CN106364172A - Fully-automatic laser marking machine for IC chip - Google Patents
Fully-automatic laser marking machine for IC chip Download PDFInfo
- Publication number
- CN106364172A CN106364172A CN201610979362.9A CN201610979362A CN106364172A CN 106364172 A CN106364172 A CN 106364172A CN 201610979362 A CN201610979362 A CN 201610979362A CN 106364172 A CN106364172 A CN 106364172A
- Authority
- CN
- China
- Prior art keywords
- chute
- mark
- sebific duct
- chip
- laser marking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
- B41J29/38—Drives, motors, controls or automatic cut-off devices for the entire printing mechanism
- B41J29/393—Devices for controlling or analysing the entire machine ; Controlling or analysing mechanical parameters involving printing of test patterns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
- B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
- B41J3/413—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material for metal
Abstract
The invention belongs to the field of laser marking equipment. The invention aims to provide a fully-automatic laser marking machine for an IC chip, which has a high automation level. The adopted technical solution is that: the fully-automatic laser marking machine for the IC chip comprises a base and a sliding chute mounted on the base. The sliding chute inclines from one end to the other end obliquely downwards. An upper end of the sliding chute is a feeding end, a lower end is a discharge end, and a middle part forms a marking region. A marking position product sensor is arranged at the marking region. A laser marking head is arranged on the base and the position of the laser marking head is corresponding to the marking region. A feeding position piece placement component and a feeding position piece blocking component are sequentially arranged along a moving route of the IC chip in the sliding chute and between the upper end of the sliding chute and the marking region. A marking position stopper component is arranged at the lower end of the marking region. According to the invention, in the process of marking the IC chip, automatic feeding, automatic arrangement, automatic marking, and automatic loading are realized, so that the human cost is greatly reduced, the production efficiency is improved and the error risk is reduced.
Description
Technical field
The invention belongs to laser marking device field is and in particular to ic chip full-automatic laser marking machine.
Background technology
Laser marking machine is a kind of product marking equipment, and it is stamped forever in various different material surfaces using laser beam
Labelling.The effect of mark is to expose deep layer material by the evaporation of entry material, or leads to entry material by luminous energy
Chemical Physics change and " quarter " goes out vestige, or moieties are burnt by luminous energy, the pattern that etches needed for showing, literary composition
All kinds of figure such as word, bar code.In the production process of ic chip, it need to be marked, such as mark upper corresponding specification type
Number, scan Quick Response Code, patent No. etc., to show independence and the patentability of this ic chip production, or user can pass through
The information of this marking recognizes relevant information and manufacturer of this ic chip etc. completely, plays publicity, the effect such as false proof.
Existing ic chip laser mark technique is to carry out mark using versatility marking machine.Specifically operator will
The chip being packaged in non-marking in sebific duct takes out, then being placed on pallet in array one by one, then manually starts
Marking machine carries out mark operation to chip.After the completion of mark, then by chip threading sebific duct one by one.Such it is legal person
The operation of work is relatively complicated, not only wastes substantial amounts of human resourcess, and production efficiency is low, various operations also easily
Error.For example: manually put chip link before mark, once chip is put and not in place be will result in marking mistake.In mark
After the completion of artificial by during chip tubulature, the phenomenon of neglected loading also easily occurs.It is badly in need of one kind in prior art and enable ic chip certainly
The ic chip full-automatic laser marking machine of dynamic feeding, automatic marking, automatic blanking, automatic tubulature etc..
Content of the invention
It is an object of the invention to provide having the ic chip full-automatic laser marking machine of high automatization level.
For achieving the above object, the technical solution adopted in the present invention is: ic chip full-automatic laser marking machine, bag
Include support and the chute being arranged on support, the vallecular cavity of described chute is matched with ic chip.Described chute is from one end to another
End tilts obliquely.The upper end of described chute is feeding end, and lower end is discharging end, and middle part constitutes mark area.Described mark area sets
Put mark position product sensor.On described support, hoistable platform is set, described hoistable platform arranges laser marking head, described sharp
The position of light labelling head is relative with mark area.Between the upper end of described chute and mark area along ic chip the traveling road in chute
Line sets gradually feed position and puts part assembly and feed position block piece assembly.The lower end setting mark position block piece assembly in described mark area.
