CN106392341A - Brittle material punching method - Google Patents
Brittle material punching method Download PDFInfo
- Publication number
- CN106392341A CN106392341A CN201610975424.9A CN201610975424A CN106392341A CN 106392341 A CN106392341 A CN 106392341A CN 201610975424 A CN201610975424 A CN 201610975424A CN 106392341 A CN106392341 A CN 106392341A
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- China
- Prior art keywords
- laser
- fragile material
- sliver
- drilling method
- processed
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to the technical field of laser punching, in particular to a brittle material punching method. Filamentation cutting is carried out on a brittle material to be processed with ultrashort laser pulse beams to form round rings penetrating through the brittle material; an ablation area is arranged in each round ring, each ablation area is of an appointed shape, the parts, of the appointed shapes, of the brittle material are removed in a laser ablation manner, and single bodies to be splintered which are not connected with one another and to be subjected to splintering processing are formed; and splintering processing is carried out on the single bodies to be splintered at the same time, so that punching machining on the brittle material is realized. Because filamentation cutting and laser ablation are combined, edge breakage of the brittle material is reduced, the area of the heat affect zone of the brittle material is reduced, the efficiency of punching is improved, the success rate of punching is increased, the cost is reduced, and the problems about efficiency and effect in the machining process are solved.
Description
Technical field
The present invention relates to laser drilling field is and in particular to a kind of fragile material drilling method.
Background technology
Sapphire crystal be a kind of integrate excellent optics, the multifunctional oxygen compound of physics, chemistry and mechanical performance,
It is widely used in the fields such as industry, national defence and scientific research, be usually used in making optical element, window material and micromechanical devices etc.,
Application particularly on mobile phone productses and receive much concern again.Most of application requirement sapphires must have very high processing matter
Amount, but because sapphire fragility is very big, traditional machining is also easy to produce the problems such as chipping, crackle and tool wear, and by
In its superior chemical stability, traditional chemical etching is extremely difficult to processing request, but laser processing technology has non-connecing
Tactile, the simple to operate, characteristic such as motility is high, it is possible to achieve arbitrary shape, processing rapidly and efficiently.
Laser can be divided into photothermy and photochemical effect with the interaction of storeroom, i.e. " hot-working " and " cold rnning
Work ".Laser heat processing refers to the purpose making melt material evaporation reach removal using the heat effect of laser, the general CO2 adopting
Laser, optical-fiber laser, semiconductor laser and excimer laser etc. towards commercial Application main flow laser instrument pulsewidth many in microsecond
(μm), nanosecond (ns) level.Long pulsewidth laser action, when material, absorbs laser energy by Joule heating, through lattice/electronics
Conduction of heat makes material irradiation region heat up, and is melted to the removal that gasification completes material." hot-working " and effect easily cause consolidation residue,
The heat affectings such as strain crack, which limit crudy and the efficiency of workpiece.
Eliminate laser material " hot-working " effect is necessary for suppressing heat-conduction effect produced by laser energy input.As
The thermal vibration passing time of material conduction band electron/lattice can be less than the action time of fruit laser photon it is possible to because come
Not as good as carrying out heat transfer, and the mechanism such as the ionization by collision under being acted on by photon, photoionization or tunnel ionization excite electronics from
Valence band transits to conduction band, and electron concentration constantly can strengthen with the carrying out of ionization, was exploded by coulomb before end-of-pulsing
Reach threshold limit value, the expendable destruction of atarting material lattice structure, macroscopical presentation is as applied material no " heat effect "
Removal, here it is ultra-short pulse laser realize " cold working " basic physical basis.Laser cold working refers to that material molecule is same
When or the multiple photon of continuous absorption so that the chemical bond in material is interrupted or lattice structure be destroyed, thus reaching the mesh of removal
, the method is more suitable for low-loss processing to sapphire high-quality.Laser cold working typically adopts short pulse and short wavelength
Laser.Picosecond laser allows to adopt laser diode pump-coupling, and single pulse energy is up to tens μ J levels, and has had common
It is ensured that the high clearance of picosecond laser processing, basic fundamental parameter attribute makes the reality of picosecond laser to MHz level high repetition frequency
Working (machining) efficiency can be far longer than other types ultrafast laser, is expected to bring breakthrough in terms of materials processing precision takes into account working (machining) efficiency
Property fly remote.Additionally, picosecond laser also has beam quality (the beam quality factor M2 of accessible diffraction limit<1.3), good
Stability and relatively low equipment purchasing and maintenance cost so as to there is boundless application prospect to shape in industrial circle
The efficiently high-precision new manufacturing science that removes taken into account is become to have the advantage less than other types laser.
The fragile materials such as sapphire are carried out punch using laser at this stage and typically adopt filamentation cutting and laser ablation two
The method of kind.
