CN104498142A - Silicon slice cutting fluid and preparation method thereof - Google Patents
Silicon slice cutting fluid and preparation method thereof Download PDFInfo
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- CN104498142A CN104498142A CN201410707054.1A CN201410707054A CN104498142A CN 104498142 A CN104498142 A CN 104498142A CN 201410707054 A CN201410707054 A CN 201410707054A CN 104498142 A CN104498142 A CN 104498142A
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Abstract
The invention belongs to the technical field of new energy resources of photoelectric materials, relates to a silicon slice cutting fluid and a preparation method thereof, and provides a silicon slice cutting fluid to overcome the defects that an existing silicon slice cutting fluid is high in cost, and relatively poor in dispersion and redispersion abilities on silicon carbide micro-powder. The silicon slice cutting fluid comprises the following raw materials in percentage by weight: 76wt%-80wt% of diethylene glycol, 15wt%-17wt% of polyethylene glycol, 2wt%-3.5wt% of glycerol, 0.5wt%-1.5wt% of fatty alcohol-polyoxyethylene ether, 0.7wt%-1.2wt% of deionized water, 0.2wt%-0.5wt% of a defoaming agent, 0.2wt%-0.5wt% of a dispersing agent and 0.1wt%-0.3wt% of an antioxidant. The main raw material is diethylene glycol, so that the preparation process is simple, easy to operate and low in cost; the dispersibility and the redispersibility of the silicon carbide micro-powder are effectively improved; the stability and the durability of slurry are ensured; the silicon slice cutting fluid has a good lubricating effect; the surface loss during cutting is effectively reduced; the cutting yield is improved; and the silicon slice cutting fluid is suitable for a silicon slice cutting process.
Description
Technical field
The invention belongs to photoelectric material technical field of new energies, be specifically related to a kind of silicon chip cutting fluid and preparation method thereof.
Background technology
In photovoltaic solar silicon chip cutting process, silicon chip cutting fluid as a kind of auxiliary material consumptive material product that must use in silicon chip cutting process, its consumption along with the silicon chip processing industry of photovoltaic solar industry and China growth and expand.During silicon chip cutting be generally use high rigidity, granularity little and the silicon carbide micro-powder of centralized particle diameter as main Cutting Medium, be uniformly dispersed in working angles for making silicon carbide micro-powder, take away the heat of friction produced in working angles in time simultaneously, usually silicon carbide micro-powder is needed to join according to a certain percentage in silicon chip cutting fluid, and fully disperse, be used further to silicon chip cutting after being configured to uniform and stable cutting mortar.But, existing silicon chip cutting fluid mainly adopts polyoxyethylene glycol, its with high costs and to the dispersion of silicon carbide micro-powder and redispersion ability poor, after long-time placement, there will be the phenomenon that silicon carbide micro-powder deposition is reunited, even if again stir, silicon carbide micro-powder also cannot be made again to be dispersed in cutting liquid.
Summary of the invention
Technical problem to be solved by this invention is to overcome the problems referred to above, there is provided a kind of silicon chip cutting fluid and preparation method thereof, this silicon chip cutting fluid is cheap for manufacturing cost, to the dispersion of silicon carbide micro-powder and redispersion ability better, effective reduction cutting cost, improves cutting effect.
The technical solution adopted for the present invention to solve the technical problems is: a kind of silicon chip cutting fluid, comprise the Diethylene Glycol of 76 ~ 80Wt%, the oxidation inhibitor of the fatty alcohol-polyoxyethylene ether of the polyoxyethylene glycol of 15 ~ 17Wt%, the glycerol of 2 ~ 3.5Wt%, 0.5 ~ 1.5Wt%, the deionized water of 0.7 ~ 1.2Wt%, the defoamer of 0.2 ~ 0.5Wt%, the dispersion agent of 0.2 ~ 0.5Wt% and 0.1 ~ 0.3Wt%.
