CN106404533A - Welding spot detection method - Google Patents
Welding spot detection method Download PDFInfo
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- CN106404533A CN106404533A CN201610761540.0A CN201610761540A CN106404533A CN 106404533 A CN106404533 A CN 106404533A CN 201610761540 A CN201610761540 A CN 201610761540A CN 106404533 A CN106404533 A CN 106404533A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/026—Specifications of the specimen
- G01N2203/0296—Welds
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- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
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- Length Measuring Devices With Unspecified Measuring Means (AREA)
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Abstract
The invention aims to solve the problem that the existing welding spot detection method cannot quickly separate disqualified welding spots from qualified welding spots on the premise of guaranteeing the intactness of the qualified welding spots, and provides a welding spot detection method. The welding spot detection is realized by a welding spot detection system. The welding spot detection system comprises a probe, a pressure sensor, a control system and an alarm system, wherein the alarm system and the pressure sensor are electrically connected with the control system respectively; the probe presses against the pressure sensor, and the pressure sensor is used for sensing pressure on the probe. The welding spot detection method comprises an initializing step, a thrust applying step, a thrust value reading step, a data analysis step and an analysis result output step. The welding spot detection method has the beneficial effect of quickly separating the disqualified welding spots from the qualified welding spots on the premise of guaranteeing the intactness of the qualified welding spots.
Description
Technical field
The present invention relates to solder joint detection technique field, in particular to a kind of solder joint detection method.
Background technology
Can come off in welding quality underproof solder joint Long-Time Service or even cause the pernicious quality events such as short-circuit fire.Weldering
Point detection technique is the technology whether qualified in order to judge the quality of solder joint.
Existing solder joint detection method cannot while ensureing that qualified solder joint is intact rapidly by underproof solder joint from
The problem separated in qualified solder joint.
Content of the invention
The present invention is intended to provide a kind of solder joint detection method, cannot be qualified in guarantee to solve existing solder joint detection method
The problem rapidly underproof solder joint separated from qualified solder joint while solder joint is intact.
Embodiments of the invention are realized in：
A kind of solder joint detection method, this solder joint detection method is realized by solder joint detecting system, and solder joint detecting system includes
Probe, pressure sensor, control system and warning system.Warning system, pressure sensor are electrically connected with control system respectively.
Probe is abutted with pressure sensor and is used for the pressure suffered by inducing probes.Solder joint detection method comprises the following steps：
Initialization step：Set the minimum thrust that up-to-standard solder joint can bear and not be destroyed in the controls
Value.
Thrust applies step：The probe of solder joint detecting system is resisted against solder joint, it is tangential that butt welding point applying is gradually increased
Thrust.
Thrust magnitude read step：Pressure sensor reads and is applied to tangential thrust on solder joint, and by this tangential thrust value
Send to control system.
Data analysis step：The variation tendency of the size to the tangential thrust value receiving for the control system is analyzed, and
Judge according to analysis result whether the quality of solder joint is qualified.
Analysis result exports step：If data analysis step judges that quality of welding spot is qualified, matter is exported by warning system
Amount qualifying signal.If data analysis step judges that quality of welding spot is unqualified, signal off quality is exported by warning system.
Solder joint detection method in the present embodiment is passed through to apply tangential thrust with the probe butt welding point of solder joint detecting system, and
Sense size and the variation tendency of this tangential thrust with pressure sensor, whether qualified for judging quality of welding spot.It judges
Principle is, when the firm welding degree of solder joint is unqualified, solder joint will be destroyed under the tangential thrust effect of probe, so presses
The stress of the probe that force snesor senses will appear from situation about declining, and just provable solder joint welding quality is unqualified；If effect
When the tangential thrust of solder joint exceedes minimum thrust value, the pressure that pressure sensor senses decline situation does not occur then it represents that
Solder joint can bear the thrust of minimum thrust value, that is, represent that quality of welding spot is qualified.
Further：
Initialization step be additionally included in set in control system up-to-standard solder joint can bear and be destroyed
High thrust value.
