CN106338236A - Film thickness measuring apparatus and system provided with film thickness measuring apparatus and used for manufacturing wafers - Google Patents
Film thickness measuring apparatus and system provided with film thickness measuring apparatus and used for manufacturing wafers Download PDFInfo
- Publication number
- CN106338236A CN106338236A CN201610856282.4A CN201610856282A CN106338236A CN 106338236 A CN106338236 A CN 106338236A CN 201610856282 A CN201610856282 A CN 201610856282A CN 106338236 A CN106338236 A CN 106338236A
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- film thickness
- measuring apparatus
- cantilever
- thickness measuring
- straight line
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
- G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
The invention discloses a film thickness measuring apparatus and a system provided with the film thickness measuring apparatus and used for manufacturing wafers. The film thickness measuring apparatus includes a mounting platform, a turntable and a cantilever assembly; the turntable is rotationally arranged on the mounting platform; a workpiece is arranged on the upper surface of the turntable; the cantilever assembly is fixed on the mounting platform; the cantilever assembly comprises a linear unit, a cantilever, at least one probe and a driving component; the linear unit is opposite to the mounting platform in a vertical direction; one end of the cantilever is connected with the linear unit, and the other end of the cantilever extends towards the direction of the turntable; the probes are arranged at the other end of the cantilever and are used for measuring the film thickness of the workpiece; the driving component drives the cantilever to move linearly along the linear unit; and the measuring points of the probes are adjusted through the linear movement of the cantilever and the rotary movement of the turntable. The film thickness measuring apparatus provided by the embodiments of the present invention has the advantages of structural simplicity and convenience in measurement.
Description
Technical field
The present invention relates to semicon industry, especially design a kind of film thickness measuring apparatus and have its for manufacturing chip
System.
Background technology
With the development of integrated circuit (ic) manufacturing technology, the requirement for film thickness and uniformity controlling increasingly improves.
Traditional film thickness measuring apparatus topology layout is complicated, accuracy of measurement is low.
Content of the invention
It is contemplated that at least solving one of above-mentioned technical problem to a certain extent.
For this reason, the present invention proposes a kind of film thickness measuring apparatus, this film thickness measuring apparatus structure is simple, complete to workpiece
The measurement of office's film thickness is convenient and is easily achieved.
Another aspect of the present invention also proposes a kind of system for manufacturing chip, and this is used for manufacturing the system structure letter of chip
Single, the measurement to film thickness is convenient.
The film thickness measuring apparatus of embodiment include according to a first aspect of the present invention: mounting platform；Turntable, described turntable can
It is rotatably provided in described erecting bed, workpiece is located at the upper surface of described turntable；Slider assembly, described slider assembly is fixed on institute
State on erecting bed, described slider assembly includes: straight line units, described straight line units and described erecting bed set above-below direction is relative
Put；Cantilever, one end of described cantilever is connected with described straight line units, and the other end of described cantilever extends to described turntable direction；
At least one probe, the other end that described probe is located at described cantilever is used for measuring the film thickness of workpiece；Actuator, described driving
Part drives described cantilever to move along a straight line along described straight line units, by the linear motion of described cantilever and the rotation of described turntable
Motion adjusts the measuring point of described probe.
Film thickness measuring apparatus according to embodiments of the present invention, turntable and slider assembly be may be contained within mounting platform,
And the linear motion of the rotation by turntable and cantilever is adjusting the measuring point of probe, thus realizing the overall film thickness to workpiece
Measurement, this film thickness measuring apparatus structure is simple, measurement is convenient.
In addition, film thickness measuring apparatus according to embodiments of the present invention, can also have a technical characteristic adding as follows:
According to one embodiment of present invention, described cantilever is between the primary importance and the second position of described straight line units
Move along a straight line, described probe moves along the radial outer end of described workpiece to radial inner end direction.
According to one embodiment of present invention, shown film thickness measuring apparatus also include: mounting seat, and described mounting seat is located at
On described mounting platform, the upper end of described mounting platform is provided with demarcation print, when described cantilever is located at the of described straight line units
During one position, described probe is oppositely arranged with described mounting seat.
According to one embodiment of present invention, described when described cantilever be located at primary importance when, described probe is in level side
To projection be located at described turntable outside, when described cantilever be located at the second position when, the projection in the horizontal direction of described probe
Inner side positioned at described turntable.
According to one embodiment of present invention, described cantilever and described straight line units are vertically arranged in the horizontal direction.