1 as shown in figure 1, filamentation cuts：Refer to the filament phenomenon being formed when superpower short laser pulse transmits in media as well.
Ultrashort laser pulse bundle acts on sapphire/glass surface, is internally formed, at it, the thread pattern running through.Thread pattern destroys
Material internal stress structure, (physics punching press sliver, CO2 laser thermal effect sliver, chemical agent are rotten to coordinate suitable sliver mode
Erosion sliver etc.) can achieve material separation.The method actual mark area is little, the mark time is short, efficiency high, and punched hole is no
Substantially taper, it can reduce the energy of absorbed, reduces stress accumulation, the intensity of preferable reserved materials.But for indigo plant
The materials such as gem, are being carried out after this kind of method is punched it is impossible to make in the hole material and matrix be efficiently separated.And due to
The reasons such as the setting of parameter can lead to be also easy to produce uneven sawtooth on cutting track.
2 as shown in Fig. 2 laser ablation：Laser beam acts on sapphire/glass surface and brings it about one kind of gasification
Except processing mode.Removal scope is laser facula irradiation area, coordinates X-Y two-dimensional scanning mirrors system and image editing system,
The material of achievable designated shape removes.This drilling method makes removal part global formation, need not carry out sliver operation, more letter
Single.But its punching time is longer, when processing compared with thick material or larger aperture, it is also easy to produce taper.With laser, material is swept
Retouch the increase of time, be easily caused material internal stress accumulation, the intensity of impact material, and easily occur stress to release in process
Put the rupture leading to sample, affect production efficiency, increase potential safety hazard.
Content of the invention
For solving above-mentioned technical problem, the invention provides one kind can alleviate Stress Release to a certain extent, and split
The low fragile material drilling method of piece difficulty.
The technical scheme is that, including：
Filamentation cutting is carried out using ultrashort laser pulse bundle to fragile material to be processed, is formed and penetrate described fragile material
Annulus；
In described annulus arrange ablation areas, described ablation areas be shaped as designated shape, disappeared using laser
The mode melted is removed to the fragile material of described designated shape, is formed and multiple treats that sliver processes and mutually disjunct treats sliver
Monomer；
To multiple described treat that sliver monomer carries out sliver process simultaneously, realize the perforation processing of described fragile material.
Further, described designated shape is intersected with described annulus for end cross or M shape, described laser light
Speckle is carried out after laser ablation process to cross or M shape region, is formed and treats that sliver is processed and mutual disjunct multiple fan section
Domain.
Further, the hollow polygon that described designated shape is intersected with described annulus for summit, described laser facula pair
After hollow polygonal region carries out laser ablation process, formed and treat that sliver is processed and mutual disjunct arcuate region.
Further, treat that sliver monomer carries out sliver process using CO2 laser to described.
Further, when described filamentation cutting being carried out using ultrashort laser pulse bundle to fragile material to be processed, formation
Hot spot dot spacing is 3-10um.
Further, when fragile material to be processed being carried out with described filamentation cutting using ultrashort laser pulse bundle, laser is defeated
Going out power is 15-50W, and output frequency is 20-100KHz.
Further, when fragile material to be processed being carried out with described filamentation cutting using ultrashort laser pulse bundle, laser is cut
Cutting a translational speed is 50-200mm/s.
Further, when described fragile material being processed using the mode of described laser ablation, laser facula is overlapping
Rate is 70%～95%.
Further, when described fragile material being processed using the mode of described laser ablation, scanning galvanometer moves
Speed is 1000-4000mm/s.
Further, when described fragile material being processed using the mode of described laser ablation, laser output frequency
For 200-500KHz.
Beneficial effects of the present invention：Filamentation cutting is combined with laser ablation, cuts shape using laser ablation in filamentation
Carry out cross, rice word or polygon ablation processing in the circle ring area becoming, make entirely circle treat that sliver Region Decomposition becomes multiple fans
Shape or arch treat sliver monomer, treat that sliver monomer carries out sliver process respectively to each, effectively reduce sliver difficulty so that
This perforation processing can be suitably used for the processing of the fragile materials such as glass, sapphire.And during due to carrying out laser ablation, hot spot active region
Domain is only cross, rice block domain or polygon outline region, and compared to traditional whole border circular areas, its sphere of action is significantly
Reduce, thus the problem alleviating Stress Release and leading to, make stress accumulation effect inconspicuous, the strength of materials can be kept, make
Material after excision is not easily broken.This processing mode reduces edge chipping and heat-affected zone, thus the efficiency of lifting, punching
And success rate, reduces cost.Solve the efficiency in the course of processing and effect problem.
