CN106356389B - A kind of display panel packaging method and display panel - Google Patents
A kind of display panel packaging method and display panel Download PDFInfo
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- CN106356389B CN106356389B CN201510427192.9A CN201510427192A CN106356389B CN 106356389 B CN106356389 B CN 106356389B CN 201510427192 A CN201510427192 A CN 201510427192A CN 106356389 B CN106356389 B CN 106356389B
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Abstract
The present invention provides a kind of display panel packaging method and display panels, including provide a substrate, and substrate includes a display area and an encapsulation dispensing area；A buffer layer is formed on substrate package dispensing area；One gate insulating layer of deposited in sequential and a gate metal conductive layer on buffer layer；One conducting insulating layer of deposition forms patterned conducting insulating layer in packaging plastic dispensing area after mask patterning and etching technics on gate metal conductive layer；The buffer layer for removing packaging plastic dispensing area inner part, exposes at least partly substrate with this；And packaging plastic is filled in packaging plastic dispensing area, and be bonded a cover board, so that packaging plastic is directly contacted substrate and cover board.The present invention makes full use of existing exposure mask, and a step removes the buffer layer of packaging plastic dispensing area, both can guarantee that packaging plastic was directly contacted with back-panel glass, and increased the adhesion of packaging plastic, and saved process and cost.
Description
Technical field
The present invention relates to display panel making technology more particularly to a kind of display panel encapsulation for increasing packaging plastic adhesion
Method and display panel.
Background technique
Existing display panel mainly includes laying the display area of pixel, and the packaging area around display area.
Currently, display panel 10 ', which encapsulates, generallys use packaging plastic 6 ' (frit glue) along the packaging area around display area 8 ' such as Fig. 1
Coating mainly includes packaging plastic dispensing area 9 ' in packaging area by component package between substrate and cover board.Moreover, encapsulation
Adhesion is most strong when glue is directly contacted with substrate and cover board, but since display panel technique becomes increasingly complex, the number of plies increases, certain
In a little situations, packaging plastic cannot directly contact substrate (or cover board), then can weaken adhesion, reduce the strong of display panel itself
Degree and physical stress etc..
As shown in Fig. 2, a kind of existing display panel packaging method, comprising the following steps:
S201: depositing a buffer layer 2 ' (Buffer layers) on a substrate 1 ', after mask patterning and etching technics,
Buffer layer 2 ' is formed in packaging plastic dispensing area.
S202: a gate insulating layer 3 ' (GI layers) and 4 ' (GL of gate metal conductive layer are deposited on the buffer layer 2 '
Layer), after mask patterning and etching technics, grid-shaped metal conductive layer is formed in packaging plastic dispensing area.
S203: conducting insulating layer 5 ' (CT layers) is deposited on the gate metal conductive layer 4 ' (GL layers), passes through mask
After patterning and etching technics, latticed interlayer insulating film is formed in packaging plastic dispensing area.
S204: on the conducting insulating layer 5 ' (CT layers) depositing a source-drain electrode metal conducting layer, (DL layers, do not show in figure
Out), after by mask patterning and etching technics, the passive drain electrode metal conducting layer covering of packaging plastic dispensing area.
S205: it is coated with one layer of planarization layer (not shown) on the source-drain electrode metal conducting layer (DL layers), passes through
After mask patterning and etching technics, packaging plastic dispensing area is covered without planarization layer.Planarization layer is predominantly located at display area,
The main purpose of planarization layer is pixel light emission area out-of-flatness caused by eliminating the offset of lower layer pattern.
S206: an anode metal layer (not shown) is deposited on the planarization layer, passes through mask patterning and quarter
After etching technique, packaging plastic dispensing area is covered without anode metal layer.
S207: being coated with a pixel defining layer (not shown) in the anode metal layer, by mask patterning and
After etching technics, packaging plastic dispensing area is covered without pixel defining layer.
S208: in display area, organic LED layers and cathode layer are deposited in the pixel defining layer (in figure not
It shows).
S209: filling packaging plastic is bonded cover board 7 '.As shown in Fig. 3 (a) and 3 (b), if filling encapsulation in this case
Glue 6 ' is bonded cover board 7 ', then what packaging plastic 6 ' touched backboard is buffer layer 2 ', the attachment between packaging plastic 6 ' and substrate 1 '
Property is weaker.It is with the same area A of packaging plastic dispensing area 9 ' for the ease of comparison, 3 (a), 5 (a) and 7 (a) in this case
Amplification subject, details are not described herein again.
