CN106404533B - A kind of solder joint detection method - Google Patents
A kind of solder joint detection method Download PDFInfo
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- CN106404533B CN106404533B CN201610761540.0A CN201610761540A CN106404533B CN 106404533 B CN106404533 B CN 106404533B CN 201610761540 A CN201610761540 A CN 201610761540A CN 106404533 B CN106404533 B CN 106404533B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/026—Specifications of the specimen
- G01N2203/0296—Welds
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Abstract
Present invention seek to address that the problem of existing solder joint detection method rapidly can not separate underproof solder joint while guaranteeing that qualified solder joint is intact from qualified solder joint, a kind of solder joint detection method is provided, it realizes that the solder joint detection system includes probe, pressure sensor, control system and alarm system by solder joint detection system；The alarm system, the pressure sensor are electrically connected with the control system respectively；The probe abuts with the pressure sensor and is used to incude pressure suffered by the probe.The solder joint detection method includes initialization step, thrust application step, thrust magnitude read step, data analysis step and analysis result output step.The invention has the advantages that rapidly underproof solder joint can be separated from qualified solder joint while guaranteeing that qualified solder joint is intact.
Description
Technical field
The present invention relates to solder joint detection technique fields, in particular to a kind of solder joint detection method.
Background technique
The underproof solder joint of welding quality the pernicious quality events such as can fall off or even cause short-circuit fire in being used for a long time.Weldering
Point detection technique be in order to judge the quality of solder joint whether He Ge technology.
Existing solder joint detection method can not while guaranteeing that qualified solder joint is intact rapidly by underproof solder joint from
The problem of being separated in qualified solder joint.
Summary of the invention
The present invention is intended to provide a kind of solder joint detection method, can not guarantee qualification to solve existing solder joint detection method
The problem of rapidly underproof solder joint is separated from qualified solder joint while solder joint is intact.
The embodiment of the present invention is achieved in that
A kind of solder joint detection method, the solder joint detection method realize that solder joint detection system includes by solder joint detection system
Probe, pressure sensor, control system and alarm system.Alarm system, pressure sensor are electrically connected to the control system respectively.
Probe abuts with pressure sensor and is used for pressure suffered by inducing probes.Detection method includes the following steps for solder joint:
Initialization step: the minimum thrust that up-to-standard solder joint is able to bear without being destroyed is set in the controls
Value.
Thrust applies step: the probe of solder joint detection system being resisted against solder joint, butt welding point application gradually increases tangential
Thrust.
Thrust magnitude read step: pressure sensor reads the tangential thrust that is applied on solder joint, and by the tangential thrust value
It is sent to control system.
Data analysis step: control system analyzes the variation tendency of the size of the tangential thrust value received, and
Judge whether the quality of solder joint is qualified based on the analysis results.
It analyzes result and exports step: if data analysis step determines that quality of welding spot is qualified, matter being exported by alarm system
Measure qualifying signal.If data analysis step determines that quality of welding spot is unqualified, signal off quality is exported by alarm system.
Solder joint detection method in the present embodiment by applying tangential thrust with the probe butt welding point of solder joint detection system, and
The size and variation tendency that the tangential thrust is incuded with pressure sensor, for judging whether quality of welding spot is qualified.What it judged
Principle is, when the firm welding degree of solder joint is unqualified, solder joint will be destroyed under the effect of the tangential thrust of probe, presses in this way
The case where stress for the probe that force snesor senses is by declining can prove that solder joint welding quality is unqualified；If effect
When the tangential thrust of solder joint is more than minimum thrust value, the pressure that pressure sensor senses does not occur decline situation, then it represents that
Solder joint is able to bear the thrust of minimum thrust value, i.e. expression quality of welding spot is qualified.
Further:
Initialization step further includes setting up-to-standard solder joint in the controls to be able to bear without being destroyed most
High thrust value.
Data analysis step further includes being carried out pair by control system to the tangential thrust value that receives and maximum thrust value
Than.
Solder joint detection method further includes the alarming step after the data analysis step: when detecting in data analysis step
When tangential thrust value is greater than maximum thrust value, alarm signal is exported by alarm system.
