA module is also connected with ARM module, and described galvanometer is the micro- galvanometer of MEMS；ARM module is passed through
Laser instrument photoelectric detection module is connected with laser instrument, is connected with galvanometer by galvanometer photoelectric detection module；ARM module also connects respectively
Map interlinking is as host computer, memory module and left and right two ccd video camera；
It is preferably, described lens are two-sided lens, wherein one side is incident beam can be focused and entering of collimating
Penetrate face, in addition one side is can be by the exit facet of incident beam divergence uniformly lines.
It is preferably, described laser instrument is LD laser instrument.I.e. semiconductor laser.
It is preferably, ARM module obtains the maximum deflection angle of the micro- galvanometer of described MEMS and described laser according to equation below
Device goes out light moment point,
Wherein, βiFor the angle away from maximum emergent ray for the i-th moment emergent ray, N is the open-wire line bar in the scanning half period
Or the quantity of concealed wire bar；
Wherein, tiGo out light moment point for laser instrument, f is galvanometer frequency, T is the rotation period of galvanometer；FPGA module control
The micro- galvanometer of MEMS processed is with βiCarry out resonance for resonance angle；FPGA module controls laser instrument with tiCarry out break-make for going out light moment point.
MEMS galvanometer drive module includes booster circuit, filter circuit, to obtain driving the voltage of electrostatic MEMS galvanometer,
On the other hand export sinusoidal signal or square-wave signal by ARM and drive galvanometer with resonance frequency；
MEMS galvanometer drive module and LD Laser Drive module control optics module to produce uniform scattering laser bundle, warp
The Collaborative Control crossing ARM and FPGA obtains the laser grating of the brightness such as equidistantly；
The information transmission collecting to ARM, is examined by MEMS galvanometer photodetector module by the feedback information obtaining
Survey frequency and the phase place of MEMS galvanometer；The feedback information of collection is passed to ARM by LD photodetector module, obtains LD laser instrument
Unlatching threshold value；
Equidistantly wait the object that the laser raster scan of brightness is detected, ARM controls ccd video camera module with certain
The time interval laser grating image that is reflected by the object of shooting, and these images are passed to ARM carry out caching process；
The image that upper computer module passes to ARM carries out strengthening, filters, processes, and obtains object by demarcating contrast
The three-dimensional coordinate of scanning, host computer is processed again to three-dimensional coordinate, obtains object after the reconstruct of these cloud three-dimensional datas
3-D view.
The work process of 3D scanning imaging system is：
1st, adopt high-power laser emitting laser beam, focused on by the one side of two-sided lens and quasi- value, another side
Divergent laser beam, scattering uniformly laser rays bar；
2nd, galvanometer drive circuit module controls MEMS galvanometer, is allowed to, according to certain track motion, reach resonant condition；
3rd, MEMS galvanometer photodetector module is acquired to the phase information of MEMS galvanometer, and by the information collecting
Pass to ARM module；LD photodetector module is acquired to by the electric current of LD laser instrument, and the feedback information by collection
Pass to ARM module, control LD laser instrument to always work in more than threshold current with this；ARM module is according to the information weight receiving
Newly calculate laser instrument goes out light moment point, and this is gone out light moment point information transmission to FPGA module；
4th, the laser instrument timing point information that FPGA module is transmitted according to ARM module, real-time adjustment controls laser instrument and MEMS
The rotation of galvanometer, incident laser lines are output as equidistantly waiting the structure light of brightness by MEMS galvanometer；
5th, with described structure light scan object to be detected, ccd video camera enters to object to be detected under the control of ARM module
Row shoots, and records the structure light image being reflected by this object, and by image storage module, image is returned to ARM module；
6th, ARM module is transferred to host computer by obtaining image information, and by host computer, image is processed, by demarcating
Contrast obtains the three-dimensional coordinate of detected material swept-volume, and host computer is processed again to three-dimensional coordinate, obtains object with this
3-D view.
Wherein host computer selects computer, in host computer, defines the two-dimensional grid of a unlimited subdivision, demarcates each intersection point
Coordinate be (x0, y0), (x1, y1), (x2, y2), (x3, y3) ..., (xn-1, yn-1), (xn, yn)
By the good two-dimensional grid coordinate of correlation calibration and certain algorithm, it is calculated the seat of each point on two dimensional image
Mark, exports and stores the two-dimensional coordinate value of each point.
