CN106338236A - Film thickness measuring apparatus and system provided with film thickness measuring apparatus and used for manufacturing wafers - Google Patents

Film thickness measuring apparatus and system provided with film thickness measuring apparatus and used for manufacturing wafers Download PDF

Info

Publication number
CN106338236A
CN106338236A CN 201610856282 CN201610856282A CN106338236A CN 106338236 A CN106338236 A CN 106338236A CN 201610856282 CN201610856282 CN 201610856282 CN 201610856282 A CN201610856282 A CN 201610856282A CN 106338236 A CN106338236 A CN 106338236A
Authority
CN
Grant status
Application
Patent type
Prior art keywords
film thickness
turntable
cantilever
probe
wafer
Prior art date
Application number
CN 201610856282
Other languages
Chinese (zh)
Inventor
路新春
赵德文
靳富
雷殿波
王军星
王同庆
李昆
Original Assignee
天津华海清科机电科技有限公司
清华大学
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical means
    • G01B11/02Measuring arrangements characterised by the use of optical means for measuring length, width or thickness
    • G01B11/06Measuring arrangements characterised by the use of optical means for measuring length, width or thickness for measuring thickness, e.g. of sheet material
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00Measuring arrangements characterised by the use of electric or magnetic means
    • G01B7/02Measuring arrangements characterised by the use of electric or magnetic means for measuring length, width or thickness
    • G01B7/06Measuring arrangements characterised by the use of electric or magnetic means for measuring length, width or thickness for measuring thickness

Abstract

The invention discloses a film thickness measuring apparatus and a system provided with the film thickness measuring apparatus and used for manufacturing wafers. The film thickness measuring apparatus includes a mounting platform, a turntable and a cantilever assembly; the turntable is rotationally arranged on the mounting platform; a workpiece is arranged on the upper surface of the turntable; the cantilever assembly is fixed on the mounting platform; the cantilever assembly comprises a linear unit, a cantilever, at least one probe and a driving component; the linear unit is opposite to the mounting platform in a vertical direction; one end of the cantilever is connected with the linear unit, and the other end of the cantilever extends towards the direction of the turntable; the probes are arranged at the other end of the cantilever and are used for measuring the film thickness of the workpiece; the driving component drives the cantilever to move linearly along the linear unit; and the measuring points of the probes are adjusted through the linear movement of the cantilever and the rotary movement of the turntable. The film thickness measuring apparatus provided by the embodiments of the present invention has the advantages of structural simplicity and convenience in measurement.

Description

膜厚度测量装置及具有其的用于制造晶片的系统 And a film thickness measuring device which has a system for manufacturing a wafer

技术领域 FIELD

[0001]本发明涉及半导体行业,尤其设计一种膜厚度测量装置及具有其的用于制造晶片的系统。 [0001] The present invention relates to semiconductor industry, in particular, to design a film thickness measuring apparatus and having a system for producing a wafer thereof.

背景技术 Background technique

[0002]随着集成电路(IC)制造技术的发展,对于膜厚度与均匀性控制的要求日益提高。 [0002] With the development of integrated circuit (IC) fabrication technology, the requirements for the uniformity of the film thickness and increasing control. 传统的膜厚度测量装置结构布局复杂、测量准确度低。 Conventional film thickness measurement apparatus structure and layout complexity, low measurement accuracy.

发明内容 SUMMARY

[0003]本发明旨在至少在一定程度上解决上述技术问题之一。 [0003] The present invention aims to solve at least one of the above-described technical problem to some extent.

[0004]为此,本发明提出一种膜厚度测量装置,该膜厚度测量装置结构简单、对工件的全局膜厚度的测量方便且易于实现。 [0004] To this end, the present invention provides a film thickness measuring apparatus, the film thickness measuring device is simple in structure, easy measurement of the overall film thickness of the workpiece and easy to implement.

[0005]本发明另一方面还提出一种用于制造晶片的系统,该用于制造晶片的系统结构简单,对膜厚度的测量方便。 [0005] In another aspect of the present invention also provides a system for producing a wafer, the wafer manufacturing system is simple and easy measurement of the film thickness used.

[0006]根据本发明第一方面实施例的膜厚度测量装置包括:安装平台;转台,所述转台可旋转地设置于所述安装台,工件设在所述转台的上表面;悬臂组件,所述悬臂组件固定在所述安装台上,所述悬臂组件包括:直线单元,所述直线单元与所述安装台在上下方向相对设置;悬臂,所述悬臂的一端与所述直线单元相连,所述悬臂的另一端向所述转台方向延伸;至少一个探头,所述探头设在所述悬臂的另一端用于测量工件的膜厚度;驱动件,所述驱动件驱动所述悬臂沿所述直线单元做直线运动,通过所述悬臂的直线运动和所述转台的旋转运动调整所述探头的测点。 The film thickness measurement apparatus [0006] according to a first aspect of the embodiment of the present invention comprises: a mounting platform; turntable, the turntable is rotatably disposed on the mounting table, the workpiece disposed in the upper surface of the turntable; boom assembly, the said boom assembly in said mounting base, said boom assembly comprising: a linear unit, the linear unit and the mounting table disposed in the vertical direction with respect to; the boom, the boom is connected to one end of the straight section, the the other end of said boom extending direction of the turntable; at least one probe, said probe is provided in the other end of the film thickness of the cantilever for measuring a workpiece; a drive member, the drive member driving said boom along said straight line linear motion unit, adjusting the point of the probe by measuring the linear movement and rotational movement of the boom of the turntable.