Further:
Up-to-standard signal, signal off quality and alarm signal are differing from each other.
Further:
Up-to-standard signal includes optical signal.
Further:
Signal off quality and alarm signal include voice signal.
Further:
Signal off quality further includes optical signal.
Further:
In data analysis step, control system draws the time changing curve of tangential thrust value, to obtain tangential thrust value
Size variation tendency.Maximum in the descending branch and time changing curve for occurring tangential thrust value in time changing curve
Tangential thrust value is less than minimum thrust value, then determines that quality of welding spot is unqualified.When not occurring tangential thrust in time changing curve
The descending branch of value and maximum tangential thrust value in time changing curve is greater than or equal to minimum thrust value, then determine quality of welding spot
It is qualified.
Further:
Solder joint detection system further includes marking equipment.
Solder joint detection method further includes the markers step after data analysis step: if data analysis step determines solder joint
It is off quality, then mark label is carried out by the component that marking equipment connects underproof solder joint.
Further:
Thrust applies in step, and butt welding point applies the tangential thrust of at least two different directions.
Thrust magnitude read step and data analysis step are executed respectively for the tangential thrust of different directions.
It analyzes in result output step, if all data analysis steps determine quality of welding spot qualification, passes through alarm system
System exports up-to-standard signal.It is defeated by alarm system if any one data analysis step judges that quality of welding spot is unqualified
The unqualified signal of mass.
Further:
There are two the tangential thrust that butt welding point applies is total, two tangential thrusts are mutually perpendicular to.
The beneficial effect of the embodiment of the present invention is:
Different from existing destructive detection method, the solder joint detection method in the present embodiment will not be broken in the detection process
Bad up-to-standard solder joint, therefore all solder joints can be detected, avoid the sampling of existing destructive detection method
Be not detected when detection the case where not being removed there are the solder joint of quality problems.And solder joint detection side in the present embodiment
In method implementation procedure, solder joint off quality destroys the tangential thrust applied by probe, it will be apparent that with the weldering not being destroyed
Point distinguishes, and is not in situation about being mixed into solder joint off quality because of human error's mistake in up-to-standard solder joint.
Thus, the quality that the solder joint detection method in the present embodiment is capable of rapidly butt welding point is detected, and is not conformed to
The solder joint of lattice can be destroyed in the detection process, and qualified solder joint is kept intact, to distinguish qualification clearly
Solder joint and underproof solder joint.
In conclusion the solder joint detection method in the present embodiment can be while guaranteeing that qualified solder joint is intact rapidly
Underproof solder joint is separated from qualified solder joint.
In addition, the solder joint being destroyed is carrying out repair welding again or when rewelding without repeating to destroy the operation of solder joint, section
It about rewelds or time of repair welding.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 is the structural schematic diagram of the solder joint detection system in the embodiment of the present invention；
Fig. 2 is the structural schematic diagram of the probe in Fig. 1；
Fig. 3 is the flow chart of the solder joint detection method in the embodiment of the present invention；
Fig. 4 is the schematic diagram of the applying mode of the tangential thrust of the solder joint detection method in the embodiment of the present invention；
Fig. 5 is the time changing curve figure of the tangential thrust in the solder joint detection method in the embodiment of the present invention；
Fig. 6 is the schematic diagram of another applying mode of the tangential thrust of the solder joint detection method in the embodiment of the present invention.
In figure:
Solder joint detection system 010；
Shell 100；
First end 101, second end 102；
Cavity 103；
Drive end bearing bracket 200；
Through-hole 201；
Rear end cap 300；
Probe 400, interconnecting piece 410, the first syringe needle 420, the second syringe needle 430；
Pressure sensor 500；
Alarm 610, control system 620；
Drive rod 710；
Briquetting 720.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.The present invention being usually described and illustrated herein in the accompanying drawings is implemented
The component of example can be arranged and be designed with a variety of different configurations.
Therefore, the detailed description of the embodiment of the present invention provided in the accompanying drawings is not intended to limit below claimed
The scope of the present invention, but be merely representative of selected embodiment of the invention.Based on the embodiments of the present invention, this field is common
Technical staff's every other embodiment obtained without making creative work belongs to the model that the present invention protects
It encloses.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.