It is right that data analysis step also includes by control system, the tangential thrust value receiving and maximum thrust value being carried out
Than.
Solder joint detection method also includes the alarming step after data analysis step：When detecting in data analysis step
When tangential thrust value is more than maximum thrust value, by warning system output alarm signal.
Further：
Up-to-standard signal, signal off quality and alarm signal are differing from each other.
Further：
Up-to-standard signal includes optical signal.
Further：
Signal off quality and alarm signal all include voice signal.
Further：
Signal off quality also includes optical signal.
Further：
In data analysis step, control system draws the time changing curve of tangential thrust value, to obtain tangential thrust value
Size variation tendency.Maximum in the descending branch that tangential thrust value occurs in time changing curve and time changing curve
Tangential thrust value is less than minimum thrust value, then judge that quality of welding spot is unqualified.When tangential thrust does not occur in time changing curve
Maximum tangential thrust value in the descending branch of value and time changing curve is more than or equal to minimum thrust value, then judge quality of welding spot
Qualified.
Further：
Solder joint detecting system also includes marking equipment.
Solder joint detection method also includes the markers step after data analysis step：If data analysis step judges solder joint
Off quality, then mark mark is carried out by the component that marking equipment is connected to underproof solder joint.
Further：
Thrust applies in step, and butt welding point applies the tangential thrust of at least two different directions.
Tangential thrust for different directions executes thrust magnitude read step data analytical procedure respectively.
In analysis result output step, if all data analysis step all judge that quality of welding spot is qualified, by warning is
System exports up-to-standard signal.If any one data analysis step judges that quality of welding spot is unqualified, defeated by warning system
The unqualified signal of mass.
Further：
The tangential thrust that butt welding point applies has two, and two tangential thrusts are mutually perpendicular to.
The beneficial effect of the embodiment of the present invention is：
Different from existing destructiveness detection method, the solder joint detection method in the present embodiment will not be broken in detection process
Bad up-to-standard solder joint, therefore, it is possible to detect to all solder joints, it is to avoid the sampling of existing destructiveness detection method
The not disallowable situation of the solder joint of the presence quality problems not being detected during detection.And solder joint detection side in the present embodiment
In method implementation procedure, solder joint off quality the tangential thrust being applied by probe is destroyed it will be apparent that with the weldering not being destroyed
Point makes a distinction, and is not in because of the wrong situation about being mixed into solder joint off quality in up-to-standard solder joint of human error.
Thus, the quality that the solder joint detection method in the present embodiment is capable of rapidly butt welding point is detected, and does not conform to
The solder joint of lattice can be destroyed in detection process, and qualified solder joint is kept intact, thus distinguish clearly qualified
Solder joint and underproof solder joint.
In sum, the solder joint detection method in the present embodiment can while ensureing that qualified solder joint is intact rapidly
Underproof solder joint is separated from qualified solder joint.
In addition, destroyed solder joint need not repeat to destroy the operation of solder joint, section when carrying out repair welding again or rewelding
About reweld or repair welding time.
Brief description
In order to be illustrated more clearly that the technical scheme of the embodiment of the present invention, below will be attached to use required in embodiment
Figure is briefly described it will be appreciated that the following drawings illustrate only certain embodiments of the present invention, and it is right to be therefore not construed as
The restriction of scope, for those of ordinary skill in the art, on the premise of not paying creative work, can also be according to this
A little accompanying drawings obtain other related accompanying drawings.
Fig. 1 is the structural representation of the solder joint detecting system in the embodiment of the present invention；
Fig. 2 is the structural representation of the probe in Fig. 1；
Fig. 3 is the flow chart of the solder joint detection method in the embodiment of the present invention；
Fig. 4 is the schematic diagram of the applying mode of the tangential thrust of solder joint detection method in the embodiment of the present invention；
Fig. 5 is the time changing curve figure of the tangential thrust in the solder joint detection method in the embodiment of the present invention；
Fig. 6 is the schematic diagram of another kind of applying mode of the tangential thrust of solder joint detection method in the embodiment of the present invention.