Brief description
Fig. 1 cuts schematic diagram for filamentation；
Fig. 2 is laser ablation schematic diagram；
Fig. 3 is a kind of embodiment schematic diagram of this patent fragile material drilling method；
Fig. 4 is another embodiment schematic diagram of this patent fragile material drilling method；
Specific embodiment
Below by way of specific embodiment, the present invention is described in further detail：
In the present invention, the principle of combined machining method is：Filamentation cutting is carried out to sapphire by ultrashort pulse laser,
In conjunction with laser ablation, the subregion at cutting center is melted, the advantage combining two kinds of boring techniques, one
The problem determining to alleviate Stress Release and lead in degree, and so that the difficulty of sliver is significantly reduced.
Specifically, the scheme of present invention employing is：
As shown in figure 3, first in the hollow ring of one diameter 1mm of motion control software inside-paint, adjusting suitable parameter
Open laser afterwards, laser cuts out an a diameter of 1mm by cutting head in sapphire surface and penetrates the annulus of sapphire layer (as schemed
Shown in 1, this annulus is approximate annulus, and reality is formed by circular arrangement by multiple through holes penetrating sapphire layer).Followed by
The annulus that CCD is cut to cutting head positions, and is moved to below scanning galvanometer using software control platform, is shaken using scanning
Mirror is processed to annulus inside, draws a solid cross on mark software, opens laser, resets parameter, mobile
The laser facula of scanning galvanometer, gets solid cross inside annulus, or rice word, and makes end points and the circle of solid cross or rice word
Ring intersects, formed multiple process and mutual disjunct sector region (being four quadrants during cross) whne sliver, each
Individual sector region treats sliver monomer for one.As shown in Figure 4 it is also possible to be to be entered with polygons such as hollow triangle for assignment graph
Row laser ablation, thus formed multiple treat that sliver is processed and mutual disjunct arcuate region, each arcuate region is treated for one
Sliver monomer.Finally using CO2 laser instrument, sliver monomer carries out sliver process to be treated to each simultaneously, make internal annulus and sapphire
Substrate is effectively separated.
Wherein, when carrying out filamentation cutting, laser parameter is the present embodiment：Laser cutting head translational speed 50-200mm/,
Frequency is 20-100KHz, and output is 15-50W, and the hot spot dot spacing of formation is 3-10um.When carrying out laser ablation, swash
Optical parameter is：Scanning galvanometer translational speed is 1000-4000mm/s, and frequency is 200-500KHz, and laser output power is 15-
50W, light laser beam overlap ratio is 70%～95%.When carrying out sliver process, vibration mirror scanning translational speed is 300-800mm/s, swashs
Light output frequency is 10-50KHz, and laser output power is 50-100W.
The above, only the specific embodiment of the present invention is it is noted that any those of ordinary skill in the art exist
Disclosed herein technical scope in, the change or replacement that can readily occur in, all should cover protection scope of the present invention it
Interior.
Claims (10)
1. a kind of fragile material drilling method it is characterised in that：
Filamentation cutting is carried out using ultrashort laser pulse bundle to fragile material to be processed, forms the circle penetrating described fragile material
Ring；
In described annulus arrange ablation areas, described ablation areas be shaped as designated shape, using laser ablation
Mode is removed to the fragile material of described designated shape, is formed and multiple treats that sliver processes and mutually disjunct treats sliver list
Body；
To multiple described treat that sliver monomer carries out sliver process simultaneously, realize the perforation processing of described fragile material.
2. fragile material drilling method as claimed in claim 1 it is characterised in that：Described designated shape is end and described annulus
Intersecting cross or M shape, described laser facula is carried out after laser ablation process to cross or M shape region, is formed
Treat that sliver is processed and mutual disjunct multiple sector region.
3. fragile material drilling method as claimed in claim 1 it is characterised in that：Described designated shape is summit and described annulus
Intersecting hollow polygon, described laser facula is carried out after laser ablation process to hollow polygonal region, is formed and treats at sliver
Reason and mutually disjunct arcuate region.
4. as described in Claims 2 or 3 fragile material drilling method it is characterised in that：Treated to described using CO2 laser
Sliver monomer carries out sliver process.
5. fragile material drilling method as claimed in claim 1 it is characterised in that：Using ultrashort laser pulse bundle to be processed crisp
Property material when carrying out the cutting of described filamentation, the hot spot dot spacing of formation is 3-10um.
6. fragile material drilling method as claimed in claim 1 it is characterised in that：Using ultrashort laser pulse bundle to be processed crisp
Property material when carrying out the cutting of described filamentation, laser output power is 15-50W, and output frequency is 20-100KHz.
7. fragile material drilling method as claimed in claim 1 it is characterised in that：Using ultrashort laser pulse bundle to be processed crisp
Property material when carrying out the cutting of described filamentation, laser cutting head translational speed is 50-200mm/s.