In the description of the present invention, it should be noted that if there is term " on ", "lower", "left", "right", "inner", "outside"
The orientation or positional relationship of equal instructions is to be based on the orientation or positional relationship shown in the drawings or when invention product uses is used
The orientation or positional relationship often put, is merely for convenience of description of the present invention and simplification of the description, rather than indication or suggestion is signified
Device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as to the present invention
Limitation.If being only used for distinguishing description in addition, occurring term " first ", " second " etc. in description of the invention, and cannot understand
For indication or suggestion relative importance.
Embodiment
The present embodiment provides a kind of solder joint detection method, which realizes by solder joint detection system 010.
Solder joint detection system 010 in the present embodiment can be made into lip pencil or other structure types easy to use.Institute in Fig. 1
What is shown is a kind of embodiment that lip pencil is made in this solder joint detection system 010.
Referring to Figure 1, the solder joint detection system 010 in the present embodiment include shell 100, drive end bearing bracket 200, rear end cap 300,
Probe 400, pressure sensor 500, alarm 610, control system 620, drive rod 710, briquetting 720.
Pressure sensor 500 and alarm 610 are communicated to connect with control system 620 respectively.Alarm 610 is sound
Device and/or optical generator.Such as alarm 610 can be the miniature loudspeaker or Light-Emitting Diode being set in shell 100.Control
System 620 processed can be used integrated circuit board form and be set in shell 100.
Shell 100 has opposite first end 101, second end 102 and the sky through first end 101 and second end 102
Chamber 103.
Drive end bearing bracket 200 is connected to the first end 101 of shell 100, and rear end cap 300 is connected to the second end 102 of shell 100.
Drive end bearing bracket 200 offers through-hole 201.
Probe 400, pressure sensor 500, drive rod 710, briquetting 720 are all set in cavity 103.
Probe 400 includes interconnecting piece 410 interconnected and 420 He of the first syringe needle for being connected to 410 both ends of interconnecting piece
Second syringe needle 430.The structure of probe is also referring to figure 2..
In the present embodiment, the first syringe needle 420 is connected to interconnecting piece 410 close to one end of first end 101 and passes through through-hole
201.Second syringe needle 430 is connected to interconnecting piece 410 close to one end of second end 102.One end of probe 400 passes through through-hole 201.Even
The cross sectional dimensions of socket part 410 is greater than the cross sectional dimensions of through-hole 201, can make probe 400 not from the through-hole 201 of drive end bearing bracket 200
In drop out.
Rear end cap 300 is supported in one end of pressure sensor 500, the other end supports probe 400.Pressure sensor 500 is rear
End cap 300 limits, and in this way when probe 400 is by the power for being directed toward rear end cap 300, the stress of probe 400 can be transferred to pressure biography
Sensor 500, i.e. pressure sensor 500 being capable of pressure suffered by inducing probes 400.
To realize above-mentioned 500 inducing probes of pressure sensor, 400 stress condition, pressure sensor 500 can be supported directly
Probe 400 can also support indirectly probe 400 by other structures.In the present embodiment, probe 400 passes through drive rod 710, pressure
Block 720 supports pressure sensor 500.
Drive rod 710 is hollow cylinder structure, and the second syringe needle 430 is inserted into the inner hole of drive rod 710, and drive rod 710 is close
One end of drive end bearing bracket 200 is resisted against the end face of interconnecting piece 410, and the other end of drive rod supports pressure sensor by briquetting 720
500.Briquetting 720 and the contact surface of pressure sensor 500 can be set to size identical with the pressure-sensitive face of pressure sensor 500 and
Shape, the power that probe 400 is received are uniformly acted on pressure sensor 500 by drive rod 710 and briquetting 720,
The uneven transmitting because of power is avoided, so that 500 only part position of pressure sensor is pressurized, cannot truely and accurately reflect spy
Pressure suffered by needle 400.
