CN106373879A - 一种敷铜板腐蚀设备 - Google Patents

一种敷铜板腐蚀设备 Download PDF

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Publication number
CN106373879A
CN106373879A CN201610893493.5A CN201610893493A CN106373879A CN 106373879 A CN106373879 A CN 106373879A CN 201610893493 A CN201610893493 A CN 201610893493A CN 106373879 A CN106373879 A CN 106373879A
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tank
copper clad
centrifugal pump
corrosion
etching tank
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CN201610893493.5A
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谢雨锟
廖继海
李丽秀
杨日福
刘友举
陈伟冰
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South China University of Technology SCUT
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South China University of Technology SCUT
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09B—EDUCATIONAL OR DEMONSTRATION APPLIANCES; APPLIANCES FOR TEACHING, OR COMMUNICATING WITH, THE BLIND, DEAF OR MUTE; MODELS; PLANETARIA; GLOBES; MAPS; DIAGRAMS
    • G09B25/00—Models for purposes not provided for in G09B23/00, e.g. full-sized devices for demonstration purposes
    • G09B25/02—Models for purposes not provided for in G09B23/00, e.g. full-sized devices for demonstration purposes of industrial processes; of machinery
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Business, Economics & Management (AREA)
  • Educational Administration (AREA)
  • Educational Technology (AREA)
  • Theoretical Computer Science (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

本发明公开了一种敷铜板腐蚀设备，包括支架、腐蚀槽、储液箱以及磁力离心泵，腐蚀槽略倾斜，腐蚀槽的高端设置着散液盒，散液盒通过管道与磁力离心泵的出水口相连；磁力离心泵的入水口是水平设置的，磁力离心泵的出水口设置成往下；腐蚀槽的后面还设置有后挡板，其特征在于：后挡板上固定有一个海绵架，海绵架的出水口的下面正好是腐蚀槽。本发明的腐蚀设备增加了海绵架，敷铜板在腐蚀完之后先用海绵擦干再到水槽清洗，可大大减少对水槽的污染，从而更环保。

Description

一种敷铜板腐蚀设备
技术领域
本发明涉及敷铜板腐蚀设备。
背景技术
中国发明专利ZL201110002860.5公开了一种敷铜板腐蚀设备，该腐蚀设备适用于高校电子工艺实习教学以及创新实验室的使用，但是使用过程中的，小部分废液在敷铜板清洗的时候会混入到水槽中，从而可能对环境造成污染。
发明内容
本发明针对现有技术的不足，提供一种更环保的敷铜板腐蚀设备。
本发明的技术方案如下：一种敷铜板腐蚀设备，包括支架、腐蚀槽、储液箱以及磁力离心泵，腐蚀槽略倾斜，储液箱位于腐蚀槽低端的出水口的下面，储液箱通过管道与磁力离心泵的入水口相连，支架的上方呈一个台阶状，前低后高，腐蚀槽固定于上阶上面，下阶上面固定着水槽，水槽与腐蚀槽的长度大致相等，腐蚀槽的高端设置着散液盒，散液盒通过管道与磁力离心泵的出水口相连；磁力离心泵的入水口是水平设置的，磁力离心泵的出水口设置成往下；腐蚀槽的后面还设置有后挡板，其特征在于：后挡板上固定有一个海绵架，海绵架的出水口的下面正好是腐蚀槽。
进一步的，储液箱的下面设置一个废液箱，废液箱的容积为储液箱的容积的1至6倍。
进一步的，废液箱的底部设有滑动轮。
进一步的，滑动轮为万向轮。
与现有技术相比，本发明具有如下优点：
1、本发明增加了海绵架，在敷铜板腐蚀完之后，把敷铜板在海绵架内的海绵上擦干后再到水槽清洗，从而大大减小腐蚀液混入到水槽的量，从而更环保。
2、出于环保的考虑，腐蚀液要需要专业的废液回收公司进行回收。腐蚀设备配备废液箱后，可大大降低废液回收的次数及成本。
附图说明
图1是本发明的正面结构示意图；
图2是本发明的侧面结构示意图。
附图标记说明：1、腐蚀槽，2、水槽，3、后挡板，4、储液箱，5、支架，6、磁力离心泵，7、废液箱，71、废液箱的入口，8、开关，9、散液盒，10、海绵架。
具体实施方式
如图1和图2所示，一种敷铜板腐蚀设备，包括支架5、腐蚀槽1、储液箱4以及磁力离心泵6，腐蚀槽1略倾斜，储液箱4位于腐蚀槽1低端的出水口的下面，储液箱4通过管道及开关8与磁力离心泵6的入水口相连，支架5的上方呈一个台阶状，前低后高，腐蚀槽1固定于上阶上面，下阶上面固定着水槽2，水槽2与腐蚀槽1的长度大致相等，腐蚀槽1的高端设置着散液盒9，散液盒9通过管道与磁力离心泵6的出水口相连；磁力离心泵6的入水口是水平设置的，磁力离心泵6的出水口设置成往下；腐蚀槽1的后面还设置有后挡板3，后挡板3上固定有一个海绵架10，海绵架10的出水口的下面正好是腐蚀槽1。储液箱4的下面设置一个废液箱7。储液箱4设置有两个出水口，一个连至磁力离心泵6，另一个正好对着废液箱的入口71。

