CN106378682A - Machining method for to-be-plated circuit based on epoxy resin encapsulating - Google Patents
Machining method for to-be-plated circuit based on epoxy resin encapsulating Download PDFInfo
- Publication number
- CN106378682A CN106378682A CN201610873093.8A CN201610873093A CN106378682A CN 106378682 A CN106378682 A CN 106378682A CN 201610873093 A CN201610873093 A CN 201610873093A CN 106378682 A CN106378682 A CN 106378682A
- Authority
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- China
- Prior art keywords
- circuit
- epoxy resin
- grinding
- emery wheel
- resin enclosed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 65
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 65
- 238000000034 method Methods 0.000 title claims abstract description 46
- 238000003754 machining Methods 0.000 title abstract description 9
- 238000000227 grinding Methods 0.000 claims abstract description 48
- 238000005488 sandblasting Methods 0.000 claims abstract description 41
- 238000005520 cutting process Methods 0.000 claims abstract description 20
- 229910001651 emery Inorganic materials 0.000 claims description 35
- 238000003672 processing method Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 14
- 238000007788 roughening Methods 0.000 claims description 13
- 239000002245 particle Substances 0.000 claims description 10
- 238000012545 processing Methods 0.000 claims description 9
- 239000012530 fluid Substances 0.000 claims description 8
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 7
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 229910052593 corundum Inorganic materials 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims description 5
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 5
- 150000001412 amines Chemical class 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 claims description 4
- 150000007524 organic acids Chemical class 0.000 claims description 4
- 239000003082 abrasive agent Substances 0.000 claims description 2
- 238000005422 blasting Methods 0.000 claims description 2
- 238000005498 polishing Methods 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 238000007747 plating Methods 0.000 abstract description 4
- 238000001465 metallisation Methods 0.000 abstract description 2
- 238000007493 shaping process Methods 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 238000010586 diagram Methods 0.000 description 6
- 239000010410 layer Substances 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000010426 asphalt Substances 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical compound CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 206010007247 Carbuncle Diseases 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910003978 SiClx Inorganic materials 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- -1 halogen ion Chemical class 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000010721 machine oil Substances 0.000 description 1
- 238000006263 metalation reaction Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/04—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
- H01L21/4896—Mechanical treatment, e.g. cutting, bending
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a machining method for a to-be-plated circuit based on epoxy resin encapsulating. The machining method includes the steps that a precision positioning cutting shaping process is used for conducting appearance machining on the epoxy resin encapsulated circuit; then a grinding wheel is used for grinding the machined encapsulated circuit; and finally a sand blasting process is adopted for conducting physical coarsening on the ground encapsulated circuit, and the to-be-plated epoxy resin encapsulated circuit is obtained. The problem that a traditional machining has damage to the epoxy resin encapsulated circuit, the follow-up reliability of the circuit is improved, meanwhile, the circuit is effectively treated before plating, the adhesive force of a plating layer is improved, and the follow-up surface metallization process is promoted.
Description
Technical field
The invention belongs to integrated circuit processing technical field, it is related to a kind of adding based on epoxy resin enclosed circuit to be plated
Work method, especially a kind of epoxy resin enclosed three-dimension packaging stacked circuit is vertically being associated by outer surface metallization
Forming processing method before.
Background technology
Three-dimension packaging stacked circuit is encapsulated to it using epoxide resin encapsulation material, then passes through outer surface side-wall metallic
Change layer and realize the interconnection between difference in functionality lead in vertical direction；But it is necessary to using epoxy resin before interconnection
The three-dimensional stacked circuit encapsulated forms processing, makes drawing of the internal stack assemblies of epoxy resin block after molding and solidification
Line can completely expose, and whole surface must be processed it is ensured that metal layer before making interconnection metal layer simultaneously
The uniformity of plating and reliability.
Epoxy resin enclosed circuit is hexahedron structure, and the pin of circuit is drawn from the bottom of circuit.If using tradition
Mechanical processing technique such as car, milling, the method such as cut it is processed, machining stress is big, and cutting output is uncontrollable, processed
May form, on the contact surface of workpiece, the microscopic damage being difficult to repair in journey, cause the failure phenomenons such as later stage cracking, layering,
Lasting stress can be applied in above-mentioned process on epoxy resin enclosed circuit simultaneously, tired therefore in process
The heat of meter generation, electrostatic charge etc. may impact to the device within circuit, bring hidden danger to the reliability of circuit,
And the more difficult control of surface roughness after processing, affect subsequent conditioning circuit and carry out surface metalation.
