CN106336933A - Preparation method of cooling roughness-eliminating cutting fluid for silicon wafer cutting - Google Patents

Preparation method of cooling roughness-eliminating cutting fluid for silicon wafer cutting Download PDF

Info

Publication number
CN106336933A
CN106336933A CN201610714958.6A CN201610714958A CN106336933A CN 106336933 A CN106336933 A CN 106336933A CN 201610714958 A CN201610714958 A CN 201610714958A CN 106336933 A CN106336933 A CN 106336933A
Authority
CN
China
Prior art keywords
parts
oil
raw material
cutting
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201610714958.6A
Other languages
Chinese (zh)
Inventor
吕凤岗
程林
曹来福
戴珍旭
胡正田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anhui Energy Technology Co Ltd
Original Assignee
Anhui Energy Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anhui Energy Technology Co Ltd filed Critical Anhui Energy Technology Co Ltd
Priority to CN201610714958.6A priority Critical patent/CN106336933A/en
Publication of CN106336933A publication Critical patent/CN106336933A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M169/00—Lubricating compositions characterised by containing as components a mixture of at least two types of ingredient selected from base-materials, thickeners or additives, covered by the preceding groups, each of these compounds being essential
    • C10M169/04—Mixtures of base-materials and additives
    • C10M169/048—Mixtures of base-materials and additives the additives being a mixture of compounds of unknown or incompletely defined constitution, non-macromolecular and macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2201/00—Inorganic compounds or elements as ingredients in lubricant compositions
    • C10M2201/02—Water
    • C10M2201/022—Hydrogen peroxide; Oxygenated water
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2201/00—Inorganic compounds or elements as ingredients in lubricant compositions
    • C10M2201/06—Metal compounds
    • C10M2201/062—Oxides; Hydroxides; Carbonates or bicarbonates
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2201/00—Inorganic compounds or elements as ingredients in lubricant compositions
    • C10M2201/08—Inorganic acids or salts thereof
    • C10M2201/082—Inorganic acids or salts thereof containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2201/00—Inorganic compounds or elements as ingredients in lubricant compositions
    • C10M2201/10—Compounds containing silicon
    • C10M2201/1013—Compounds containing silicon used as thickening agents
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2205/00—Organic macromolecular hydrocarbon compounds or fractions, whether or not modified by oxidation as ingredients in lubricant compositions
    • C10M2205/16—Paraffin waxes; Petrolatum, e.g. slack wax
    • C10M2205/163—Paraffin waxes; Petrolatum, e.g. slack wax used as base material
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
    • C10M2207/02—Hydroxy compounds
    • C10M2207/021—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
    • C10M2207/02—Hydroxy compounds
    • C10M2207/021—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms
    • C10M2207/022—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms containing at least two hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
    • C10M2207/10—Carboxylix acids; Neutral salts thereof
    • C10M2207/12—Carboxylix acids; Neutral salts thereof having carboxyl groups bound to acyclic or cycloaliphatic carbon atoms
    • C10M2207/125—Carboxylix acids; Neutral salts thereof having carboxyl groups bound to acyclic or cycloaliphatic carbon atoms having hydrocarbon chains of eight up to twenty-nine carbon atoms, i.e. fatty acids
    • C10M2207/126—Carboxylix acids; Neutral salts thereof having carboxyl groups bound to acyclic or cycloaliphatic carbon atoms having hydrocarbon chains of eight up to twenty-nine carbon atoms, i.e. fatty acids monocarboxylic
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
    • C10M2207/10—Carboxylix acids; Neutral salts thereof
    • C10M2207/12—Carboxylix acids; Neutral salts thereof having carboxyl groups bound to acyclic or cycloaliphatic carbon atoms
    • C10M2207/125—Carboxylix acids; Neutral salts thereof having carboxyl groups bound to acyclic or cycloaliphatic carbon atoms having hydrocarbon chains of eight up to twenty-nine carbon atoms, i.e. fatty acids
    • C10M2207/127—Carboxylix acids; Neutral salts thereof having carboxyl groups bound to acyclic or cycloaliphatic carbon atoms having hydrocarbon chains of eight up to twenty-nine carbon atoms, i.e. fatty acids polycarboxylic
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
    • C10M2207/10—Carboxylix acids; Neutral salts thereof
    • C10M2207/14—Carboxylix acids; Neutral salts thereof having carboxyl groups bound to carbon atoms of six-membered aromatic rings
    • C10M2207/141—Carboxylix acids; Neutral salts thereof having carboxyl groups bound to carbon atoms of six-membered aromatic rings monocarboxylic
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
    • C10M2207/40—Fatty vegetable or animal oils
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
    • C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
    • C10M2209/104—Polyethers, i.e. containing di- or higher polyoxyalkylene groups of alkylene oxides containing two carbon atoms only
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2215/00—Organic non-macromolecular compounds containing nitrogen as ingredients in lubricant compositions
    • C10M2215/02—Amines, e.g. polyalkylene polyamines; Quaternary amines
    • C10M2215/04—Amines, e.g. polyalkylene polyamines; Quaternary amines having amino groups bound to acyclic or cycloaliphatic carbon atoms
    • C10M2215/042—Amines, e.g. polyalkylene polyamines; Quaternary amines having amino groups bound to acyclic or cycloaliphatic carbon atoms containing hydroxy groups; Alkoxylated derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2215/00—Organic non-macromolecular compounds containing nitrogen as ingredients in lubricant compositions
    • C10M2215/22—Heterocyclic nitrogen compounds
    • C10M2215/223—Five-membered rings containing nitrogen and carbon only
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2227/00—Organic non-macromolecular compounds containing atoms of elements not provided for in groups C10M2203/00, C10M2207/00, C10M2211/00, C10M2215/00, C10M2219/00 or C10M2223/00 as ingredients in lubricant compositions
    • C10M2227/06—Organic compounds derived from inorganic acids or metal salts
    • C10M2227/061—Esters derived from boron
    • C—CHEMISTRY; METALLURGY
    • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2229/00—Organic macromolecular compounds containing atoms of elements not provided for in groups C10M2205/00, C10M2209/00, C10M2213/00, C10M2217/00, C10M2221/00 or C10M2225/00 as ingredients in lubricant compositions
    • C10M2229/04—Siloxanes with specific structure
    • C10M2229/041—Siloxanes with specific structure containing aliphatic substituents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Organic Chemistry (AREA)
  • Lubricants (AREA)