Described feed position puts part assembly, feed position block piece assembly, mark position product sensor, laser marking head and mark position block piece assembly
It is electrically connected with industrial PC respectively.
Preferably, the upper end setting automatic feed mechanism of described chute, described automatic feed mechanism includes non-mark product
Sebific duct feeding bin, hungry area pipe pulp-collecting box, the first pushing material component and feed position product sensor.The side setting of described chute upper end
Hungry area pipe pulp-collecting box, relative opposite side arranges the first pushing material component.With hungry area pipe pulp-collecting box and on the cell wall of described chute
The relative position of one pushing material component is respectively provided with opening, and described opening is matched with the sebific duct of packaging ic chip.Described non-mark is produced
Product sebific duct feeding bin is located at relative with chute notch one side on chute, and the vallecular cavity of non-mark product sebific duct feeding bin and chute
Connection.Described feed position product sensor puts the side near chute upper end for the part assembly positioned at feed position.Described first pusher group
Part and feed position product sensor are electrically connected with industrial PC respectively.
Preferably, the lower end setting automatic material blanking mechanism of described chute, described automatic material blanking mechanism includes hungry area pipe feeding
Confirmation sensor filled by storehouse, mark product sebific duct pulp-collecting box, the second pushing material component and sebific duct.The side of described chute lower end sets
Put mark product sebific duct pulp-collecting box, relative opposite side arranges the second pushing material component.With mark on the cell wall of described chute
Product sebific duct pulp-collecting box and the relative position of the second pushing material component are respectively provided with opening, the sebific duct phase of described opening and packaging ic chip
Cooperation.Described hungry area pipe feeding bin is located at relative with chute notch one side on chute, and the groove of hungry area pipe feeding bin and chute
Chamber connects.Described sebific duct is filled and is confirmed that sensor is located at the side near chute lower end for the mark position block piece assembly.Described second pushes away
Material assembly and sebific duct are filled confirmation sensor and are electrically connected with industrial PC respectively.
Preferably, described feed position is put part assembly and is included the first cylinder and the abutting being arranged on the first cylinder outfan
Bar, described first cylinder is erected on chute and outfan is relative with the notch of chute.First cylinder and industrial PC electrically connect
Connect.
Preferably, described feed position block piece assembly and mark position block piece assembly all include the second cylinder and are fixed on the second gas
Baffle plate on cylinder outfan, described second cylinder is erected on chute and outfan is relative with the notch of chute, described baffle plate with
The vallecular cavity of chute matches.Described second cylinder is electrically connected with industrial PC.
Preferably, described non-mark product sebific duct feeding bin and hungry area pipe feeding bin all include two be arranged side by side vertical
Post, the gathering sill that the relative side setting of described two columns is matched with sebific duct, described gathering sill is extended to by one end of column
The other end of column.
Preferably, described hungry area pipe pulp-collecting box and mark product sebific duct pulp-collecting box are by two blocks of splicing plates positioned opposite
Constitute, the distance between described two splicing plates are matched with the length of sebific duct, splicing plate is by three pieces of orthogonal plate bodys two-by-two
Constitute.
Preferably, described first pushing material component and the second pushing material component all include being fixed on chute side the 3rd cylinder and
With cutting somebody's hair that the 3rd cylinder is connected.The outfan dorsad chute of described 3rd cylinder, described cut somebody's hair in u shape, and the bottom of u shape with
The outfan of the 3rd cylinder is affixed, and the both sides of u shape are relative with the two ends of sebific duct.Described 3rd cylinder is electrically connected with industrial PC
Connect.
Preferably, described support is arranged audible-visual annunciator, the upper surface setting installing rack of support, front setting push-and-pull is taken out
Drawer and installation cabinet.Setting mouse and keyboard, described industrial PC position in display, described push-and-pull drawer is arranged on described installing rack
In installation cabinet.Described audible-visual annunciator, display, mouse and keyboard are electrically connected with industrial PC respectively.
