CN106356389A - Display panel packing method and display panel - Google Patents
Display panel packing method and display panel Download PDFInfo
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- CN106356389A CN106356389A CN201510427192.9A CN201510427192A CN106356389A CN 106356389 A CN106356389 A CN 106356389A CN 201510427192 A CN201510427192 A CN 201510427192A CN 106356389 A CN106356389 A CN 106356389A
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Abstract
The invention provides a display panel packing method and a display panel. The method includes: providing a substrate which comprises a display area and a packing coating area; forming a buffering layer on the packing coating area; sequentially depositing a grid electrode insulating layer and a grid electrode metal conductive layer on the buffering layer; depositing a connection insulating layer on the grid electrode metal conductive layer, and performing mask patterning and etching to form a patterned connection insulating layer in the packing coating area; removing part of the buffering layer in the packing coating area to expose at least part of the substrate; filling the packing coating area with packing glue, and pasting a cover plate to enable the packing glue to directly contact with the substrate and the cover plate. An existing mask is fully utilized to remove the buffering layer of the packing coating area in one step, so that the packing flue can be ensured to directly contact with backplate glass, adhesiveness of the packing glue is improved, and process and cost are saved.
Description
Technical field
The present invention relates to display floater making technology, more particularly, to a kind of increase packaging plastic tack
Display floater method for packing and display floater.
Background technology
Existing display floater mainly includes laying the viewing area of pixel, and around viewing area
Packaging area.At present, as Fig. 1, display floater 10 ' encapsulation generally adopts packaging plastic 6 ' (frit
Glue) along the packaging area coating around viewing area 8 ', by component package substrate and cover plate it
Between, main inclusion packaging plastic dispensing area 9 ' in packaging area.And, packaging plastic is directly and substrate
When contacting with cover plate, tack is the strongest, but because display floater technique becomes increasingly complex, the number of plies increases
Many, in some cases, packaging plastic can not directly contact substrate (or cover plate), then can weaken attachment
Property, reduce intensity and physical stress of display floater itself etc..
As shown in Fig. 2 a kind of existing display floater method for packing, comprise the following steps:
S201: in a substrate 1 ' upper deposition one cushion 2 ' (buffer layer), by mask artwork
After case and etching technics, form cushion 2 ' in packaging plastic dispensing area.
S202: deposit a gate insulator 3 ' (gi layer) and grid on described cushion 2 '
Pole metal conducting layer 4 ' (gl layer), after mask patterning and etching technics, in packaging plastic
Dispensing area forms grid-shaped metal conductive layer.
S203: in the upper deposition of described gate metal conductive layer 4 ' (gl layer) conducting insulating barrier 5 '
(ct layer), after mask patterning and etching technics, forms grid in packaging plastic dispensing area
Shape interlayer insulating film.
S204: in described conducting insulating barrier 5 ' (ct layer) upper deposition one source-drain electrode metal conducting layer
(dl layer, in figure is not shown), after mask patterning and etching technics, packaging plastic applying area
Domain passive drain electrode metal conducting layer covers.
S205: in described source-drain electrode metal conducting layer (dl layer) upper coating one layer of planarization layer (figure
Not shown in), after mask patterning and etching technics, packaging plastic dispensing area no planarization layer
Cover.Planarization layer is predominantly located at viewing area, and the main purpose of planarization layer is to eliminate lower floor's figure
The pixel light emission area out-of-flatness that the offset of shape causes.
S206: an anode metal layer (not shown) is deposited on described planarization layer, passes through
After mask patterning and etching technics, packaging plastic dispensing area no anode metal layer covers.
S207: a pixel defining layer (not shown) is coated with described anode metal layer, leads to
After crossing mask patterning and etching technics, packaging plastic dispensing area no pixel defining layer covers.
S208: in viewing area, in described pixel defining layer evaporation Organic Light Emitting Diode layer with
Cathode layer (not shown).