One end of the close drive rod 710 of interconnecting piece 410 is the tapered surface being gradually reduced from end to intermediate sizes, transmission
Bar 710 is the bellmouth cooperated with tapered surface close to one end of interconnecting piece 410.Taper between interconnecting piece 410 and drive rod 710
The interconnecting piece 410 that is forced through that face cooperation can be such that probe 400 receives is transferred uniformly into drive rod 710, makes pressure sensor 500
The pressure value sensed can truely and accurately react the stress of probe 400.
One end of the separate rear end cap 300 of drive end bearing bracket 200 is pyramidal structure, and conical step surface is equipped in drive end bearing bracket 200,
One end end face of the close drive end bearing bracket 200 of interconnecting piece 410 is the tapered surface cooperated with conical step surface.The cooperation of tapered surface herein
Facilitate interconnecting piece 410 in cavity 103 in.Herein compared with using plane to cooperate, tapered surface cooperation can ensure probe 400
Installation site, avoid 400 positional shift of probe or inclination cause probe 400 be pressurized when generate a lateral component, make it
The pressure for being transferred to pressure sensor 500 is less than the actual loading of probe 400.
The application method of solder joint detection system 010 in the present invention is, by two parts of the part to be detected connected with solder joint
Among a part fixed setting, the shell 100 or rear end cap 300 of this solder joint detection system 010 are then held, with probe 400
Support another part among two components connected by solder joint；Again to make two parts relative motion of part to be detected to exert a force
The thrust being gradually increased is imposed in the direction of solder joint.
Fig. 3 is the flow chart of the solder joint detection method in the present embodiment.Referring to figure 3., this solder joint detection method include with
Lower step:
Initialization step: the minimum thrust that up-to-standard solder joint is able to bear without being destroyed is set in the controls
Value Fmax；The maximum thrust value Fmin that up-to-standard solder joint is able to bear without being destroyed is set in the controls.
Thrust applies step: the probe of solder joint detection system being resisted against solder joint P, what butt welding point P application gradually increased cuts
To thrust F.The application direction of tangential thrust F refers to Fig. 4.
Thrust magnitude read step: pressure sensor reads the tangential thrust F that is applied on solder joint P, and by the tangential thrust
Value is sent to control system.Due to probe butt welding point P apply tangential thrust F generate solder joint to the reaction force of probe by visiting
Needle is transferred to pressure sensor, and is read by pressure sensor,
Data analysis step: control system analyzes the variation tendency of the size of the tangential thrust value F received, and
Judge whether the quality of solder joint is qualified based on the analysis results.Meanwhile by control system to the tangential thrust value F received and most
High thrust value Fmax is compared.
As a kind of optional scheme, in data analysis step, the time change that control system draws tangential thrust value F is bent
Line (F-t curve), to obtain the variation tendency of the size of tangential thrust value.When occurring tangential thrust value in time changing curve
Maximum tangential thrust value in descending branch and time changing curve is less than minimum thrust value Fmin, then determines that quality of welding spot does not conform to
Lattice.When the maximum value of the tangential thrust in the descending branch and time changing curve for not occurring tangential thrust value in time changing curve
More than or equal to minimum thrust value Fmin, then quality of welding spot qualification is determined.Fig. 5 is referred to, f1 curve is typical quality in figure
The tangential thrust change curve of underproof solder joint, in the highest point of f1 curve position to the right, control system captures curve
Descending branch, in addition the highest point of f1 curve under Fmin, then determines that the quality of welding spot is unqualified.F2 curve is typical case in figure
Up-to-standard solder joint tangential thrust change curve, in f2 curve, the tangential thrust that pressure sensor senses is basic
There is not descending branch, and is capable of most settling more than Fmin for curve in the form linearly risen, to can determine that quality of welding spot closes
Lattice.
It analyzes result and exports step: if data analysis step determines that quality of welding spot is qualified, matter being exported by alarm system
Measure qualifying signal；If data analysis step determines that quality of welding spot is unqualified, signal off quality is exported by alarm system；
If detect that tangential thrust value F1 is greater than maximum thrust value Fmax in data analysis step, executes alarming step: passing through report
Alert system exports alarm signal.As when tangential thrust value reaches the position Fmax in the f2 curve in Fig. 5, alarm system just issues report
Alert signal reminds operator to stop force, and excessive tangential thrust is avoided to destroy up-to-standard solder joint.
