CN103709955A - Circuit connecting material and method for production thereof, and method for production mounted body using it - Google Patents
Circuit connecting material and method for production thereof, and method for production mounted body using it Download PDFInfo
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- CN103709955A CN103709955A CN201310454922.5A CN201310454922A CN103709955A CN 103709955 A CN103709955 A CN 103709955A CN 201310454922 A CN201310454922 A CN 201310454922A CN 103709955 A CN103709955 A CN 103709955A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/08—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances oxides
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
Abstract
The invention provides circuit connecting material with good tightness and a method for production thereof, and a method for production mounted body using it. A anisotropic conductive film containing anatase active dioxide particles, polymerizable resin, a polymerization initiator and conductive particles is pre-stuck onto an electrode of a first electronic part; a second electronic part is configured on the anisotropic conductive film; a compressing head is used to press from above the second electronic part. When performing pre-sticking, anatase active dioxide particles are used for superhydrophilicity. Therefore, invasive can be improved, and tightness of the substrate can be improved.
Description
Technical field
The present invention relates to circuit connection material and the manufacture method thereof of connecting electronic parts and the manufacture method of using its assembly forming.
Background technology
In the past, anisotropic conductive film (ACF:Anisotropic Conductive Film) for installing the parts such as semi-conductor on printed base plate.For example, manufacturing LCD(Liquid Crystal Display) during panel, for the drive IC (unicircuit) of Engagement Control pixel on glass substrate, be referred to as glass top chip technology (COG) etc.
For example, use comprises when the circuit connection material of the formation of basement membrane/ACF/ mulch film carries out anisotropic conductive connection, conventionally pre-, pastes in step, peels off mulch film and makes it be attached at glass substrate, by pre-press-connection machine thermo-compressed at the temperature of approximately 70 ℃, then peel off basement membrane.Now, if a little less than the closing force of ACF for substrate, basement membrane occurs and be not stripped from, but ACF strips down from substrate together with basement membrane, the unfavorable condition that must again paste in advance.
In patent documentation 1, recorded by coordinating specific (methyl) urethane-methacrylate to improve the binder composition for the adaptation of substrate.But, when regulating adaptation with reactive explosive, may affect the characteristic of formal crimping.
Patent documentation 1: TOHKEMY 2011-168786 communique.
Summary of the invention
The present invention proposes in view of in the past such practical situation, and it provides has circuit connection material and the manufacture method thereof of excellent adaptation and the manufacture method of using its assembly forming.
The inventor, by depth studying, found that, shows the active oxidation titanium of Superhydrophilic by cooperation, improves circuit connection material for the adaptation of substrate.
That is, circuit connection material of the present invention is characterised in that, the active oxidation titanium particle, polymerizability resin and the polymerization starter that contain Detitanium-ore-type.
In addition, the manufacture method of circuit connection material of the present invention is characterised in that, there are following steps: for the titan oxide particles irradiation ultraviolet radiation of Detitanium-ore-type, make the activation step of active oxidation titanium particle and the matching step that above-mentioned active oxidation titanium particle, polymerizability resin and polymerization starter are coordinated.
In addition, the manufacture method of assembly of the present invention is characterised in that, there are following steps: pre-pre-stickup step of pasting the anisotropic conductive film of the active oxidation titanium particle, polymerizability resin, polymerization starter and the conductive particle that contain Detitanium-ore-type on the electrode of the 1st electronic unit, with in above-mentioned anisotropic conductive film, configure the 2nd electronic unit, by the compression step of pushing by bonding head (pressing ヘ ッ De) above of the 2nd electronic unit.
Invention effect
According to the present invention, the active oxidation titanium particle by Detitanium-ore-type, shows Superhydrophilic, therefore can improve wetting property, improves the adaptation for substrate.
Accompanying drawing explanation
Fig. 1 represents the schematic diagram of the crystalline structure of anatase-type titanium oxide.
Fig. 2 represents the schematic diagram of the crystalline structure of Titanium Dioxide (Rutile) Top grade.
