CN106319458A - Target material unbundling device - Google Patents
Target material unbundling device Download PDFInfo
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- CN106319458A CN106319458A CN201510360031.2A CN201510360031A CN106319458A CN 106319458 A CN106319458 A CN 106319458A CN 201510360031 A CN201510360031 A CN 201510360031A CN 106319458 A CN106319458 A CN 106319458A
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- sweller
- target
- container
- target material
- unbundling
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Abstract
The invention relates to a target material unbundling device. As for a target material using conductive adhesive for bundling, a swelling agent can be used for unbundling. The target material unbundling device comprises an unbundling container 3, a slag collection hopper 4, a filter screen 5, a pipeline 6 and a swelling agent storage tank 7. The target material bundled through the conductive adhesive is used for unbundling through the device, on one hand, waste target materials can be separated from backboards in a damage-free mode, and thus the recovery utilization rate of the backboards is increased; and on the other hand, the slag collection hopper is used for enrichment of conductive adhesive slag, and hence precious metal conductive particles can be effectively recovered conveniently. The target material unbundling device can automatically recycle the swelling agent, and meanwhile repeated recycling cost of the target material is further reduced.
Description
Technical field
The invention belongs to sputtering target material field, the solution binding and the backboard that are specifically related to sputtering target material reclaim.
Background technology
Sputtering target shows in integrated circuit, plane and in the high-tech industry such as solar film battery, has and be extremely widely applied.Along with the size of sputtering substrate constantly increases the application with New Technologies, the requirement that sputtering target is connected with backboard at purity, microstructure and target is more and more higher.
In sputter procedure, target material assembly, as negative electrode, first should have excellent electric conductivity, and simultaneously in order to discharge the heat that upper state ion high velocity bombardment target material surface produces, target material assembly also to have excellent heat conductivity.Therefore, the connection of target and backboard should have certain bond strength, to avoid sputtering target coming off at work, problems of crack, there are high pyroconductivity and conductivity again, in addition the crystal grain of target is after thermo-mechanical processi, fine uniform, it is impossible to change in welding process.For the connectivity problem of target Yu back board module, predominantly organic tool pressing, hot pressing or the method for Hot Isostatic Pressing Diffusion.The binding method of a kind of cylindric target of the U.S. Patent Application Publication of Publication No. US2009/0250337A1, which disclose use In, Sn, InSn, tubular target is carried sealing of tube with tubular as solder by the low-temperature metal of SnBi or low temperature (less than 300 DEG C) fusing point, but, the target utilizing the method to bind can not bear high temperature during using, and causes owing to solder is the most expensive binding high cost.Simultaneously because the thermal coefficient of expansion between target from back board module is different, therefore easily make target or back board module bend in welding process, thus cause the target material assembly after binding to bend.
The Chinese patent of Publication No. CN103264231A discloses a kind of welding method being suitable to high temperature sputtering target material, by containing the argentum powder that percentage by weight is 60-70% or the epoxide-resin glue of the activated carbon granule that percentage by weight is 70-80% at the solder side of target and backboard and the two sided coatings of copper mesh, solidify under normal temperature and pressure after stacking each layer successively and complete the binding of target.This patent can not bear this technical problem of high temperature during solving target sputter, the target utilizing method described in this patent to make can bear the high temperature of 200-250 DEG C, so that target as sputter power can improve about 1/3rd, and sputter rate can be significantly improved, it is less susceptible to miss the target, achieve high-efficiency and continuous sputter, significantly improve production efficiency.But, when using epoxide-resin glue to fix target with back board module, it is difficult to be eliminated owing to epoxide-resin glue is bonded on back board module, therefore this binding method causes back board module to be difficult to be recovered.
At present, disassembling or remaining target is peeled off by the mode of high temperature cabonization for using the conducting resinl sputtering target that carries out binding to generally use machinery, backboard is easily caused damage by this solution binding mode, and has bigger waste in terms of operation and energy expenditure.
Summary of the invention
The present invention is directed to the above-mentioned target to using conducting resinl to bind and unbinding timing problem encountered, it is proposed that a kind of solution binding mode and solution binding device.
Concrete, the present invention uses sweller to soak target material assembly, makes conducting resinl gradually dissolve, so that remaining target is separated from each other with backboard.This solution binding method will not form damage, the beneficially recovery of backboard to backboard.Conductive noble metal granule in conducting resinl residue can be unified to carry out enriching and recovering simultaneously.
The solution binding device of the present invention includes unbinding container, slag gathering hopper, filter screen, pipeline, sweller storage tank.Wherein unbind lower vessel portion and there is sweller outlet, and connection has slag gathering hopper, slag gathering hopper bottom to be shelved with filter screen for being enriched with target residue.Filter screen lower part outlet connects sweller pipeline, is connected to the entrance of sweller storage tank by sweller pipeline.Sweller storage tank top is provided with outlet, makes sweller enter into through piping and unbinds container, thus defines sweller and can recycle in whole solution binding device.