In order to expose substrate 1 ', existing improved method is to increase an exposure mask and one of technique, with continued reference to
Fig. 4, comprising the following steps:
S301: depositing a buffer layer 2 ' (Buffer layers) on a substrate 1 ', after mask patterning and etching technics,
Buffer layer 2 ' is formed in packaging plastic dispensing area.
S302: a gate insulating layer 3 ' (GI layers) and 4 ' (GL of gate metal conductive layer are deposited on the buffer layer 2 '
Layer), after mask patterning and etching technics, grid-shaped metal conductive layer is formed in packaging plastic dispensing area.
S303: conducting insulating layer 5 ' (CT layers) is deposited on the gate metal conductive layer 4 ' (GL layers), passes through mask
After patterning and etching technics, latticed interlayer insulating film is formed in packaging plastic dispensing area.
S304: on the conducting insulating layer 5 ' (CT layers) depositing a source-drain electrode metal conducting layer, (DL layers, do not show in figure
Out), after by mask patterning and etching technics, the passive drain electrode metal conducting layer covering of packaging plastic dispensing area.
S305: it is coated with one layer of planarization layer (not shown) on the source-drain electrode metal conducting layer (DL layers), passes through
After mask patterning and etching technics, packaging plastic dispensing area is covered without planarization layer.Planarization layer is predominantly located at display area,
The main purpose of planarization layer is pixel light emission area out-of-flatness caused by eliminating the offset of lower layer pattern.(the step in Fig. 4
S301 to S305 is identical as the step S201 to S205 in Fig. 2.)
S306: increasing by a mask plate, and after mask patterning and etching technics, removal exposes to the open air in packaging plastic dispensing area
Buffer layer 2 ', expose the substrate 1 '.Portion of buffer layer 2 ' is removed and exposes substrate 1 ', while can also remove the conducting of part
Insulating layer 5 '.
S307: an anode metal layer (not shown) is deposited on the planarization layer, passes through mask patterning and quarter
After etching technique, packaging plastic dispensing area is covered without anode metal layer.
S308: being coated with a pixel defining layer (not shown) in the anode metal layer, by mask patterning and
After etching technics, packaging plastic dispensing area is covered without pixel defining layer.
S309: in display area, organic LED layers and cathode layer are deposited in the pixel defining layer (in figure not
It shows).
S310: filling packaging plastic is bonded cover board 7 '.As shown in Fig. 5 (a) and 5 (b), after cover board 7 ' is bonded, packaging plastic 6 '
Backboard is touched in packaging plastic dispensing area is substrate 1 ' (glass) with 6 ' same nature of packaging plastic.Although this method energy
Increase the adhesion between packaging plastic 6 ' and substrate 1 ', but is removed due to needing to increase exposure mask yellow light technique with together with
Buffer layer 2 ' increases cost.
In view of this, inventor providing a kind of display panel packaging method and display panel.
Summary of the invention
For the defects in the prior art, the purpose of the present invention is to provide a kind of display panel packaging method and displays
Panel both can guarantee that packaging plastic was directly contacted with back-panel glass, increase the adhesion of packaging plastic, but without increase an exposure mask and
One of yellow light technique, has saved process and cost.
According to an aspect of the present invention, a kind of display panel packaging method is provided, comprising the following steps:
S100: providing a substrate, and the substrate includes a display area and an encapsulation dispensing area；
S110: a buffer layer is formed on the substrate package dispensing area；
S120: one gate insulating layer of deposited in sequential and a gate metal conductive layer on the buffer layer；
S130: a conducting insulating layer is deposited on the gate metal conductive layer, passes through mask patterning and etching technics
Afterwards, the patterned conducting insulating layer is formed in the packaging plastic dispensing area；
S140: the buffer layer of packaging plastic dispensing area inner part is removed, at least partly described substrate is exposed with this；With
And
S150: packaging plastic is filled in the packaging plastic dispensing area, and is bonded a cover board, contacts the packaging plastic directly
The substrate and the cover board.
Preferably, in the step S140 further include:
S141: a source-drain electrode metal conducting layer is deposited on the conducting insulating layer；
S142: being coated with one layer of planarization layer on the source-drain electrode metal conducting layer, passes through mask patterning and etching work
After skill, the planarization layer is placed only in display area；And
S143: technique is performed etching by the mask pattern of the planarization layer, removes packaging plastic dispensing area inner part
The buffer layer.