Abstract

A cooling roughness-eliminating cutting fluid for silicon wafer cutting relates to the field of silicon material processing technology and is prepared from the following raw materials (by weight): 60-80 parts of paraffinic based oil, 6-8 parts of anise oil, 5-7 parts of potassium nitrate, 1-3 parts of triethanolamine, 2-4 parts of glycerin, 1-3 parts of polyethylene glycol, 1-3 parts of ricinoleic acid, 2-4 parts of a surfactant, 1-3 parts of sodium hydroxide, 2-4 parts of sodium silicate, 2-4 parts of borate, 2-4 parts of methylsilicone oil, 2-4 parts of hydrogen peroxide, 1-3 parts of benzotriazol, 2-4 parts of sodium benzoate, 1-3 parts of sebacic acid, 25-35 parts of alcohol and 2-4 parts of a grinding aid. The invention has the following beneficial effects: the formula is scientific and reasonable; the selected raw materials are all cheap and easily available; the prepared cutting fluid has cooling and degradation effects inside and can adsorb heat produced during silicon wafer cutting; with the addition of the grinding aid therein, flatness and smoothness of the silicon wafer during cutting are guaranteed; and the product will not cause physical damage to the silicon wafer itself, is safe and thorough, is environment friendly and healthy, and is convenient for promotion and application.