Further, in order to sweller can flow in the duct, pipeline adds pump.
Further, pipeline is provided with valve to control the flowing of sweller.
Further, unbind be provided with on container unbind container cover to unbind container seal, to prevent sweller from volatilizing.
Being put into by used target unbinds in container, and covered container lid seals, and prevents sweller from volatilizing.According to the type of binding glue, select in sweller storage tank, put into different swellers, such as the mixing sweller of n-butyl alcohol and dimethylbenzene, by pump sweller pumped into by sweller storage tank and unbind in container, after reaching designated capabilities, cut off container and storage tank by valve.Remaining target soaks 2-3 hour in sweller, and target realizes separating with backboard.Opening container bottom valve, remnants target and backboard are taken out, and the sweller having carried conducting resinl residue secretly enters slag gathering hopper, the residue of solid is stayed in slag gathering hopper by strainer filtering, and sweller is pumped in sweller storage tank recycle by pipeline.Whole system is in addition to charging and output section, and whole flow process takes Automated condtrol.
Accompanying drawing explanation
Fig. 1 is the solution binding apparatus structure schematic diagram of the present invention.
Wherein: 1, sweller 2, remaining target 3, unbind container 4, slag gathering hopper 5, filter screen 6, pipeline 7, sweller storage tank 8, unbind container cover.
Detailed description of the invention
Below in conjunction with accompanying drawing, embodiment of the present invention is further elaborated.
Embodiment 1
The solution binding device of the present invention includes unbinding container 3, slag gathering hopper 4, filter screen 5, pipeline 6, sweller storage tank 7 and unbinding container cover 8.Wherein unbind container 3 bottom and there is sweller outlet, and connection has slag gathering hopper 4, slag gathering hopper 4 bottom to be shelved with filter screen 5 for being enriched with target residue.Filter screen 5 lower part outlet connects sweller pipeline, is connected to the entrance of sweller storage tank 7 by sweller pipeline 6.Sweller storage tank 7 top is provided with outlet, makes sweller enter into through piping 6 and unbinds container 3, thus defines sweller and can recycle in whole solution binding device.Pipeline 6 adds pump to help sweller 1 to flow.It is additionally provided with valve to control the flowing of sweller 1.
Used target 2 is put into and unbinds in container 3, cover and unbind container cover 8 and seal, prevent sweller from volatilizing.Type according to binding glue, select in sweller storage tank, put into different swellers 1, such as the mixing sweller of n-butyl alcohol and dimethylbenzene, by pump sweller pumped into by sweller storage tank 7 and unbind in container 3, after reaching designated capabilities, cut off container and storage tank by valve.Remaining target soaks 2-3 hour in sweller, and target realizes separating with backboard.Opening container bottom valve, remnants target and backboard are taken out, and the sweller having carried conducting resinl residue secretly enters slag gathering hopper, the conducting resinl residue of solid is filtered by filter screen 5 to be stayed in slag gathering hopper 4, and sweller is pumped in sweller storage tank 7 recycle by pipeline 6.Whole system is in addition to charging and output section, and whole flow process takes Automated condtrol.
In the present embodiment, glue residue is enriched in the slag gathering hopper 4 above filter screen 5.Thus the conductive noble metal granule in conducting resinl residue can be enriched with, in order to reclaim.
Above example is only used for being specifically described the present invention, and protection scope of the present invention is not played any restriction effect by it, and protection scope of the present invention is determined by claim.According to techniques known and technical scheme disclosed in this invention, can derive or association goes out many flexible programs, all these flexible programs, also being regarded as is protection scope of the present invention.
Claims (4)
1. a target solution binding device, it includes unbinding container 3, slag gathering hopper 4, filter screen 5, pipeline 6 and sweller storage tank 7；The described container 3 that unbinds is for storing sweller 1 and target 2；Unbind container 3 bottom and there is sweller outlet, and connection has slag gathering hopper 4, slag gathering hopper 4 bottom to be shelved with filter screen 5 for being enriched with glue residue；Filter screen 5 lower part outlet connects pipeline 6, is connected to the entrance of sweller storage tank 7 by pipeline 6；Sweller storage tank 7 top is provided with outlet, makes sweller 1 enter into through piping 6 and unbinds container 3；Thus define sweller and can recycle in whole solution binding device.
2. target solution binding device as claimed in claim 1, adds pump on described pipeline 6, for promoting the circulation of sweller.
3. target solution binding device as claimed in claim 2, is provided with valve on described pipeline 6.