S209: filling packaging plastic, cover plate 7 ' of fitting.As shown in Fig. 3 (a) and 3 (b), such as
Filling packaging plastic 6 ' touches backboard come cover plate 7 ' of fitting, then packaging plastic 6 ' to fruit in this case
Be cushion 2 ', the tack between packaging plastic 6 ' and substrate 1 ' is weaker.For the ease of right
3 (a), 5 (a) in this case is all identical with packaging plastic dispensing area 9 ' with 7 (a) for ratio
Region a is amplification subject, and here is omitted.
In order to expose substrate 1 ', existing improved method is to increase a mask and one work
Skill, with continued reference to Fig. 4, comprises the following steps:
S301: in a substrate 1 ' upper deposition one cushion 2 ' (buffer layer), by mask artwork
After case and etching technics, form cushion 2 ' in packaging plastic dispensing area.
S302: deposit a gate insulator 3 ' (gi layer) and grid on described cushion 2 '
Pole metal conducting layer 4 ' (gl layer), after mask patterning and etching technics, in packaging plastic
Dispensing area forms grid-shaped metal conductive layer.
S303: in the upper deposition of described gate metal conductive layer 4 ' (gl layer) conducting insulating barrier 5 '
(ct layer), after mask patterning and etching technics, forms grid in packaging plastic dispensing area
Shape interlayer insulating film.
S304: in described conducting insulating barrier 5 ' (ct layer) upper deposition one source-drain electrode metal conducting layer
(dl layer, in figure is not shown), after mask patterning and etching technics, packaging plastic applying area
Domain passive drain electrode metal conducting layer covers.
S305: in described source-drain electrode metal conducting layer (dl layer) upper coating one layer of planarization layer (figure
Not shown in), after mask patterning and etching technics, packaging plastic dispensing area no planarization layer
Cover.Planarization layer is predominantly located at viewing area, and the main purpose of planarization layer is to eliminate lower floor's figure
The pixel light emission area out-of-flatness that the offset of shape causes.(the step s301 to s305 in Fig. 4 with
Step s201 to s205 in Fig. 2 is identical.)
S306: increase by a mask plate, after mask patterning and etching technics, remove and expose to the open air
The cushion 2 ' of packaging plastic dispensing area, exposes described substrate 1 '.Portion of buffer layer 2 ' is moved
Except exposing substrate 1 ', also can remove the conducting insulating barrier 5 ' of part simultaneously.
S307: an anode metal layer (not shown) is deposited on described planarization layer, passes through
After mask patterning and etching technics, packaging plastic dispensing area no anode metal layer covers.
S308: a pixel defining layer (not shown) is coated with described anode metal layer, leads to
After crossing mask patterning and etching technics, packaging plastic dispensing area no pixel defining layer covers.
S309: in viewing area, in described pixel defining layer evaporation Organic Light Emitting Diode layer with
Cathode layer (not shown).
S310: filling packaging plastic, cover plate 7 ' of fitting.As shown in Fig. 5 (a) and 5 (b), will
After cover plate 7 ' laminating, packaging plastic 6 ' what packaging plastic dispensing area touched backboard is and packaging plastic
The substrate 1 ' (glass) of 6 ' same natures.Although this method can make packaging plastic 6 ' and substrate 1 '
Between tack increase, but due to need to increased mask with together with gold-tinted technique to remove slow
Rush layer 2 ', increased cost.
In view of this, a kind of display floater method for packing and display floater are inventor provided.
Content of the invention
For defect of the prior art, it is an object of the invention to provide a kind of encapsulation of display floater
Method and display floater, both can guarantee that packaging plastic and back-panel glass directly contact, increased packaging plastic
Tack, a mask and one gold-tinted technique need not be increased again, saved operation and cost.