Content of the invention
It is an object of the invention to provide a kind of processing method based on epoxy resin enclosed circuit to be plated.Solve biography
The damage that system machining causes to epoxy resin enclosed circuit, improves the follow-up reliability of circuit, circuit is plated simultaneously
Before carried out effective process, improve the adhesive force of coating, promote sequent surface metallize operation carrying out.
The purpose of the present invention is achieved through the following technical solutions：
This processing method based on epoxy resin enclosed circuit to be plated, comprises the following steps：
Step 1, carries out profile roughing using precision positioning cutting forming technique to epoxy resin enclosed circuit, obtains
Encapsulating circuit after roughing；
Step 2, carries out grinding using emery wheel to the encapsulating circuit after roughing, obtains the encapsulating circuit after grinding；
The abrasive material of its medium plain emery wheel is silicon-carbide particle, and silicon-carbide particle is attached on soft matrix；
Step 3, carries out physics roughening using sand blasting process to the encapsulating circuit after grinding, obtains asphalt mixtures modified by epoxy resin to be plated
Fat encapsulates circuit, and the spout of sand-blasting machine is less than 20cm with the distance of circuit, and sand-blast material is Al2O3, the particle size range of sand-blast material
For 150-300 mesh.
Further, the feature of the present invention also resides in：
Wherein in step 2, the detailed process of grinding operation is, the detailed process of grinding is：Successively no lead leg is drawn
3 faces roughly ground using emery wheel and precision grinding process；Successively 2 faces having lead leg to draw are carried out roughly grinding using emery wheel, essence
Mill and finishing operations.
Wherein in step 2, the detailed process of roughly grinding operation is, is trimmed to the emery wheel of 2.0～3.0mm using thickness, emery wheel
Rotating speed is 800-2000r/min, and each amount of feeding is less than 50 μm, and thickness of cutting is 100-200 μm.
Wherein in step 2, the detailed process of precision grinding process is, is trimmed to the emery wheel of 5.0～8.0mm using thickness, emery wheel
Rotating speed is 800-1500r/min, refines 3-4 time, and each amount of feeding is 10-20 μm, and thickness of cutting is below 100 μm.
Wherein in step 2, the detailed process of finishing operations is, is trimmed to the emery wheel of 10.0～20.0mm, emery wheel using thickness
Rotating speed be 800-1500r/min, polishing cutting 1-2 time, each amount of feeding is less than 5 μm, and thickness of cutting is below 10 μm.
Using grinding fluid, the encapsulating circuit after processing is rinsed wherein during grinding in step 2；Grinding fluid is
Organic acid and the mixed liquor of organic amine, in grinding fluid, halogen ion concentration control range is Cl-≤5ppm、Na+≤1ppm、K+≤
2ppm, electrical conductivity is about 0.06S/cm.
Wherein used in step 3, blasting method is workpiece rotoblast, and the pressure of sandblasting is 0.05-0.15MPa, sandblasting
Time be 5-20s.
Using clamping tooling, the encapsulating circuit after roughing is fixed wherein in step 2, clamping tooling includes frock
Base slide rail, tooling base slide rail is fixed with vice fixed block, and tooling base slide rail is additionally provided with the vice being capable of activity
Movable block, is provided with Mobile tool between vice fixed block and vice movable block, Mobile tool is provided be stuck in epoxy
Boss between two pins of resin-encapsulate circuit, is provided with emery wheel above Mobile tool.
Wherein realize sand blasting process using sand blasting unit in step 3, sand blasting unit includes rotating base, rotating base
On be provided with pilot protection frock, the surrounding of pilot protection frock is provided with sand-blasting machine spout, pilot protection frock is provided with
It is inserted into the groove of two pins of epoxy resin enclosed circuit.
Wherein sand-blasting machine spout at least 2, and sand-blasting machine spout and fixing epoxy resin bag in pilot protection frock
The distance of envelope circuit is less than 20cm.
The invention has the beneficial effects as follows：Using precision positioning cutting forming technique, epoxy resin enclosed circuit is carried out outer
So that the pin that circuit function face has the one side of pin extraction exposes uniformly, inner lead end points is clear for shape processing；Use
The soft emery wheel of silicon carbide material reduces processing external carbuncle while meeting machining accuracy to greatest extent, reduces in circuit
The damage that portion causes, ensure that the defect such as circuit surface flawless and scuffing after grinding；Using sand blasting process, to grinding
Encapsulating circuit after shaping carries out physics roughening, by sand-blast material Al2O3To the scratching in the non-functional face of circuit, plough plough effect, make
Circuit surface produces microcosmic out-of-flatness, forms rough structure, subsequent metal coating adhesion is effectively ensured.