Each point distance away from ccd video camera on object is obtained by the triangle telemetry of laser, host computer counts to these
Obtain, according to carrying out restructuring Screening Treatment, the depth coordinate that on object, each is put, recombinate with the two-dimensional coordinate that the first step obtains, obtain
The three-dimensional coordinate of each point on image.
The three-dimensional coordinate of the image of the camera coordinate system obtaining is changed, is obtained each figure under world coordinate system
The three-dimensional coordinate of picture.
The cloud data that a series of three-dimensional coordinates obtaining are constituted is processed, and realizes thing using upper computer software algorithm
The 3D modeling of body, namely：Reconstruct obtains the body form of the solid of three-dimensional.It is existing skill that two dimensional image converts to 3-D view
Art, will not be described here.
The beneficial effect that technical scheme provided in an embodiment of the present invention is brought is：Produced equidistant etc. using the micro- galvanometer of MEMS
The sweep mechanism light of brightness.
Solve mechanism's striations width that laser emitting light obtains in MEMS in deflection and brightness not
Uniform problem, has obtained equidistantly and has waited the laser structure light of brightness.
MEMS galvanometer, LD laser instrument and ccd video camera are worked in coordination with by ARM module and FPGA module, on the one hand reduces fortune
During row, resources of chip is required, arithmetic speed and precision can be improved simultaneously, on the other hand, host computer processes image processing algorithm
More convenient and quicker, effect of visualization is more preferable.Thus, in laser projection, augmented reality, structure light scan, laser radar and medical treatment
There is good application future in imaging and the various fields such as scanning.
Brief description
Fig. 1 is the MEMS galvanometer of the embodiment of the present invention and the reference model figure of laser instrument.
Fig. 2 is that the laser instrument of the embodiment of the present invention goes out the structure light spacing line chart corresponding to light moment point.
Fig. 3 goes out light moment curve chart for the laser instrument corresponding to equidistant structure light of the embodiment of the present invention.
When Fig. 4 is the N=4 of the embodiment of the present invention, when the laser instrument before and after optimization corresponding to equidistant structure light goes out light
Carve and correlation curve.
When Fig. 5 is the N=8 of the embodiment of the present invention, when the laser instrument before and after optimization corresponding to equidistant structure light goes out light
Carve and correlation curve.
When Fig. 6 is the N=1024 of the embodiment of the present invention, the laser instrument before and after optimization corresponding to equidistant structure light goes out light
Moment and correlation curve.
Fig. 7 is 8 equidistant isoluminant gratings of the embodiment of the present invention.
Fig. 8 is 32 equidistant isoluminant gratings of the embodiment of the present invention.
Fig. 9 is 64 equidistant isoluminant gratings of the embodiment of the present invention.
Figure 10 is 128 equidistant isoluminant gratings of the embodiment of the present invention.
Figure 11 is the theory diagram of the embodiment of the present invention.
Figure 12 is the flowchart of the embodiment of the present invention.
Figure 13 is the galvanometer drive circuit figure of the embodiment of the present invention.
Figure 14 is the voltage conversion circuit figure one of the embodiment of the present invention.
Figure 15 is the voltage conversion circuit figure two of the embodiment of the present invention.
Figure 16 is the voltage conversion circuit figure three of the embodiment of the present invention.
Figure 17 is the voltage conversion circuit figure four of the embodiment of the present invention.
Figure 18 is the laser instrument power supply circuit of the embodiment of the present invention.
Figure 19 is the drive circuit for laser figure of the embodiment of the present invention.
Figure 20 is that the host computer of the embodiment of the present invention demarcates grid schematic diagram.
Figure 21 is the camera coordinate system of the embodiment of the present invention and the transition diagram of world coordinate system.
Figure 22 is the laser raster scan object exemplary plot that photographs of left side CCD of the embodiment of the present invention.
Figure 23 is the laser raster scan object example that photographs of right side CCD of the embodiment of the present invention.
Figure 24 is the object exemplary plot of the 3D reconstruct of the embodiment of the present invention.