According to an aspect of the present invention, a kind of display floater method for packing is provided, walks including following
Rapid:
S100: provide a substrate, described substrate includes a viewing area and an encapsulation dispensing area；
S110: form a cushion on described substrate package dispensing area；
S120: deposited in sequential one gate insulator and a gate metal are conductive on described cushion
Layer；
S130: deposition one conducting insulating barrier on described gate metal conductive layer, by mask pattern
After change and etching technics, form the described conducting insulation of patterning in described packaging plastic dispensing area
Layer；
S140: remove the described cushion of packaging plastic dispensing area interior part, at least portion is exposed with this
Divide described substrate；And
S150: fill packaging plastic in described packaging plastic dispensing area, and a cover plate of fitting, make described
Substrate described in packaging plastic directly contact and described cover plate.
Preferably, also include in described step s140:
S141: deposit a source-drain electrode metal conducting layer on described conducting insulating barrier；
S142: be coated with one layer of planarization layer on described source-drain electrode metal conducting layer, by mask artwork
After case and etching technics, described planarization layer is placed only in viewing area；And
S143: technique is performed etching by the mask pattern of described planarization layer, removes packaging plastic and apply
The described cushion that cloth intra-zone divides.
Preferably, in described step s120, formed latticed described in described packaging plastic dispensing area
Metal conducting layer.
Preferably, in described step s130, form latticed conducting in described packaging plastic dispensing area
Insulating barrier.
Preferably, in described step s140, the described substrate in the mesh of described grid is exposed.
Preferably, described in described step s142, planarization layer is organic film, by gold-tinted technique
Etch patterning described planarization layer.
Preferably, the mask pattern of described planarization layer exposes the conducting of described packaging plastic dispensing area
Insulating barrier and cushion.
Preferably, described packaging plastic dispensing area is not by source-drain electrode metal conducting layer, planarization
Any one layer in layer, anode metal layer, pixel defining layer is covered.
Preferably, the material of described cushion is identical with the material of described conducting insulating barrier.
According to another aspect of the present invention, also provide a kind of display floater, comprising:
One substrate, including a viewing area and an encapsulation dispensing area；
One cushion, is formed at the packaging plastic dispensing area on described substrate；
One gate insulator and a gate metal conductive layer, are formed on described cushion；
One conducting insulating barrier, is formed at the described grid gold of described viewing area and encapsulation dispensing area
Belong on conductive layer, the described conducting insulating barrier of described encapsulation dispensing area exposes at least partly described base
Plate；And
One cover plate, by encapsulating the packaging plastic dispensing area on substrate described in glue laminating；
Wherein, described packaging plastic contacts described substrate and described cover plate.
Preferably, also include:
One source-drain electrode metal conducting layer, is formed on the described conducting insulating barrier of described viewing area；
One planarization layer, is formed on described source-drain electrode metal conducting layer；
One anode metal layer, is formed on described planarization layer；
One pixel defining layer, is formed in described anode metal layer；And
Organic Light Emitting Diode layer and cathode layer, are formed in described pixel defining layer.
Preferably, described gate metal conductive layer forms grid-shaped metal in packaging plastic dispensing area and leads
Electric layer, described conducting insulating barrier forms latticed conducting insulating barrier in described packaging plastic dispensing area,
The described substrate exposing in the mesh of described grid is contacted with described packaging plastic.
Preferably, described packaging plastic dispensing area is not by source-drain electrode metal conducting layer, planarization
Any one layer in layer, anode metal layer, pixel defining layer is covered.
Preferably, the material of described cushion is identical with the material of described conducting insulating barrier.
The display floater method for packing of the present invention and display floater pass through modified technique, make full use of
Existing mask, a step removes the cushion of packaging plastic dispensing area, saves a mask and one
The cost of road gold-tinted technique, both can guarantee that packaging plastic and back-panel glass directly contact, increased packaging plastic
Tack, saved operation and cost again.