Description

The preparation method of rough type cutting fluid is gone in a kind of silicon chip cutting cooling
Technical field
The present invention relates to silicon materials processing technique field is and in particular to rough type cutting fluid is gone in a kind of silicon chip cutting cooling Preparation method.
Background technology
Silicon materials, are important semi-conducting materials, chemical elemental symbol si, and the silicon that electronics industry uses should have high-purity Degree and the excellent performance such as electrical and mechanical, silicon is maximum, the most widely used semi-conducting material of yield, its yield and consumption mark Will a national electronics industry level, monocrystal silicon application in solar cells, and high-purity monocrystal silicon is important half Conductor material.The today developing rapidly in photovoltaic technology and microminiature semiconductor inverter technology, produced using silicon single crystal Solaode directly solar energy can be converted into luminous energy it is achieved that the beginning of green energy resource revolution of marching toward.
Silicon chip is a kind of physical form that silicon materials exist, and in normal application, silicon chip, is the weight making integrated circuit Want material, by the means such as photoetching, ion implanting are carried out to silicon chip, various semiconductor device can be made.Made with silicon chip Chip has surprising operational capability, and the development of science and technology constantly promotes the development of quasiconductor, automatization and computer etc. Technology develops, and makes the cost of this high-tech product of silicon chip have dropped down to very cheap degree, but silicon chip is in processing, different Process node all can make silicon chip processing flaw occurs.
Silicon chip processing when, be the sheet article being cut into by corresponding silicon heavy stone used as an anchor, this silicon heavy stone used as an anchor generally cutting when, In order to ensure its corresponding cutting accuracy and flatness, generally it is required for additive using some lubrication classes it is ensured that its precision, But reality is in use, great majority are all to be substituted using common cutting fluid, this conventional cutting liquid use when, pin For silicon chip, this precise materials have a certain impact, and can leave part cut after cutting on silicon chip, and actual In use, cutting liquid temp is too high, leads to the actual quality of silicon chip to be subject to certain affecting.
Content of the invention:
The technical problem to be solved is to provide a kind of raw material to be easy to get, and formula is rationally accurate, and using effect is good Silicon chip cutting cooling go the preparation method of rough type cutting fluid.
The technical problem to be solved employs the following technical solutions to realize:
A kind of silicon chip cutting cooling goes rough type cutting fluid it is characterised in that being made up of following raw material:
Paraffine base crude oil 60-80 part, Fructus Anisi Stellati oil 6-8 part, potassium nitrate 5-7 part, triethanolamine 1-3 part, glycerol 2-4 part, poly- second Glycol 1-3 part, castor oil acid 1-3 part, surfactant 2-4 part, sodium hydroxide 1-3 part, sodium silicate 2-4 part, boric acid fat 2-4 Part, methyl-silicone oil 2-4 part, hydrogen peroxide 2-4 part, BTA 1-3 part, sodium benzoate 2-4 part, decanedioic acid 1-3 part, ethanol 25-35 part, grinding aid 2-4 part.
The preferable separate of each raw material is: 70 parts of paraffine base crude oil, 7 parts of Fructus Anisi Stellati oil, 6 parts of potassium nitrate, 2 parts of triethanolamine, glycerol 3 Part, 2 parts of Polyethylene Glycol, 2 parts of castor oil acid, 3 parts of surfactant, 2 parts of sodium hydroxide, 3 parts of sodium silicate, 3 parts of boric acid fat, methyl 3 parts of silicone oil, 2 parts of hydrogen peroxide, 2 parts of BTA, 3 parts of sodium benzoate, 2 parts of decanedioic acid, 30 parts of ethanol, 3 parts of grinding aid.
Described grinding aid is by grinding after being compounded according to the amount of 3:1:1 using Pulvis Talci, graphite powder, white carbon Become, its particle diameter is 20-25um；
It is another object of the present invention to the method that in the preparation present invention, rough type cutting fluid is gone in silicon chip cutting cooling, its feature It is, comprise the following steps:
1) take triethanolamine, glycerol and Polyethylene Glycol to put in reactor, be warming up to 65-70 DEG C, then by paraffine base crude oil, Fructus Anisi Stellati oil and potassium nitrate are added thereto, and after stirring 2-3h, after cooling, discharging is standby；
2) by after the castor oil acid in raw material, surfactant, sodium hydroxide, sodium silicate and boric acid fat alkane premixing, enter After row stirring at normal temperature, obtain assisting liquid, standby；
3) take an agitator tank, by the methyl-silicone oil in raw material, hydrogen peroxide, BTA, sodium benzoate, decanedioic acid and Ethanol is added thereto, and then heats to 35-45 DEG C, after stirring 1-2h, the raw material in step 2 is added thereto, is warming up to 60-80 DEG C, after continuing stirring 30-40min, it is cooled to 20-25 DEG C, the material in step 1 is added thereto, again continuously stirred 3-5h Afterwards, discharging；
4) grinding aid in raw material is mixed in the material in step 3, is sufficiently stirred for until after uniformly, you can obtain.
The invention has the beneficial effects as follows: inventive formulation selection is scientific and reasonable, and the raw material of selection is product cheap and easy to get Product, the cutting waste fluid prepared, internal effect that will solve containing cooling itself, the heat producing when silicon chip can be cut is carried out Absorption, simultaneously internal grinding aid add it is ensured that during cutting silicon chip smooth Lubricity, physics will not be caused in itself to silicon chip Injury, safety is thorough, environment protection health simultaneously, is easy to promote and uses.
Specific embodiment
In order that technological means, creation characteristic, reached purpose and effect that the present invention realizes are easy to understand, tie below Close specific embodiment, the present invention is expanded on further.
Embodiment 1
Weigh: paraffine base crude oil 60kg, Fructus Anisi Stellati oil 6kg, potassium nitrate 5kg, triethanolamine 1kg, glycerol 2kg, Polyethylene Glycol 1kg, castor oil acid 1kg, surfactant 2kg, sodium hydroxide 1kg, sodium silicate 2kg, boric acid fat 2kg, methyl-silicone oil 2kg, mistake Hydrogen oxide 2kg, BTA 1kg, sodium benzoate 2kg, decanedioic acid 1kg, ethanol 25kg, grinding aid 2kg；
Embodiment 2
Weigh: paraffine base crude oil 70kg, Fructus Anisi Stellati oil 7kg, potassium nitrate 6kg, triethanolamine 2kg, glycerol 3kg, Polyethylene Glycol 2kg, castor oil acid 2kg, surfactant 3kg, sodium hydroxide 2kg, sodium silicate 3kg, boric acid fat 3kg, methyl-silicone oil 3kg, mistake Hydrogen oxide 2kg, BTA 2kg, sodium benzoate 3kg, decanedioic acid 2kg, ethanol 30kg, grinding aid 3kg；
The method preparing above-described embodiment 1 or 2 is:
1) take triethanolamine, glycerol and Polyethylene Glycol to put in reactor, be warming up to 65-70 DEG C, then by paraffine base crude oil, Fructus Anisi Stellati oil and potassium nitrate are added thereto, and after stirring 2-3h, after cooling, discharging is standby；
2) by after the castor oil acid in raw material, surfactant, sodium hydroxide, sodium silicate and boric acid fat alkane premixing, enter After row stirring at normal temperature, obtain assisting liquid, standby；
3) take an agitator tank, by the methyl-silicone oil in raw material, hydrogen peroxide, BTA, sodium benzoate, decanedioic acid and Ethanol is added thereto, and then heats to 35-45 DEG C, after stirring 1-2h, the raw material in step 2 is added thereto, is warming up to 60-80 DEG C, after continuing stirring 30-40min, it is cooled to 20-25 DEG C, the material in step 1 is added thereto, again continuously stirred 3-5h Afterwards, discharging；
4) grinding aid in raw material is mixed in the material in step 3, is sufficiently stirred for until after uniformly, you can obtain.
Ultimate principle and principal character and the advantages of the present invention of the present invention have been shown and described above.The technology of the industry , it should be appreciated that the present invention is not restricted to the described embodiments, the simply explanation described in above-described embodiment and description is originally for personnel The principle of invention, without departing from the spirit and scope of the present invention, the present invention also has various changes and modifications, these changes Change and improvement both falls within scope of the claimed invention.Claimed scope by appending claims and its Equivalent thereof.