According to one embodiment of present invention, projection in the horizontal direction is misaligned with described turntable for described straight line units.
According to one embodiment of present invention, described film thickness measuring apparatus also include: positioning component, described positioning component
It is located on described turntable and be used for positioning described workpiece.
According to one embodiment of present invention, described pop one's head in as eddy current probe and/or optic probe.
According to one embodiment of present invention, described straight line units include: guide rail and support base, and described guide rail is located at described
On support base, described cantilever does horizontal direction linear motion along described guide rail.
According to one embodiment of present invention, the adjustable angle between described straight line units and described guide rail.
The system for manufacturing chip of embodiment includes the film thickness survey of above-described embodiment according to a second aspect of the present invention
Amount device, described film thickness measuring apparatus are used for carrying out film thickness measurement to chip.
In addition, the system for manufacturing chip according to embodiments of the present invention, can also have the technology added as follows special
Levy:
According to one embodiment of present invention, the system for manufacturing chip also includes: chip conveying device, described chip
Vehicle includes mechanical hand, and chip is moved and carries out film thickness measurement on described film thickness measuring apparatus by described mechanical hand.
According to one embodiment of present invention, the system for manufacturing chip also includes: loading stage, described loading stage and/
Or described film thickness measuring apparatus may be contained within described chip conveying device.
According to one embodiment of present invention, described mechanical hand and described film thickness measuring apparatus are located in the longitudinal direction
Same level direction, described loading stage is located at same level direction with described mechanical hand in left and right directions.
The additional aspect of the present invention and advantage will be set forth in part in the description, and partly will become from the following description
Obtain substantially, or recognized by the practice of the present invention.
Brief description
The above-mentioned and/or additional aspect of the present invention and advantage will become from reference to the description to embodiment for the accompanying drawings below
Substantially and easy to understand, wherein:
Fig. 1 is the front view of film thickness measuring apparatus according to an embodiment of the invention；
Fig. 2 is the front view of film thickness measuring apparatus according to an embodiment of the invention；
Fig. 3 is the top view of film thickness measuring apparatus according to an embodiment of the invention；
Fig. 4 is the top view of film thickness measuring apparatus according to an embodiment of the invention；
Fig. 5 is the structural representation of the system for manufacturing chip according to an embodiment of the invention；
Fig. 6 is the structural representation of the system for manufacturing chip in accordance with another embodiment of the present invention.
Reference:
For manufacturing the system 300 of chip；
Film thickness measuring apparatus 100；
Mounting platform 10；
Turntable 20；
Slider assembly 30；Straight line units 31；Guide rail 311；Support base 312；Cantilever 32；
Probe 40；
Mounting seat 50；
Positioning component 60；Support 61；Sucker 62；Alignment pin 63；
Chip conveying device 200；Mechanical hand 201；Loading stage 202；
Production equipment 400.
Specific embodiment
Embodiments of the invention are described below in detail, the example of described embodiment is shown in the drawings, wherein from start to finish
The element that same or similar label represents same or similar element or has same or like function.Below with reference to attached
The embodiment of figure description is exemplary it is intended to be used for explaining the present invention, and is not considered as limiting the invention.
Referring to Fig. 1-Fig. 6, film thickness measuring apparatus 100 according to embodiments of the present invention are described, as Fig. 1 and Fig. 2 institute
Show, this film thickness measuring apparatus 100 substantially may include that mounting platform 10, turntable 20 and slider assembly 30.Turntable 20 and cantilever
Assembly 30 may be contained within mounting platform 10, wherein, slider assembly 30 may include that straight line units 31, cantilever 32, at least one
Probe 40 and actuator (not shown).
Specifically, as depicted in figs. 1 and 2, turntable 20 is rotationally arranged at mounting platform 10.Workpiece is located at turntable 20
Upper surface.Straight line units 31 are oppositely arranged in above-below direction with mounting platform 10.One end of cantilever 32 is connected with straight line units 31,
The other end of cantilever 32 extends to turntable 20 direction, as shown in Figure 3 and Figure 4.The other end that probe 40 is located at cantilever 32 is used for surveying
The film thickness of amount workpiece.Actuator drives cantilever 32 to move along a straight line along straight line units 31, and the measuring point of probe 40 passes through cantilever 32
Linear motion or the rotary motion of turntable 20 be adjusted.