[0007]根据本发明实施例的膜厚度测量装置,将转台和悬臂组件均设置于安装平台上,且通过转台的旋转和悬臂的直线运动来调整探头的测点,从而实现对工件的全局膜厚度的测量,该膜厚度测量装置结构简单、测量方便。 [0007] The film thickness measurement apparatus of the embodiment of the present invention, the turret and the boom assembly are disposed on the mounting platform, and adjusting the measuring point of the probe by the linear movement of the turntable rotation and the boom in order to achieve global film workpiece measuring the thickness of the film thickness measuring device is simple in structure, easy measurement.

[0008]另外,根据本发明实施例的膜厚度测量装置,还可以具有如下附加的技术特征: [0008] Further, the film thickness measurement apparatus according to an embodiment of the present invention, may also have the following additional technical features:

[0009]根据本发明的一个实施例,所述悬臂从所述直线单元的第一位置和第二位置之间做直线运动,所述探头沿所述工件的径向外端向径向内端方向移动。 [0009] According to an embodiment of the present invention, the linear motion of the arm between a first position and a second unit of the linear position of the probe along the workpiece radially outer end to the radially inner end movement direction.

[0010]根据本发明的一个实施例,所示膜厚度测量装置还包括:安装座,所述安装座设在所述安装平台上,所述安装平台的上端设有标定样片,当所述悬臂位于所述直线单元的第一位置时,所述探头与所述安装座相对设置。 [0010] According to one embodiment of the present invention, a film thickness measuring apparatus shown in further comprising: a mounting base, the mounting base when the boom is provided on the mounting platform, the upper end of the mounting platform is provided with calibration samples, when in the first position of the linear unit, the probe is disposed opposite to the mount.

[0011]根据本发明的一个实施例,所述当所述悬臂位于第一位置时,所述探头在水平方向的投影位于所述转台的外侧,当所述悬臂位于第二位置时,所述探头在水平方向的投影位于所述转台的内侧。 [0011] According to one embodiment of the present invention, when the projection of the boom in the first position, said probe in a horizontal direction is located outside of the turret, the boom when in the second position, the probe positioned inside said turret in a horizontal projection.

[0012]根据本发明的一个实施例,所述悬臂与所述直线单元在水平方向垂直设置。 [0012] According to one embodiment of the present invention, the cantilever arm disposed perpendicular to the straight line unit in the horizontal direction.

[0013]根据本发明的一个实施例,所述直线单元与所述转台在水平方向的投影不重合。 [0013] According to one embodiment of the present invention, the linear unit and the projection in the horizontal direction of the turntable do not coincide.

[0014]根据本发明的一个实施例,所述膜厚度测量装置还包括:定位组件,所述定位组件设在所述转台上用于定位所述工件。 [0014] According to one embodiment of the present invention, the film thickness measuring apparatus further comprising: a positioning assembly, said positioning assembly is provided in the turntable for positioning the workpiece.

[0015]根据本发明的一个实施例,所述探头为电涡流探头和/或光学探头。 [0015] According to one embodiment of the present invention, the probes are eddy current probes and / or optical probe.

[0016]根据本发明的一个实施例,所述直线单元包括:导轨和支撑座,所述导轨设在所述支撑座上,所述悬臂沿所述导轨做水平方向直线运动。 [0016] According to an embodiment of the present invention, the linear unit comprising: a guide rail and the supporting base, the guide rail provided on said support base, said boom in the horizontal direction along the guide rail to make linear motion.

[0017]根据本发明的一个实施例,所述直线单元与所述导轨之间的角度可调。 [0017] According to one embodiment of the present invention, the angle between the straight section and the rail is adjustable.

[0018]根据本发明第二方面实施例的用于制造晶片的系统包括上述实施例的膜厚度测量装置,所述膜厚度测量装置用于对晶片进行膜厚度测量。 The film thickness measurement apparatus system for producing a wafer [0018] According to a second aspect of the embodiment of the present invention comprises the above-described embodiments, the film thickness measurement means for measuring the film thickness of the wafer.

[0019]另外,根据本发明实施例的用于制造晶片的系统,还可以具有如下附加的技术特征: [0019] Further, a system for manufacturing a wafer according to an embodiment of the present invention, may also have the following additional technical features:

[0020]根据本发明的一个实施例,用于制造晶片的系统还包括:晶片运送装置,所述晶片运送装置包括机械手,所述机械手将晶片运动于所述膜厚度测量装置上进行膜厚度测量。 [0020] According to one embodiment of the present invention, a system for manufacturing a wafer further comprises: a wafer conveying means, said conveying means comprises a wafer robot, the robot movement will be film thickness measurement wafer on said film thickness measuring device .

[0021]根据本发明的一个实施例,用于制造晶片的系统还包括:装载台,所述装载台和/或所述膜厚度测量装置均设置于所述晶片运送装置上。 [0021] According to one embodiment of the present invention, a system for manufacturing a wafer further comprising: a loading station, the loading station and / or the film thickness measuring devices are provided in the wafer transport apparatus.

[0022]根据本发明的一个实施例,所述机械手与所述膜厚度测量装置在前后方向上位于同一水平方向,所述装载台与所述机械手在左右方向位于同一水平方向。 [0022] According to one embodiment of the present invention, the manipulator of the film thickness measuring device located in the same horizontal direction in the longitudinal direction, the loading station and the manipulator in the horizontal direction at the same left-right direction.

[0023]本发明的附加方面和优点将在下面的描述中部分给出,部分将从下面的描述中变得明显,或通过本发明的实践了解到。 [0023] Additional aspects and advantages of the invention will be set forth in part in the description which follows, from the following description in part be apparent from, or learned by practice of the present invention.