Preferably, this cutting liquid comprises the oxidation inhibitor of the Diethylene Glycol of 77Wt%, the polyoxyethylene glycol of 17Wt%, the glycerol of 3Wt%, the fatty alcohol-polyoxyethylene ether of 1Wt%, the deionized water of 1Wt%, the defoamer of 0.4Wt%, the dispersion agent of 0.35Wt% and 0.25Wt%.
Concrete, described dispersion agent is sodium polyacrylate.
Concrete, described defoamer is polyethers.
Further, described deionization electrical conductivity of water is less than 1.5US/MM.
Preferably, described oxidation inhibitor is antioxidant 264.
In order to prepare above-mentioned silicon chip cutting fluid, the preparation method of a kind of silicon chip cutting fluid adopted, comprises the following steps:
A. be (76 ~ 80) by Diethylene Glycol, polyoxyethylene glycol, glycerol according to mass percent: (15 ~ 17): the ratio mixing of (2 ~ 3.5), and at room temperature stirred;
B. be (0.1 ~ 0.3) by oxidation inhibitor, fatty alcohol-polyoxyethylene ether, deionized water according to mass percent: (0.5 ~ 1.5): the ratio mixing of (0.7 ~ 1.2);
C. the mixed solution that step B is formed is joined in the mixed solution of steps A formation, basis of formation cutting liquid;
D. add a certain proportion of defoamer and dispersion agent in the basic cutting liquid in step C, and stir, form silicon chip cutting fluid.
Preferably, in steps A, the mass percent of Diethylene Glycol, polyoxyethylene glycol, glycerol is specially 77:17:3.
Preferably, in step B, the mass percent of oxidation inhibitor, fatty alcohol-polyoxyethylene ether, deionized water is specially 0.25:1:1.
Concrete, the defoamer in step D is polyethers, and its mass percent is 0.2 ~ 0.5%; Dispersion agent is sodium polyacrylate, and its mass percent is 0.2 ~ 0.5%.
The invention has the beneficial effects as follows: the silicon chip cutting fluid in the present invention, its main raw material is Diethylene Glycol, preparation technology is simple, easy handling, with low cost, effectively improve dispersiveness and the redispersibility of silicon carbide micro-powder, ensure that stability and the persistence of slurry, and there is good lubricant effect, effectively reduce surface losses during cutting, improve cutting yield.The present invention is applicable to silicon chip cutting technique.
Accompanying drawing explanation
Fig. 1 is preparation method's schema of silicon chip cutting fluid in the present invention.
Embodiment
Below in conjunction with drawings and Examples, describe technical scheme of the present invention in detail.
A kind of silicon chip cutting fluid in the present invention, comprise the Diethylene Glycol of 76 ~ 80Wt%, the oxidation inhibitor of the fatty alcohol-polyoxyethylene ether of the polyoxyethylene glycol of 15 ~ 17Wt%, the glycerol of 2 ~ 3.5Wt%, 0.5 ~ 1.5Wt%, the deionized water of 0.7 ~ 1.2Wt%, the defoamer of 0.2 ~ 0.5Wt%, the dispersion agent of 0.2 ~ 0.5Wt% and 0.1 ~ 0.3Wt%.Wt% and mass percent.
Embodiment 1
Silicon chip cutting fluid in this example, its defoamer adopts polyethers, and dispersion agent adopts sodium polyacrylate, and oxidation inhibitor adopts antioxidant 264, and component is as shown in table 1:
The component table of table 1 embodiment 1
Wherein, Diethylene Glycol, polyoxyethylene glycol and glycerol are as lubricant, and fatty alcohol-polyoxyethylene ether is as emulsifying agent.
Its preparation method as shown in Figure 1, mixes according to described mass percent by above-mentioned three kinds of lubricants, and at room temperature stirs, make it form Homogeneous phase mixing liquid 1; Oxidation inhibitor, emulsifying agent and deionized water are mixed according to above-mentioned mass percent and after stirring, joins in mixed solution 1, basis of formation cutting liquid; Dispersion agent and defoamer are joined in basic cutting liquid according to described mass percent, and fully stirs, form uniform silicon chip cutting fluid.