That is, when the film thickness of workpiece being measured by film thickness measuring apparatus 100, workpiece is with turntable 20
Rotation and rotate, probe 40 moves with the linear motion of cantilever 32.I.e. can be by adjusting the movement velocity of cantilever 32
Carry out the measuring point of layout probe 40 with the angular velocity of turntable 20 rotation.Wherein, actuator can be motor, by motor
Control the point-to-point speed of cantilever 32, the every stepping certain distance of cantilever 32, turntable 20 rotates a circle, probe 40 is according to measuring point
Quantitative requirement certain angular interval measures once, after completing a circumference measurement；Cantilever 32 steps to next and measures circumference, probe
40 Film thickness values continuing measurement workpiece, so repeatedly, complete the overall film thickness measurement of workpiece.
Thus, film thickness measuring apparatus 100 according to embodiments of the present invention, turntable 20 and slider assembly 30 be may be contained within
On mounting platform 10, and the linear motion of the rotation by turntable 20 and cantilever 32 come adjust probe 40 measuring point, thus realizing
Measurement to the overall film thickness of workpiece, this film thickness measuring apparatus 100 structure is simple, measurement is convenient.
In some embodiments of the invention, cantilever 32 can be between the primary importance of straight line units 31 and the second position
Move along a straight line, meanwhile, probe 40 moves along the radial outer end of workpiece to radial inner end direction.That is, cantilever 32 is
In moving process between one position and the second position, the measuring point of probe 40 moves to radial inner end direction from the radial outer end of workpiece
Dynamic, thus realizing the measurement to workpiece overall situation film thickness.
In other specific embodiments, film thickness measuring apparatus 100 can also include: mounting seat 50.Mounting seat 50 is located at
On mounting platform 10, the upper end of mounting platform 10 is provided with demarcation print, when cantilever 32 is located at the primary importance of straight line units 31,
Probe 40 is oppositely arranged with mounting seat 50.I.e. workpiece for measurement can measure in same mounting platform 10 with demarcating print, from
And before the film thickness measurement to workpiece starts, probe 40 can first be carried out to the film thickness of the demarcation print in mounting seat 50
Measurement, and as zero reference value, then again the film thickness of workpiece is measured.Thus, it is possible to improve film thickness measurement dress
Put compactedness and the convenience of 100 structures.
Alternatively, when cantilever 32 is located at primary importance, as shown in figure 3, probe 40 projections in the horizontal direction are located at and turn
The outside of platform 20, when cantilever 32 is located at the second position, as shown in figure 4, probe 40 projections in the horizontal direction are located at turntable 20
Inner side.I.e. mounting seat 50 and turntable 20 are disposed on mounting platform 10, pop one's head in 40 when the outside of turntable 20, to installation
Demarcation print film thickness on seat 50 measures, and probe 40, when the inner side of turntable 20, measures to the film thickness of workpiece.
Demarcation print in mounting seat 50 can be changed according to the species of workpiece to be measured, to improve film thickness measuring apparatus 100
The accuracy of measurement.
In one particular embodiment of the present invention, as shown in Figure 3 and Figure 4, cantilever 32 and straight line units 31 are in level side
To being vertically arranged.That is, in the horizontal direction, the bearing of trend of cantilever 32 is different from the bearing of trend of straight line units 31.
I.e. slider assembly 30 development length in the horizontal direction will not change with the change of cantilever 32 position, so that film thickness
The structure of measurement apparatus 100 is compacter and coordinates.
Advantageously, projection in the horizontal direction is misaligned with turntable 20 for straight line units 31.In other words, straight line units 31 with turn
Platform 20 keeps at a certain distance away setting in vertical direction.Thus, it is possible to be easy to mechanical hand 201 to pick and place workpiece from turntable 20, improve
The measurement efficiency of film thickness measuring apparatus 100.Additionally, the periphery of mounting platform 10 can be provided with the loading stage for loading workpiece
202, workpiece can be captured from loading stage 202 and carry out film thickness measurement to turntable 20, after having surveyed, further through machine by mechanical hand 201
Tool handss 201 again workpiece grabbing are back on loading stage 202, so that the measurement of film thickness is simple and convenient, and efficiency high.
Wherein, as depicted in figs. 1 and 2, straight line units 31 can include guide rail 311 and support base 312.Guide rail 311 is located at
On support base 312, cantilever 32 does horizontal direction linear motion along guide rail 311.Wherein, between straight line units 31 and guide rail 311
Adjustable angle.Adjusted vertically square between probe 40 and workpiece by the angle between regulation straight line units 31 and guide rail 311
To distance, thus be adapted to different workpieces film thickness measurement needs.