附图说明 BRIEF DESCRIPTION

[0024]本发明的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解,其中: [0024] The foregoing and / or other aspects and advantages of the invention will be described with reference to embodiments in conjunction with the embodiments become apparent and more readily appreciated below, wherein:

[0025]图1是根据本发明一个实施例的膜厚度测量装置的主视图; [0025] FIG. 1 is a front view of a film thickness measurement apparatus of the present embodiment according to the invention;

[0026]图2是根据本发明一个实施例的膜厚度测量装置的主视图; [0026] FIG. 2 is a front view of a film thickness measurement apparatus of the present embodiment according to the invention;

[0027]图3是根据本发明一个实施例的膜厚度测量装置的俯视图; [0027] FIG. 3 is a plan view of a film thickness measuring apparatus according to an embodiment of the present invention;

[0028]图4是根据本发明一个实施例的膜厚度测量装置的俯视图; [0028] FIG. 4 is a plan view of a film thickness measuring apparatus according to an embodiment of the present invention;

[0029]图5是根据本发明一个实施例的用于制造晶片的系统的结构示意图; [0029] FIG. 5 is a diagram showing the configuration of a system for manufacturing a wafer according to one embodiment of the present invention;

[0030]图6是根据本发明另一个实施例的用于制造晶片的系统的结构示意图。 [0030] FIG. 6 is a schematic diagram of a system for manufacturing a wafer according to another embodiment of the present invention.

[0031]附图标记: [0031] The reference numerals:

[0032]用于制造晶片的系统300; [0032] A system for manufacturing a wafer 300;

[0033]膜厚度测量装置100; [0033] The film thickness measurement apparatus 100;

[0034]安装平台10; [0034] The mounting platform 10;

[0035]转台 20; [0035] The turret 20;

[0036] 悬臂组件30 ;直线单元31 ;导轨311 ;支撑座312;悬臂32 ; [0036] The boom assembly 30; linear unit 31; rail 311; 312 supporting base; boom 32;

[0037]探头 40; [0037] The probe 40;

[0038] 安装座50; [0038] The mount 50;

[0039] 定位组件60;支架61;吸盘62;定位销63; [0039] The positioning assembly 60; cradle 61; sucker 62; positioning pin 63;

[0040]晶片运送装置200;机械手201;装载台202; [0040] The wafer transport device 200; manipulator 201; loading stage 202;

[0041 ] 生产设备400。 [0041] equipment 400.

具体实施方式 detailed description

[0042]下面详细描述本发明的实施例,所述实施例的示例在附图中示出,其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。 [0042] Example embodiments of the present invention is described in detail below, exemplary embodiments of the embodiment shown in the accompanying drawings, wherein same or similar reference numerals designate the same or similar elements or elements having the same or similar functions. 下面通过参考附图描述的实施例是示例性的,旨在用于解释本发明,而不能理解为对本发明的限制。 By following with reference to the embodiments described are exemplary, and are intended for explaining the present invention and should not be construed as limiting the present invention.

[0043]下面参照图1-图6描述根据本发明实施例的膜厚度测量装置100,如图1和图2所示,该膜厚度测量装置100大体可以包括:安装平台10、转台20和悬臂组件30。 [0043] Referring now to Figures 1-6 embodiment described film thickness measurement apparatus 100 according to the embodiment of the present invention, FIGS. 1 and 2, the film thickness measuring apparatus 100 generally may include: a mounting platform 10, the turret 20 and boom assembly 30. 转台20和悬臂组件30均设置于安装平台10上,其中,悬臂组件30可以包括:直线单元31、悬臂32、至少一个探头40和驱动件(图未示出)。 The boom assembly 20 and the turntable 30 are disposed on the mounting platform 10, wherein the boom assembly 30 may include: a linear unit 31, the boom 32, the probe 40 and at least a drive member (not shown).

[0044]具体地,如图1和图2所示,转台20可旋转地设置于安装平台10。 [0044] Specifically, as shown in FIGS. 1 and 2, the turntable 20 is rotatably disposed on the mounting platform 10. 工件设在转台20的上表面。 A workpiece provided on the surface of the turntable 20. 直线单元31与安装平台10在上下方向相对设置。 Internet unit 31 is mounted with a straight line 10 in the vertical direction disposed opposite. 悬臂32的一端与直线单元31相连,悬臂32的另一端向转台20方向延伸,如图3和图4所示。 One end of the boom unit 32 is connected with a straight line 31, the other end of the arm 32 extends toward the direction of the turntable 20, as shown in FIGS. 3 and 4. 探头40设在悬臂32的另一端用于测量工件的膜厚度。 Probe 40 provided at the other end of the arm 32 for the film thickness measurement of the work. 驱动件驱动悬臂32沿直线单元31做直线运动,探头40的测点通过悬臂32的直线运动或转台20的旋转运动进行调整。 Driving the boom member 32 along the linear drive unit 31 is moved linearly, the probe 40 of the measuring point is adjusted by a linear movement or rotational movement of the boom 32 of the turntable 20.