Claims (5)

1.一种敷铜板腐蚀设备，包括支架、腐蚀槽、储液箱以及磁力离心泵，腐蚀槽略倾斜，储液箱位于腐蚀槽低端的出水口的下面，储液箱通过管道与磁力离心泵的入水口相连，支架的上方呈一个台阶状，前低后高，腐蚀槽固定于上阶上面，下阶上面固定着水槽，水槽与腐蚀槽的长度大致相等，腐蚀槽的高端设置着散液盒，散液盒通过管道与磁力离心泵的出水口相连；磁力离心泵的入水口是水平设置的，磁力离心泵的出水口设置成往下；腐蚀槽的后面还设置有后挡板，其特征在于：后挡板上固定有一个海绵架，海绵架的出水口的下面正好是腐蚀槽。
2.根据权利要求1所述的敷铜板腐蚀设备，其特征在于：储液箱的下面设置一个废液箱。
3.根据权利要求2所述的敷铜板腐蚀设备，其特征在于：废液箱的底部设有滑动轮。
4.根据权利要求3所述的敷铜板腐蚀设备，其特征在于：滑动轮为万向轮。
5.根据权利要求2所述的敷铜板腐蚀设备，其特征在于：废液箱的容积为储液箱的容积的1至6倍。
CN201610893493.5A 2016-10-14 2016-10-14 一种敷铜板腐蚀设备 Pending CN106373879A (zh)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07334838A (ja) * 1994-06-08 1995-12-22 Kao Corp 磁気記録媒体の製造方法
JP2007335791A (ja) * 2006-06-19 2007-12-27 Febacs:Kk 基板処理装置
CN201119125Y (zh) * 2007-11-13 2008-09-17 华南理工大学 敷铜板腐蚀装置
CN102074157A (zh) * 2011-01-07 2011-05-25 华南理工大学 一种敷铜板腐蚀设备
CN202162162U (zh) * 2011-06-22 2012-03-14 深圳市崇达电路技术股份有限公司 吸水海绵的清洁装置
CN202803687U (zh) * 2012-09-26 2013-03-20 龙宇电子(梅州)有限公司 覆铜板加工用钢板清洗干燥装置
JP2016056032A (ja) * 2014-09-05 2016-04-21 株式会社Ｎｓｃ エッチング装置、およびこのエッチング装置に用いるガラス基板用エッチング液

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07334838A (ja) * 1994-06-08 1995-12-22 Kao Corp 磁気記録媒体の製造方法
JP2007335791A (ja) * 2006-06-19 2007-12-27 Febacs:Kk 基板処理装置
CN201119125Y (zh) * 2007-11-13 2008-09-17 华南理工大学 敷铜板腐蚀装置
CN102074157A (zh) * 2011-01-07 2011-05-25 华南理工大学 一种敷铜板腐蚀设备
CN202162162U (zh) * 2011-06-22 2012-03-14 深圳市崇达电路技术股份有限公司 吸水海绵的清洁装置
CN202803687U (zh) * 2012-09-26 2013-03-20 龙宇电子(梅州)有限公司 覆铜板加工用钢板清洗干燥装置
JP2016056032A (ja) * 2014-09-05 2016-04-21 株式会社Ｎｓｃ エッチング装置、およびこのエッチング装置に用いるガラス基板用エッチング液

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