Brief description
By reading detailed description non-limiting example made with reference to the following drawings, the present invention
Other features, objects and advantages will become more apparent upon:
Fig. 1 is the schematic diagram of the display floater of prior art；
Fig. 2 is the flow chart of the first existing display floater method for packing；
Fig. 3 (a) is the partial enlargement of the packaging area of the first existing display floater method for packing
Figure；
Fig. 3 (b) be Fig. 3 (a) in b-b to profile；
Fig. 4 is the flow chart of the first existing display floater method for packing
Fig. 5 (a) is the partial enlargement of the packaging area of second existing display floater method for packing
Figure；
Fig. 5 (b) be Fig. 5 (a) in c-c to profile；
Fig. 6 is the flow chart of the display floater method for packing of the present invention；
Fig. 7 (a) is the partial enlarged drawing of the packaging area of display floater method for packing of the present invention；
And
Fig. 7 (b) be Fig. 7 (a) in d-d to profile.
Reference
1 ' substrate
2 ' cushions
3 ' gate insulators
4 ' gate metal conductive layers
5 ' conducting insulating barriers
6 ' packaging plastics
7 ' cover plates
8 ' viewing areas
9 ' packaging areas
10 ' display floaters
1 substrate
2 cushions
3 gate insulators
4 gate metal conductive layers
5 conducting insulating barriers
6 packaging plastics
7 cover plates
Specific embodiment
It is described more fully with example embodiment referring now to accompanying drawing.However, example embodiment
Can implement in a variety of forms, and be not understood as limited to embodiment set forth herein；Phase
Instead, these embodiments are provided so that the present invention will fully and completely, and by example embodiment
Design comprehensively conveys to those skilled in the art.Represent identical in figure identical reference
Or similar structure, thus repetition thereof will be omitted.
Described feature, structure or characteristic can combine in any suitable manner at one or more
In many embodiments.In the following description, many details are provided thus providing to the present invention
The fully understanding of embodiment.However, one of ordinary skill in the art would recognize that, there is no certain detail
One of section or more, or using other methods, constituent element, material etc. it is also possible to put into practice
Technical scheme.In some cases, it is not shown in detail or describes known features, material
Or operation is to avoid the fuzzy present invention.
Because the improvement of the present invention essentially consists in the packaging area of display floater, in order to more clearly aobvious
Show the feature of the present invention, therefore not shown in the profile of Fig. 7 (a) and 7 (b), display floater shows
The profile in region.
As shown in Fig. 6 and Fig. 7 (a) and 7 (b), the invention provides a kind of display floater envelope
Dress method, comprising:
S100: provide a substrate, described substrate includes a viewing area and an encapsulation dispensing area.
S110 a: cushion 2 is deposited on a substrate 1, by mask patterning and etching technics
Afterwards, form cushion 2 in packaging plastic dispensing area.
S120: deposit a gate insulator 3 and a gate metal conductive layer 4 on cushion 2,
After mask patterning and etching technics, form grid-shaped metal in packaging plastic dispensing area conductive
Layer.
S130: deposition one conducting insulating barrier 5 on gate metal conductive layer 4, by mask pattern
After change and etching technics, form latticed interlayer insulating film in packaging plastic dispensing area.
S140: remove the described cushion 2 of packaging plastic dispensing area interior part, exposed at least with this
Partly described substrate 1.Wherein, specifically include that in described step s140
S141: deposit a source-drain electrode metal conducting layer on conducting insulating barrier 5.By mask pattern
After change and etching technics, source-drain electrode metal conducting layer does not cover packaging plastic dispensing area.
S142: be coated with one layer of planarization layer on source-drain electrode metal conducting layer, (due to planarization layer
It is mainly used in viewing area, therefore in figure is not shown) after mask patterning and etching technics, flat
Change layer and be placed only in viewing area.The material of cushion 2 is identical with the material of conducting insulating barrier 5.Flat
Smoothization layer is organic film, can pass through the etch patterning planarization layer of gold-tinted technique.