Specific embodiment
Embodiment 1
Referring to Fig. 1 to Figure 24, the present invention provides a kind of laser structure light 3D imaging method, including for generating structure light
Optics module, video camera, host computer and hardware control circuit, optics module include by laser instrument, lens and the micro- galvanometer of MEMS according to
The secondary light path rearranging；Hardware control circuit is by ARM module, FPGA module, galvanometer drive circuit module, Laser Drive mould
Block, MEMS galvanometer photodetector module and LD photodetector module composition.Comprise the steps：
Step one, calculate the laser instrument equidistantly waiting brightness laser mechanism light by ARM module goes out light moment point；
Step 2, ARM module sends result of calculation to FPGA module, and FPGA module is according to the result of calculation in step one
By Laser Drive module, laser instrument is controlled, by galvanometer drive module, to MEMS, micro- galvanometer is controlled；
Step 3, laser instrument under the control of FPGA module outgoing laser beams to lens；
Step 4, the incident beam modulated of laser instrument is become to scatter uniform laser lines by lens, and is incident to that MEMS is micro- to shake
Mirror；
Step 5, MEMS galvanometer photodetector module is acquired to the phase information of MEMS galvanometer, and will collect
Information transmission to ARM module；LD photodetector module is acquired to by the electric current of LD laser instrument, and collection is anti-
Feedforward information passes to ARM module, controls LD laser instrument to always work in more than threshold current with this；ARM module is according to reception
What information recalculated laser instrument goes out light moment point, and this is gone out light moment point information transmission to FPGA module；
Step 6, the laser instrument timing point information that FPGA module is transmitted according to ARM module, real-time adjustment control laser instrument and
The rotation of MEMS galvanometer, incident laser lines are output as equidistantly waiting the structure light of brightness by MEMS galvanometer；
Step 7, uses structure light scan object to be detected, and ccd video camera is under the control of ARM module to object to be detected
Shot, record the structure light image being reflected by this object, and image is returned to by ARM module by image storage module；
Step 8, ARM module is transferred to host computer by obtaining image information, and by host computer, image is processed, and leads to
Cross and demarcate the three-dimensional coordinate that contrast obtains detected material swept-volume, host computer is processed again to three-dimensional coordinate, is obtained with this
The 3-D view of object.
In step 2, ARM module obtains the maximum deflection angle of the micro- galvanometer of MEMS according to equation below and laser instrument goes out light
Moment point,
Wherein, βiFor the angle away from maximum emergent ray for the i-th moment emergent ray, N is the open-wire line bar in the scanning half period
Or the quantity of concealed wire bar；
Wherein, tiGo out light moment point for laser instrument, f is galvanometer frequency, T is the rotation period of galvanometer；FPGA module control
The micro- galvanometer of MEMS processed carries out resonance；FPGA module controls laser instrument with tiCarry out break-make for going out light moment point.
Laser instrument is LD laser instrument.
Lens are two-sided lens, and wherein one side is the plane of incidence that incident beam can be focused and collimate, in addition one
Face is can be by the exit facet of incident beam divergence uniformly lines.
A kind of equidistant LASER Light Source structure light control algolithm of homogeneous energy
During MEMS galvanometer and laser instrument Collaborative Control, the inequality with width and brightness of the structure light obtaining
Even defect, this method passes through the structure light that modeling has obtained equidistantly and waited brightness, overcomes this two defects, obtains uniformly
The equidistant structure light of energy.
Initially set up the reference model of MEMS galvanometer and laser instrument, α is the maximum angle of structure light, βiCarve during for i-th
Penetrate the angle of light line-spacing maximum emergent ray, l1And l2For two diverse locations in galvanometer rotation process.N is the scanning half period
Interior open-wire line bar or the quantity of concealed wire bar.D is the distance at galvanometer center to scan screen.Setting number of scanning lines N=8192, α=
60 °, frequency f=456Hz of MEMS galvanometer, with the maximum angle of the deflection of MEMS galvanometer as reference point, obtain it corresponding
Movement locus expression formula：
According to reference model, it is derived by
The deflection angle of corresponding moment MEMS galvanometer is obtained with this；
Angle will be obtained substitute into following formula obtaining equidistant laser instrument and going out light moment point,
Analysis obtains two moment point t of the maximum time interval of structure brightness8192To t8193, with 0～255 this 256
Number quantifying the energy of each structure light, by calculate each structure light time interval, represent high-high brightness with 255
Structure light, obtains the time difference of high-high brightness, carries out following computing：
Δtmin=t8192-t8193
Δtmin* 255=ξ (constant, the high-high brightness of quantization)
Obtain the corresponding energy of each structure light, you can obtain the structural light stripes of uniform luminance：
Pu(t)=ξ/Δ tmin
Reconstructed with the 16384 equidistant structure lights waiting brightness obtaining and obtain different light and shade fringe number, you can
To the equidistant light and shade striped waiting brightness.