Alternatively, as Figure 1-Figure 4, film thickness measuring apparatus 100 also include: positioning component 60.Positioning component 60 sets
Turntable 20 is used for positioning workpiece.Positioning component 60 may include that support 61, sucker 62 and alignment pin 63.Sucker 62 is located at
The upper surface of support 61, alignment pin 63 is rotatably arranged on support 61, and workpiece passes through alignment pin 63 and sucker 62 is positioned at and props up
On frame 61.
Alternatively, probe 40 can be eddy current probe and/or optic probe.That is, can be independent on cantilever 32
Setting eddy current probe or optic probe, as shown in figure 3, can also arrange eddy current probe and optics spy simultaneously on cantilever 32
Head, as shown in Figure 4.Wherein, eddy current probe 40 can be used for the measurement to thickness of metal film, and optic probe 40 can be used for non-gold
Belong to the measurement of film thickness.By arranging eddy current probe 40 and optic probe 40 so that film thickness measuring apparatus 100 simultaneously
There is the function of measurement thickness of metal film and non-metallic film thickness simultaneously.
System 300 for manufacturing chip according to embodiments of the present invention includes the film thickness measuring apparatus of above-described embodiment
100, film thickness measuring apparatus 100 are used for carrying out film thickness measurement to chip.I.e. chip is after production equipment 400 manufactures,
By film thickness measuring apparatus 100, its film thickness being measured, thus realizing the effective monitoring to chip film thickness, protecting
The film thickness of card chip meets demand.
Because film thickness measuring apparatus 100 according to embodiments of the present invention have, structure is simple, and measurement is convenient and accurate
Advantage, therefore, the system structure 200 for manufacturing chip according to embodiments of the present invention is simple, measurement is convenient and accurate.
Alternatively, as shown in Figure 5 and Figure 6, the system 300 for manufacturing chip can also include: chip conveying device
200.Chip conveying device 200 includes mechanical hand 201, and chip conveying is carried out on film thickness measuring apparatus 100 by mechanical hand 201
Film thickness measures.That is, chip can be automatically placed in film thickness measuring apparatus 100 by mechanical hand 201 being surveyed
Amount, and after having measured, by mechanical hand 201, chip can be taken off from film thickness measuring apparatus 100, thus improve being used for
Manufacture the production of system 300 and the measurement efficiency of chip, reduce production cost.
Further, as shown in Figure 5 and Figure 6, the system 300 for manufacturing chip also includes: loading stage 202.Loading stage
202 and/or film thickness measuring apparatus 100 may be contained within chip conveying device 200.That is, loading stage 202 and film thickness
Measurement apparatus 100 can may be contained within chip conveying device 200, so that tight for manufacturing system 300 structure of chip
Gather, small volume.Or, one of them of loading stage 202 and film thickness measuring apparatus 100 is arranged at chip conveying device 200
On, another is located at the outside of chip conveying device 200.For example, as shown in figure 5, film thickness measuring apparatus 100 are arranged at chip
On vehicle 200, the perisporium of loading stage 202 adjacent wafer vehicle 200, and mechanical hand 201 and loading stage 202 are in left and right
Direction is located at same level direction.Again for example, as shown in fig. 6, film thickness measuring apparatus 100 and the equal adjacent wafer of loading stage 202
The perisporium of vehicle 200, and mechanical hand 201 is located at same level direction in the longitudinal direction with film thickness measuring apparatus 100,
Loading stage 202 is located at same level direction with mechanical hand 201 in left and right directions.
In description of the invention it is to be understood that term " on ", D score ", bottom ", " interior ", the orientation of the instruction such as " outward "
Or position relationship is based on orientation shown in the drawings or position relationship, it is for only for ease of the description present invention and simplifies description, and
It is not instruction or the hint device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore
It is not considered as limiting the invention.
In the present invention, unless otherwise clearly defined and limited, term " installation ", " being connected ", " connection ", " fixation " etc.
Term should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or is integrally connected；It can be machine
Tool connects or electrically connects；Can be to be joined directly together it is also possible to be indirectly connected to by intermediary, can be two units
Connection within part.For the ordinary skill in the art, above-mentioned term can be understood as the case may be at this
Concrete meaning in bright.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or D score
The first and second feature directly contacts can be included not to be directly contact but passes through it is also possible to include the first and second features
Between other characterisation contact.And, fisrt feature second feature " on ", that " top " and " above " include first is special
Levy directly over second feature and oblique upper, or be merely representative of fisrt feature level height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " below " include fisrt feature directly over second feature and oblique upper, or be merely representative of
Fisrt feature level height is less than second feature.