Above-mentioned up-to-standard signal, signal off quality and alarm signal are differing from each other, so as to operator's identification.
Up-to-standard signal may include optical signal, and light emitting diode is such as arranged in alarm system, and issue green light as up-to-standard
Signal.To remind operator solder joint off quality, the settable sound more with warning effect in alarm system occur
Signal generation apparatus, such as loudspeaker, and when finding solder joint off quality, signal is made a sound as alarm.Quality is not
Qualifying signal may also include luminous optical signal, to distinguish the green optical signal of up-to-standard signal.Likewise, to avoid operator
It exerts a force excessive, destroys qualified solder joint, alarm signal also includes voice signal.
For further underproof solder joint is marked, avoid mixing with up-to-standard solder joint, solder joint detection system
System further includes marking equipment.Solder joint detection method further includes the markers step after data analysis step: if data analysis step
It is rapid to determine that quality of welding spot is unqualified, then mark label is carried out by the component that marking equipment connects underproof solder joint.
For the quality for testing solder joint from different perspectives, thrust applies in step, can butt welding point apply at least two not Tongfangs
To tangential thrust, for example, butt welding point P apply tangential thrust can be two orthogonal tangential thrust F and T, please refer to
Fig. 6.Thrust magnitude read step and data analysis step are executed respectively for the tangential thrust of different directions.Analyze result output step
In rapid, if all data analysis steps determine quality of welding spot qualification, up-to-standard signal is exported by alarm system.If appointing
Data analysis step of anticipating judges that quality of welding spot is unqualified, then exports signal off quality by alarm system.
In conclusion the solder joint detection method in the present embodiment can be while guaranteeing that qualified solder joint is intact rapidly
Underproof solder joint is separated from qualified solder joint.
Claims (8)
1. a kind of solder joint detection method, it is characterised in that:
The solder joint detection method by solder joint detection system realize, the solder joint detection system include probe, pressure sensor,
Control system and alarm system；The alarm system, the pressure sensor are electrically connected with the control system respectively；It is described
Probe abuts with the pressure sensor and is used to incude pressure suffered by the probe；The solder joint detection system is packaged into
The solder joint detection system of lip pencil, lip pencil includes shell, and the shell has opposite first end, second end and runs through institute
State the cavity of first end and the second end；The first end of the shell is connected with drive end bearing bracket, the second end of the shell
It is connected with rear end cap；The drive end bearing bracket offers through-hole；The probe is set in cavity, and one end of the probe passes through described
Through-hole；The pressure sensor is set in the cavity, and the rear end cap, the other end are supported in one end of the pressure sensor
Support the probe；
Drive rod and briquetting are additionally provided in the cavity, the probe supports the pressure by the drive rod, the briquetting
Force snesor；
The probe includes interconnecting piece interconnected and the first syringe needle and the second syringe needle for being connected to the interconnecting piece both ends,
The cross sectional dimensions of the interconnecting piece is greater than the cross sectional dimensions of the through-hole；
The drive rod is hollow cylinder structure, and second syringe needle is inserted into the inner hole of the drive rod, the one of the drive rod
End is resisted against the end face of the interconnecting piece, and the other end of the drive rod supports the pressure sensor by the briquetting；
Being arranged to the contact surface of the pressure sensor for the briquetting is identical with the pressure-sensitive face of the pressure sensor big
Small and shape；
Detection method includes the following steps for the solder joint:
Initialization step: the minimum thrust that up-to-standard solder joint is able to bear without being destroyed is set in the control system
Value；The maximum thrust value that up-to-standard solder joint is able to bear without being destroyed is set in the control system；
Thrust apply step: the probe of the solder joint detection system is resisted against the solder joint, to the solder joint apply by
Gradually increased tangential thrust；
Thrust magnitude read step: the tangential thrust being applied to described in the pressure sensor reading on the solder joint, and this is cut
The control system is sent to thrust magnitude；
Data analysis step: the control system divides the variation tendency of the size of the tangential thrust value received
Analysis, and judge whether the quality of the solder joint is qualified based on the analysis results；By the control system to cutting described in receiving
It is compared to thrust magnitude and the maximum thrust value；
In the data analysis step, the control system draws the time changing curve of the tangential thrust value, to obtain
State the variation tendency of the size of tangential thrust value；When the descending branch for occurring the tangential thrust value in the time changing curve and
The maximum tangential thrust value in the time changing curve is less than the minimum thrust value, then determines the quality of welding spot not
It is qualified；When in the descending branch and the time changing curve for not occurring the tangential thrust value in the time changing curve most
The big tangential thrust value is greater than or equal to the minimum thrust value, then determines that the quality of welding spot is qualified；
Alarming step: when detecting that the tangential thrust value is greater than the maximum thrust value in the data analysis step, lead to
Cross the alarm system output alarm signal；
It analyzes result and exports step: if the data analysis step determines that the quality of welding spot is qualified, being by the alarm
System exports up-to-standard signal；If the data analysis step determines that the quality of welding spot is unqualified, it is by the alarm
System exports signal off quality.