4. target solution binding device as claimed in claim 1, described in unbind to be provided with on container 3 and unbind container cover 8 and seal unbinding container 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510360031.2A CN106319458A (en) | 2015-06-26 | 2015-06-26 | Target material unbundling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510360031.2A CN106319458A (en) | 2015-06-26 | 2015-06-26 | Target material unbundling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106319458A true CN106319458A (en) | 2017-01-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510360031.2A Pending CN106319458A (en) | 2015-06-26 | 2015-06-26 | Target material unbundling device |
Country Status (1)
| Country | Link |
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| CN (1) | CN106319458A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109161862A (en) * | 2018-11-01 | 2019-01-08 | 广西晶联光电材料有限责任公司 | A kind of device and method of plane and the binding of rotary target material solution |
| CN111378838A (en) * | 2018-12-28 | 2020-07-07 | 宁波江丰电子材料股份有限公司 | Target material recovery device and recovery method |
Citations (8)
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| CN1051880A (en) * | 1989-11-24 | 1991-06-05 | 中国石油化工总公司抚顺石油化工研究院 | Scrap electrical wires, electrical cables separate reclaim the method for metallic conductor and plastics |
| EP0717458A1 (en) * | 1994-12-15 | 1996-06-19 | Toyota Jidosha Kabushiki Kaisha | Method of recovering electrolyte membranes from fuel cells and apparatus for the same |
| JPH10230518A (en) * | 1997-02-19 | 1998-09-02 | Suzuki Motor Corp | Separating plant of coating film of resin molded body |
| JP2002035634A (en) * | 2000-07-24 | 2002-02-05 | Matsushita Electric Ind Co Ltd | Method and device for separating metal material in metal-containing resin |
| JP2005119134A (en) * | 2003-10-16 | 2005-05-12 | Umg Abs Ltd | Recovery method of thermoplastic resin from coating film applied resin molded product, thermoplastic resin composition and thermoplastic resin molded product |
| CN2897384Y (en) * | 2006-04-10 | 2007-05-09 | 四川通世达实业集团生物科技制品有限公司 | Self-cleaning closed filter |
| CN200948373Y (en) * | 2006-04-10 | 2007-09-19 | 四川通世达实业集团生物科技制品有限公司 | Automatic continuous paste (oil) collecting machine |
| CN204939600U (en) * | 2015-06-26 | 2016-01-06 | 汉能新材料科技有限公司 | A kind of target solution ties up device |
-
2015
- 2015-06-26 CN CN201510360031.2A patent/CN106319458A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1051880A (en) * | 1989-11-24 | 1991-06-05 | 中国石油化工总公司抚顺石油化工研究院 | Scrap electrical wires, electrical cables separate reclaim the method for metallic conductor and plastics |
| EP0717458A1 (en) * | 1994-12-15 | 1996-06-19 | Toyota Jidosha Kabushiki Kaisha | Method of recovering electrolyte membranes from fuel cells and apparatus for the same |
| JPH10230518A (en) * | 1997-02-19 | 1998-09-02 | Suzuki Motor Corp | Separating plant of coating film of resin molded body |
| JP2002035634A (en) * | 2000-07-24 | 2002-02-05 | Matsushita Electric Ind Co Ltd | Method and device for separating metal material in metal-containing resin |
| JP2005119134A (en) * | 2003-10-16 | 2005-05-12 | Umg Abs Ltd | Recovery method of thermoplastic resin from coating film applied resin molded product, thermoplastic resin composition and thermoplastic resin molded product |
| CN2897384Y (en) * | 2006-04-10 | 2007-05-09 | 四川通世达实业集团生物科技制品有限公司 | Self-cleaning closed filter |
| CN200948373Y (en) * | 2006-04-10 | 2007-09-19 | 四川通世达实业集团生物科技制品有限公司 | Automatic continuous paste (oil) collecting machine |
| CN204939600U (en) * | 2015-06-26 | 2016-01-06 | 汉能新材料科技有限公司 | A kind of target solution ties up device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109161862A (en) * | 2018-11-01 | 2019-01-08 | 广西晶联光电材料有限责任公司 | A kind of device and method of plane and the binding of rotary target material solution |
| CN111378838A (en) * | 2018-12-28 | 2020-07-07 | 宁波江丰电子材料股份有限公司 | Target material recovery device and recovery method |
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Effective date of registration: 20170829 Address after: 100101, No. 14, building 1, 7, 101, 0801, 3, building 8, building No. 2, West Beichen Road, Chaoyang District, Beijing Applicant after: Chinese LIAN mobile energy investment Limited Address before: 100101 Beijing, Beichen West Road, No. 8, Beichen Century Center, block B, floor 10, Applicant before: Hanergy New materials Technology Co., Ltd. |
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20170111 |