In the description of this specification, reference term " embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or the spy describing with reference to this embodiment or example
Point is contained at least one embodiment or the example of the present invention.In this manual, to the schematic representation of above-mentioned term not
Necessarily refer to identical embodiment or example.And, the specific features of description, structure, material or feature can be any
One or more embodiments or example in combine in an appropriate manner.
Although embodiments of the invention have been shown and described above it is to be understood that above-described embodiment is example
Property it is impossible to be interpreted as limitation of the present invention, those of ordinary skill in the art is in the principle without departing from the present invention and objective
In the case of above-described embodiment can be changed within the scope of the invention, change, replace and modification.
Claims (14)
1. a kind of film thickness measuring apparatus are it is characterised in that include:
Mounting platform；
Turntable, described turntable is rotationally arranged at described erecting bed, and workpiece is located at the upper surface of described turntable；
Slider assembly, described slider assembly is fixed on described erecting bed, and described slider assembly includes:
Straight line units, described straight line units are oppositely arranged in above-below direction with described erecting bed；
Cantilever, one end of described cantilever is connected with described straight line units, and the other end of described cantilever extends to described turntable direction；
At least one probe, the other end that described probe is located at described cantilever is used for measuring the film thickness of workpiece；
Actuator, described actuator drives described cantilever to move along a straight line along described straight line units, by the straight line of described cantilever
The rotary motion of motion and described turntable adjusts the measuring point of described probe.
2. film thickness measuring apparatus according to claim 1 are it is characterised in that described cantilever is from the of described straight line units
Move along a straight line between one position and the second position, described probe moves along the radial outer end of described workpiece to radial inner end direction
Dynamic.
3. film thickness measuring apparatus according to claim 2 are it is characterised in that also include: mounting seat, and described mounting seat sets
On described mounting platform, the upper end of described mounting platform is provided with demarcation print, when described cantilever is located at described straight line units
During primary importance, described probe is oppositely arranged with described mounting seat.
4. film thickness measuring apparatus according to claim 3 it is characterised in that described when described cantilever be located at primary importance
When, the projection in the horizontal direction of described probe is located at the outside of described turntable, when described cantilever is located at the second position, described spy
Head projection in the horizontal direction is located at the inner side of described turntable.
5. film thickness measuring apparatus according to claim 2 are it is characterised in that described cantilever and described straight line units are in water
Square to being vertically arranged.
6. film thickness measuring apparatus according to claim 5 are it is characterised in that described straight line units and described turntable are in water
Square to projection misaligned.
7. film thickness measuring apparatus according to claim 1 are it is characterised in that also include: positioning component, described positioning group
Part is located on described turntable and is used for positioning described workpiece.
8. film thickness measuring apparatus according to claim 1 it is characterised in that described probe be eddy current probe and/or
Optic probe.
9. film thickness measuring apparatus according to claim 1 are it is characterised in that described straight line units include: guide rail and
Support seat, described guide rail is located on described support base, and described cantilever does horizontal direction linear motion along described guide rail.
10. film thickness measuring apparatus according to claim 9 it is characterised in that described straight line units and described guide rail it
Between adjustable angle.
A kind of 11. systems for manufacturing chip are it is characterised in that the film thickness including described in any one of claim 1-10 is surveyed
Amount device, described film thickness measuring apparatus are used for carrying out film thickness measurement to chip.
12. systems for manufacturing chip according to claim 11 are it is characterised in that also include: chip conveying device,
Described chip conveying device includes mechanical hand, and chip conveying is carried out thickness on described film thickness measuring apparatus by described mechanical hand
Degree measurement.
13. systems for manufacturing chip according to claim 12 are it is characterised in that also include: loading stage, described dress
Microscope carrier and/or described film thickness measuring apparatus may be contained within described chip conveying device.
