CN106353940A - Preparation process of ACF (Anisotropic Conductive Film) adhesive - Google Patents
Preparation process of ACF (Anisotropic Conductive Film) adhesive Download PDFInfo
- Publication number
- CN106353940A CN106353940A CN201610917300.5A CN201610917300A CN106353940A CN 106353940 A CN106353940 A CN 106353940A CN 201610917300 A CN201610917300 A CN 201610917300A CN 106353940 A CN106353940 A CN 106353940A
- Authority
- CN
- China
- Prior art keywords
- acf
- finished product
- resin
- semi
- conducting particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
Abstract
The invention discloses a preparation process of ACF (Anisotropic Conductive Film) adhesive. The ACF adhesive comprises resin and conducting particles. The preparation process of the ACF adhesive comprises the following steps: firstly, pouring the resin and the conducting particles into a container barrel, stirring, dissolving and mixing to obtain an ACF mixed solution; secondly, coating a base membrane with the ACF mixed solution to form a curled ACF semi-finished product; thirdly, cutting the curled ACF semi-finished product into a certain width; fourthly, recoiling the cut ACF semi-finished product, and secondarily cutting to obtain a finished product of the ACF adhesive; fifthly, baling and packing the finished product of the ACF adhesive. The resin and the conducting particles serve as raw materials for processing. The preparation process disclosed by the invention is simple in structure and convenient to operate; the service performance of the ACF adhesive is greatly improved.
Description
Technical field
The present invention relates to processing technology field, more particularly, to a kind of processing technology of acf glue.
Background technology
Acf anisotropic conductive film Chinese implication is: anisotropic conductive film, also referred to as different side
Tropism conductive adhesive film, fast-developing towards light, thin, short, littleization with electronic product, various portable electric products are nearly all with liquid
Crystal display is also popularized as display floater, mobile phone camera very much, liquid crystal display in addition to liquid crystal panel, outside it
Enclose the control purposes that must interlock driving chip as display signal, the liquid crystal panel of many liquid crystal displays and driving ic system
Interface engagement technique and mobile phone camera cob technique be useful acf glue, but existing acf glue make efficiency is relatively low, and
The performance of acf glue is not ideal enough, therefore, solves the problems, such as that this class is particularly important.
Content of the invention
For the deficiencies in the prior art, the invention provides a kind of acf glue processing technology, by using resin and conductive particle
Son carrys out seat raw material and is processed, to solve the problems, such as that existing acf colloidality can be low.
In order to solve the above problems, the invention provides a kind of acf glue processing technology, acf glue includes resin and conduction
Particle, the making of this acf glue comprises the following steps:
Step one: resin and conducting particles are poured into and is stirred dissolving mixing in drum, be manufactured into acf mixed liquor；
Step 2: acf mixed liquor is coated to basement membrane, becomes the acf semi-finished product of web-like；
Step 3: the acf semi-finished product of web-like are cut into certain width；
Step 4: after the acf semi-finished product after cutting batch again, be cut into finished product acf glue again；
Step 5: finished product acf glue is packed packaging.
Further improvement is that: described resin is acrylic acid or epoxy resin.
Further improvement is that: described conducting particles is carbon fiber or metallic or polymer or insulation coated particle.
The invention has the beneficial effects as follows: liquid crystal display, is connected, heat-resisting and insulation function except blocks moisture with acf glue
Electrode relative position between outer predominantly fixing ic chip and substrate, and provide a compressing strength to maintain between electrode and conducting particles
Contact area, mobile phone camera predominantly fixed in addition to heat-resisting and insulation function with the resin adhesive agent function in acf glue
Electrode relative position between pcb and fpc, and provide a compressing strength to maintain the contact area between electrode and conducting particles, this
Bright structure is simple and convenient to operate, substantially increases the serviceability of acf glue.
Specific embodiment
In order to deepen the understanding of the present invention, below in conjunction with embodiment, the present invention is further described, the present embodiment
It is only used for explaining the present invention, do not constitute limiting the scope of the present invention.
Present embodiments provide a kind of acf glue processing technology, acf glue includes resin and conducting particles, this acf glue
Making comprises the following steps:
Step one: resin and conducting particles are poured into and is stirred dissolving mixing in drum, be manufactured into acf mixed liquor；
Step 2: acf mixed liquor is coated to basement membrane, becomes the acf semi-finished product of web-like；
Step 3: the acf semi-finished product of web-like are cut into certain width；
Step 4: after the acf semi-finished product after cutting batch again, be cut into finished product acf glue again；
Step 5: finished product acf glue is packed packaging.