Realize the equidistant structural light stripes waiting brightness obtaining by hardware and software.
A kind of 3D scanning imaging system, including the light path being made up of the laser instrument being arranged in order, lens, galvanometer, galvanometer with
Galvanometer drive circuit module connects, and laser instrument is connected with Laser Drive module, galvanometer drive circuit module and Laser Drive
Module is all connected with FPGA module, and FPGA module is also connected with ARM module, and galvanometer is the micro- galvanometer of MEMS；ARM module passes through laser optical
Electric detecting module is connected with laser instrument, is connected with galvanometer by galvanometer photoelectric detection module；ARM module is also respectively connected with image
Position machine, memory module and left and right two ccd video camera；
Lens are two-sided lens, and wherein one side is the plane of incidence that incident beam can be focused and collimate, in addition one
Face is can be by the exit facet of incident beam divergence uniformly lines.
Laser instrument is LD laser instrument.I.e. semiconductor laser.
ARM module obtains the maximum deflection angle of the micro- galvanometer of MEMS according to equation below and laser instrument goes out light moment point,
Wherein, βiFor the angle away from maximum emergent ray for the i-th moment emergent ray, N is the open-wire line bar in the scanning half period
Or the quantity of concealed wire bar；
Wherein, tiGo out light moment point for laser instrument, f is galvanometer frequency, T is the rotation period of galvanometer；FPGA module control
The micro- galvanometer of MEMS processed is with βiCarry out resonance for resonance angle；FPGA module controls laser instrument with tiCarry out break-make for going out light moment point.
MEMS galvanometer drive module includes booster circuit, filter circuit, to obtain driving the voltage of electrostatic MEMS galvanometer,
On the other hand export sinusoidal signal or square-wave signal by ARM and drive galvanometer with resonance frequency；
MEMS galvanometer drive module and LD Laser Drive module control optics module to produce uniform scattering laser bundle, warp
The Collaborative Control crossing ARM and FPGA obtains the laser grating of the brightness such as equidistantly；
The information transmission collecting to ARM, is examined by MEMS galvanometer photodetector module by the feedback information obtaining
Survey frequency and the phase place of MEMS galvanometer；The feedback information of collection is passed to ARM by LD photodetector module, obtains LD laser instrument
Unlatching threshold value；
Equidistantly wait the object that the laser raster scan of brightness is detected, ARM controls ccd video camera module with certain
The time interval laser grating image that is reflected by the object of shooting, and these images are passed to ARM carry out caching process；
The image that upper computer module passes to ARM carries out strengthening, filters, processes, and obtains object by demarcating contrast
The three-dimensional coordinate of scanning, host computer is processed again to three-dimensional coordinate, obtains object after the reconstruct of these cloud three-dimensional datas
3-D view.
Peripheral circuit aspect is not technical key point, there are not necessary inventive features, those skilled in the art
Use can be replaced with other interlock circuits.
The micro- galvanometer of MEMS, using electrostatic MEMS galvanometer, drives galvanometer so that galvanometer is reached by galvanometer drive circuit module
Resonant condition, the maximum deflection angle of MEMS galvanometer is 60 degree.
Laser Drive module, is spaced by the make-and-break time that driving chip controls LD laser instrument, and LD laser instrument
Intensification modulation etc.；The main control chip model of laser control module is MAX3601A.
MEMS galvanometer drive circuit module, mainly includes D.C. regulated power supply, boost chip, operational amplification circuit.This mould
Block is used for the voltage required for output driving MEMS galvanometer；MEMS galvanometer drive module is with LM2733YML for main control chip control
The booster circuit of system
ARM module, calculate the equidistant LD laser instrument waiting brightness laser mechanism light goes out light moment point, passes to FPGA
To control the deflection of laser instrument and MEMS galvanometer, the main control chip model of ARM module is STM32F107VCT6.