Embodiment
Below, for embodiments of the present invention, in the time of with reference to accompanying drawing, be described in detail in the following order.
1. circuit connection material and manufacture method thereof
2. the manufacture method of assembly
3. embodiment.
<1. circuit connection material and manufacture method > thereof
Active oxidation titanium particle, polymerizability resin and polymerization starter that circuit connection material in present embodiment contains Detitanium-ore-type.Thus, can improve the adaptation for substrate.And then, can at lower temperature, paste in advance.Therefore, can reduce the heat affecting for substrate, improve productivity.
As titan oxide particles, industrial main utilization has the titanium oxide of the crystalline structure of Fig. 1 and Fig. 2 Detitanium-ore-type shown in separately and rutile-type.In present embodiment, it is desirable to use the titan oxide particles of the Detitanium-ore-type of photocatalytic activity excellence.
Compare with the titanium oxide of rutile-type, the photocatalytic activity of the titanium oxide of Detitanium-ore-type is excellent.Its reason can be enumerated, and when manufacturing the titanium oxide of rutile-type, at 900 ℃, burns till above, therefore large particle diameter occurs, specific surface area reduces, so the reason that reduces of photocatalytic activity, and is narrow reason with the band of comparing of Detitanium-ore-type.
Because titanium oxide is semi-conductor, its electronic orbit with atom and molecule forms the energy-structure of banded energy band structure.Energy band structure has the valence band of electrons occupy and the conduction band that electronics does not enter, and forbidden band between the two.Energy level is sequentially valence band < forbidden band < conduction band.
Generally believe to have the light over the high energy in forbidden band if absorb, the electronics of valence band is excited, and is transferred to conduction band, and titanium oxide is activated.Now, valence band produces the betatopic cave of funeral that is referred to as hole.This cavitation, in the oxygen of titanium oxide, produces oxygen defect, and planar water, shows Superhydrophilic therein.
The median size of titan oxide particles is preferably 20～400nm.When median size is large, specific surface area diminishes, so photoabsorption rate variance, and photocatalytic activity reduces.In addition, median size hour, it is difficult that the dispersiveness in resin becomes, and similarly, photocatalytic activity reduces.
In addition, the use level of titan oxide particles is preferably 1～30wt%.When use level is many, resin viscosity increases, and is difficult to performance as the function of circuit connection material.In addition, when use level is few, cannot bring into play the effect of Superhydrophilic.
In addition, as the method for active oxidation titanium, as long as can give high energy, as simple method, preferably use the uviolizing of wavelength 300～400nm left and right.
As the binder composition that contains polymerizability resin and polymerization starter (base-material), can use any aggretion type of radical polymerization mould assembly, anionoid polymerization type, cationic polymerization type etc., but suitable be the radical polymerization mould assembly that needs adaptation during at low temperature curable more, in pre-crimping.
The binder composition of radical polymerization mould assembly contains film and forms resin, free-radical polymerised resin and radical polymerization initiator.
It is more than 10000 high molecular weight resins that film formation resin is equivalent to molecular-weight average, considers, preferably the molecular-weight average of 10000～80000 left and right from the viewpoint of film formative.As film, form resin, can enumerate the various resins of phenoxy resin, polyester urethane resin, vibrin, urethane resin, acrylic resin, polyimide resin, butyral resin etc., they may be used alone, or two or more kinds may be used in combination.Wherein, the viewpoint that forms state, connection reliability etc. from film is considered, is applicable to using phenoxy resin.Film forms the content of resin with respect to binder composition 100 mass parts, is generally 30～80 mass parts, is preferably 40～70 mass parts.
Free-radical polymerised resin is to have the material that carries out the functional group of polymerization by free radical, can enumerate epoxy acrylate, urethane acrylate, polyester acrylate etc., and they may be used alone, or two or more kinds may be used in combination.Wherein, in the present embodiment, preferably use epoxy acrylate.The content of free-radical polymerised resin, with respect to binder composition 100 mass parts, is generally 10～60 mass parts, is preferably 20～50 mass parts.