Preferably, the cell wall of described chute and gathering sill is arranged lubricant coating, the lubrication used by described lubricant coating applies
Material consists of the following parts by weight: 13 parts of novolac epoxy resin, 2 parts of m-diaminobenzene., 7 parts of TEPA, 8 parts of politef,
3 parts of graphite powder, 4 parts of molybdenum bisuphide, 43 parts of expoxy propane propylene ether, 20 parts of toluene.The preparation method of described lubricant coating is as follows:
A, by novolac epoxy resin add expoxy propane propylene ether in mix homogeneously be obtained resin emulsion.B, by m-diaminobenzene., four ethylene
Five amine add mix homogeneously in toluene that curing agent emulsion is obtained.C, polytetrafluorethylepowder powder, graphite powder, molybdenum bisuphide are mixed
To mixed-powder.D, by mixed-powder and curing agent emulsion be separately added in resin emulsion be obtained slip coating.
Beneficial effects of the present invention embody a concentrated reflection of, during ic chip carries out mark it is achieved that automatic charging, from
Dynamic arrangement, automatic marking, automatic tubulature, have greatly saved human cost, have improve production efficiency, reduced risk of error.
Specifically, in use, staff is placed on the upper of chute after the sebific duct filling non-mark chip breaks a seal to the present invention
Material end, empty sebific duct is placed on the discharging end of chute.Now feed position block piece assembly and mark position block piece assembly are in industrial PC
Control under be in state that chute is blocked, the chip within sebific duct positioned at chute upper end is one in the chute tilting
The automatic vallecular cavity along chute of one glides, until reaching the position of feed position block piece assembly.Then feed position puts part assembly
Also chute is blocked under the control of industrial PC.Now mark position product sensor detects in mark area and does not have chip, will
To industrial PC, industrial PC controls feed position block piece assembly to lift to feedback of the information, and feed position block piece assembly and feed position put part
A collection of chip between assembly continues to glide along chute, and the obstruct by mark position block piece assembly rests in mark area.
To chip, industrial PC controls laser marking head to start to carry out automatic marking to chip to mark position product sensor sensing.Mark
Complete rear feeding block piece assembly to lift, the chip of mark continues on chute and falls into and completes automatic tubulature in hungry area pipe.Entering
Material position is put under part assembly and the cooperation of feed position block piece assembly, the chip of non-mark a collection of batch of automatically into mark area successively
Carry out automatic marking.Compare with traditional ic chip marking machine, automaticity of the present invention is higher, and the risk of error is lower.
Brief description
Fig. 1 is the axonometric chart of the present invention；
Fig. 2 is a portion enlarged drawing in Fig. 1；
Fig. 3 is the front view of the present invention；
Fig. 4 is the b-b direction view of structure shown in Fig. 3；
Fig. 5 is c portion enlarged drawing in Fig. 4；
Fig. 6 is d portion enlarged drawing in Fig. 5；
Fig. 7 is the structural representation of non-mark product sebific duct feeding bin；
Fig. 8 is the structural representation of hungry area pipe pulp-collecting box.
Specific embodiment
In conjunction with the ic chip full-automatic laser marking machine shown in Fig. 1-8, including support 1 and the chute being arranged on support 1
2, the vallecular cavity of described chute 2 is matched with ic chip, that is, the width of the vallecular cavity of chute 2 is suitable with ic chip just can load
Ic chip, can guide to ic chip again.Such as ic chip width 10mm, then the width of vallecular cavity is just between 10.5-11mm.Institute
State chute 2 to be tilted obliquely from one end to the other end, the upper end of described chute 2 is feeding end, and lower end is discharging end, and middle part is constituted
Mark area.When ic chip is when one end of chute 2 is put in chute 2, ic chip can glide along chute to the other end, in Fig. 1
Chute 2 is tilted by upper right lower left, then the upper right side of chute 2 is feeding end, and lower-left end is discharging end, and ic chip is from chute
2 upper right side is put into just can be along chute 2 landing to lower-left end.Described mark area setting mark position product sensor 3.Described
On support 1, hoistable platform 30 is set, described hoistable platform 30 arranges laser marking head 7, described hoistable platform 30 passes through to drive
Laser marking head 7 lifts thus controlling the distance between itself and workpiece, the species of described hoistable platform 30 is more, such as: institute
Stating hoistable platform 30 can be including a linear electric machine stretching along the vertical direction, and the outfan of linear electric machine arranges pallet,
Laser marking head 7 is arranged on pallet；Certainly linear electric machine can also replace with cylinder, flexible by linear electric machine or cylinder
Laser marking head 7 is driven to lift；The support that hoistable platform 30 can also be including ball wire bar pair and is arranged on ball wire bar pair
Disk, rotarily drives pallet by screw mandrel and moves up and down.Certainly, it is also feasible by the way of other play phase same-action.Institute
The position stating laser marking head 7 is relative with mark area, and laser marking head 7 can carry out mark operation to the workpiece in mark area.