Further, the functional surfaces of encapsulating circuit are carried out with refine and carries out encapsulating circuit is carried out using grinding fluid
Cleaning, improves the defects such as " wire drawing, the adhesion " that conventional machinery processing technology causes on metal and nonmetallic materials interface,
Solve the problems, such as using coolants such as machine oil and kerosene, circuit to be polluted；The heat that produces during in time mill being cut and
The electric charge release of accumulation, by above-mentioned technique, firmly crisp metal lead wire material inside circuit and relatively soft resin material are equal
Fine dimension can be carried out, high accuracy is processed, and will not be produced metamorphic layer.
Further, alundum (Al2O3) is effectively clashed into the surface of encapsulating circuit, makes the asphalt mixtures modified by epoxy resin of circuit surface
Make it produce plastic deformation while fat is effectively peeled off, cause dislocation density in epoxide resin material crystal grain to increase, and right
Epoxy resin surface impact produces erose pit, and these pit directions are different, do not have fixed orientation, is conducive to reducing
Shrinkage stress when coating layer is formed, the metal terminal material exposing after simultaneously circuit surface mill being cut into is polished, and makes
It forms the 3-D solid structure of dimpling from the planar structure wrapped up by epoxy resin, and shape is also trimmed to transition from rectangle
Mellow and full ellipse, thus effectively improve the attachment in epoxy resin surface for the coating layer.
Further, clamping tooling can by epoxy resin enclosed circuit clamping be fixed up, and can respectively by
Encapsulating circuit no/one side that has pin fixes respectively upward, is conveniently processed the step 2 in method.
Further, sand blasting unit can carry out sand blasting process to encapsulating circuit, makes the surface of epoxy resin thick
Change, rotating base can drive epoxy resin enclosed circuit to be rotated, enable sand-blasting machine to carry out omnibearing physics to it
Roughening, multiple sand-blasting machine spouts can improve the efficiency of physics roughening.
Brief description
Fig. 1 is using the adhesive force comparison diagram that after the inventive method, encapsulating circuit is carried out with coating and conventional method coating；
Fig. 2 cuts, for midplane of the present invention mill, the effect contrast figure that precision form is shaped with tradition machinery；
Fig. 3 is metal terminal Profile Correlation figure before and after physics roughening in the present invention；
Fig. 4 is the structural representation of clamping tooling clamping no pin lead surface in the present invention；
Fig. 5 is the structural representation that in the present invention, clamping tooling is clamped with pin lead surface；
Fig. 6 is the structural representation of sand blasting unit in the present invention.
In figure：1 is tooling base slide rail；2 is vice fixed block；3 is Mobile tool；4 is vice movable block；5 is emery wheel；
6 is epoxy resin enclosed circuit；7 is sand-blasting machine spout；8 is pilot protection frock；9 is rotating base.