S143: technique is performed etching by the mask pattern of planarization layer and removes packaging plastic dispensing area
The cushion 2 inside exposing to the open air, exposes at least part of substrate 1.The mask pattern of planarization layer exposes encapsulation
The conducting insulating barrier 5 of glue dispensing area and cushion 2.Base in the present embodiment, in the mesh of grid
Plate 1 is exposed.Because the opening range in this region for the planarization layer mask is larger, so can be simultaneously
Conducting insulating barrier 5 can be exposed, also can carry out quarter to conducting insulating barrier 5, thus by cushion 2 He
Conducting insulating barrier 5 removes together, but is not limited.The present invention is not required for applying in this packaging plastic
Cloth region removes all of conducting insulating barrier 5, during crossing quarter cushion 2, even if there being conducting
Insulating barrier 5 remains, and does not also interfere with enforcement and the effect of the present invention, such as Fig. 7 (a) and 7 (b)
Shown.Different from prior art, before used in s106, mask is, planarization layer is made
Mask, the quantity of mask does not increase, and decreases corresponding gold-tinted technique, decreases
Operation, reduces cost.
And, in viewing area maker LED device, mainly comprise the steps that
One anode metal layer is deposited on the planarization layer of viewing area.By mask patterning and etching technics
Afterwards, anode metal layer does not cover packaging plastic dispensing area.The anode metal layer of viewing area applies
Cloth one pixel defining layer.After mask patterning and etching technics, pixel defining layer does not cover envelope
Dress glue dispensing area.Evaporation Organic Light Emitting Diode layer and the moon in the pixel defining layer of viewing area
Pole layer.After mask patterning and etching technics, Organic Light Emitting Diode layer and cathode layer do not cover
Lid packaging plastic dispensing area.
S150: fill packaging plastic 6 in packaging plastic dispensing area, laminating cover plate 7 is so that packaging plastic 6
One side directly contact cover plate 7, another side directly contact substrate 1, strengthen packaging plastic 6 to substrate 1
Tack.As shown in Fig. 7 (b), due to packaging plastic 7 directly contact substrate 1 and cover plate 7,
Tack between packaging plastic 7 and substrate 1, cover plate 7 greatly enhances, and improves display floater itself
Intensity and physical stress etc., here is omitted.
With continued reference to Fig. 7 (b), the present invention provides a kind of display floater, comprising: a substrate 1.One
Cushion 2, is formed at the packaging plastic dispensing area on substrate 1.One gate insulator 3 and a grid
Metal conducting layer 4, is formed on cushion 2.Gate metal conductive layer 4 is in packaging plastic dispensing area
Form grid-shaped metal conductive layer.One conducting insulating barrier 5, is formed on gate metal conductive layer 4,
Expose at least part of substrate 1.Conducting insulating barrier 5 is formed between grid-like layer absolutely in packaging plastic dispensing area
Edge layer.The material of cushion 2 is identical with the material of conducting insulating barrier 5.One source-drain electrode metallic conduction
Layer, is formed on the conducting insulating barrier 5 of viewing area.One planarization layer (not shown), shape
Become on source-drain electrode metal conducting layer.One anode metal layer (not shown), is formed at planarization
On layer.One pixel defining layer (not shown), is formed in anode metal layer.Organic light emission two
Pole pipe layer and cathode layer (not shown), are formed in pixel defining layer.One cover plate 7, passes through
Packaging plastic dispensing area on packaging plastic 6 adhesive substrates 1.Packaging plastic 6 contact substrate 1 and cover plate
7.
Wherein, the base that the mesh of grid-shaped metal conductive layer and latticed interlayer insulating film exposes
Plate 1 contacts the one side directly contact cover plate 7 so that packaging plastic 6 with packaging plastic 6, and another side is direct
Contact substrate 1, strengthens the tack to substrate 1 for the packaging plastic 6.
Packaging plastic dispensing area is not by source-drain electrode metal conducting layer, planarization layer, anode metal
Any one layer in layer, pixel defining layer is covered.