Between the upper end of described chute 2 and mark area, along ic chip, the course in chute 2 sets gradually feed position
Put part assembly 4 and feed position block piece assembly 5, as shown in figure 1, ic chip moves in chute 2 to left down, then chute 2 along upper right
Feed position is set gradually from right to left on the chute 2 between upper end and mark area and puts part assembly 4 and feed position block piece assembly
5.The effect of described feed position room assembly 4 is to push against the workpiece in chute 2, stops workpiece from continuing to glide, specifically ties
Structure can be with reference to shown in Fig. 5 and 6, including the first cylinder 16 and the abutting bar 17 being arranged on the first cylinder 16 outfan, institute
State that the first cylinder 16 is erected on chute 2 and outfan is relative with the notch of chute 2, the first cylinder 16 is electrically connected with industrial PC
Connect.Namely feed position is put part assembly 4 and is electrically connected with industrial PC, and feed position is put part assembly 4 and controlled by industrial PC
System.It can also be to drive abutting bar 17 by linear electric machine that described feed position puts part assembly 4.Certainly other play identical work
Mode is also feasible.
The effect of described feed position block piece assembly 5 is to block chute 2, stops workpiece slide.Described feed position block piece
The concrete structure of assembly 5 is also more, in conjunction with shown in Fig. 5 and 6, being including the second cylinder 18 and to be fixed on the second cylinder 18 defeated
Go out the baffle plate 19 on end, described second cylinder 18 is erected on chute 2 and outfan is relative with the notch of chute 2, described baffle plate
19 are matched with the vallecular cavity of chute 2, baffle plate 19 be used for the vallecular cavity of chute 2 is blocked, in figure baffle plate 19 be shaped as l shape, certainly
It can also be one flat plate.In the same manner, baffle plate 19 drive mode can also be using linear electric machine or other play phase same-action
Mode.Described second cylinder 18 is electrically connected with industrial PC, that is, feed position block piece assembly 5 is electrically connected with industrial PC
Connect and be controlled by industrial PC.The lower end setting mark position block piece assembly 6 in described mark area, mark position block piece assembly 6
Effect be to block chute 2, so that workpiece is rested in mark area.Its concrete structure and the structure of feed position block piece assembly 5
Similar, here is omitted.Described mark position product sensor 3 and laser marking head 7 are also electrically connected with industrial PC respectively.
In use, staff is placed on the upper of chute 2 after the sebific duct filling non-mark chip breaks a seal to the present invention
Material end, empty sebific duct is placed on the discharging end of chute 2.Now feed position block piece assembly 5 and mark position block piece assembly 6 are in industry control electricity
It is in the state that chute 2 is blocked, the chip within sebific duct positioned at chute 2 upper end is in the chute 2 tilting under the control of brain
Inside the automatic vallecular cavity along chute 2 one by one glides, until reaching the position of feed position block piece assembly 5.Then feed position
Put part assembly 4 also to block chute 2 under the control of industrial PC.Now mark position product sensor 3 detects in mark area
There is no chip, by feedback of the information to industrial PC, industrial PC controls feed position block piece assembly 5 to lift, feed position block piece assembly 5
And a collection of chip that feed position is put between part assembly 4 continues to glide along chute 2, intercepted by mark position block piece assembly 6
Rest in mark area.Mark position product sensor 3 senses chip, and industrial PC controls laser marking head 7 to start to chip
Carry out automatic marking.Mark completes rear feeding block piece assembly 5 and lifts, and the chip of mark continues on chute 2 and falls into hungry area pipe
Inside complete automatic tubulature.Put under part assembly 4 and the cooperation of feed position block piece assembly 5 in feed position, the chip a collection of of non-mark
That criticizes carries out automatic marking successively automatically into mark area.Compare with traditional ic chip marking machine, automaticity of the present invention
Higher, the risk of error is lower.