[0045]也就是说,通过膜厚度测量装置100对工件的膜厚度进行测量时,工件随着转台20的旋转而转动,探头40随着悬臂32的直线运动而运动。 [0045] That is, when the film thickness measured by the film thickness measuring device 100 of the workpiece, the workpiece with rotation of the turret 20 is rotated, the probe 40 with the linear movement of the boom 32 is moved. 即可以通过调整悬臂32的运动速度和转台20旋转的角速度来布局探头40的测点。 I.e., the layout may be probe 40 measuring points by adjusting the moving speed of the boom 32 and the turntable 20 of the angular velocity. 其中,驱动件可以为步进电机,通过步进电机控制悬臂32的直线运动速度,悬臂32每步进一定距离,转台20旋转一周,探头40根据测点的数量要求间隔一定角度测量一次,完成一个圆周测量后;悬臂32步进到下一测量圆周,探头40继续测量工件的膜厚度值,如此反复,完成工件的全局膜厚度测量。 Wherein the drive member may be a stepper motor, stepper motor controlling the speed of linear movement 32 of the boom, the boom 32 a distance per step, one rotation of the turntable 20, the probe 40 measures the time required according to the number of measuring points spaced angle, complete after a circumferential measurement; boom 32 steps to the next measurement circumference, probe 40 continues to measure the film thickness value of the workpiece, and so forth, to complete the overall film thickness measurement of the work.

[0046]由此,根据本发明实施例的膜厚度测量装置100,将转台20和悬臂组件30均设置于安装平台10上,且通过转台20的旋转和悬臂32的直线运动来调整探头40的测点,从而实现对工件的全局膜厚度的测量,该膜厚度测量装置100结构简单、测量方便。 [0046] Thus, according to an embodiment of the film thickness measurement apparatus 100 according to the present invention, the boom assembly 30 and the turntable 20 are disposed on the mounting platform 10, and the probe 40 is adjusted by rotating the turntable 20 and the linear movement of the boom 32 measurement points, enabling global measurement of the film thickness of a workpiece, the film thickness measurement apparatus 100 is simple in structure, easy measurement.

[0047]在本发明的一些实施例中,悬臂32可以从直线单元31的第一位置和第二位置之间做直线运动,同时,探头40沿工件的径向外端向径向内端方向移动。 [0047] In some embodiments of the present invention, the cantilever 32 can be moved linearly from a position between the first position and the second linear unit 31, while the probe 40 along the radially outer end of the workpiece radially inner end direction mobile. 也就是说,悬臂32在第一位置和第二位置之间移动过程中,探头40的测点从工件的径向外端向径向内端方向移动,从而实现对工件全局膜厚度的测量。 That is, the boom 32, the probe 40 of the measuring point from the radially outer end of the workpiece is moved to the radially inner end of the movement direction between a first position and a second position in order to achieve global measurement of the film thickness of the workpiece.

[0048]另一些具体实施例中,膜厚度测量装置100还可以包括:安装座50。 [0048] In other specific embodiments, the film thickness measurement apparatus 100 may further comprises: mounting seat 50. 安装座50设在安装平台10上,安装平台10的上端设有标定样片,当悬臂32位于直线单元31的第一位置时,探头40与安装座50相对设置。 Mounting seat 50 provided on the mounting platform 10, the upper end of the mounting platform 10 is provided with a calibration sample, when the boom 32 in the first position of the linear units 31, 40 and the probe mount 50 disposed opposite. 即待测工件与标定样片可以在同一安装平台10进行测量,从而在对工件的膜厚度测量开始之前,探头40可以先对安装座50上的标定样片的膜厚度进行测量,并作为零点参考值,然后再对工件的膜厚度进行测量。 I.e., the test and calibration sample workpiece can be measured on the same mounting platform 10, thereby measuring the thickness of the workpiece prior to the start of the film, the probe 40 may be calibrated prior to the film thickness of the sample 50 is mounted on the base is measured and a reference value as the zero point , then the film thickness of the workpiece was measured. 由此,可以提高膜厚度测量装置100结构的紧凑性和方便性。 Thereby, it is possible to improve the compactness and convenience of a film structure 100 thickness measuring device.

[0049]可选地,当悬臂32位于第一位置时,如图3所示,探头40在水平方向的投影位于转台20的外侧,当悬臂32位于第二位置时,如图4所示,探头40在水平方向的投影位于转台20的内侧。 [0049] Alternatively, when the boom 32 is in the first position, shown in Figure 3, the probe 40 in the horizontal direction of the projection 20 is positioned outside the turntable, when the boom 32 is in the second position, shown in Figure 4, probe 40 in the horizontal direction of the projection 20 is located inside the turret. 即安装座50与转台20间隔设置在安装平台10上,探头40在转台20的外侧时,对安装座50上的标定样片膜厚度进行测量,探头40在转台20的内侧时,对工件的膜厚度进行测量。 That is, when the mount 50 and the turntable 20 spaced on the mounting platform 10, the probe 40 in the turntable outside 20 of the calibration sample a film thickness of 50 on the mount were measured, the probe 40 in the turntable inside 20, the film of the workpiece The thickness is measured. 安装座50上的标定样片可以根据待测量工件的种类进行更换,以提高膜厚度测量装置100测量的准确性。 Mounted on the calibration sample 50 can be replaced according to the kind of the workpiece to be measured, in order to improve the accuracy of the film thickness measuring device 100 measures.

[0050]在本发明的一个具体实施例中,如图3和图4所示,悬臂32与直线单元31在水平方向垂直设置。 [0050] In one embodiment of the present invention, in particular embodiments, as shown in FIGS. 3 and 4, the boom 32 and the line unit 31 vertically disposed in a horizontal direction. 也就是说,在水平方向上,悬臂32的延伸方向与直线单元31的延伸方向不同。 That is, in the horizontal direction different from the extending direction of the linear unit 32 of the boom 31. 即悬臂组件30在水平方向的延伸长度不会随着悬臂32位置的改变而改变,从而使得膜厚度测量装置100的结构更加紧凑和协调。 I.e., the boom assembly 30 does not change with the position of the boom 32 is changed in the extending length of the horizontal direction, so that the film thickness measurement apparatus 100 more compact structure and coordination.