In figure：
Solder joint detecting system 010；
Housing 100；
First end 101, the second end 102；
Cavity 103；
Drive end bearing bracket 200；
Through hole 201；
Rear end cap 300；
Probe 400, connecting portion 410, the first syringe needle 420, the second syringe needle 430；
Pressure sensor 500；
Alarm 610, control system 620；
Drive link 710；
Briquetting 720.
Specific embodiment
Purpose, technical scheme and advantage for making the embodiment of the present invention are clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described it is clear that described embodiment is
The a part of embodiment of the present invention, rather than whole embodiments.The present invention generally described and illustrated in accompanying drawing herein is implemented
The assembly of example can be arranged with various different configurations and design.
Therefore, below the detailed description of the embodiments of the invention providing in the accompanying drawings is not intended to limit claimed
The scope of the present invention, but be merely representative of the selected embodiment of the present invention.Based on the embodiment in the present invention, this area is common
The every other embodiment that technical staff is obtained under the premise of not making creative work, broadly falls into the model of present invention protection
Enclose.
It should be noted that：Similar label and letter represent similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined in individual accompanying drawing, then do not need it to be defined further and explains in subsequent accompanying drawing.
In describing the invention, if it should be noted that occur term " on ", D score, "left", "right", " interior ", " outward "
It is based on orientation shown in the drawings or position relationship in the orientation of instruction or position relationship, or used when this invention product uses
The orientation often put or position relationship, are for only for ease of the description present invention and simplify description, rather than instruction or hint indication
Device or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to the present invention
Restriction.If additionally, term " first ", " second " etc. occur in description of the invention being only used for distinguishing description, and not being understood that
For indicating or implying relative importance.
Embodiment
The present embodiment provides a kind of solder joint detection method, and this solder joint detection method is realized by solder joint detecting system 010.
Solder joint detecting system 010 in the present embodiment can be made into lip pencil or other versions easy to use.Institute in Fig. 1
Show is a kind of embodiment that this solder joint detecting system 010 makes lip pencil.
Refer to Fig. 1, the solder joint detecting system 010 in the present embodiment include housing 100, drive end bearing bracket 200, rear end cap 300,
Probe 400, pressure sensor 500, alarm 610, control system 620, drive link 710, briquetting 720.
Pressure sensor 500 and alarm 610 are communicated to connect with control system 620 respectively.Alarm 610 occurs for sound
Device and/or optical generator.For example alarm 610 can be disposed on the miniature loudspeaker in housing 100 or Light-Emitting Diode.Control
System 620 processed can be arranged in housing 100 using surface-mounted integrated circuit form.
Housing 100 has relative first end 101, the second end 102 and runs through first end 101 and the sky at the second end 102
Chamber 103.
Drive end bearing bracket 200 is connected to the first end 101 of housing 100, and rear end cap 300 is connected to the second end 102 of housing 100.
Drive end bearing bracket 200 offers through hole 201.
Probe 400, pressure sensor 500, drive link 710, briquetting 720 may be contained within cavity 103.
Probe 400 includes interconnective connecting portion 410 and the first syringe needle 420 He being connected to connecting portion 410 two ends
Second syringe needle 430.The structure of probe also refer to Fig. 2.
In the present embodiment, the first syringe needle 420 is connected to connecting portion 410 and near one end of first end 101 and passes through through hole
201.Second syringe needle 430 is connected to connecting portion 410 one end near the second end 102.One end of probe 400 passes through through hole 201.Even
The cross sectional dimensions of socket part 410 is more than the cross sectional dimensions of through hole 201, can make probe 400 not from the through hole 201 of drive end bearing bracket 200
In drop out.
Rear end cap 300 is supported in one end of pressure sensor 500, the other end supports probe 400.Pressure sensor 500 is rear
End cap 300 is spacing, and so when probe 400 is subject to the power pointing to rear end cap 300, the stress of probe 400 can be transferred to pressure and pass
Sensor 500, that is, pressure sensor 500 being capable of pressure suffered by inducing probes 400.