Preferably, in the step S120, the latticed metal conducting layer is formed in the packaging plastic dispensing area.
Preferably, in the step S130, latticed conducting insulating layer is formed in the packaging plastic dispensing area.
Preferably, in the step S140, the substrate in the mesh of the grid is exposed.
Preferably, planarization layer described in the step S142 is organic film, passes through the etch patterning institute of yellow light technique
State planarization layer.
Preferably, the conducting insulating layer and buffering of the mask pattern exposure packaging plastic dispensing area of the planarization layer
Layer.
Preferably, the packaging plastic dispensing area not by source-drain electrode metal conducting layer, planarization layer, anode metal layer,
Any one layer in pixel defining layer is covered.
Preferably, the material of the buffer layer is identical as the conducting material of insulating layer.
According to another aspect of the present invention, a kind of display panel is also provided, comprising:
One substrate, including a display area and an encapsulation dispensing area；
One buffer layer, the packaging plastic dispensing area being formed on the substrate；
One gate insulating layer and a gate metal conductive layer, are formed on the buffer layer；
One conducting insulating layer, is formed on the gate metal conductive layer of the display area and encapsulation dispensing area,
The conducting insulating layer of the encapsulation dispensing area exposes at least partly described substrate；And
One cover board passes through the packaging plastic dispensing area on substrate described in encapsulation glue laminating；
Wherein, the packaging plastic contacts the substrate and the cover board.
Preferably, further includes:
One source-drain electrode metal conducting layer is formed on the conducting insulating layer of the display area；
One planarization layer is formed on the source-drain electrode metal conducting layer；
One anode metal layer is formed on the planarization layer；
One pixel defining layer is formed in the anode metal layer；And
Organic Light Emitting Diode layer and cathode layer are formed in the pixel defining layer.
Preferably, the gate metal conductive layer forms grid-shaped metal conductive layer in packaging plastic dispensing area, described to lead
Logical insulating layer forms latticed conducting insulating layer in the packaging plastic dispensing area, the base of exposure in the mesh of the grid
Plate is contacted with the packaging plastic.
Preferably, the packaging plastic dispensing area not by source-drain electrode metal conducting layer, planarization layer, anode metal layer,
Any one layer in pixel defining layer is covered.
Preferably, the material of the buffer layer is identical as the conducting material of insulating layer.
Display panel packaging method of the invention and display panel make full use of existing exposure mask by improvement technique,
One step removes the buffer layer of packaging plastic dispensing area, saves the cost of an exposure mask and one of yellow light technique, both can guarantee envelope
Dress glue is directly contacted with back-panel glass, increases the adhesion of packaging plastic, and saved process and cost.
Detailed description of the invention
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, other feature of the invention,
Objects and advantages will become more apparent upon:
Fig. 1 is the schematic diagram of the display panel of the prior art；
Fig. 2 is the flow chart of the first existing display panel packaging method；
Fig. 3 (a) is the partial enlarged view of the packaging area of the first existing display panel packaging method；
Fig. 3 (b) is the sectional view of B-B direction in Fig. 3 (a)；
Fig. 4 is the flow chart of the first existing display panel packaging method
Fig. 5 (a) is the partial enlarged view of the packaging area of second of existing display panel packaging method；
Fig. 5 (b) be Fig. 5 (a) in C-C to sectional view；
Fig. 6 is the flow chart of display panel packaging method of the invention；
Fig. 7 (a) is the partial enlarged view of the packaging area of display panel packaging method of the invention；And
Fig. 7 (b) be Fig. 7 (a) in D-D to sectional view.
Appended drawing reference
1 ' substrate
2 ' buffer layers
3 ' gate insulating layers
4 ' gate metal conductive layers
5 ' conducting insulating layers
6 ' packaging plastics
7 ' cover boards
8 ' display areas
9 ' packaging areas
10 ' display panels
1 substrate
2 buffer layers
3 gate insulating layers
4 gate metal conductive layers
5 conducting insulating layers
6 packaging plastics
7 cover boards
Specific embodiment
Example embodiment is described more fully with reference to the drawings.However, example embodiment can be with a variety of shapes
Formula is implemented, and is not understood as limited to embodiment set forth herein；On the contrary, thesing embodiments are provided so that the present invention will
Fully and completely, and by the design of example embodiment comprehensively it is communicated to those skilled in the art.It is identical attached in figure
Icon note indicates same or similar structure, thus will omit repetition thereof.