[0051]有利地,直线单元31与转台20在水平方向的投影不重合。 [0051] Advantageously, the linear projection unit 31 and the turntable 20 do not overlap in the horizontal direction. 换言之,直线单元31与转台20在竖直方向间隔一定距离设置。 In other words, the linear section 31 and the turntable 20 in a vertical direction arranged at a distance. 由此,可以便于机械手201从转台20上取放工件,提高膜厚度测量装置100的测量效率。 Accordingly, the robot 201 may facilitate the turntable 20 to take place from the workpiece, to improve the efficiency of the measurement of the film thickness measurement apparatus 100. 此外,安装平台10的外周可以设有用于装载工件的装载台202,机械手201可以将工件从装载台202抓取至转台20进行膜厚度测量,测完后,又通过机械手201再次将工件抓取回至装载台202上,从而使得膜厚度的测量简单方便,且效率高。 Further, the outer periphery of the mounting platform 10 may be provided with a loading station for loading the workpiece 202, the robot 201 can fetch the workpiece from the loading station 202 to the turntable 20 for film thickness measurement, measured after, and again gripping the workpiece by the robot 201 back to the loading station 202, so that the film thickness measurement is simple and convenient, and high efficiency.

[0052] 其中,如图1和图2所示,直线单元31可以包括导轨311和支撑座312。 [0052] wherein 1 and 2, the linear guide unit 31 may include a base 311 and a support 312. 导轨311设在支撑座312上,悬臂32沿导轨311做水平方向直线运动。 Guide rails 311 provided on the support base 312, the boom 311 along the rails 32 in the horizontal direction to make a linear motion. 其中,直线单元31与导轨311之间的角度可调。 Wherein the linear unit 31 is an adjustable angle between the guide rails 311. 即通过调节直线单元31与导轨311之间的角度来调节探头40与工件之间竖直方向的距离,从而适应于不同工件膜厚度测量的需要。 I.e., the vertical direction to adjust the distance between the probe 40 and the workpiece by adjusting the angle between the straight section 31 and the guide rail 311, to accommodate the needs of different parts of the film thickness measurement.

[0053] 可选地,如图1-图4所示,膜厚度测量装置100还包括:定位组件60。 [0053] Alternatively, as shown in Figures 1 to 4, the film thickness measurement apparatus 100 further comprising: a positioning assembly 60. 定位组件60设在转台20上用于定位工件。 Positioning assembly 60 is provided for positioning the workpiece 20 on the turntable. 定位组件60可以包括:支架61、吸盘62和定位销63。 Positioning assembly 60 may include: a holder 61, chuck 62 and the positioning pin 63. 吸盘62设在支架61的上表面,定位销63可转动地设在支架61上,工件通过定位销63和吸盘62定位在支架61上。 The chuck 62 provided on the upper surface of the bracket 61, the positioning pin 63 is rotatably provided on the holder 61, the positioning pin 63 and the workpiece by the chuck 62 is positioned on a support 61.

[0054] 可选地,探头40可以为电涡流探头和/或光学探头。 [0054] Alternatively, the probe 40 may be a eddy current probes and / or optical probe. 也就是说,悬臂32上可以单独设置电涡流探头或光学探头,如图3所示,悬臂32上也可以同时设置电涡流探头和光学探头,如图4所示。 That is, the boom 32 may be provided on a separate eddy current probe or an optical probe, as shown in Figure 3, it may be provided an optical probe and eddy current probes simultaneously on the boom 32, as shown in FIG. 其中,电涡流探头40可用于对金属膜厚度的测量,光学探头40可用于对非金属膜厚度的测量。 Wherein the eddy current probe 40 may be used to measure the thickness of the metal film, the optical probe 40 can be used to measure the thickness of non-metallic film. 通过同时设置电涡流探头40和光学探头40可以使得膜厚度测量装置100同时具有测量金属膜厚度和非金属膜厚度的功能。 By providing simultaneous eddy current probes 40 and probe 40 may be such that the optical film thickness measuring apparatus 100 while having a film thickness measurement function and a non-metal film thickness.

[0055]根据本发明实施例的用于制造晶片的系统300包括上述实施例的膜厚度测量装置100,膜厚度测量装置100用于对晶片进行膜厚度测量。 [0055] 100, a film thickness measuring device 100 for measuring the film thickness of the wafer 300 for producing a system according to an embodiment of the wafer of the present invention includes the film thickness measurement apparatus of the above embodiment. 即晶片从生产设备400制造出来后,可以通过膜厚度测量装置100对其膜厚度进行测量,从而实现对晶片膜厚度的有效监测,保证晶片的膜厚度满足需求。 I.e. the wafer 400 from the production equipment manufactured, may be measured by the film thickness of the film 100 to its thickness measuring apparatus, in order to achieve effective monitoring of the film thickness of the wafer, to ensure that the film thickness of the wafer to meet the demand.

[0056]由于根据本发明实施例的膜厚度测量装置100具有结构简单,测量方便且准确的优点,因此,根据本发明实施例的用于制造晶片的系统结构200简单、测量方便且准确。 [0056] Since the film thickness measurement apparatus according to embodiments of the present invention 100 having a simple structure, convenient and accurate measurement of advantage, therefore, for a system configuration according to an embodiment of the manufacture of the wafer 200 of the present invention is simple, convenient and accurate measurement.