For realizing above-mentioned use pressure sensor 500 inducing probes 400 stressing conditions, pressure sensor 500 can directly be supported
Probe 400, also can support probe 400 by other structures indirectly.In the present embodiment, probe 400 passes through drive link 710, pressure
Block 720 supports pressure sensor 500.
Drive link 710 is hollow cylinder structure, and the second syringe needle 430 inserts the endoporus of drive link 710, and drive link 710 is close
One end of drive end bearing bracket 200 is resisted against the end face of connecting portion 410, and the other end of bar of passing on Gong supports pressure sensor by briquetting 720
500.The contact surface of briquetting 720 and pressure sensor 500 can be set to pressure-sensitive face identical size with pressure sensor 500 and
Shape so that the power that is subject to of probe 400 can uniformly act on pressure sensor 500 by drive link 710 and briquetting 720,
Avoid the uneven transmission because of power so that pressure sensor 500 only part position pressurized it is impossible to truely and accurately reflect spy
Pressure suffered by pin 400.
One end of the close drive link 710 of connecting portion 410 is the taper surface being gradually reduced to intermediate sizes from end, transmission
Bar 710 is near the bellmouth that one end of connecting portion 410 is with taper surface cooperation.Taper between connecting portion 410 and drive link 710
Face cooperation can make the connecting portion 410 that is forced through that probe 400 is subject to be transferred uniformly into drive link 710, makes pressure sensor 500
The pressure value sensing can truely and accurately react the stress of probe 400.
One end away from rear end cap 300 of drive end bearing bracket 200 is to be provided with type conical bench face in pyramidal structure, and drive end bearing bracket 200,
One end end face of the close drive end bearing bracket 200 of connecting portion 410 is the taper surface with the cooperation of type conical bench face.The cooperation of taper surface herein
Facilitate centering in cavity 103 for the connecting portion 410.Coordinate than using plane, taper surface cooperation is able to ensure that probe 400 herein
Installation site, it is to avoid the skew of probe 400 position or tilt produce a lateral component when leading to probe 400 pressurized so as to
The pressure being transferred to pressure sensor 500 is less than the actual loading of probe 400.
The using method of the solder joint detecting system 010 in the present invention is, by the two parts of the part to be detected being connected with solder joint
Among a part be fixedly installed, then hold housing 100 or the rear end cap 300 of this solder joint detecting system 010, with probe 400
Support the another part among two parts connecting by solder joint；Again to making two parts relative motion of part to be detected to exert a force
Impose the thrust being gradually increased in the direction of solder joint.
Fig. 3 is the flow chart of the solder joint detection method in the present embodiment.Refer to Fig. 3, this solder joint detection method include with
Lower step：
Initialization step：Set the minimum thrust that up-to-standard solder joint can bear and not be destroyed in the controls
Value Fmax；Set maximum thrust value Fmin that up-to-standard solder joint can bear and not be destroyed in the controls.
Thrust applies step：The probe of solder joint detecting system is resisted against solder joint P, what the applying of butt welding point P was gradually increased cuts
To thrust F.The applying direction of tangential thrust F refers to Fig. 4.
Thrust magnitude read step：Pressure sensor reads and is applied to tangential thrust F on solder joint P, and by this tangential thrust
Value sends to control system.The solder joint being produced due to tangential thrust F that probe butt welding point P applies is to the reaction force of probe by visiting
Pin is transferred to pressure sensor, and is read by pressure sensor,
Data analysis step：The variation tendency of the size to tangential thrust value F receiving for the control system is analyzed, and
Judge according to analysis result whether the quality of solder joint is qualified.Meanwhile, by control system to tangential thrust value F receiving with
High thrust value Fmax is contrasted.