Radical polymerization initiator can be used known initiator, wherein, can preferably use organo-peroxide.As organo-peroxide; can enumerate peroxy ketal class, diacyl peroxide class, peroxide two carbonates, peroxy esters class, dialkyl peroxide class, hydroperoxide type, silyl peroxide etc.; they may be used alone, or two or more kinds may be used in combination.Wherein, in the present embodiment, preferably use peroxy ketal class.The content of radical polymerization initiator, with respect to free base system binder composition 100 mass parts, is generally 0.1～30 mass parts, is preferably 1～20 mass parts.
In addition, other interpolation compositions as in base-material, preferably add silane coupling agent.As silane coupling agent, can enumerate epoxy base system, amino system, sulfydryl system, thioether system, uride system etc.In addition, can add mineral filler.As mineral filler, can use silicon-dioxide, talcum, calcium carbonate, magnesium oxide etc., the kind of mineral filler is not particularly limited.In addition, when coordinating each composition of these base-materials, preferably use toluene, vinyl acetic monomer or their mixed solvent.
In addition, conductive particle when giving anisotropy to circuit connection material, the coating metal resin particle being formed by the coating metal of gold, nickel, zinc etc. such as the surface that can use the resin particle of metallic particles, benzoguanamine resin or the styrene resins etc. such as gold grain, silver-colored particle, nickel particle etc.As the median size of this conductive particle, be 1～10 μ m, 2～6 μ m more preferably.
In addition, the average particle density of the conductive particle in base-material is from the viewpoint consideration of connection reliability and insulating reliability, preferably 1000～50000/mm
2, more preferably 3000～30000/mm
2.
Comprise that the circuit connection material of this formation is owing to having coordinated the active oxidation titanium particle of Detitanium-ore-type, therefore by the Superhydrophilic of active oxidation titanium, improved with glass substrate surperficial-wetting property of OH, can improve the adaptation with substrate.And then, can under than the low temperature of the low 50 ℃ of left and right of common precompressed jointing temp, carry out pre-crimping.Therefore, the heat affecting reduction for substrate, can improve productivity.
Then, the manufacture method for above-mentioned circuit connection material describes.The manufacture method of the circuit connection material in present embodiment has: the titan oxide particles irradiation ultraviolet radiation to Detitanium-ore-type, make the activation step of active oxidation titanium, and the matching step that active oxidation titanium particle, polymerizability resin and polymerization starter are coordinated.
In activation step, the titan oxide particles irradiation ultraviolet radiation to Detitanium-ore-type.Ultraviolet irradiation condition is not particularly limited, with hundreds of μ W/cm
2the ultraviolet ray of intensity illumination wavelength 300～400nm left and right of left and right 1 hour～48 hours.The active oxidation titanium particle of this Detitanium-ore-type disperses in base-material, and the moisture therefore being adsorbed by hole is diffusion not, and is maintained.Therefore, can after stopping, rayed keep for a long time Superhydrophilic.
In matching step, active oxidation titanium particle is engaged in the base-material that contains polymerizability resin and polymerization starter.As base-material, can use any aggretion type of radical polymerization mould assembly, anionoid polymerization type, cationic polymerization type etc.
Wherein, for circuit connection material form membranaceous, by the manufacture method that coordinates conductive particle manufacture to there is anisotropic anisotropic conductive film, describe.The manufacture method of this anisotropic conductive film has: in the application step of peeling off coating composition on base material, the active oxidation titanium particle that said composition contains Detitanium-ore-type, film form resin, polymerizability resin, polymerization starter and conductive particle; With the drying step that makes to peel off the composition dries on base material.
