CN106374029A - Led散热方法 - Google Patents
Led散热方法 Download PDFInfo
- Publication number
- CN106374029A CN106374029A CN201510422132.8A CN201510422132A CN106374029A CN 106374029 A CN106374029 A CN 106374029A CN 201510422132 A CN201510422132 A CN 201510422132A CN 106374029 A CN106374029 A CN 106374029A
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- Prior art keywords
- heat
- led
- heat radiation
- base plate
- cooling
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Links
- 238000000034 method Methods 0.000 title claims abstract description 9
- 230000005855 radiation Effects 0.000 title abstract 4
- 238000004806 packaging method and process Methods 0.000 claims abstract description 5
- 239000007769 metal material Substances 0.000 claims abstract description 3
- 230000000694 effects Effects 0.000 abstract description 7
- 239000000758 substrate Substances 0.000 abstract description 4
- 238000009792 diffusion process Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 238000001816 cooling Methods 0.000 abstract 5
- 238000006243 chemical reaction Methods 0.000 abstract 1
- 230000000191 radiation effect Effects 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
常规的功率型LED散热装置是通过LED封装基板将热量传递到散热底板，散热底板与传热系统相连结，传热系统再与外壳或散热器连接，将热量散发出去。由于材料表面固有的平整度问题，实际上还是存在着微细的气穴。空气的界面热阻极大，不利于热扩散，转换过程越多，整体界面热阻越大，导致热量传递少，散热效果差。本发明提供一种LED的散热方法，它是将散热底板、外壳、散热片为一体化金属材料，所有LED的封装基板设定在同一块散热底板上，与接触面垂直排列。本发明具有散热效果显著的特点。
Description
技术领域
本发明涉及一种LED散热方法，解决了功率型LED散热问题。
背景技术
常规的功率型LED散热装置是通过LED封装基板将热量传递到散热底板，散热底板与传热系统相连结，传热系统再与外壳或散热器连接，将热量散发出去。由于材料表面固有的平整度问题，实际上还是存在着微细的气穴。空气的界面热阻极大，不利于热扩散，转换过程越多，整体界面热阻越大，导致热量传递少，散热效果差。要解决以上问题，就必须对LED的散热装置进行优化，使热量传递满足LED对环境温度的要求。
发明内容
本发明的目的在于提供一种LED的散热方法，提高LED散热效果。
本发明是通过以下技术方案实现的，它是将散热底板、外壳、散热片为一体化金属材料，所有LED的封装基板设定在同一块散热底板上，与接触面垂直排列。
本发明具有散热效果显著的特点。
具体实施方式
示例：将本发明的LED散热技术用于1W的LED灯具上。即将LED的散热基板用螺钉固定在灯具内芯的散热底板上，所用的散热底板与灯具外壳及外壳散热片可选用铝材一体化浇铸。当灯具工作时，LED产生大量的热量通过基板直接传输到散热片上，进入空气，没有中间传热的节点，因而传热效果好，降温效果显著。在室温环境下工作10小时后，进行测量散器表面温度为45℃。本发明具有散热效果显著的特点。
Claims (1)
1.LED散热方法，其特征在于散热底板、外壳、散热片为一体化金属材料，所有LED的封装基板设定在同一散热底板上，散热片与接触面垂直排列。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510422132.8A CN106374029A (zh) | 2015-07-20 | 2015-07-20 | Led散热方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510422132.8A CN106374029A (zh) | 2015-07-20 | 2015-07-20 | Led散热方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106374029A true CN106374029A (zh) | 2017-02-01 |
Family
ID=57879884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510422132.8A Pending CN106374029A (zh) | 2015-07-20 | 2015-07-20 | Led散热方法 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106374029A (zh) |
-
2015
- 2015-07-20 CN CN201510422132.8A patent/CN106374029A/zh active Pending
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Legal Events
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| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170201 |