As a kind of optional scheme, in data analysis step, the time change that control system draws tangential thrust value F is bent
Line (F-t curve), to obtain the variation tendency of the size of tangential thrust value.When tangential thrust value occurs in time changing curve
Maximum tangential thrust value in descending branch and time changing curve is less than minimum thrust value Fmin, then judge that quality of welding spot does not conform to
Lattice.Maximum when the tangential thrust in the descending branch that tangential thrust value does not occur in time changing curve and time changing curve
More than or equal to minimum thrust value Fmin, then judge that quality of welding spot is qualified.Refer to Fig. 5, in figure f1 curve is typical quality
The tangential thrust change curve of underproof solder joint, in the peak of f1 curve position to the right, control system captures curve
Descending branch, the peak adding f1 curve under Fmin, then judges that this quality of welding spot is unqualified.In figure f2 curve is typical case
Up-to-standard solder joint tangential thrust change curve, in f2 curve, the tangential thrust that pressure sensor senses is basic
The form linearly rising, occurs without descending branch, and is capable of settling more than Fmin most of curve, thus can determine that quality of welding spot closes
Lattice.
Analysis result exports step：If data analysis step judges that quality of welding spot is qualified, matter is exported by warning system
Amount qualifying signal；If data analysis step judges that quality of welding spot is unqualified, signal off quality is exported by warning system；
If tangential thrust value F1 is detected in data analysis step more than maximum thrust value Fmax, execute alarming step：By report
Alarm system output alarm signal.As when in the f2 curve in Fig. 5, tangential thrust value reaches Fmax position, warning system just sends report
Alert signal reminds operator to stop force, it is to avoid excessive tangential thrust destroys up-to-standard solder joint.
Above-mentioned up-to-standard signal, signal off quality and alarm signal are differing from each other, so that operator's identification.
Up-to-standard signal may include optical signal, such as arranges light emitting diode in warning system, and sends green glow as up-to-standard
Signal.For reminding operator that solder joint off quality occurs, the sound more with alarming effect can be set in warning system
Signal generation apparatus, such as loudspeaker, and when finding solder joint off quality, send voice signal as alarm.Quality is not
Qualifying signal may also include luminous optical signal, to distinguish the green optical signal of up-to-standard signal.Likewise, for avoiding operator
Force is excessive, destroys qualified solder joint, and alarm signal also includes voice signal.
For being marked to underproof solder joint further, it is to avoid mix with up-to-standard solder joint, solder joint detection system
System also includes marking equipment.Solder joint detection method also includes the markers step after data analysis step：If data analysis walks
Rapid judgement quality of welding spot is unqualified, then carry out mark mark by the component that marking equipment is connected to underproof solder joint.
For testing the quality of solder joint from different perspectives, thrust applies in step, can butt welding point applying at least two not Tongfang
To tangential thrust, for example, butt welding point P apply tangential thrust can be two orthogonal tangential thrusts F and T, refer to
Fig. 6.Tangential thrust for different directions executes thrust magnitude read step data analytical procedure respectively.Analysis result output step
In rapid, if all data analysis step all judge that quality of welding spot is qualified, up-to-standard signal is exported by warning system.If appointing
One data analysis step of meaning judges that quality of welding spot is unqualified, then export signal off quality by warning system.
In sum, the solder joint detection method in the present embodiment can while ensureing that qualified solder joint is intact rapidly
Underproof solder joint is separated from qualified solder joint.
Claims (10)
1. a kind of solder joint detection method it is characterised in that：
Described solder joint detection method by solder joint detecting system realize, described solder joint detecting system include probe, pressure sensor,
Control system and warning system；Described warning system, described pressure sensor are electrically connected with described control system respectively；Described
Probe is abutted with described pressure sensor and is used for sensing the pressure suffered by described probe；
Described solder joint detection method comprises the following steps：
Initialization step：The minimum thrust that up-to-standard solder joint can bear and not be destroyed is set in described control system
Value；
Thrust applies step：The described probe of described solder joint detecting system is resisted against described solder joint, to described solder joint apply by
The cumulative tangential thrust adding；
Thrust magnitude read step：It is applied to the tangential thrust on described solder joint described in described pressure sensor reading, and this is cut
Send to described control system to thrust magnitude；
Data analysis step：The variation tendency of the size to the described tangential thrust value receiving for the described control system is carried out point
Analysis, and judge whether the quality of described solder joint is qualified according to analysis result；
Analysis result exports step：If described data analysis step judges that described quality of welding spot is qualified, by the described system that reports to the police
System exports up-to-standard signal；If described data analysis step judges that described quality of welding spot is unqualified, by the described system that reports to the police
System exports signal off quality.