In application step, as above-mentioned formation, preparing after composition, using metering bar coater, apparatus for coating etc. to be coated with peeling off on base material.Peel off base material such as comprising that the stripper by silicone etc. is coated on PET(polyethylene terephthalate Polyethylene Terephthalate), OPP(tropism's polypropylene Oriented Polypropylene), the poly-4-methyl 1-amylene poly 4-methyl-1-pentene of PMP(), PTFE(tetrafluoroethylene Polytetrafluoroethylene) etc. on the stepped construction that forms, when preventing composition dries, maintain the shape of composition.In addition, composition can be dissolved in organic solvent by above-mentioned composition and obtain, and as organic solvent, can use toluene, vinyl acetic monomer or their mixed solvent, other various organic solvents.
In follow-up drying step, the composition of peeling off on base material is dry by hot baking box, heat drying apparatus etc.Thus, can obtain being dispersed with the anisotropic conductive film of conductive particle in insulativity adhering resin, the active oxidation titanium particle that described insulativity adhering resin contains Detitanium-ore-type, film form resin, polymerizability resin and polymerization starter.
<2. the assemble method > of assembly
Then, for having used the assemble method of the electronic unit of foregoing circuit connecting material to describe.The assemble method of the electronic unit in present embodiment has: pre-pre-stickup step of pasting the anisotropic conductive film of the active oxidation titanium particle, polymerizability resin, polymerization starter and the conductive particle that contain Detitanium-ore-type on the electrode of the 1st electronic unit, with in anisotropic conductive film, configure the 2nd electronic unit, by the 2nd electronic unit above by the compression step of bonding head extruding.Thus, the electrode of the 1st electronic unit is connected via conductive particle with the electrode of the 2nd electronic unit, can make anisotropic conductive film solidify simultaneously.
Wherein, as the 1st electronic unit, can be set forth in coating IZO(indium zinc oxide Indium Zinc Oxide on glass substrate) the IZO coating glass that forms of film, coating SiN on glass substrate
xthe SiN that (silicon nitride) film forms
xcoating glass etc.In addition, as the 2nd electronic unit, can enumerate COF(membrane of flip chip Chip On Film), IC(unicircuit Integrated Circuit) etc.
In present embodiment, owing to coordinating the active oxidation titanium particle of Detitanium-ore-type in anisotropic conductive film, therefore by the Superhydrophilic of active oxidation titanium, with glass substrate surperficial-the wetting property raising of OH, pre-, paste in step, can improve the adaptation with glass substrate.Thus, can prevent that ACF from peeling off from glass substrate together with basement membrane, can improve transfer printing.In addition, due to the excellent adaptation obtaining with glass substrate, therefore can under than the low temperature of the low 50 ℃ of left and right of common precompressed jointing temp, paste in advance.Therefore, the heat affecting of substrate is reduced, can improve productivity.
Embodiment
<3. embodiment >
Below, for embodiments of the invention, describe.In the present embodiment, synthetic titanium oxide, is engaged in the anisotropic conductive film of radical-curable.And, carry out the pre-stickup test of anisotropic conductive film.In addition, use anisotropic conductive to connect film production assembly, measure the contact resistance of assembly.Should illustrate, the invention is not restricted to these embodiment.
Synthetic, the making of anisotropic conductive film of titanium oxide, the making of assembly, paste test and being determined as follows of contact resistance carried out in advance.
[synthesizing of titanium oxide]
With reference to TOHKEMY 2001-287997 communique, titanium tetrachloride is contacted with oxygen in gas phase, make its oxidation, by such vapor phase process, prepare titanium oxide monocrystalline.That is, on top, possess in the gas-phase reaction pipe of multilayered tube burner, at approximately 830 ℃, carry out oxidizing reaction, synthetic titanium oxide keeps it 120 minutes at 350～400 ℃, carries out heat treated, obtains the titanium oxide of the Detitanium-ore-type of median size 1.2 μ m.In addition, temperature of reaction is become to 1000 ℃, obtain the Titanium Dioxide (Rutile) Top grade of median size 1.0 μ m.For these titanium oxide, use the different a plurality of sieves of eyelet to carry out dry classification.And, measure by the ratio of the eyelet of sieve, with accumulative total (accumulation) weight percent, represent.