Specific embodiment
Below in conjunction with the accompanying drawings the present invention is described in further detail：
The invention provides a kind of processing method based on epoxy resin enclosed circuit to be plated, its detailed process is：
Step 1, carries out profile roughing using precision positioning cutting forming technique to epoxy resin enclosed circuit, obtains
Encapsulating circuit after roughing；Using vice, the epoxy resin encapsulated body after mold cure is fixed on cutting off machine, and
And make non-functional towards upper, be used lead root position as machining benchmark position, adjust amesdial and vice, then using gold
Hard rock saw carries out rough cutting to embedding body, and encapsulating die and unnecessary potting compound are removed.Encapsulating electricity after the roughing obtaining
The circuit function on road shows out uniformly clearly inner lead end points,
Encapsulating circuit after roughing is clamped by step 2 using clamping tooling, then using the emery wheel edge of high-speed rotation
Encapsulating circuit surface and carry out longitudinally reciprocating motion and epoxy resin surface is cut, grinding carriage does horizontal stroke along machine tool guideway simultaneously
Moving to index(ing) feed controls between 5-50 μm by each cutting output, preferably 20 μm, 30 μm or 40 μm；The mill of its medium plain emery wheel
Expect for silicon-carbide particle, and silicon-carbide particle is attached on soft matrix, in the presence of mill shear force, abrasive particle can be in various degree
Be retracted in soft matrix, therefore emery wheel forms small cut in circuit surface, produces trickle chip；The tool of grinding
Body process is to be divided into corase grind, fine grinding and refine by the amount of feeding of grinding.And 3 non-functional faces that no lead leg is drawn are advanced
Refined after row corase grind；2 functional surfaces having lead leg to draw first are roughly ground, then refines and finally carry out refine；Wherein roughly grind
Using the emery wheel of thickness correction to 2.0-3.0mm, preferably 2.5mm, the rotating speed of emery wheel controls in 800-2000r/min, preferably
For 1000r/min or 1500r/min, each amount of feeding is less than 50 μm, preferably 50 μm, 40 μm or 35 μm, and thickness of cutting is
100-200 μm, preferably 100 μm or 150 μm；Fine grinding is trimmed to the emery wheel of 5.0-8.0mm using thickness, preferably 6mm or
7mm, the rotating speed of emery wheel is controlled in 800-1500r/min by fine grinding, preferably 1000r/min or 1300r/min, grinding 3 or 4
Secondary, the amount of feeding of each grinding is 10-20 μm, preferably 10 μm or 15 μm；Refine controls the rotating speed of emery wheel in 800-
1500r/min, preferably 1300r/min or 1400r/min, grinding 1 or 2 times, the amount of feeding of each grinding is less than 5 μm, excellent
Elect 3 μm or 2 μm as, thickness of cutting below 10 μm, preferably 5 μm or 8 μm.And using content of halogen during grinding
Relatively low aqueous grinding fluid is carried out to encapsulating circuit and cools down, and grinding fluid is the mixed liquor of organic acid and organic amine, specifically
Organic acid select dodecanedioic acid, organic amine select triethanolamine；And Cl in grinding fluid-≤5ppm、Na+≤1ppm、K+≤
2ppm, electrical conductivity is 0.06S/cm, finally obtains the encapsulating circuit of grinding.
The encapsulating circuit of the grinding obtaining in step 2 is fixed up by step 3 using pilot protection frock 8, wherein circuit
Function face down, and effective protection is carried out to the circuit outer lead of functional surfaces, prevents from sandblasting coarsening process, it being caused
Damage；Carry out sandblasting using workpiece rotoblast technique, wherein sand-blasting machine spout is less than 20cm with encapsulating the distance between circuit,
It is preferably 10-20cm, 15cm or 18cm；The material of sandblasting is Al2O3, the particle size range of sand-blast material is 150-300 mesh, preferably
For 200 mesh, 230 mesh or 280 mesh；The pressure of sandblasting is 0.05-0.15MPa, preferably 0.10MPa；The time of sandblasting is 5-
20s, preferably 10s or 15s.Finally give epoxy resin enclosed circuit to be plated.
Using clamping tooling, the encapsulating circuit after roughing is fixed up in step 2, clamping tooling as shown in figure 4,
Including tooling base slide rail 1, tooling base slide rail 1 is fixed on vice fixed block 2, and tooling base slide rail 1 is additionally provided with
The vice movable block 4 that can slide on, is provided with Mobile tool 3 between vice fixed block 2 and vice movable block 4；Wherein
Epoxy resin enclosed circuit 6 is arranged between vice fixed block 3 and vice movable block 4, and the boss of Mobile tool 3 is inserted into ring
Between two groups of pins of oxygen resin-encapsulate circuit 6, the top of epoxy resin enclosed circuit 6 is provided with emery wheel 5, and emery wheel 5 is green carbon
SiClx emery wheel.Wherein Fig. 4 clamps, for clamping tooling, the knot that epoxy resin enclosed circuit 6 carries out grinding process to no pin lead surface
Structure schematic diagram；Fig. 5 clamps epoxy resin enclosed circuit 6 for clamping tooling and the structure having pin lead surface to carry out grinding process is shown
It is intended to.
Realize sand blasting process using sand blasting unit in step 3, the physics completing epoxy resin enclosed circuit 6 is thick
Change；As shown in fig. 6, sand blasting unit includes rotating base 9, rotating base 9 is provided with pilot protection frock 8, pilot protection work
Fill 8 fixing epoxy resin enclosed circuit 6, two groups of pins of wherein epoxy resin enclosed circuit 6 are inserted into pilot protection frock 8
In groove, make the function of epoxy resin enclosed circuit 6 face down, and carry out necessary closed protective measure to prevent sandblasting to circuit
The damage of lead；The periphery of pilot protection frock 8 is provided with sand-blasting machine spout 7, and sand-blasting machine spout 7 is no less than two, and sandblasting
The distance between machine spout 7 and epoxy resin enclosed circuit 6 are less than 20cm, preferably 10-20cm, 15cm or 18cm.