The mode of feeding of the present invention can directly sebific duct be placed in chute 2 described above, in order to improve further certainly
Dynamicization level, more preferable way can also be the upper end setting automatic feed mechanism of described chute 2, described automatic feed mechanism bag
Include non-mark product sebific duct feeding bin 8, hungry area pipe pulp-collecting box 9, the first pushing material component 10 and feed position product sensor 11.Specifically
Set-up mode is the side setting hungry area pipe pulp-collecting box 9 of described chute 2 upper end, and hungry area pipe pulp-collecting box 9 is used for containing ic chip complete
Portion skid off after hungry area pipe, relative opposite side arranges the first pushing material component 10, and the first pushing material component 10 is used in chute 2
Hungry area pipe pushes in hungry area pipe pulp-collecting box 9, as shown in figure 3, hungry area pipe pulp-collecting box 9 is located at the right side of chute 2, then the first pusher group
Part 10 is located at the left side of chute 2.Described first pushing material component 10 includes being fixed on the 3rd cylinder 24 of chute 2 side and with the 3rd
What cylinder 24 connected cuts somebody's hair 25.The outfan dorsad chute 2 of described 3rd cylinder 24, described cutting somebody's hair 25 is in u shape, and the bottom of u shape
Portion is affixed with the outfan of the 3rd cylinder 24, and the both sides of u shape are relative with the two ends of sebific duct.Described 3rd cylinder 24 and industrial PC
It is electrically connected with, that is, the electromagnetic valve of the 3rd cylinder 24 is electrically connected with industrial PC, the 3rd cylinder 24 is entered by industrial PC
Row controls.Certainly described 3rd cylinder 24 can also be linear electric machine or other play the equipment of phase same-action.
On the cell wall of described chute 2, the position relative with hungry area pipe pulp-collecting box 9 and the first pushing material component 10 is respectively provided with opening,
Described opening is matched with the sebific duct of packaging ic chip, that is, the length of opening is at least greater than the length of sebific duct.Described not
Mark product sebific duct feeding bin 8 is located at the one side relative with chute 2 notch on chute 2, and non-mark product sebific duct feeding bin 8 with
The vallecular cavity connection of chute 2.Described non-mark product sebific duct feeding bin 8 is used for containing the sebific duct equipped with non-mark product, does not beat
Mark product sebific duct feeding bin 8 can be a rectangular-shaped box body, and box body bottom is provided with the bar shaped connecting with chute 2 vallecular cavity
Through hole.In order to simplify structure and be easy to place sebific duct, more preferable way is as shown in fig. 7, non-mark product sebific duct feeding bin 8 wraps
Include two columns being arranged side by side 20, the gathering sill 21 that the relative side setting of described two columns 20 is matched with sebific duct, described
Gathering sill 21 extends to the other end of column 20 by one end of column 20.Described feed position product sensor 11 is put positioned at feed position
Part assembly 4 is near the side of chute 2 upper end.Feed position product sensor 11 is electrically connected with industrial PC.When feed position product
When there is no workpiece in the chute 2 that sensor 11 senses at this, then illustrate that the sebific duct at now chute 2 feeding end is hungry area pipe, the
One pushing material component 10 action, hungry area pipe is pushed in hungry area pipe pulp-collecting box 9, the glue in non-mark product sebific duct feeding bin 8
Pipe automatically falls in chute 2 and completes automatic Loading.In order to simplify the structure of hungry area pipe pulp-collecting box 9, described hungry area pipe pulp-collecting box 9 is also
Can be to be made up of two blocks of splicing plates 22 positioned opposite, the distance between described two splicing plates 22 are matched with the length of sebific duct
Close, splicing plate 22 by three pieces two-by-two orthogonal plate body constitute.
Equally, the mode of blanking of the present invention can be that hungry area pipe is directly placed on the discharging end of chute 2, treats that hungry area pipe fills
Taken away after full.In order to improve automatization level further, more preferable way can also be that the lower end of described chute 2 sets
Put automatic material blanking mechanism, described automatic material blanking mechanism includes hungry area pipe feeding bin 12, mark product sebific duct pulp-collecting box 13, second
Confirmation sensor 15 filled by pushing material component 14 and sebific duct.The side setting mark product sebific duct pulp-collecting box of described chute 2 lower end
13, relative opposite side arranges the second pushing material component 14.On the cell wall of described chute 2 with mark product sebific duct pulp-collecting box 13 and
The relative position of second pushing material component 14 is respectively provided with opening, and described opening is matched with the sebific duct of packaging ic chip.Described hungry area
Pipe feeding bin 12 is located at relative with chute 2 notch one side on chute 2, and hungry area pipe feeding bin 12 is connected with the vallecular cavity of chute 2.