Claims (4)

1. a kind of silicon chip cutting cooling goes rough type cutting fluid it is characterised in that being made up of following raw material:
Paraffine base crude oil 60-80 part, Fructus Anisi Stellati oil 6-8 part, potassium nitrate 5-7 part, triethanolamine 1-3 part, glycerol 2-4 part, Polyethylene Glycol 1-3 part, castor oil acid 1-3 part, surfactant 2-4 part, sodium hydroxide 1-3 part, sodium silicate 2-4 part, boric acid fat 2-4 part, first Base silicone oil 2-4 part, hydrogen peroxide 2-4 part, BTA 1-3 part, sodium benzoate 2-4 part, decanedioic acid 1-3 part, ethanol 25-35 Part, grinding aid 2-4 part.
2. a kind of silicon chip cutting cooling according to claim 1 go rough type cutting fluid it is characterised in that each raw material excellent Choosing is separated into: 70 parts of paraffine base crude oil, 7 parts of Fructus Anisi Stellati oil, 6 parts of potassium nitrate, 2 parts of triethanolamine, 3 parts of glycerol, 2 parts of Polyethylene Glycol, castor 2 parts of Oleum Sesami acid, 3 parts of surfactant, 2 parts of sodium hydroxide, 3 parts of sodium silicate, 3 parts of boric acid fat, 3 parts of methyl-silicone oil, hydrogen peroxide 2 Part, 2 parts of BTA, 3 parts of sodium benzoate, 2 parts of decanedioic acid, 30 parts of ethanol, 3 parts of grinding aid.
3. a kind of silicon chip cutting cooling according to claim 1 go rough type cutting fluid it is characterised in that: described helps Grinding agent is ground after passing through to be compounded according to the amount of 3:1:1 using Pulvis Talci, graphite powder, white carbon and forms, and its particle diameter is 20- 25um.
4. the method for preparation the claims 1 or 2 is it is characterised in that include following preparation process:
1) take triethanolamine, glycerol and Polyethylene Glycol to put in reactor, be warming up to 65-70 DEG C, then by paraffine base crude oil, anise Oil and potassium nitrate are added thereto, and after stirring 2-3h, after cooling, discharging is standby；
2) will often after the castor oil acid in raw material, surfactant, sodium hydroxide, sodium silicate and boric acid fat alkane premixing, carry out After temperature stirring, obtain assisting liquid, standby；
3) take an agitator tank, by the methyl-silicone oil in raw material, hydrogen peroxide, BTA, sodium benzoate, decanedioic acid and ethanol It is added thereto, then heats to 35-45 DEG C, after stirring 1-2h, the raw material in step 2 is added thereto, is warming up to 60-80 DEG C, After continuing stirring 30-40min, it is cooled to 20-25 DEG C, the material in step 1 is added thereto, again after continuously stirred 3-5h, Discharging；
4) grinding aid in raw material is mixed in the material in step 3, is sufficiently stirred for until after uniformly, you can obtain.
CN201610714958.6A 2016-08-24 2016-08-24 Preparation method of cooling roughness-eliminating cutting fluid for silicon wafer cutting Withdrawn CN106336933A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610714958.6A CN106336933A (en) 2016-08-24 2016-08-24 Preparation method of cooling roughness-eliminating cutting fluid for silicon wafer cutting

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610714958.6A CN106336933A (en) 2016-08-24 2016-08-24 Preparation method of cooling roughness-eliminating cutting fluid for silicon wafer cutting

Publications (1)

Publication Number Publication Date
CN106336933A true CN106336933A (en) 2017-01-18

Family

ID=57824428

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610714958.6A Withdrawn CN106336933A (en) 2016-08-24 2016-08-24 Preparation method of cooling roughness-eliminating cutting fluid for silicon wafer cutting