8. fragile material drilling method as claimed in claim 1 it is characterised in that：Using described laser ablation mode to described
When fragile material is processed, laser facula Duplication is 70%～95%.
9. fragile material drilling method as claimed in claim 1 it is characterised in that：Using described laser ablation mode to described
When fragile material is processed, scanning galvanometer translational speed is 1000-4000mm/s.
10. fragile material drilling method as claimed in claim 1 it is characterised in that：Using described laser ablation mode to institute
When stating fragile material and being processed, laser output frequency is 200-500KHz.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610975424.9A CN106392341B (en) | 2016-11-07 | 2016-11-07 | A kind of fragile material drilling method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610975424.9A CN106392341B (en) | 2016-11-07 | 2016-11-07 | A kind of fragile material drilling method |
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| CN106392341A true CN106392341A (en) | 2017-02-15 |
| CN106392341B CN106392341B (en) | 2019-06-11 |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018165994A1 (en) * | 2017-03-17 | 2018-09-20 | 北京工业大学 | High-precision laser machining method for sapphire submicron-order section |
| CN108723615A (en) * | 2018-07-17 | 2018-11-02 | 西安中科微精光子制造科技有限公司 | Micropore laser processing and system based on the control of laser pulse Duplication |
| CN108971775A (en) * | 2017-06-02 | 2018-12-11 | 大族激光科技产业集团股份有限公司 | A kind of laser boring method and equipment for metal |
| CN109175714A (en) * | 2018-09-27 | 2019-01-11 | 江苏大学 | A kind of laser rotary-cut mark method on hard brittle material surface |
| CN109226977A (en) * | 2018-09-12 | 2019-01-18 | 广东正业科技股份有限公司 | A kind of low temperature process method and system of hard brittle material |
| CN109304547A (en) * | 2018-10-12 | 2019-02-05 | 广东正业科技股份有限公司 | A kind of laser processing and system of hard brittle material |
| CN111151895A (en) * | 2020-01-13 | 2020-05-15 | 大族激光科技产业集团股份有限公司 | Process and system for cutting transparent material by utilizing filamentation effect |
| CN112234017A (en) * | 2020-10-19 | 2021-01-15 | 绍兴同芯成集成电路有限公司 | Double-sided processing technology for glass carrier plate and wafer |
| CN113172354A (en) * | 2021-05-13 | 2021-07-27 | 深圳力星激光智能装备有限公司 | Laser processing method for hole-shaped structure of brittle sheet |
| CN114096488A (en) * | 2019-07-16 | 2022-02-25 | 日东电工株式会社 | Method for dividing composite material |
| CN115536257A (en) * | 2022-10-25 | 2022-12-30 | 深圳市益铂晶科技有限公司 | Corrosion splitting method for glass micropores |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| WO2018165994A1 (en) * | 2017-03-17 | 2018-09-20 | 北京工业大学 | High-precision laser machining method for sapphire submicron-order section |
| CN108971775A (en) * | 2017-06-02 | 2018-12-11 | 大族激光科技产业集团股份有限公司 | A kind of laser boring method and equipment for metal |
| CN108723615A (en) * | 2018-07-17 | 2018-11-02 | 西安中科微精光子制造科技有限公司 | Micropore laser processing and system based on the control of laser pulse Duplication |
| CN109226977A (en) * | 2018-09-12 | 2019-01-18 | 广东正业科技股份有限公司 | A kind of low temperature process method and system of hard brittle material |
| CN109175714A (en) * | 2018-09-27 | 2019-01-11 | 江苏大学 | A kind of laser rotary-cut mark method on hard brittle material surface |
| CN109304547A (en) * | 2018-10-12 | 2019-02-05 | 广东正业科技股份有限公司 | A kind of laser processing and system of hard brittle material |
| CN114096488A (en) * | 2019-07-16 | 2022-02-25 | 日东电工株式会社 | Method for dividing composite material |
| CN111151895A (en) * | 2020-01-13 | 2020-05-15 | 大族激光科技产业集团股份有限公司 | Process and system for cutting transparent material by utilizing filamentation effect |
| CN112234017A (en) * | 2020-10-19 | 2021-01-15 | 绍兴同芯成集成电路有限公司 | Double-sided processing technology for glass carrier plate and wafer |
| CN112234017B (en) * | 2020-10-19 | 2023-07-14 | 绍兴同芯成集成电路有限公司 | Double-sided processing technology for glass carrier plate and wafer |
| CN113172354A (en) * | 2021-05-13 | 2021-07-27 | 深圳力星激光智能装备有限公司 | Laser processing method for hole-shaped structure of brittle sheet |
| CN115536257A (en) * | 2022-10-25 | 2022-12-30 | 深圳市益铂晶科技有限公司 | Corrosion splitting method for glass micropores |
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|---|---|
| CN106392341B (en) | 2019-06-11 |
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