Described feature, structure or characteristic can be incorporated in one or more embodiments in any suitable manner
In.In the following description, many details are provided to provide and fully understand to embodiments of the present invention.However,
One of ordinary skill in the art would recognize that without one or more in specific detail, or using other methods, constituent element, material
Material etc., can also practice technical solution of the present invention.In some cases, be not shown in detail or describe known features, material or
Person operates to avoid the fuzzy present invention.
Since improvement of the invention essentially consists in the packaging area of display panel, in order to more clearly show spy of the invention
Sign, therefore the sectional view of display panel display area is not shown in the figure in the section of Fig. 7 (a) and 7 (b).
As shown in Fig. 6 and Fig. 7 (a) and 7 (b), the present invention provides a kind of display panel packaging methods, comprising:
S100: providing a substrate, and the substrate includes a display area and an encapsulation dispensing area.
S110: depositing a buffer layer 2 on a substrate 1, after mask patterning and etching technics, is coated in packaging plastic
Region forms buffer layer 2.
S120: a gate insulating layer 3 and a gate metal conductive layer 4 are deposited on buffer layer 2, passes through mask patterning
And after etching technics, grid-shaped metal conductive layer is formed in packaging plastic dispensing area.
S130: depositing a conducting insulating layer 5 on gate metal conductive layer 4, after mask patterning and etching technics,
Latticed interlayer insulating film is formed in packaging plastic dispensing area.
S140: the buffer layer 2 of packaging plastic dispensing area inner part is removed, at least partly described substrate 1 is exposed with this.
Wherein, it is specifically included that in the step S140
S141: a source-drain electrode metal conducting layer is deposited on conducting insulating layer 5.Pass through mask patterning and etching technics
Afterwards, source-drain electrode metal conducting layer does not cover packaging plastic dispensing area.
S142: one layer of planarization layer is coated on source-drain electrode metal conducting layer, (since planarization layer is mainly used for viewing area
Domain, therefore be not shown in the figure) by mask patterning and etching technics after, planarization layer is placed only in display area.Buffer layer 2
Material is identical as the conducting material of insulating layer 5.Planarization layer is organic film, can be etch patterning flat by yellow light technique
Change layer.
S143: technique is performed etching by the mask pattern of planarization layer and removes the buffering exposed to the open air in packaging plastic dispensing area
Layer 2 exposes at least partly substrate 1.The conducting insulating layer 5 and buffering of the mask pattern exposure packaging plastic dispensing area of planarization layer
Layer 2.In the present embodiment, the substrate 1 in the mesh of grid is exposed.Due to planarization layer mask the region opening range compared with
Greatly, so conducting insulating layer 5 can be exposed simultaneously, can also quarter be carried out to conducting insulating layer 5, thus by buffer layer 2 and conducting
Insulating layer 5 removes together, and but not limited to this.The present invention is not required for removing all conductings in the packaging plastic dispensing area exhausted
Edge layer 5, even if there is conducting insulating layer 5 to remain, will not influence implementation and effect of the invention during crossing quarter buffer layer 2
Fruit, as shown in Fig. 7 (a) and 7 (b).Different from the prior art, planarization layer is made before the exposure mask used in S106 is
The quantity of exposure mask, exposure mask does not increase, and reduces corresponding yellow light technique, reduces process, reduces costs.
Also, it in display area maker LED device, mainly comprises the steps that in the flat of display area
Change and deposits an anode metal layer on layer.After mask patterning and etching technics, anode metal layer does not cover packaging plastic coating
Region.A pixel defining layer is coated in the anode metal layer of display area.After mask patterning and etching technics, pixel
Definition layer does not cover packaging plastic dispensing area.Organic LED layers and cathode are deposited in the pixel defining layer of display area
Layer.After mask patterning and etching technics, Organic Light Emitting Diode layer and cathode layer do not cover packaging plastic dispensing area.
S150: packaging plastic 6 is filled in packaging plastic dispensing area, cover board 7 is bonded, so that the one side of packaging plastic 6 directly contacts
Cover board 7, another side directly contact substrate 1, reinforce packaging plastic 6 to the adhesion of substrate 1.As shown in Fig. 7 (b), due to packaging plastic 7
It directly contacts substrate 1 and cover board 7, the adhesion between packaging plastic 7 and substrate 1, cover board 7 greatly enhances, improve display panel
Itself intensity and physical stress etc., details are not described herein again.