[0057] 可选地,如图5和图6所示,用于制造晶片的系统300还可以包括:晶片运送装置200。 [0057] Alternatively, as shown, a system 300 for manufacturing wafers 5 and 6 may further comprise: a wafer transport device 200. 晶片运送装置200包括机械手201,机械手201将晶片运送于膜厚度测量装置100上进行膜厚度测量。 Wafer transport device 200 includes a robot 201, the wafer conveying robot 201 to 100 for measuring the film thickness of the film thickness measuring device. 也就是说,晶片可以通过机械手201自动地放置在膜厚度测量装置100进行测量,且在测量完之后,可以通过机械手201将晶片从膜厚度测量装置100取下,从而提高用于制造晶片的系统300的生产和测量效率,降低生产成本。 That is, the wafer 201 can be placed automatically by the robot in the film thickness measurement apparatus 100 is measured, and after completion of the measurement, the wafer may be removed from the film thickness measuring apparatus 100 by the robot 201, thereby improving the system for manufacturing a wafer measuring the efficiency of production and 300, to reduce production costs.

[0058] 进一步地,如图5和图6所示,用于制造晶片的系统300还包括:装载台202。 [0058] Further, as shown in Figures 5 and 6, a system 300 for manufacturing a wafer further comprises: loading station 202. 装载台202和/或膜厚度测量装置100均设置于晶片运送装置200上。 The loading station 202 and / or the film thickness measuring device 100 are provided in the wafer transport device 200. 也就是说,装载台202和膜厚度测量装置100可以均设置于晶片运送装置200上,从而使得用于制造晶片的系统300结构紧凑,体积较小。 That is, the loading station 202 and a film thickness measuring device 100 may be disposed on each wafer transport device 200, so that the system 300 for fabricating a wafer structure compact, smaller volume. 或者,装载台202和膜厚度测量装置100的其中一个设置于晶片运送装置200上,另一个位于晶片运送装置200的外侧。 Or wherein the loading station 202 and a film thickness measuring device 100 is disposed on a wafer conveying device 200, another device 200 is located outside the wafer transport. 例如,如图5所示,膜厚度测量装置100设置于晶片运送装置200上,装载台202邻近晶片运送装置200的周壁,且机械手201与装载台202在左右方向位于同一水平方向。 For example, as shown in FIG. 5, the film thickness measurement apparatus 100 provided in the wafer transport device 200, the loading station 202 near the peripheral wall of the wafer transport apparatus 200 and the robot 201 and the loading station 202 is located in the same horizontal direction in the horizontal direction. 又例如,如图6所示,膜厚度测量装置100与装载台202均邻近晶片运送装置200的周壁,且机械手201与膜厚度测量装置100在前后方向上位于同一水平方向,装载台202与机械手201在左右方向位于同一水平方向。 As another example, as shown, the film thickness measuring device 100 and the load station 202 are adjacent to the wafer conveying device 6 of the peripheral wall 200 and the robot 201 and the film thickness measurement apparatus 100 is located in the same horizontal direction in the longitudinal direction, the loading station 202 and the robot 201 at the same left-right direction in the horizontal direction.

[0059]本发明的描述中,需要理解的是,术语“上”、“下” “、底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。 [0059] The description of the present invention, it is to be understood that the terms "upper", "lower", "bottom", "inner", "outer position or positional relationship" or the like based on the indication of the orientation depicted in the figures positional relationship, for convenience of description only and the present invention is to simplify the description, but does not indicate or imply that the device or element referred to must have a particular orientation, the orientation of a particular configuration and operation, can not be construed as limiting the present invention.

[0060]在本发明中,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通。 [0060] In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "connected," "fixed" and like terms are to be broadly understood, for example, may be a fixed connection, may be detachable connection, or integrally connected; may be a mechanical connector may be electrically connected; may be directly connected, can also be connected indirectly through intervening structures, it may be in communication the interior of the two elements. 对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本发明中的具体含义。 Those of ordinary skill in the art, to be understood that the specific meanings in the present invention depending on the circumstances.

[0061]在本发明中,除非另有明确的规定和限定,第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触,也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。 [0061] In the present invention, unless otherwise expressly specified or limited, the first feature in the "on" a second "lower" or the first and second features may include direct contact, and may also include a first the second feature is not in direct contact, but the contact by the additional features therebetween. 而且,第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方,或仅仅表示第一特征水平高度高于第二特征。 Also, the first feature a second feature in the "on", "above", "upper" and includes obliquely upward directly above first feature a second feature, or only represents a first characteristic level is higher than the height of the second feature. 第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正上方和斜上方,或仅仅表示第一特征水平高度小于第二特征。 In the first feature a second feature "beneath", "below" and "lower" above and includes a first positive feature obliquely upward in the second feature, or just less than the level represented by the first feature a second feature.

[0062]在本说明书的描述中,参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。 [0062] In the description of the present specification, reference to the term "one embodiment," "some embodiments", "an example", "a specific example", or "some examples" means that a description of the exemplary embodiment or embodiments described a particular feature, structure, material, or characteristic is included in at least one embodiment of the present invention, embodiments or examples. 在本说明书中,对上述术语的示意性表述不一定指的是相同的实施例或示例。 In the present specification, a schematic representation of the above terms necessarily referring to the same embodiment or example. 而且,描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。 Furthermore, the particular features, structures, materials, or characteristics described embodiments or examples may be at any one or more in a proper manner.

[0063] 尽管上面已经示出和描述了本发明的实施例,可以理解的是,上述实施例是示例性的,不能理解为对本发明的限制,本领域的普通技术人员在不脱离本发明的原理和宗旨的情况下在本发明的范围内可以对上述实施例进行变化、修改、替换和变型。 [0063] Although the above has been illustrated and described embodiments of the present invention, it is understood that the above embodiments are exemplary and are not to be construed as limiting the present invention, those of ordinary skill in the art without departing from the present invention. may be performed from the principles and spirit of the present invention within the scope of the above-described embodiment, variations, modifications, alternatives, and modifications.