Packaging plastic 7 directly contact substrate 1 and cover plate 7, packaging plastic 7 and base due to this display floater
Tack between plate 1, cover plate 7 greatly enhances, and improves intensity and the physics of display floater itself
Stress etc., here is omitted.
In summary, the display floater method for packing of the present invention and display floater pass through to improve work
Skill, makes full use of existing mask, and a step removes the cushion of packaging plastic dispensing area, saves
One mask and the cost of one gold-tinted technique, both can guarantee that packaging plastic was directly connect with back-panel glass
Touch, increase the tack of packaging plastic, saved operation and cost again.
Above the specific embodiment of the present invention is described.It is to be appreciated that the present invention is simultaneously
It is not limited to above-mentioned particular implementation, those skilled in the art can be within the scope of the claims
Make various modifications or modification, this has no effect on the flesh and blood of the present invention.
Claims (14)
1. a kind of display floater method for packing is it is characterised in that comprise the following steps:
S100: provide a substrate, described substrate includes a viewing area and an encapsulation dispensing area；
S110: form a cushion on described substrate package dispensing area；
S120: deposited in sequential one gate insulator and a gate metal are conductive on described cushion
Layer；
S130: deposition one conducting insulating barrier on described gate metal conductive layer, by mask pattern
After change and etching technics, form the described conducting insulation of patterning in described packaging plastic dispensing area
Layer；
S140: remove the described cushion of packaging plastic dispensing area interior part, at least portion is exposed with this
Divide described substrate；And
S150: fill packaging plastic in described packaging plastic dispensing area, and a cover plate of fitting, make described
Substrate described in packaging plastic directly contact and described cover plate.
2. display floater method for packing as claimed in claim 1 is it is characterised in that described step
Also include in s140:
S141: deposit a source-drain electrode metal conducting layer on described conducting insulating barrier；
S142: be coated with one layer of planarization layer on described source-drain electrode metal conducting layer, by mask artwork
After case and etching technics, described planarization layer is placed only in viewing area；And
S143: technique is performed etching by the mask pattern of described planarization layer, removes packaging plastic and apply
The described cushion that cloth intra-zone divides.
3. display floater method for packing as claimed in claim 1 or 2 is it is characterised in that described
In step s120, form latticed described metal conducting layer in described packaging plastic dispensing area.
4. display floater method for packing as claimed in claim 3 is it is characterised in that described step
In s130, form latticed conducting insulating barrier in described packaging plastic dispensing area.
5. display floater method for packing as claimed in claim 4 is it is characterised in that described step
In s140, the described substrate in the mesh of described grid is exposed.
6. display floater method for packing as claimed in claim 2 is it is characterised in that described step
Planarization layer described in s142 is organic film, by the etch patterning described planarization of gold-tinted technique
Layer.
7. display floater method for packing as claimed in claim 6 is it is characterised in that described flat
The mask pattern changing layer exposes conducting insulating barrier and the cushion of described packaging plastic dispensing area.
8. display floater method for packing as claimed in claim 1 is it is characterised in that described encapsulation
Glue dispensing area is not fixed by source-drain electrode metal conducting layer, planarization layer, anode metal layer, pixel
Any one layer in adopted layer is covered.
9. display floater method for packing as claimed in claim 1 is it is characterised in that described buffering
The material of layer is identical with the material of described conducting insulating barrier.
10. a kind of display floater is it is characterised in that include:
One substrate, including a viewing area and an encapsulation dispensing area；
One cushion, is formed at the packaging plastic dispensing area on described substrate；
One gate insulator and a gate metal conductive layer, are formed on described cushion；
One conducting insulating barrier, is formed at the described grid gold of described viewing area and encapsulation dispensing area
Belong on conductive layer, the described conducting insulating barrier of described encapsulation dispensing area exposes at least partly described base
Plate；And
One cover plate, by encapsulating the packaging plastic dispensing area on substrate described in glue laminating；
Wherein, described packaging plastic contacts described substrate and described cover plate.