Embodiment 2
Silicon chip cutting fluid in this example, its defoamer adopts polyethers, and dispersion agent adopts sodium polyacrylate, and oxidation inhibitor adopts antioxidant 264, and component is as follows:
The component table of table 2 embodiment 2
Its preparation method for Diethylene Glycol, polyoxyethylene glycol and glycerol to be mixed according to described mass percent, and at room temperature stirs, and makes it form Homogeneous phase mixing liquid 1; Antioxidant 264, fatty alcohol-polyoxyethylene ether and deionized water are mixed according to above-mentioned mass percent and after stirring, joins in mixed solution 1, basis of formation cutting liquid; Sodium polyacrylate and polyethers are joined in basic cutting liquid according to described mass percent, and fully stirs, form uniform silicon chip cutting fluid.
Embodiment 3
Silicon chip cutting fluid in this example, its defoamer adopts polyethers, and dispersion agent adopts sodium polyacrylate, and oxidation inhibitor adopts antioxidant 264, and lubricant comprises Diethylene Glycol, polyoxyethylene glycol and glycerol, and component is as shown in table 3:
The component table of table 3 embodiment 3
Its preparation method for be mixed according to described mass percent by lubricant, and at room temperature stirs, and makes it form Homogeneous phase mixing liquid 1; Antioxidant 264, fatty alcohol-polyoxyethylene ether and deionized water are mixed according to above-mentioned mass percent and after stirring, joins in mixed solution 1, basis of formation cutting liquid; Sodium polyacrylate and polyethers are joined in basic cutting liquid according to described mass percent, and fully stirs, form uniform silicon chip cutting fluid.
Embodiment 4
Silicon chip cutting fluid in this example, component is as follows:
The component table of table 4 embodiment 4
Its preparation method for Diethylene Glycol, polyoxyethylene glycol and glycerol to be mixed according to described mass percent, and at room temperature stirs, and makes it form Homogeneous phase mixing liquid 1; Antioxidant 264, fatty alcohol-polyoxyethylene ether and deionized water are mixed according to above-mentioned mass percent and after stirring, joins in mixed solution 1, basis of formation cutting liquid; Sodium polyacrylate and polyethers are joined in basic cutting liquid according to described mass percent, and fully stirs, form uniform silicon chip cutting fluid.
Embodiment 5
Silicon chip cutting fluid component in this example is as shown in table 5:
The component table of table 5 embodiment 5
Its preparation method for Diethylene Glycol, polyoxyethylene glycol and glycerol to be mixed according to described mass percent, and at room temperature stirs, and makes it form Homogeneous phase mixing liquid 1; Antioxidant 264, fatty alcohol-polyoxyethylene ether and deionized water are mixed according to above-mentioned mass percent and after stirring, joins in mixed solution 1, basis of formation cutting liquid; Sodium polyacrylate and polyethers are joined in basic cutting liquid according to described mass percent, and fully stirs, form uniform silicon chip cutting fluid.
Embodiment 6
Silicon chip cutting fluid component in this example is as shown in the table:
The component table of table 6 embodiment 6
Its preparation method for Diethylene Glycol, polyoxyethylene glycol and glycerol to be mixed according to described mass percent, and at room temperature stirs, and makes it form Homogeneous phase mixing liquid 1; Antioxidant 264, fatty alcohol-polyoxyethylene ether and deionized water are mixed according to above-mentioned mass percent and after stirring, joins in mixed solution 1, basis of formation cutting liquid; Sodium polyacrylate and polyethers are joined in basic cutting liquid according to described mass percent, and fully stirs, form uniform silicon chip cutting fluid.