With continued reference to Fig. 7 (b), the present invention provides a kind of display panel, comprising: a substrate 1.One buffer layer 2, is formed in base
Packaging plastic dispensing area on plate 1.One gate insulating layer 3 and a gate metal conductive layer 4, are formed on buffer layer 2.Grid gold
Belong to conductive layer 4 and forms grid-shaped metal conductive layer in packaging plastic dispensing area.One conducting insulating layer 5, is formed in gate metal and leads
In electric layer 4, expose at least partly substrate 1.Insulating layer 5 is connected and forms latticed interlayer insulating film in packaging plastic dispensing area.It is slow
The material for rushing layer 2 is identical as the conducting material of insulating layer 5.One source-drain electrode metal conducting layer, the conducting for being formed in display area are exhausted
In edge layer 5.One planarization layer (not shown), is formed on source-drain electrode metal conducting layer.One anode metal layer (is not shown in figure
Out), it is formed on planarization layer.One pixel defining layer (not shown), is formed in anode metal layer.Organic light-emitting diodes
Tube layer and cathode layer (not shown), are formed in pixel defining layer.One cover board 7, by 6 adhesive substrates 1 of packaging plastic
Packaging plastic dispensing area.Packaging plastic 6 contacts substrate 1 and cover board 7.
Wherein, the substrate 1 and packaging plastic 6 that the mesh of grid-shaped metal conductive layer and latticed interlayer insulating film exposes
Contact, so that the one side of packaging plastic 6 directly contacts cover board 7, another side directly contacts substrate 1, reinforces packaging plastic 6 to substrate 1
Adhesion.
Packaging plastic dispensing area is not by source-drain electrode metal conducting layer, planarization layer, anode metal layer, pixel defining layer
Any one layer covered.
Since the packaging plastic 7 of the display panel directly contacts substrate 1 and cover board 7, between packaging plastic 7 and substrate 1, cover board 7
Adhesion greatly enhance, improve intensity and physical stress of display panel itself etc., details are not described herein again.
In summary, display panel packaging method of the invention and display panel are made full use of existing by improving technique
Some exposure masks, a step remove the buffer layer of packaging plastic dispensing area, save the cost of an exposure mask and one of yellow light technique, both
It can guarantee that packaging plastic is directly contacted with back-panel glass, increase the adhesion of packaging plastic, and saved process and cost.
Specific embodiments of the present invention are described above.It is to be appreciated that the invention is not limited to above-mentioned
Particular implementation, those skilled in the art can make various deformations or amendments within the scope of the claims, this not shadow
Ring substantive content of the invention.
Claims (12)
1. a kind of display panel packaging method, which comprises the following steps:
S100: providing a substrate, and the substrate includes a display area and an encapsulation dispensing area；
S110: a buffer layer is formed on the substrate package dispensing area；
S120: one gate insulating layer of deposited in sequential and a gate metal conductive layer on the buffer layer；
S130: a conducting insulating layer, after mask patterning and etching technics, In are deposited on the gate metal conductive layer
The packaging plastic dispensing area forms the patterned conducting insulating layer；
S140: the buffer layer of packaging plastic dispensing area inner part is removed, at least partly described substrate is exposed with this；And
S150: filling packaging plastic in the packaging plastic dispensing area, and be bonded a cover board, makes described in the packaging plastic directly contacts
Substrate and the cover board；
In the step S140 further include:
S141: a source-drain electrode metal conducting layer is deposited on the conducting insulating layer；
S142: being coated with one layer of planarization layer on the source-drain electrode metal conducting layer, after mask patterning and etching technics,
The planarization layer is placed only in display area；And
S143: technique is performed etching by the mask pattern of the planarization layer, removes the institute of packaging plastic dispensing area inner part
State buffer layer.
2. display panel packaging method as described in claim 1, which is characterized in that in the step S120, in the encapsulation
Glue dispensing area forms the latticed metal conducting layer.
3. display panel packaging method as claimed in claim 2, which is characterized in that in the step S130, in the encapsulation
Glue dispensing area forms latticed conducting insulating layer.
4. display panel packaging method as claimed in claim 3, which is characterized in that in the step S140, the grid
The substrate in mesh is exposed.
5. display panel packaging method as described in claim 1, which is characterized in that planarization layer described in the step S142
It is organic film, passes through the etch patterning planarization layer of yellow light technique.