11. display floaters as claimed in claim 10 are it is characterised in that also include:
One source-drain electrode metal conducting layer, is formed on the described conducting insulating barrier of described viewing area；
One planarization layer, is formed on described source-drain electrode metal conducting layer；
One anode metal layer, is formed on described planarization layer；
One pixel defining layer, is formed in described anode metal layer；And
Organic Light Emitting Diode layer and cathode layer, are formed in described pixel defining layer.
12. display floaters as described in claim 10 or 11 are it is characterised in that described grid
Metal conducting layer forms grid-shaped metal conductive layer, described conducting insulating barrier in packaging plastic dispensing area
Form latticed conducting insulating barrier in described packaging plastic dispensing area, expose in the mesh of described grid
Described substrate contact with described packaging plastic.
13. display floaters as claimed in claim 11 are it is characterised in that described packaging plastic is coated with
Region is not by source-drain electrode metal conducting layer, planarization layer, anode metal layer, pixel defining layer
Any one layer covered.
14. display floaters as claimed in claim 10 are it is characterised in that the material of described cushion
Matter is identical with the material of described conducting insulating barrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510427192.9A CN106356389B (en) | 2015-07-20 | 2015-07-20 | A kind of display panel packaging method and display panel |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510427192.9A CN106356389B (en) | 2015-07-20 | 2015-07-20 | A kind of display panel packaging method and display panel |
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| CN106356389A true CN106356389A (en) | 2017-01-25 |
| CN106356389B CN106356389B (en) | 2019-11-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510427192.9A Active CN106356389B (en) | 2015-07-20 | 2015-07-20 | A kind of display panel packaging method and display panel |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107068902A (en) * | 2017-03-14 | 2017-08-18 | 上海天马有机发光显示技术有限公司 | A kind of display device |
| CN108919574A (en) * | 2018-07-16 | 2018-11-30 | 中国科学院宁波材料技术与工程研究所 | It is a kind of using transparent graphene conductive film as flexible liquid crystal display part of substrate and preparation method thereof |
| CN117042499A (en) * | 2023-08-31 | 2023-11-10 | 绵阳惠科光电科技有限公司 | Display panel and display device |
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| CN102695685A (en) * | 2010-01-12 | 2012-09-26 | 日本电气硝子株式会社 | Glass film laminate, method of producing the same, and method of producing glass film |
| US20150084498A1 (en) * | 2013-09-23 | 2015-03-26 | Samsung Display Co., Ltd. | Organic light-emitting diode (oled) display and method for manufacturing the same |
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| CN1578553A (en) * | 2003-07-19 | 2005-02-09 | 三星Sdi株式会社 | Encapsulated organic electroluminescent display |
| CN101071707A (en) * | 2006-05-08 | 2007-11-14 | 东元电机股份有限公司 | Method for making packaging coating area for field emission display device |
| CN102695685A (en) * | 2010-01-12 | 2012-09-26 | 日本电气硝子株式会社 | Glass film laminate, method of producing the same, and method of producing glass film |
| US20150084498A1 (en) * | 2013-09-23 | 2015-03-26 | Samsung Display Co., Ltd. | Organic light-emitting diode (oled) display and method for manufacturing the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107068902A (en) * | 2017-03-14 | 2017-08-18 | 上海天马有机发光显示技术有限公司 | A kind of display device |
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| CN108919574A (en) * | 2018-07-16 | 2018-11-30 | 中国科学院宁波材料技术与工程研究所 | It is a kind of using transparent graphene conductive film as flexible liquid crystal display part of substrate and preparation method thereof |
| CN117042499A (en) * | 2023-08-31 | 2023-11-10 | 绵阳惠科光电科技有限公司 | Display panel and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106356389B (en) | 2019-11-29 |
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