As shown in table 1.The titanium oxide A of Detitanium-ore-type of preparation median size (D50) 200nm, the titanium oxide B of the Detitanium-ore-type of median size (D50) 20nm, the titanium oxide C of the Detitanium-ore-type of median size (D50) 400nm, the titanium oxide D of the Detitanium-ore-type of median size (D50) 10nm, the titanium oxide F of the titanium oxide E of the Detitanium-ore-type of median size (D50) 500nm and the rutile-type of median size (D50) 200nm.
Table 1
[making of anisotropic conductive film]
Be configured to: phenoxy resin (trade(brand)name: YP-50, Dongdu changes into society's system) solids component convert and to count in the composition of 60 mass parts, radical polymerization resin (trade(brand)name: EB-600, ダ イ セ ルサ イテック society system) 35 mass parts and reaction initiator (trade(brand)name: パ ー ヘ キ サ C, Japanese grease society system) 2 mass parts, with 10000/mm of particle density
2disperse the conductive particle (trade(brand)name: AUL705, ponding chemical industry society system) of median size 5 μ m to be prepared.Use metering bar coater to be coated on PET film this binder composition, by oven dried, make the anisotropic conductive film of thickness 15 μ m.
[making of assembly]
Evaluating glass substrate (ITO(indium zinc oxide Indium Tin Oxide) the coating glass of use) upper, by joint-cutting, be that the wide anisotropic conductive film of 1.5mm is used cushioning material (tetrafluoroethylene) that 150 μ m are thick with pre-press-connection machine pre-crimping under the 70 ℃-1MPa-1 condition of second of the wide apparatus of 1.5mm (Star ー Le).Then, with identical press-connection machine, under the 80 ℃-0.5MPa-0.5 condition of second, pre-fix and evaluate with COF(50 μ mP, Cu8 μ mt-Sn plating, 38 μ mt), last under the 190 ℃-2MPa-10 condition of second to have used the formal press-connection machine crimping of the wide apparatus of 1.5mm, make assembly.
[pre-stickup tested]
Use comprises that joint-cutting is for the circuit connection material of the formation of the wide basement membrane/ACF/ mulch film of 1.5mm.Peel off mulch film, be pasted on and evaluate with on non-alkali glass, use the thick cushioning material (tetrafluoroethylene) of 150 μ m, with pre-press-connection machine pre-crimping under the 50 ℃-1MPa-1 condition of second of the wide apparatus of 1.5mm.And, peel off basement membrane, the situation that ACF is peeled off by glass substrate together with basement membrane is designated as " NG ".Carry out this pre-test, number of times of mensuration NG pasted 10 times.
[mensuration of contact resistance]
For assembly, measure the contact resistance at initial stage.Contact resistance while using digital multimeter (model: デ ジ タ Le マ Le チ メ ー タ 7555, Yokogawa Motor society system) to measure circulation 1mA electric current with 4 terminal methods.
<3.1 is about the effect > of titanium oxide
[embodiment 1]
For titanium oxide A, the ultraviolet ray of illumination wavelength 365nm 24 hours.In above-mentioned binder composition, contain this titanium oxide A of 5wt%, make anisotropic conductive film.NG number of the pre-stickup test of anisotropic conductive film is 0.In addition, the contact resistance value of assembly is 1.09 Ω.
［ comparative example 1 ］
Mismatch titanium oxide and make anisotropic conductive film.NG number of the pre-stickup test of anisotropic conductive film is 9.In addition, the contact resistance value of assembly is 1.09 Ω.
［ comparative example 2 ］
The titanium oxide A ' that contains the not irradiation ultraviolet radiation of 5wt% in above-mentioned binder composition, makes anisotropic conductive film.NG number of the pre-stickup test of anisotropic conductive film is 9.In addition, the contact resistance value of assembly is 1.09 Ω.
［ comparative example 3 ］
For titanium oxide F, the ultraviolet ray of illumination wavelength 365nm 24 hours.In above-mentioned binder composition, contain this titanium oxide F of 5wt%, make anisotropic conductive film.NG number of the pre-stickup test of anisotropic conductive film is 6.In addition, the contact resistance value of assembly is 1.08 Ω.