Embodiment 7
Silicon chip cutting fluid in this example, its defoamer adopts polyethers, and dispersion agent adopts sodium polyacrylate, and oxidation inhibitor adopts antioxidant 264, and component is as follows:
The component table of table 7 embodiment 7
Its preparation method for Diethylene Glycol, polyoxyethylene glycol and glycerol to be mixed according to described mass percent, and at room temperature stirs, and makes it form Homogeneous phase mixing liquid 1; Antioxidant 264, fatty alcohol-polyoxyethylene ether and deionized water are mixed according to above-mentioned mass percent and after stirring, joins in mixed solution 1, basis of formation cutting liquid; Sodium polyacrylate and polyethers are joined in basic cutting liquid according to described mass percent, and fully stirs, form uniform silicon chip cutting fluid.
Claims (10)
1. a silicon chip cutting fluid, it is characterized in that, comprise the Diethylene Glycol of 76 ~ 80Wt%, the oxidation inhibitor of the fatty alcohol-polyoxyethylene ether of the polyoxyethylene glycol of 15 ~ 17Wt%, the glycerol of 2 ~ 3.5Wt%, 0.5 ~ 1.5Wt%, the deionized water of 0.7 ~ 1.2Wt%, the defoamer of 0.2 ~ 0.5Wt%, the dispersion agent of 0.2 ~ 0.5Wt% and 0.1 ~ 0.3Wt%.
2. a kind of silicon chip cutting fluid as claimed in claim 1, it is characterized in that, comprise the oxidation inhibitor of the Diethylene Glycol of 77Wt%, the polyoxyethylene glycol of 17Wt%, the glycerol of 3Wt%, the fatty alcohol-polyoxyethylene ether of 1Wt%, the deionized water of 1Wt%, the defoamer of 0.4Wt%, the dispersion agent of 0.35Wt% and 0.25Wt%.
3. a kind of silicon chip cutting fluid as claimed in claim 1 or 2, is characterized in that, described dispersion agent is sodium polyacrylate.
4. a kind of silicon chip cutting fluid as claimed in claim 1 or 2, is characterized in that, described defoamer is polyethers.
5. a kind of silicon chip cutting fluid as claimed in claim 1 or 2, is characterized in that, described deionization electrical conductivity of water is less than 1.5US/MM.
6. a kind of silicon chip cutting fluid as claimed in claim 1 or 2, is characterized in that, described oxidation inhibitor is antioxidant 264.
7. a preparation method for silicon chip cutting fluid, is characterized in that, comprises the following steps:
A. be (76 ~ 80) by Diethylene Glycol, polyoxyethylene glycol, glycerol according to mass percent: (15 ~ 17): the ratio mixing of (2 ~ 3.5), and at room temperature stirred;
B. be (0.1 ~ 0.3) by oxidation inhibitor, fatty alcohol-polyoxyethylene ether, deionized water according to mass percent: (0.5 ~ 1.5): the ratio mixing of (0.7 ~ 1.2);
C. the mixed solution that step B is formed is joined in the mixed solution of steps A formation, basis of formation cutting liquid;
D. add a certain proportion of defoamer and dispersion agent in the basic cutting liquid in step C, and stir, form silicon chip cutting fluid.
8. the preparation method of a kind of silicon chip cutting fluid as claimed in claim 7, is characterized in that, in steps A, the mass percent of Diethylene Glycol, polyoxyethylene glycol, glycerol is specially 77:17:3.
9. the preparation method of a kind of silicon chip cutting fluid as claimed in claim 8, is characterized in that, in step B, the mass percent of oxidation inhibitor, fatty alcohol-polyoxyethylene ether, deionized water is specially 0.25:1:1.
10. the preparation method of a kind of silicon chip cutting fluid as claimed in claim 9, is characterized in that, the defoamer in step D is polyethers, and its mass percent is 0.2 ~ 0.5%; Dispersion agent is sodium polyacrylate, and its mass percent is 0.2 ~ 0.5%.