Described resin is acrylic acid or epoxy resin.Described conducting particles is carbon fiber or metallic or polymer or exhausted
Edge coated particle.
The invention has the beneficial effects as follows: liquid crystal display, is connected, heat-resisting and insulation function except blocks moisture with acf glue
Electrode relative position between outer predominantly fixing ic chip and substrate, and provide a compressing strength to maintain between electrode and conducting particles
Contact area, mobile phone camera predominantly fixed in addition to heat-resisting and insulation function with the resin adhesive agent function in acf glue
Electrode relative position between pcb and fpc, and provide a compressing strength to maintain the contact area between electrode and conducting particles, this
Bright structure is simple and convenient to operate, substantially increases the serviceability of acf glue.
Claims (3)
1. a kind of acf glue processing technology it is characterised in that: acf glue includes resin and conducting particles, the making bag of this acf glue
Include following steps:
Step one: resin and conducting particles are poured into and is stirred dissolving mixing in drum, be manufactured into acf mixed liquor；
Step 2: acf mixed liquor is coated to basement membrane, becomes the acf semi-finished product of web-like；
Step 3: the acf semi-finished product of web-like are cut into certain width；
Step 4: after the acf semi-finished product after cutting batch again, be cut into finished product acf glue again；
Step 5: finished product acf glue is packed packaging.
2. acf glue processing technology as claimed in claim 1 it is characterised in that: described resin be acrylic acid or epoxy resin.
3. acf glue processing technology as claimed in claim 1 it is characterised in that: described conducting particles be carbon fiber or clipped wire
Son or polymer or insulation coated particle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610917300.5A CN106353940A (en) | 2016-10-21 | 2016-10-21 | Preparation process of ACF (Anisotropic Conductive Film) adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610917300.5A CN106353940A (en) | 2016-10-21 | 2016-10-21 | Preparation process of ACF (Anisotropic Conductive Film) adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106353940A true CN106353940A (en) | 2017-01-25 |
Family
ID=57863502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610917300.5A Pending CN106353940A (en) | 2016-10-21 | 2016-10-21 | Preparation process of ACF (Anisotropic Conductive Film) adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106353940A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3064391A (en) * | 1959-08-07 | 1962-11-20 | Devol Lee | Method of making an anisotropic conducting target plate |
| KR20080100988A (en) * | 2007-05-15 | 2008-11-21 | 엘지전자 주식회사 | Method for manufacturing anisotropic conductive film |
| KR20090073564A (en) * | 2007-12-31 | 2009-07-03 | 주식회사 효성 | Anisotropic conductive film having thermochromic microcapsule or photochromic microcapsule |
| CN102634286A (en) * | 2012-05-17 | 2012-08-15 | 深圳市飞世尔实业有限公司 | Photo-thermal dual curable type anisotropic conductive resin and conductive film as well as preparation method of conductive resin and conductive film |
| CN104312471A (en) * | 2014-11-10 | 2015-01-28 | 深圳市飞世尔实业有限公司 | Anisotropic conductive film containing benzoxazine and preparation method of anisotropic conductive film |
-
2016
- 2016-10-21 CN CN201610917300.5A patent/CN106353940A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3064391A (en) * | 1959-08-07 | 1962-11-20 | Devol Lee | Method of making an anisotropic conducting target plate |
| KR20080100988A (en) * | 2007-05-15 | 2008-11-21 | 엘지전자 주식회사 | Method for manufacturing anisotropic conductive film |
| KR20090073564A (en) * | 2007-12-31 | 2009-07-03 | 주식회사 효성 | Anisotropic conductive film having thermochromic microcapsule or photochromic microcapsule |
| CN102634286A (en) * | 2012-05-17 | 2012-08-15 | 深圳市飞世尔实业有限公司 | Photo-thermal dual curable type anisotropic conductive resin and conductive film as well as preparation method of conductive resin and conductive film |
| CN104312471A (en) * | 2014-11-10 | 2015-01-28 | 深圳市飞世尔实业有限公司 | Anisotropic conductive film containing benzoxazine and preparation method of anisotropic conductive film |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170125 |
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| RJ01 | Rejection of invention patent application after publication |