The evaluation result of embodiment shown in table 21, comparative example 1～3.
Table 2
As shown in table 2, in comparative example 1, owing to not containing titanium oxide, therefore the NG of pre-stickup test often.In addition, in comparative example 2, due to not to titanium oxide irradiation ultraviolet radiation, therefore do not show Superhydrophilic effect, the NG of pre-stickup test often.In addition, in comparative example 3, owing to using Titanium Dioxide (Rutile) Top grade F, the Superhydrophilic effect of therefore utilizing uviolizing to produce is little, and the NG of pre-stickup test often.On the other hand, in embodiment 1, by anatase-type titanium oxide A irradiation ultraviolet radiation, show Superhydrophilic effect, can improve the transfer printing for substrate.And then, even in the situation that the temperature during than common pre-crimping is low 50 ℃, also show good adaptation.
<3.2 is about the particle diameter > of titanium oxide
［ embodiment 2 ］
For the titanium oxide B of median size 20nm, the ultraviolet ray of illumination wavelength 365nm 24 hours.In above-mentioned binder composition, contain this titanium oxide B of 5wt%, make anisotropic conductive film.NG number of the pre-stickup test of anisotropic conductive film is 0.In addition, the contact resistance value of assembly is 1.28 Ω.
[embodiment 3]
For the titanium oxide C of median size 400nm, the ultraviolet ray of illumination wavelength 365nm 24 hours.In above-mentioned binder composition, contain this titanium oxide C of 5wt%, make anisotropic conductive film.NG number of the pre-stickup test of anisotropic conductive film is 0.In addition, the contact resistance value of assembly is 1.12 Ω.
[comparative example 4]
For the titanium oxide D of median size 10nm, the ultraviolet ray of illumination wavelength 365nm 24 hours.In above-mentioned binder composition, contain this titanium oxide D of 5wt%, make anisotropic conductive film.NG number of the pre-stickup test of anisotropic conductive film is 0.In addition, the contact resistance value of assembly is 5.08 Ω.
［ comparative example 5 ］
For the titanium oxide D of median size 500nm, the ultraviolet ray of illumination wavelength 365nm 24 hours.In above-mentioned binder composition, contain this titanium oxide E of 5wt%, make anisotropic conductive film.NG number of the pre-stickup test of anisotropic conductive film is 4.In addition, the contact resistance value of assembly is 1.09 Ω.
Embodiment 1～4 has been shown, the evaluation result of comparative example 4,5 in table 3.
Table 3
As shown in table 3, in comparative example 4, because median size is less than 20nm, therefore produce aggregate, there is bad connection.In addition, in comparative example 5, because median size is larger than 400nm, specific surface area is not enough, and transfer printing worsens.On the other hand, in embodiment 1～3, because median size is 20～400nm, be suitable, therefore the result of pre-stickup test and contact resistance value is good.
<3.3 is about the content > of titanium oxide
[embodiment 4]
For titanium oxide A, the ultraviolet ray of illumination wavelength 365nm 24 hours.In above-mentioned binder composition, contain this titanium oxide A of 1wt%, make anisotropic conductive film.NG number of the pre-stickup test of anisotropic conductive film is 0.In addition, the contact resistance value of assembly is 1.12 Ω.
［ embodiment 5 ］
For titanium oxide A, the ultraviolet ray of illumination wavelength 365nm 24 hours.In above-mentioned binder composition, contain this titanium oxide A of 30wt%, make anisotropic conductive film.NG number of the pre-stickup test of anisotropic conductive film is 0.In addition, the contact resistance value of assembly is 1.18 Ω.
［ comparative example 6 ］
For titanium oxide A, the ultraviolet ray of illumination wavelength 365nm 24 hours.In above-mentioned binder composition, contain this titanium oxide A of 0.5wt%, make anisotropic conductive film.NG number of the pre-stickup test of anisotropic conductive film is 5.In addition, the contact resistance value of assembly is 1.18 Ω.