Described sebific duct is filled and is confirmed that sensor 15 is located at the side near chute 2 lower end for the mark position block piece assembly 6.Described second pusher group
Part 14 and sebific duct are filled confirmation sensor 15 and are electrically connected with industrial PC respectively.The work of the automatic material blanking mechanism of the present invention is former
Reason is similar with automatic feed mechanism of the present invention, and here is omitted.Fill confirmation sensor 15 when sebific duct and sense that sebific duct is filled
Afterwards, the second pushing material component 14 starts and pushes the sebific duct filled in mark product sebific duct pulp-collecting box 13.
Preferably way is it is also possible that arrange audible-visual annunciator 31, so, when fault, acousto-optic on described support 1
Alarm 31 can be reported to the police.The upper surface setting installing rack 26 of support 1, front setting push-and-pull drawer 27 and installation cabinet 28.Described
Display 29, setting mouse and keyboard in described push-and-pull drawer 27 are arranged on installing rack 26, described industrial PC is located at installs cabinet
In 28.Described audible-visual annunciator 31, display 29, mouse and keyboard are electrically connected with industrial PC respectively.So staff
Just can more be easy to operate.Artificial 3 people can be substituted using laser marking machine of the present invention.There is anti-error equipment, prevent
Marking mistake function, has the function that feeding prompting, fastener, misoperation warning function and 1 people operate multiple devices, and operative employee is ripe
After white silk, 1 people can operate the equipment of most three.Therefore mark efficiency has obtained greatly being lifted.
The chute 2 of the present invention and gathering sill 21 as the sliding channel of ic chip and sebific duct, in order to reduce friction, preferably
Way can also be setting lubricant coating on described chute 2 and the cell wall of gathering sill 21, and the lubrication used by described lubricant coating applies
Material consists of the following parts by weight: 13 parts of novolac epoxy resin, 2 parts of m-diaminobenzene., 7 parts of TEPA, 8 parts of politef,
3 parts of graphite powder, 4 parts of molybdenum bisuphide, 43 parts of expoxy propane propylene ether, 20 parts of toluene.
The preparation method of described lubricant coating is as follows:
A, by novolac epoxy resin add expoxy propane propylene ether in mix homogeneously be obtained resin emulsion.
B, by m-diaminobenzene., TEPA add toluene in mix homogeneously be obtained curing agent emulsion.
C, polytetrafluorethylepowder powder, graphite powder, molybdenum bisuphide are mixed to get mixed-powder.
D, by mixed-powder and curing agent emulsion be separately added in resin emulsion be obtained slip coating.
Lubricant coating using slip coating of the present invention is processed into as follows:
A, the internal groove side wall of chute 2 and gathering sill 21 is carried out oil removing, processing of rust removing, naturally dry, then carry out bonderizing；
B, treated chute 2 and gathering sill 21 are heated 5min at a temperature of 120 DEG C, the lubrication that will be prepared with spray gun
Coating under conditions of compressed air even application on the internal groove side wall of chute 2 and gathering sill 21, spray gun pressure is 0.4mpa, empty
Gas usage amount is 400l/min, and coating spray volume is 150ml/min, and spray distance is 250mm, after surface drying under room temperature, at 90 DEG C
Under the conditions of solidify 30min, obtain final product lubricant coating.
The chute 2 being provided with lubricant coating of the present invention is tilted to put with the chute 2 being provided with common lubricant coating
Put, angle of inclination is 40 °.The feeding end that the ic chip of two same sizes is individually positioned in two chutes 2 carries out free downslide
Motion, two chutes 2 carry out respectively 3 times testing and record it and are snapped down to the time used by discharging end.Result is as shown in the table:
| For the first time (s) | Second (s) | For the third time (s) | |
| The present invention | 6.1 | 6.2 | 6.2 |
| Commonly | 7.5 | 7.2 | 7.7 |
According to upper table as can be seen that compared with common slip coating, slip coating of the present invention is processed into
Lubricant coating, its not only lubricant effect greatly improved, performance is more stable simultaneously.