Claims (14)

  1. 1.一种膜厚度测量装置,其特征在于,包括: 安装平台; 转台,所述转台可旋转地设置于所述安装台,工件设在所述转台的上表面; 悬臂组件,所述悬臂组件固定在所述安装台上,所述悬臂组件包括: 直线单元,所述直线单元与所述安装台在上下方向相对设置; 悬臂,所述悬臂的一端与所述直线单元相连,所述悬臂的另一端向所述转台方向延伸; 至少一个探头,所述探头设在所述悬臂的另一端用于测量工件的膜厚度; 驱动件,所述驱动件驱动所述悬臂沿所述直线单元做直线运动,通过所述悬臂的直线运动和所述转台的旋转运动调整所述探头的测点。 A film thickness measuring apparatus, characterized by comprising: a mounting platform; turntable, the turntable is rotatably disposed on the mounting table, the workpiece disposed in the upper surface of the turntable; boom assembly, said boom assembly fixed to the mounting base, said boom assembly comprising: a linear unit, the linear unit is disposed opposite the mounting table in the vertical direction; a cantilever one end connected to the linear unit, the cantilever the other end extending toward the direction of the turntable; at least one probe, said probe is provided at the other end of the cantilever for film thickness measurement of the workpiece; a drive member, the drive member drives the cantilever unit along the straight line linearly motion, adjusting the measuring point by the probe of the cantilever linear movement and rotational movement of the turntable.
  2. 2.根据权利要求1所述的膜厚度测量装置,其特征在于,所述悬臂从所述直线单元的第一位置和第二位置之间做直线运动,所述探头沿所述工件的径向外端向径向内端方向移动。 The film thickness measurement apparatus according to claim 1, wherein said boom from a linear motion of the linear unit between a first position and a second position, the radial direction of the workpiece probe moved to the outer end of the radially inner end direction.
  3. 3.根据权利要求2所述的膜厚度测量装置,其特征在于,还包括:安装座,所述安装座设在所述安装平台上,所述安装平台的上端设有标定样片,当所述悬臂位于所述直线单元的第一位置时,所述探头与所述安装座相对设置。 3. The film thickness measurement apparatus according to claim 2, characterized in that, further comprising: a mounting base, the mounting base provided on an upper end of the mounting platform, the mounting platform is provided with calibration samples, when the when in the first position of the straight boom means, said probe is disposed opposite to the mount.
  4. 4.根据权利要求3所述的膜厚度测量装置,其特征在于,所述当所述悬臂位于第一位置时,所述探头在水平方向的投影位于所述转台的外侧,当所述悬臂位于第二位置时,所述探头在水平方向的投影位于所述转台的内侧。 The film thickness measurement apparatus according to claim 3, wherein said projection when said boom is in the first position of the probe in the horizontal direction is located outside of the turntable, when the boom is located a second position inside said probe in a horizontal projection in said turntable.
  5. 5.根据权利要求2所述的膜厚度测量装置,其特征在于,所述悬臂与所述直线单元在水平方向垂直设置。 The film thickness measurement apparatus according to claim 2, wherein said cantilever means with the vertically disposed straight in a horizontal direction.
  6. 6.根据权利要求5所述的膜厚度测量装置,其特征在于,所述直线单元与所述转台在水平方向的投影不重合。 The film thickness measurement apparatus according to claim 5, characterized in that the linear unit and the projection of the turntable in a horizontal direction do not coincide.
  7. 7.根据权利要求1所述的膜厚度测量装置,其特征在于,还包括:定位组件,所述定位组件设在所述转台上用于定位所述工件。 7. The film thickness measurement apparatus according to claim 1, characterized in that, further comprising: a positioning assembly, said positioning assembly is provided in the turntable for positioning the workpiece.
  8. 8.根据权利要求1所述的膜厚度测量装置,其特征在于,所述探头为电涡流探头和/或光学探头。 8. The film thickness measurement apparatus according to claim 1, wherein said probe is eddy current probes and / or optical probe.
  9. 9.根据权利要求1所述的膜厚度测量装置,其特征在于,所述直线单元包括:导轨和支撑座,所述导轨设在所述支撑座上,所述悬臂沿所述导轨做水平方向直线运动。 9. The film thickness measurement apparatus according to claim 1, wherein said linear element comprising: a support base rail and the guide rail is provided along the guide rail in the horizontal direction to make the support base, the cantilever linear motion.
  10. 10.根据权利要求9所述的膜厚度测量装置,其特征在于,所述直线单元与所述导轨之间的角度可调。 10. The film thickness measurement apparatus according to claim 9, characterized in that the angle between the straight line and the guide rail unit is adjustable.
  11. 11.一种用于制造晶片的系统,其特征在于,包括权利要求1-10任一项所述的膜厚度测量装置,所述膜厚度测量装置用于对晶片进行膜厚度测量。 11. A system for manufacturing a wafer, characterized by comprising a film thickness measuring apparatus of any one of claims 1-10, said film thickness measuring device for measuring the film thickness of the wafer.
  12. 12.根据权利要求11所述的用于制造晶片的系统,其特征在于,还包括:晶片运送装置,所述晶片运送装置包括机械手,所述机械手将晶片运送于所述膜厚度测量装置上进行膜厚度测量。 12. A system for manufacturing a wafer according to claim 11, characterized in that, further comprising: a wafer conveying means, said conveying means comprising a robot wafer, the wafer transport robot for carrying out the film thickness measuring device The film thickness measurement.
  13. 13.根据权利要求12所述的用于制造晶片的系统,其特征在于,还包括:装载台,所述装载台和/或所述膜厚度测量装置均设置于所述晶片运送装置上。 13. The system for producing a wafer according to claim 12, characterized in that, further comprising: a loading station, the loading station and / or the film thickness measuring devices are provided in the wafer transport apparatus.
  14. 14.根据权利要求13所述的用于制造晶片的系统,其特征在于,所述机械手与所述膜厚度测量装置在前后方向上位于同一水平方向,所述装载台与所述机械手在左右方向位于同一水平方向。 14. The system for producing a wafer according to claim 13, characterized in that the manipulator with said film thickness measuring device located in the same horizontal direction in the longitudinal direction, the loading station and the manipulator in the horizontal direction in the same horizontal direction.
CN 201610856282 2016-09-28 2016-09-28 Film thickness measuring apparatus and system provided with film thickness measuring apparatus and used for manufacturing wafers CN106338236A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201610856282 CN106338236A (en) 2016-09-28 2016-09-28 Film thickness measuring apparatus and system provided with film thickness measuring apparatus and used for manufacturing wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201610856282 CN106338236A (en) 2016-09-28 2016-09-28 Film thickness measuring apparatus and system provided with film thickness measuring apparatus and used for manufacturing wafers