According to coating adhesion method of testing, according to GB/T5270-20052.8 clause, epoxy resin enclosed circuit is existed
Adhesive force before and after physics roughening is tested, and obtains comparison diagram as shown in Figure 1, is not carry out physics roughening plating on the left of in figure
The design sketch of the epoxy resin enclosed circuit of layer, it once has large-area coating to come off using adhesive tape adhesion；On the right side of in figure it is
Carry out the epoxy resin enclosed circuit of physics roughening, adhered to three times using adhesive tape, only coating edge has and comes off a little.Therefore originally
The effect that invention carries out coating after physics roughening to epoxy resin enclosed circuit is substantially good than traditional handicraft.
Fig. 2 cuts the design sketch of precision form for tradition machinery forming and flat stone mill, and the left side of figure becomes for tradition machinery
The design sketch of shape, in figure epoxy resin surface is coarse and has damage；The right side of figure cuts precision form for the present invention using flat stone mill
Design sketch, its epoxy resin surface is smooth and free from flaw.
Fig. 3 is the comparison diagram of metal terminal section on functional surfaces before and after physics roughening, before the left side of figure is for physics roughening
Diagram, wherein metal terminal plane is covered by coating；The right side of figure is the diagram after physics roughening, wherein metal terminal dimpling
Rise, and wrapped up by coating.
Claims (10)
1. a kind of processing method based on epoxy resin enclosed circuit to be plated is it is characterised in that comprise the following steps：
Step 1, carries out profile roughing using precision positioning cutting forming technique to epoxy resin enclosed circuit, obtains slightly adding
Encapsulating circuit after work；
Step 2, carries out grinding using emery wheel to the encapsulating circuit after roughing, obtains the encapsulating circuit after grinding；Wherein
The abrasive material of emery wheel is silicon-carbide particle, and silicon-carbide particle is attached on soft matrix；
Step 3, carries out physics roughening using sand blasting process to the encapsulating circuit after grinding, obtains epoxy resin bag to be plated
Envelope circuit, the spout of sand-blasting machine is less than 20cm with the distance of circuit, and sand-blast material is Al2O3, the particle size range of sand-blast material is
150-300 mesh.
2. the processing method based on epoxy resin enclosed circuit to be plated according to claim 1 is it is characterised in that described
In step 2, the detailed process of grinding is：3 faces successively no lead leg drawn are roughly ground using emery wheel and precision grinding process；According to
Secondary to have lead leg draw 2 faces carry out roughly grinding, refine and finishing operations using emery wheel.
3. the processing method based on epoxy resin enclosed circuit to be plated according to claim 2 is it is characterised in that described
In step 2, the detailed process of roughly grinding operation is, is trimmed to using thickness to the emery wheel of 2.0～3.0mm, the rotating speed of emery wheel is 800-
2000r/min, each amount of feeding is less than 50 μm of thicknesses of cutting and is 100-200 μm.
4. the processing method based on epoxy resin enclosed circuit to be plated according to claim 2 is it is characterised in that described
In step 2, the detailed process of precision grinding process is, is trimmed to the emery wheel of 5.0～8.0mm using thickness, the rotating speed of emery wheel is 800-
1500r/min, refines 3-4 time, and each amount of feeding is 10-20 μm, and thickness of cutting is below 100 μm.
5. the processing method based on epoxy resin enclosed circuit to be plated according to claim 2 is it is characterised in that described
In step 2, the detailed process of finishing operations is, is trimmed to the emery wheel of 10.0～20.0mm using thickness, the rotating speed of emery wheel is 800-
1500r/min, polishing cutting 1-2 time, each amount of feeding is less than 5 μm, and thickness of cutting is below 10 μm.
6. the processing method based on epoxy resin enclosed circuit to be plated according to claim 1 is it is characterised in that described
Using grinding fluid, the encapsulating circuit after processing is rinsed during grinding in step 2；Grinding fluid is organic acid and organic
The mixed liquor of amine, and Cl in grinding fluid-≤5ppm、Na+≤1ppm、K+≤ 2ppm, electrical conductivity be 0.06S/cm, can in time by
Heat and the release of accumulative electric charge that mill produces during cutting.