2. a kind of solder joint detection method according to claim 1 it is characterised in that：
Described initialization step is additionally included in described control system and sets up-to-standard solder joint and can bear and not be destroyed
Maximum thrust value；
Described data analysis step is also included by described control system to the described tangential thrust value receiving and described maximum
Thrust magnitude is contrasted；
Described solder joint detection method also includes the alarming step after described data analysis step：When described data analysis step
In detect described tangential thrust value be more than described maximum thrust value when, by described warning system output alarm signal.
3. solder joint detection method according to claim 2 it is characterised in that：
Described up-to-standard signal, described signal off quality and described alarm signal are differing from each other.
4. solder joint detection method according to claim 2 it is characterised in that：
Described up-to-standard signal includes optical signal.
5. solder joint detection method according to claim 2 it is characterised in that：
Described signal off quality and described alarm signal all include voice signal.
6. solder joint detection method according to claim 5 it is characterised in that：
Described signal off quality also includes optical signal.
7. solder joint detection method according to claim 1 it is characterised in that：
In described data analysis step, described control system draws the time changing curve of described tangential thrust value, to obtain
State the variation tendency of the size of tangential thrust value；When the descending branch that described tangential thrust value occurs in described time changing curve and
Maximum in described time changing curve described tangential thrust value is less than described minimum thrust value, then judge described quality of welding spot not
Qualified；When in the descending branch that described tangential thrust value does not occur in described time changing curve and described time changing curve
Described greatly tangential thrust value is more than or equal to described minimum thrust value, then judge that described quality of welding spot is qualified.
8. solder joint detection method according to claim 1 it is characterised in that：
Described solder joint detecting system also includes marking equipment；
Described solder joint detection method also includes the markers step after described data analysis step：If described data analysis step
Judge that described quality of welding spot is unqualified, then mark mark is carried out by the component that described marking equipment is connected to underproof solder joint
Note.
9. solder joint detection method according to claim 1 it is characterised in that：
Described thrust applies in step, described solder joint is applied with the described tangential thrust of at least two different directions；
Described tangential thrust for different directions executes described thrust magnitude read step and described data analysis step respectively；
In described analysis result output step, if all described data analysis step all judge that described quality of welding spot is qualified, lead to
Cross described warning system and export up-to-standard signal；If any one of data analysis step judges that described quality of welding spot does not conform to
Lattice, then export signal off quality by described warning system.
10. solder joint detection method according to claim 9 it is characterised in that：
The described tangential thrust that described solder joint is applied has two, and two described tangential thrusts are mutually perpendicular to.
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Cited By (7)
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| CN109030201A (en) * | 2018-05-31 | 2018-12-18 | 歌尔股份有限公司 | Solder joint thrust measurement device and method |
| CN109283182A (en) * | 2018-08-03 | 2019-01-29 | 江苏理工学院 | A kind of detection method of battery welding point defect, apparatus and system |
| CN109916703A (en) * | 2019-02-22 | 2019-06-21 | 重庆金康动力新能源有限公司 | Solder joint detection device and solder joint detection method |
| CN111185406A (en) * | 2019-09-03 | 2020-05-22 | 北京瑞诚联众科技有限公司 | Image-based welding spot detection method |
| CN111650043A (en) * | 2020-03-23 | 2020-09-11 | 万向一二三股份公司 | Detection method for ultrasonic welding quality |
| CN112067442A (en) * | 2020-09-11 | 2020-12-11 | 天津航天长征火箭制造有限公司 | Aerospace storage box welding spot rosin joint quantitative detection device and method |
| CN112985984A (en) * | 2020-12-14 | 2021-06-18 | 系统电子科技（镇江）有限公司 | Many electric core solder joints quality detection device |
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