Publications (1)

Publication Number Publication Date
CN106338236A true true CN106338236A (en) 2017-01-18

Family

ID=57839383

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201610856282 CN106338236A (en) 2016-09-28 2016-09-28 Film thickness measuring apparatus and system provided with film thickness measuring apparatus and used for manufacturing wafers

Country Status (1)

Country Link
CN (1) CN106338236A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106989679A (en) * 2017-02-23 2017-07-28 北京交通大学 Non-contact semiconductor wafer thickness measurement device

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1170655A (en) * 1996-05-31 1998-01-21 Memc电子材料有限公司 Automated wafer lapping system
KR20030081607A (en) * 2002-04-12 2003-10-22 한국디엔에스 주식회사 Spin-etcher with thickness measuring system
CN101261306A (en) * 2008-04-14 2008-09-10 无锡市易控系统工程有限公司 Full-automatic wafer test method and equipment accomplishing the method
CN101769721A (en) * 2010-02-03 2010-07-07 隆达电子股份有限公司 Optical measurement device
CN102175133A (en) * 2011-02-25 2011-09-07 清华大学 Global metal film thickness measuring device
CN102538686A (en) * 2010-12-09 2012-07-04 财团法人金属工业研究发展中心 Thickness measurement method
CN102564287A (en) * 2011-12-15 2012-07-11 清华大学 Method for measuring film thickness of wafer by using wafer platform
CN102784760A (en) * 2011-05-20 2012-11-21 北京北方微电子基地设备工艺研究中心有限责任公司 Testing sorting equipment for wafer

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1170655A (en) * 1996-05-31 1998-01-21 Memc电子材料有限公司 Automated wafer lapping system
KR20030081607A (en) * 2002-04-12 2003-10-22 한국디엔에스 주식회사 Spin-etcher with thickness measuring system
CN101261306A (en) * 2008-04-14 2008-09-10 无锡市易控系统工程有限公司 Full-automatic wafer test method and equipment accomplishing the method
CN101769721A (en) * 2010-02-03 2010-07-07 隆达电子股份有限公司 Optical measurement device
CN102538686A (en) * 2010-12-09 2012-07-04 财团法人金属工业研究发展中心 Thickness measurement method
CN102175133A (en) * 2011-02-25 2011-09-07 清华大学 Global metal film thickness measuring device
CN102784760A (en) * 2011-05-20 2012-11-21 北京北方微电子基地设备工艺研究中心有限责任公司 Testing sorting equipment for wafer
CN102564287A (en) * 2011-12-15 2012-07-11 清华大学 Method for measuring film thickness of wafer by using wafer platform

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106989679A (en) * 2017-02-23 2017-07-28 北京交通大学 Non-contact semiconductor wafer thickness measurement device

Similar Documents

Publication Publication Date Title
CN103056635A (en) Automatic aligning assembling system of parts
CN201548380U (en) Linear type three-coordinate coversion machine for testing satellite quality characteristics
CN101261306A (en) Full-automatic wafer test method and equipment accomplishing the method
US20120224945A1 (en) Substrate holder positioning method and substrate processing system
CN101886921A (en) Measurement method and measurement accessory for zero point calibration of gear measuring center
CN101515016A (en) Probe apparatus, probing method, and storage medium
CN103050427A (en) Wafer pre-alignment method
JP2010199227A (en) Grinding device
CN1937202A (en) Silicon wafer prealigning device
JPH09330960A (en) Inspection device
CN101774102A (en) Rotary welding device
JP2008258321A (en) Cutting method and cutting device
CN101794721A (en) Alignment apparatus for semiconductor wafer
JP2004127979A (en) Substrate supporting device, and inspection apparatus and aligner having the same
CN102402127A (en) Silicon chip prealignment device and silicon chip prealignment method
CN201298024Y (en) Automatically controlled silicon chip checking system
CN103389051A (en) Vertical-type wafer shape measuring instrument
JP2010131680A (en) Holding means driver
JP2001351890A (en) Chip polishing method
CN201764933U (en) Vehicle ball race inner diameter automatic measuring apparatus
JP2005022059A (en) Grinder and grinding method
CN103600269A (en) Full-automatic grinding machine and grinding method thereof
CN201514459U (en) Chip test desk
US20090016857A1 (en) Substrate-replacing apparatus, substrate-processing apparatus, and substrate-inspecting apparatus
CN202869986U (en) Four-working-position parallel testing device

Legal Events

Date Code Title Description
C06 Publication
C10 Entry into substantive examination
TA01