14. systems for manufacturing chip according to claim 13 are it is characterised in that described mechanical hand and described thickness
Degree measurement apparatus are located at same level direction in the longitudinal direction, and described loading stage and described mechanical hand are located at same in left and right directions
One horizontal direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610856282.4A CN106338236A (en) | 2016-09-28 | 2016-09-28 | Film thickness measuring apparatus and system provided with film thickness measuring apparatus and used for manufacturing wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610856282.4A CN106338236A (en) | 2016-09-28 | 2016-09-28 | Film thickness measuring apparatus and system provided with film thickness measuring apparatus and used for manufacturing wafers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106338236A true CN106338236A (en) | 2017-01-18 |
Family
ID=57839383
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610856282.4A Pending CN106338236A (en) | 2016-09-28 | 2016-09-28 | Film thickness measuring apparatus and system provided with film thickness measuring apparatus and used for manufacturing wafers |
Country Status (1)
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| CN (1) | CN106338236A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106989679A (en) * | 2017-02-23 | 2017-07-28 | 北京交通大学 | Contactless semiconductor wafer measuring thickness device |
| CN114812387A (en) * | 2022-04-01 | 2022-07-29 | 中信戴卡股份有限公司 | Device and method for detecting size of aluminum alloy hub casting blank |
| CN115638757A (en) * | 2022-11-11 | 2023-01-24 | 法博思(宁波)半导体设备有限公司 | Device and method for limiting silicon wafer measurement range |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1170655A (en) * | 1996-05-31 | 1998-01-21 | Memc电子材料有限公司 | Automated wafer lapping system |
| KR20030081607A (en) * | 2002-04-12 | 2003-10-22 | 한국디엔에스 주식회사 | Spin-etcher with thickness measuring system |
| CN101261306A (en) * | 2008-04-14 | 2008-09-10 | 无锡市易控系统工程有限公司 | Full-automatic wafer test method and equipment accomplishing the method |
| CN101769721A (en) * | 2010-02-03 | 2010-07-07 | 隆达电子股份有限公司 | Optical measurement device |
| CN102175133A (en) * | 2011-02-25 | 2011-09-07 | 清华大学 | Global metal film thickness measuring device |
| CN102538686A (en) * | 2010-12-09 | 2012-07-04 | 财团法人金属工业研究发展中心 | Thickness measurement method |
| CN102564287A (en) * | 2011-12-15 | 2012-07-11 | 清华大学 | Method for measuring film thickness of wafer by using wafer platform |
| CN102784760A (en) * | 2011-05-20 | 2012-11-21 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Testing sorting equipment for wafer |
-
2016
- 2016-09-28 CN CN201610856282.4A patent/CN106338236A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1170655A (en) * | 1996-05-31 | 1998-01-21 | Memc电子材料有限公司 | Automated wafer lapping system |
| KR20030081607A (en) * | 2002-04-12 | 2003-10-22 | 한국디엔에스 주식회사 | Spin-etcher with thickness measuring system |
| CN101261306A (en) * | 2008-04-14 | 2008-09-10 | 无锡市易控系统工程有限公司 | Full-automatic wafer test method and equipment accomplishing the method |
| CN101769721A (en) * | 2010-02-03 | 2010-07-07 | 隆达电子股份有限公司 | Optical measurement device |
| CN102538686A (en) * | 2010-12-09 | 2012-07-04 | 财团法人金属工业研究发展中心 | Thickness measurement method |
| CN102175133A (en) * | 2011-02-25 | 2011-09-07 | 清华大学 | Global metal film thickness measuring device |
| CN102784760A (en) * | 2011-05-20 | 2012-11-21 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Testing sorting equipment for wafer |
| CN102564287A (en) * | 2011-12-15 | 2012-07-11 | 清华大学 | Method for measuring film thickness of wafer by using wafer platform |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106989679A (en) * | 2017-02-23 | 2017-07-28 | 北京交通大学 | Contactless semiconductor wafer measuring thickness device |
| CN114812387A (en) * | 2022-04-01 | 2022-07-29 | 中信戴卡股份有限公司 | Device and method for detecting size of aluminum alloy hub casting blank |
| CN115638757A (en) * | 2022-11-11 | 2023-01-24 | 法博思(宁波)半导体设备有限公司 | Device and method for limiting silicon wafer measurement range |
| CN115638757B (en) * | 2022-11-11 | 2023-11-28 | 法博思(宁波)半导体设备有限公司 | Device and method for limiting silicon wafer measurement range |
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Effective date of registration: 20171023 Address after: 100084 Beijing City, Haidian District Tsinghua Yuan Applicant after: Tsinghua University Applicant after: TIANJIN HWATSING TECHNOLOGY COMPANY LIMITED (HWATSING CO., LTD.) Address before: 300350, Tianjin City, Jinnan District Science and Technology Park, Hai Hing Road, No. 9, building No. 8 Applicant before: TIANJIN HWATSING TECHNOLOGY COMPANY LIMITED (HWATSING CO., LTD.) Applicant before: Tsinghua University |
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