Country Status (1)

Country Link
CN (1) CN106336933A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109097176A (en) * 2018-08-30 2018-12-28 江苏欧仕达润滑油有限公司 A kind of micro-lubricating cutting liquid and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101550376A (en) * 2009-05-07 2009-10-07 龚如纯 Environment-friendly energy-saving lubricating rust-proof water-based cutting liquid
CN104293467A (en) * 2014-09-30 2015-01-21 苏州长盛机电有限公司 Micro-emulsion cutting fluid for aluminum alloy, and preparation method of micro-emulsion cutting fluid
CN104371819A (en) * 2014-11-10 2015-02-25 马锋 Environment-friendly efficient long-acting water-based rust preventive cutting fluid universal for multiple metals
CN105886003A (en) * 2014-10-17 2016-08-24 佛山市侨硕新能源有限公司 Torch hydrocarbon cutting liquid

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101550376A (en) * 2009-05-07 2009-10-07 龚如纯 Environment-friendly energy-saving lubricating rust-proof water-based cutting liquid
CN104293467A (en) * 2014-09-30 2015-01-21 苏州长盛机电有限公司 Micro-emulsion cutting fluid for aluminum alloy, and preparation method of micro-emulsion cutting fluid
CN105886003A (en) * 2014-10-17 2016-08-24 佛山市侨硕新能源有限公司 Torch hydrocarbon cutting liquid
CN104371819A (en) * 2014-11-10 2015-02-25 马锋 Environment-friendly efficient long-acting water-based rust preventive cutting fluid universal for multiple metals

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109097176A (en) * 2018-08-30 2018-12-28 江苏欧仕达润滑油有限公司 A kind of micro-lubricating cutting liquid and preparation method thereof

Similar Documents

Publication Publication Date Title
CN109280332A (en) A kind of preparation method of boron nitride/epoxy resin heat conductive insulating composite material
CN104225965B (en) A kind of silicone defoaming agent and preparation method thereof
CN108529923A (en) A kind of modified cement grinding aid and preparation method thereof
CN104803679B (en) A kind of ceramic material and preparation method thereof
CN103553468B (en) Gold mine tailings and fluorite mine tailing is utilized to make the method for aerated bricks
CN109207127B (en) Preparation method of nanofluid based on glycerol low-eutectic-solvent system and nanofluid prepared by preparation method
CN106082234A (en) Intermediate frequency (IF) smelting reclaims the method for diamond wire cutting silica flour
CN102304351B (en) Preparation method and application of water-soluble environment-friendly heat conduction oil
CN106336933A (en) Preparation method of cooling roughness-eliminating cutting fluid for silicon wafer cutting
CN104498142A (en) Silicon slice cutting fluid and preparation method thereof
CN102433191A (en) Silicon carbide cutting fluid and using method thereof
CN106243588A (en) A kind of alkylation acid hydrocarbon separation coalescent pack
CN103059816B (en) A kind of efficient phase-change energy storage material and preparation method thereof
CN110961054B (en) Composite phase-change microcapsule type fluid for high-voltage environment, preparation and application
CN103695149A (en) Silicon wafer cutting solution
CN103639063B (en) A kind of silicon carbide micro-powder reclaims medicament
CN103409117A (en) Preparation method for low-temperature phase-change paraffin
CN106350166A (en) Preparation method of easily-decomposed cutting fluid for cutting silicon wafer
CN101613596B (en) Sidewall stabilizer
CN110156023A (en) A kind of environmentally protective smelting high-purity silicon method
CN106045484B (en) A kind of steel ladle working layer castable and its preparation method and application
CN107523262B (en) A method of producing hot melt adhesive
CN114230217A (en) Cement grinding aid
CN103725391B (en) A kind of devitrified glass processing micro-emulsion cutting fluid and preparation method thereof
CN103880571A (en) Rock emulsion explosive and preparation method thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WW01 Invention patent application withdrawn after publication
WW01 Invention patent application withdrawn after publication

Application publication date: 20170118