［ comparative example 7 ］
For titanium oxide A, the ultraviolet ray of illumination wavelength 365nm 24 hours.In above-mentioned binder composition, contain this titanium oxide A of 35wt%, make anisotropic conductive film.NG number of the pre-stickup test of anisotropic conductive film is 0.In addition, the contact resistance value of assembly is 3.08 Ω.
Embodiment 1,4,5 has been shown, the evaluation result of comparative example 6,7 in table 4.
Table 4
As shown in table 4, in comparative example 6, because the content of titanium oxide A is less, Superhydrophilic effect is faint, and transfer printing is poor.In addition, in comparative example 7, because the content of titanium oxide A is many, the viscosity of ACF increases, and therefore bad connection occurs.On the other hand, in embodiment 1,4,5, because the content of titanium oxide A is 1～30wt%, be suitable, therefore pre-result of pasting test and contact resistance value is good.
Claims (6)
1. circuit connection material, active oxidation titanium particle, polymerizability resin and polymerization starter that it contains Detitanium-ore-type.
2. circuit connection material claimed in claim 1, wherein, the median size of above-mentioned active oxidation titanium particle is 20～400nm.
3. the circuit connection material described in claim 1 or 2, wherein, the use level of above-mentioned active oxidation titanium particle is 1～30wt%.
4. circuit connection material claimed in claim 1, wherein, above-mentioned polymerizability resin is free-radical polymerised resin, above-mentioned polymerization starter is radical polymerization initiator.
5. the manufacture method of circuit connection material, it has:
Titan oxide particles irradiation ultraviolet radiation to Detitanium-ore-type, makes the activation step of active oxidation titanium particle; With
The matching step that coordinates above-mentioned active oxidation titanium particle, polymerizability resin and polymerization starter.
6. the manufacture method of assembly, it has:
Pre-pre-stickup step of pasting the anisotropic conductive film of the active oxidation titanium particle, polymerizability resin, polymerization starter and the conductive particle that contain Detitanium-ore-type on the electrode of the 1st electronic unit; With
In above-mentioned anisotropic conductive film, configure the 2nd electronic unit, by the compression step of pushing by bonding head of the 2nd electronic unit above.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012223476A JP6029922B2 (en) | 2012-10-05 | 2012-10-05 | CIRCUIT CONNECTION MATERIAL, ITS MANUFACTURING METHOD, AND MOUNTING BODY MANUFACTURING METHOD USING THE SAME |
| JP2012-223476 | 2012-10-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103709955A true CN103709955A (en) | 2014-04-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310454922.5A Pending CN103709955A (en) | 2012-10-05 | 2013-09-30 | Circuit connecting material and method for production thereof, and method for production mounted body using it |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6029922B2 (en) |
| KR (1) | KR20140044747A (en) |
| CN (1) | CN103709955A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106663885A (en) * | 2014-06-30 | 2017-05-10 | 迪睿合株式会社 | Anisotropically-conductive film and connection structure |
| CN108291114A (en) * | 2015-11-25 | 2018-07-17 | 日立化成株式会社 | Adhesive for circuit connection composition and structure |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020041032A (en) | 2018-09-07 | 2020-03-19 | デクセリアルズ株式会社 | Manufacturing method of connection structure and connection film |
| JP2024042257A (en) * | 2022-09-15 | 2024-03-28 | 株式会社レゾナック | Adhesive composition, adhesive film, connected structure and manufacturing method thereof |
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| CN106663885B (en) * | 2014-06-30 | 2019-04-19 | 迪睿合株式会社 | Anisotropic conductive film and connection structural bodies |
| CN108291114A (en) * | 2015-11-25 | 2018-07-17 | 日立化成株式会社 | Adhesive for circuit connection composition and structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6029922B2 (en) | 2016-11-24 |
| JP2014074139A (en) | 2014-04-24 |
| KR20140044747A (en) | 2014-04-15 |
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