2. solder joint detection method according to claim 1, it is characterised in that:
The up-to-standard signal, the signal off quality and the alarm signal are differing from each other.
3. solder joint detection method according to claim 1, it is characterised in that:
The up-to-standard signal includes optical signal.
4. solder joint detection method according to claim 1, it is characterised in that:
The signal off quality and the alarm signal include voice signal.
5. solder joint detection method according to claim 4, it is characterised in that:
The signal off quality further includes optical signal.
6. solder joint detection method according to claim 1, it is characterised in that:
The solder joint detection system further includes marking equipment；
The solder joint detection method further includes the markers step after the data analysis step: if the data analysis step
Determine that the quality of welding spot is unqualified, then mark mark is carried out by the component that the marking equipment connects underproof solder joint
Note.
7. solder joint detection method according to claim 1, it is characterised in that:
The thrust applies in step, applies the tangential thrust of at least two different directions to the solder joint；
The thrust magnitude read step and the data analysis step are executed respectively for the tangential thrust of different directions；
In the analysis result output step, if all data analysis steps determine that the quality of welding spot is qualified, lead to
It crosses the alarm system and exports up-to-standard signal；If any one of data analysis step judges that the quality of welding spot does not conform to
Lattice then export signal off quality by the alarm system.
8. solder joint detection method according to claim 7, it is characterised in that:
There are two total to the tangential thrust of solder joint application, two tangential thrusts are mutually perpendicular to.
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| CN201610761540.0A CN106404533B (en) | 2016-08-29 | 2016-08-29 | A kind of solder joint detection method |
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| CN109030201B (en) * | 2018-05-31 | 2021-03-16 | 歌尔股份有限公司 | Welding spot thrust detection device and method |
| CN109283182A (en) * | 2018-08-03 | 2019-01-29 | 江苏理工学院 | A kind of detection method of battery welding point defect, apparatus and system |
| CN109916703B (en) * | 2019-02-22 | 2021-11-30 | 重庆金康动力新能源有限公司 | Welding spot detection device and welding spot detection method |
| CN111185406A (en) * | 2019-09-03 | 2020-05-22 | 北京瑞诚联众科技有限公司 | Image-based welding spot detection method |
| CN111650043B (en) * | 2020-03-23 | 2023-05-05 | 万向一二三股份公司 | Ultrasonic welding quality detection method |
| CN112067442A (en) * | 2020-09-11 | 2020-12-11 | 天津航天长征火箭制造有限公司 | Aerospace storage box welding spot rosin joint quantitative detection device and method |
| CN112985984A (en) * | 2020-12-14 | 2021-06-18 | 系统电子科技（镇江）有限公司 | Many electric core solder joints quality detection device |
| CN117630643B (en) * | 2023-12-06 | 2024-08-20 | 皆利士多层线路版(中山)有限公司 | Electrical measuring clamp capable of automatically detecting push-out force |
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