7. the processing method based on epoxy resin enclosed circuit to be plated according to claim 1 is it is characterised in that described
Used in step 3, blasting method is workpiece rotoblast, and the pressure of sandblasting is 0.05-0.15MPa, and the time of sandblasting is 5-
20s.
8. the processing method based on epoxy resin enclosed circuit to be plated according to claim 1 is it is characterised in that described
Using clamping tooling, the encapsulating circuit after roughing is fixed in step 2, clamping tooling includes tooling base slide rail (1),
Vice fixed block (2) is fixed with tooling base slide rail (1), tooling base slide rail (1) is additionally provided with the vice being capable of activity
Movable block (4), is provided with Mobile tool (3) between vice fixed block (2) and vice movable block (4), Mobile tool (3) is upper to be arranged
There is the boss being stuck between epoxy resin enclosed (6) two pins of circuit, above Mobile tool (3), be provided with emery wheel (5).
9. the processing method based on epoxy resin enclosed circuit to be plated according to claim 1 is it is characterised in that described
Sand blasting process is realized using sand blasting unit, sand blasting unit includes rotating base (9), rotating base (9) is upper to be arranged in step 3
Leaded protecting tool set-up (8), the surrounding of pilot protection frock (8) is provided with sand-blasting machine spout (7), in pilot protection frock (8)
It is provided with inserting the groove of two pins of epoxy resin enclosed circuit (6).
10. the processing method based on epoxy resin enclosed circuit to be plated according to claim 9 is it is characterised in that institute
State sand-blasting machine spout (7) at least 2, and sand-blasting machine spout (7) goes up the epoxy resin enclosed of fixation with pilot protection frock (8)
The distance of circuit (6) is less than 20cm.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108436781A (en) * | 2018-04-02 | 2018-08-24 | 四川艾尔诺航空金属器材有限公司 | A kind of tooling and its method of the local coating of removal |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5811877A (en) * | 1994-08-30 | 1998-09-22 | Hitachi, Ltd. | Semiconductor device structure |
| CN1381069A (en) * | 2000-03-17 | 2002-11-20 | 松下电器产业株式会社 | Module with built-in electronic elements and method of manufacture thereof |
| CN102729155A (en) * | 2012-05-22 | 2012-10-17 | 无锡市喷特环保工程有限公司 | Novel vertical sand blasting device |
| CN102832140A (en) * | 2012-08-31 | 2012-12-19 | 中国电子科技集团公司第四十研究所 | Machining method of metal packaging shell of large-scale and large-power integrated circuit |
| CN103500713A (en) * | 2013-09-28 | 2014-01-08 | 宁波康强电子股份有限公司 | Manufacturing method of pre-packaged lead frame |
| CN103594447A (en) * | 2013-10-24 | 2014-02-19 | 天水华天科技股份有限公司 | IC chip stack packaged component large in packaging density and good in high frequency performance and manufacturing method thereof |
-
2016
- 2016-09-30 CN CN201610873093.8A patent/CN106378682B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5811877A (en) * | 1994-08-30 | 1998-09-22 | Hitachi, Ltd. | Semiconductor device structure |
| CN1381069A (en) * | 2000-03-17 | 2002-11-20 | 松下电器产业株式会社 | Module with built-in electronic elements and method of manufacture thereof |
| CN102729155A (en) * | 2012-05-22 | 2012-10-17 | 无锡市喷特环保工程有限公司 | Novel vertical sand blasting device |
| CN102832140A (en) * | 2012-08-31 | 2012-12-19 | 中国电子科技集团公司第四十研究所 | Machining method of metal packaging shell of large-scale and large-power integrated circuit |
| CN103500713A (en) * | 2013-09-28 | 2014-01-08 | 宁波康强电子股份有限公司 | Manufacturing method of pre-packaged lead frame |
| CN103594447A (en) * | 2013-10-24 | 2014-02-19 | 天水华天科技股份有限公司 | IC chip stack packaged component large in packaging density and good in high frequency performance and manufacturing method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 陈加福: "《化学镀技术1000问》", 30 November 2015, 机械工业出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108436781A (en) * | 2018-04-02 | 2018-08-24 | 四川艾尔诺航空金属器材有限公司 | A kind of tooling and its method of the local coating of removal |
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