Claims (10)
1.ic chip full-automatic laser marking machine it is characterised in that: include support (1) and the chute that is arranged on support (1)
(2), the vallecular cavity of described chute (2) is matched with ic chip；Described chute (2) is tilted from one end obliquely to the other end；Described
The upper end of chute (2) is feeding end, and lower end is discharging end, and middle part constitutes mark area；Described mark area setting mark position product passes
Sensor (3)；Described support (1) is upper to arrange hoistable platform (30), and described hoistable platform (30) is upper to arrange laser marking head (7), institute
The position stating laser marking head (7) is relative with mark area；Along ic chip in chute between the upper end of described chute (2) and mark area
(2) course in sets gradually feed position and puts part assembly (4) and feed position block piece assembly (5)；The lower end in described mark area
Setting mark position block piece assembly (6)；Described feed position puts part assembly (4), feed position block piece assembly (5), mark position product sensing
Device (3), laser marking head (7) and mark position block piece assembly (6) are electrically connected with industrial PC respectively.
2. ic chip full-automatic laser marking machine according to claim 1 it is characterised in that: the upper end of described chute (2)
Setting automatic feed mechanism, described automatic feed mechanism include non-mark product sebific duct feeding bin (8), hungry area pipe pulp-collecting box (9),
First pushing material component (10) and feed position product sensor (11)；The side setting hungry area pipe pulp-collecting box of described chute (2) upper end
(9), relative opposite side arranges the first pushing material component (10)；With hungry area pipe pulp-collecting box (9) and on the cell wall of described chute (2)
The relative position of one pushing material component (10) is respectively provided with opening, and described opening is matched with the sebific duct of packaging ic chip；Described do not beat
Mark product sebific duct feeding bin (8) is located at the upper one side relative with chute (2) notch of chute (2), and non-mark product sebific duct feeding
Storehouse (8) is connected with the vallecular cavity of chute (2)；Described feed position product sensor (11) puts part assembly (4) near sliding positioned at feed position
The side of groove (2) upper end；Described first pushing material component (10) and feed position product sensor (11) are electrical with industrial PC respectively
Connect.
3. ic chip full-automatic laser marking machine according to claim 2 it is characterised in that: the lower end of described chute (2)
Setting automatic material blanking mechanism, described automatic material blanking mechanism includes hungry area pipe feeding bin (12), mark product sebific duct pulp-collecting box
(13), confirmation sensor (15) filled by the second pushing material component (14) and sebific duct；The side setting mark of described chute (2) lower end
Product sebific duct pulp-collecting box (13), relative opposite side arranges the second pushing material component (14)；On the cell wall of described chute (2) with beat
Mark product sebific duct pulp-collecting box (13) position relative with the second pushing material component (14) is respectively provided with opening, described opening with pack ic core
The sebific duct of piece matches；Described hungry area pipe feeding bin (12) is located at the upper one side relative with chute (2) notch of chute (2), and empty
Sebific duct feeding bin (12) is connected with the vallecular cavity of chute (2)；Described sebific duct is filled confirmation sensor (15) and is located at mark position block piece group
Part (6) is near the side of chute (2) lower end；Described second pushing material component (14) and sebific duct fill confirmation sensor (15) respectively with
Industrial PC is electrically connected with.
4. ic chip full-automatic laser marking machine according to claim 3 it is characterised in that: described feed position puts part assembly
(4) the first cylinder (16) and the abutting bar (17) being arranged on the first cylinder (16) outfan, described first cylinder (16) are included
It is erected at chute (2) above and outfan is relative with the notch of chute (2)；First cylinder (16) is electrically connected with industrial PC.
5. ic chip full-automatic laser marking machine according to claim 4 it is characterised in that: described feed position block piece assembly
And mark position block piece assembly (6) all includes the second cylinder (18) and the baffle plate being fixed on the second cylinder (18) outfan (5)
(19), described second cylinder (18) is erected at chute (2) above and outfan is relative with the notch of chute (2), described baffle plate (19)
Match with the vallecular cavity of chute (2)；Described second cylinder (18) is electrically connected with industrial PC.