6. display panel packaging method as claimed in claim 5, which is characterized in that the mask pattern exposure of the planarization layer
The conducting insulating layer and buffer layer of the packaging plastic dispensing area.
7. display panel packaging method as described in claim 1, which is characterized in that the packaging plastic dispensing area is not by source
Drain metal conductive layer, planarization layer, anode metal layer, any one layer in pixel defining layer covered.
8. display panel packaging method as described in claim 1, which is characterized in that the material of the buffer layer and the conducting
The material of insulating layer is identical.
9. a kind of display panel characterized by comprising
One substrate, including a display area and an encapsulation dispensing area；
One buffer layer, the packaging plastic dispensing area being formed on the substrate；
One gate insulating layer and a gate metal conductive layer, are formed on the buffer layer；
One conducting insulating layer, is formed on the gate metal conductive layer of the display area and encapsulation dispensing area, described
The conducting insulating layer for encapsulating dispensing area exposes at least partly described substrate；And
One cover board passes through the packaging plastic dispensing area on substrate described in encapsulation glue laminating；
Wherein, the packaging plastic contacts the substrate and the cover board；
Further include:
One source-drain electrode metal conducting layer is formed on the conducting insulating layer of the display area；
One planarization layer, is formed on the source-drain electrode metal conducting layer, mask patterning and quarter by the planarization layer
After etching technique, the planarization layer is placed only in display area, also, is performed etching by the mask pattern of the planarization layer
Technique removes the buffer layer of packaging plastic dispensing area inner part；
One anode metal layer is formed on the planarization layer；
One pixel defining layer is formed in the anode metal layer；And
Organic Light Emitting Diode layer and cathode layer are formed in the pixel defining layer.
10. display panel as claimed in claim 9, which is characterized in that the gate metal conductive layer is in packaging plastic applying area
Domain forms grid-shaped metal conductive layer, and the conducting insulating layer forms latticed conducting insulation in the packaging plastic dispensing area
Layer, the substrate of exposure is contacted with the packaging plastic in the mesh of the grid.
11. display panel as claimed in claim 9, which is characterized in that the packaging plastic dispensing area is not by source-drain electrode gold
Belong to conductive layer, planarization layer, anode metal layer, any one layer in pixel defining layer covered.
12. display panel as claimed in claim 9, which is characterized in that the material of the buffer layer and the conducting insulating layer
Material it is identical.
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| CN107068902B (en) * | 2017-03-14 | 2019-04-12 | 上海天马有机发光显示技术有限公司 | A kind of display device |
| CN108919574A (en) * | 2018-07-16 | 2018-11-30 | 中国科学院宁波材料技术与工程研究所 | It is a kind of using transparent graphene conductive film as flexible liquid crystal display part of substrate and preparation method thereof |
| CN117042499A (en) * | 2023-08-31 | 2023-11-10 | 绵阳惠科光电科技有限公司 | Display panel and display device |
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|---|---|---|---|---|
| CN1578553A (en) * | 2003-07-19 | 2005-02-09 | 三星Sdi株式会社 | Encapsulated organic electroluminescent display |
| CN101071707A (en) * | 2006-05-08 | 2007-11-14 | 东元电机股份有限公司 | Method for making packaging coating area for field emission display device |
| CN102695685A (en) * | 2010-01-12 | 2012-09-26 | 日本电气硝子株式会社 | Glass film laminate, method of producing the same, and method of producing glass film |
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| KR20150033195A (en) * | 2013-09-23 | 2015-04-01 | 삼성디스플레이 주식회사 | Organic light emitting display apparatus and method for manufacturing the same |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1578553A (en) * | 2003-07-19 | 2005-02-09 | 三星Sdi株式会社 | Encapsulated organic electroluminescent display |
| CN101071707A (en) * | 2006-05-08 | 2007-11-14 | 东元电机股份有限公司 | Method for making packaging coating area for field emission display device |
| CN102695685A (en) * | 2010-01-12 | 2012-09-26 | 日本电气硝子株式会社 | Glass film laminate, method of producing the same, and method of producing glass film |
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Address after: 201506, No. nine, No. 1568, Jinshan Industrial Zone, Shanghai, Jinshan District Patentee after: Shanghai Hehui optoelectronic Co., Ltd Address before: 201500, building two, building 100, 1, Jinshan Industrial Road, 208, Shanghai, Jinshan District Patentee before: Shanghai Hehui optoelectronic Co., Ltd |
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