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106753734A (en) * | 2017-01-23 | 2017-05-31 | 杭州传化精细化工有限公司 | A kind of silicon chip cutting fluid |
| CN107053503A (en) * | 2016-11-21 | 2017-08-18 | 宁晋松宫电子材料有限公司 | A kind of silicon section residual plate method |
| CN109810759A (en) * | 2019-01-21 | 2019-05-28 | 安徽华顺半导体发展有限公司 | A kind of high thermal conductivity silicon wafer cutting liquid and preparation method thereof |
| CN110872538A (en) * | 2018-08-30 | 2020-03-10 | 比亚迪股份有限公司 | Silicon wafer cutting fluid, preparation method and application thereof, and sand slurry for cutting silicon wafer |
| CN111254002A (en) * | 2018-11-30 | 2020-06-09 | 洛阳阿特斯光伏科技有限公司 | Cooling liquid used in cutting process and preparation method and application thereof |
| CN114989880A (en) * | 2022-07-06 | 2022-09-02 | 湖南三安半导体有限责任公司 | Cutting fluid and preparation method thereof |
| CN116426330A (en) * | 2022-12-20 | 2023-07-14 | 常州高特新材料股份有限公司 | Water-based silicon wafer diamond wire cutting fluid |
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| CN102618376A (en) * | 2012-02-27 | 2012-08-01 | 常州君合科技有限公司 | Diamond abrasive wire cutting fluid for semiconductor precision sheet and preparation method of diamond abrasive wire cutting fluid |
| CN103396875A (en) * | 2013-08-02 | 2013-11-20 | 镇江荣德新能源科技有限公司 | Cooling liquid for diamond-wire cutting equipment, and preparation method thereof |
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| JP2006111728A (en) * | 2004-10-14 | 2006-04-27 | Palace Chemical Co Ltd | Wire saw cutting oil |
| CN102618376A (en) * | 2012-02-27 | 2012-08-01 | 常州君合科技有限公司 | Diamond abrasive wire cutting fluid for semiconductor precision sheet and preparation method of diamond abrasive wire cutting fluid |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107053503A (en) * | 2016-11-21 | 2017-08-18 | 宁晋松宫电子材料有限公司 | A kind of silicon section residual plate method |
| CN107053503B (en) * | 2016-11-21 | 2019-03-15 | 宁晋松宫电子材料有限公司 | A kind of silicon slice residual plate method |
| CN106753734A (en) * | 2017-01-23 | 2017-05-31 | 杭州传化精细化工有限公司 | A kind of silicon chip cutting fluid |
| CN106753734B (en) * | 2017-01-23 | 2020-01-14 | 杭州传化精细化工有限公司 | Silicon wafer cutting fluid |
| CN110872538A (en) * | 2018-08-30 | 2020-03-10 | 比亚迪股份有限公司 | Silicon wafer cutting fluid, preparation method and application thereof, and sand slurry for cutting silicon wafer |
| CN110872538B (en) * | 2018-08-30 | 2021-11-12 | 比亚迪股份有限公司 | Silicon wafer cutting fluid, preparation method and application thereof, and sand slurry for cutting silicon wafer |
| CN111254002A (en) * | 2018-11-30 | 2020-06-09 | 洛阳阿特斯光伏科技有限公司 | Cooling liquid used in cutting process and preparation method and application thereof |
| CN109810759A (en) * | 2019-01-21 | 2019-05-28 | 安徽华顺半导体发展有限公司 | A kind of high thermal conductivity silicon wafer cutting liquid and preparation method thereof |
| CN114989880A (en) * | 2022-07-06 | 2022-09-02 | 湖南三安半导体有限责任公司 | Cutting fluid and preparation method thereof |
| CN116426330A (en) * | 2022-12-20 | 2023-07-14 | 常州高特新材料股份有限公司 | Water-based silicon wafer diamond wire cutting fluid |
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