6. ic chip full-automatic laser marking machine according to claim 5 it is characterised in that: described non-mark product sebific duct
Feeding bin (8) and hungry area pipe feeding bin (12) all include two columns being arranged side by side (20), and described two columns (20) are relative
The gathering sill (21) that side setting is matched with sebific duct, described gathering sill (21) extends to column (20) by one end of column (20)
The other end.
7. ic chip full-automatic laser marking machine according to claim 6 it is characterised in that: described hungry area pipe pulp-collecting box
(9) constitute by two blocks of splicing plates (22) positioned opposite with mark product sebific duct pulp-collecting box (13), described two splicing plates
The distance between (22) match with the length of sebific duct, splicing plate (22) by three pieces two-by-two orthogonal plate body constitute.
8. ic chip full-automatic laser marking machine according to claim 7 it is characterised in that: described first pushing material component
(10) and the second pushing material component (14) is all included being fixed on the 3rd cylinder (24) of chute (2) side and is connected with the 3rd cylinder (24)
Connect cuts somebody's hair (25)；Outfan dorsad chute (2) of described 3rd cylinder (24), described cut somebody's hair (25) are in u shape, and the bottom of u shape
Portion is affixed with the outfan of the 3rd cylinder (24), and the both sides of u shape are relative with the two ends of sebific duct；Described 3rd cylinder (24) and industry control
Computer is electrically connected with.
9. ic chip full-automatic laser marking machine according to claim 8 it is characterised in that: described support (1) is upper to be arranged
Audible-visual annunciator (31), upper surface setting installing rack (26) of support (1), front setting push-and-pull drawer (27) and installation cabinet
(28)；Described installing rack (26) is upper to arrange setting mouse and keyboard, described industry control in display (29), described push-and-pull drawer (27)
Computer is located to be installed in cabinet (28)；Described audible-visual annunciator (31), display (29), mouse and keyboard are electric with industrial PC respectively
Property connect.
10. ic chip full-automatic laser marking machine according to claim 9 it is characterised in that: described chute (2) and guiding
Lubricant coating is arranged on the cell wall of groove (21), the slip coating used by described lubricant coating consists of the following parts by weight: phenolic aldehyde ring
13 parts of oxygen tree fat, 2 parts of m-diaminobenzene., 7 parts of TEPA, 8 parts of politef, 3 parts of graphite powder, 4 parts of molybdenum bisuphide, epoxy
43 parts of propane-propylene ether, 20 parts of toluene；The preparation method of described lubricant coating is as follows: a, by novolac epoxy resin add epoxy third
In alkane propylene ether, mix homogeneously is obtained resin emulsion；B, by m-diaminobenzene., TEPA add toluene in mix homogeneously be obtained
Curing agent emulsion；C, polytetrafluorethylepowder powder, graphite powder, molybdenum bisuphide are mixed to get mixed-powder；D, by mixed-powder and
Curing agent emulsion is separately added in resin emulsion and slip coating is obtained.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610979362.9A CN106364172B (en) | 2016-11-07 | 2016-11-07 | IC chip full-automatic laser marking machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610979362.9A CN106364172B (en) | 2016-11-07 | 2016-11-07 | IC chip full-automatic laser marking machine |
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| CN106364172B CN106364172B (en) | 2017-10-17 |
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| CN106985546A (en) * | 2017-03-10 | 2017-07-28 | 深圳市杰普特光电股份有限公司 | Laser mark printing device |
| CN107529495A (en) * | 2017-08-10 | 2018-01-02 | 无锡启盛实验设备有限公司 | Embedded box laser marking machine |
| CN108098150A (en) * | 2017-12-16 | 2018-06-01 | 天津希凝科技发展有限公司 | New pattern laser marking machine |
| CN108723609A (en) * | 2018-07-24 | 2018-11-02 | 廊坊西波尔钻石技术有限公司 | Etching laser machining and superhard material processing method |
| CN108857080A (en) * | 2018-09-19 | 2018-11-23 | 深圳市创金激光科技有限公司 | A kind of full-automatic laser marking equipment of COB substrate |
| CN109108480A (en) * | 2018-10-08 | 2019-01-01 | 方志兰 | A kind of IC chip laser printing fixture |
| CN113715529A (en) * | 2021-09-09 | 2021-11-30 | 珠海格力智能装备有限公司 | Chip marking machine, control method and device of chip marking machine and marking system |
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| CN106364172B (en) | 2017-10-17 |
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