FPGA module, Collaborative Control MEMS galvanometer and LD laser instrument, the resonance along with MEMS galvanometer is so that uniformly swash
Light mechanism light becomes the equidistant laser light mechanism light waiting brightness.The master chip XC6SLX45-2CSG32 of FPGA module.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all spirit in the present invention and
Within principle, any modification, equivalent substitution and improvement made etc., should be included within the scope of the present invention.
Claims (4)
1. a kind of laser structure light 3D imaging method, including for the optics module of generating structure light, video camera, host computer and hard
Part control circuit, described optics module includes being arranged in order, by laser instrument, lens and the micro- galvanometer of MEMS, the light path forming；Described
Hardware control circuit is by ARM module, FPGA module, galvanometer drive circuit module, Laser Drive module, MEMS galvanometer light electrical resistivity survey
Survey device module and LD photodetector module composition it is characterised in that：
Step one, calculate the laser instrument equidistantly waiting brightness laser mechanism light by ARM module goes out light moment point；
Step 2, ARM module sends result of calculation to FPGA module, and FPGA module is passed through according to the result of calculation in step one
Laser Drive module is controlled to laser instrument, by galvanometer drive module, to MEMS, micro- galvanometer is controlled；
Step 3, laser instrument under the control of FPGA module outgoing laser beams to lens；
Step 4, the incident beam modulated of laser instrument is become to scatter uniform laser lines by lens, and is incident to the micro- galvanometer of MEMS；
Step 5, MEMS galvanometer photodetector module is acquired to the phase information of MEMS galvanometer, and by the letter collecting
Breath passes to ARM module；LD photodetector module is acquired to by the electric current of LD laser instrument, and the feedback letter by collection
Breath passes to ARM module, controls LD laser instrument to always work in more than threshold current with this；ARM module is according to the information receiving
Recalculate laser instrument goes out light moment point, and this is gone out light moment point information transmission to FPGA module；
Step 6, the laser instrument timing point information that FPGA module is transmitted according to ARM module, real-time adjustment controls laser instrument and MEMS
The rotation of galvanometer, incident laser lines are output as equidistantly waiting the structure light of brightness by MEMS galvanometer；
Step 7, with described structure light scan object to be detected, ccd video camera is under the control of ARM module to object to be detected
Shot, record the structure light image being reflected by this object, and image is returned to by ARM module by image storage module；
Step 8, ARM module is transferred to host computer by obtaining image information, and by host computer, image is processed, by mark
Fixed contrast obtains the three-dimensional coordinate of detected material swept-volume, and host computer is processed again to three-dimensional coordinate, obtains object with this
3-D view.
2. laser structure light 3D imaging method according to claim 1 is it is characterised in that in described step 2, ARM module
The maximum deflection angle of the micro- galvanometer of described MEMS is obtained according to equation below and described laser instrument goes out light moment point,
Wherein, βiFor the angle away from maximum emergent ray for the i-th moment emergent ray, N is open-wire line bar in the scanning half period or dark
The quantity of lines；
Wherein, tiGo out light moment point for laser instrument, f is galvanometer frequency, T is the rotation period of galvanometer；FPGA module controls MEMS
Micro- galvanometer carries out resonance；FPGA module controls laser instrument with tiCarry out break-make for going out light moment point.
3. laser structure light 3D imaging method according to claim 1 is it is characterised in that described laser instrument is LD laser
Device.
4. laser structure light 3D imaging method according to claim 1 it is characterised in that described lens be two-sided lens,
Wherein one side is the plane of incidence that incident beam can be focused and collimate, and in addition one side is can to become incident beam divergence
The uniformly exit facet of lines.
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| CN110726383A (en) * | 2019-09-26 | 2020-01-24 | 成都市众智三维科技有限公司 | High-precision integrated three-dimensional measurement system based on MEMS |
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| CN111367138A (en) * | 2020-04-14 | 2020-07-03 | 长春理工大学 | Novel laser scanning projection device |
| CN111486791A (en) * | 2020-05-27 | 2020-08-04 | 中科融合感知智能研究院(苏州工业园区)有限公司 | Device for adaptively adjusting light quality of sine stripe structure and operation method |
| CN112958973A (en) * | 2021-02-08 | 2021-06-15 | 西安知象光电科技有限公司 | Welding vision locating device of medium plate robot based on structured light three-dimensional vision |
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