CN106316406A - Preparation technology of anti-corrosive substrate for LED - Google Patents

Preparation technology of anti-corrosive substrate for LED Download PDF

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Publication number
CN106316406A
CN106316406A CN201610654579.2A CN201610654579A CN106316406A CN 106316406 A CN106316406 A CN 106316406A CN 201610654579 A CN201610654579 A CN 201610654579A CN 106316406 A CN106316406 A CN 106316406A
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parts
substrate
slurry
led
preparation technology
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陈加根
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Wave Island Anhui Recreation Facility Co Ltd
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Wave Island Anhui Recreation Facility Co Ltd
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    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/584—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon nitride
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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
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    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
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    • C04B2235/6567—Treatment time

Abstract

The invention relates to a preparation technology of an anti-corrosive substrate for an LED. The technology comprises the steps of 1 preparing of a composite sintering aid, 2 preparing of slurry and 3 molding. The preparation technology has the following advantages that by adopting an appropriate sintering method and selecting the appropriate sintering aid, compactness of a sintered body is achieved, and the heat conductivity of the substrate is greatly improved; the sintering aid can form a low-melting-point phase, achieve liquid-phase sintering, lower the firing temperature, promote compactness of a green body and improve the hardness and glossiness of the substrate surface; the substrate is high in heat conductivity coefficient, excellent in heat resistance, good in corrosion resistance and capable of avoiding the phenomena such as bending and warping.

Description

A kind of preparation technology of LED corrosion resistance substrate
Technical field
The invention belongs to LED matrix technique field, be specifically related to the preparation technology of a kind of LED corrosion resistance substrate.
Background technology
LED mainly include LED chip and Lamp cup, usual LED chip be with LED luminescent wafer with beat gold thread, eutectic or The mode of flip is connected on heat-radiating substrate formation, then LED chip is fixed on the circuit board of system, and heat-radiating substrate is played the part of Heat radiation, conduct electricity, insulate triple role, existing heat-radiating substrate is mainly metal basal board, but this kind of metal basal board connects LED The technology of luminescent wafer also exists the drawback of poor radiation, poor insulativity.
Along with the demand of LED illumination is increasingly urgent, the heat dissipation problem of great power LED comes into one's own (too high temperature increasingly LED luminous efficiency can be caused to decay)；If LED uses produced used heat effectively to shed, then the life-span of LED can be caused Fatefulue impact.Present stage more universal heat-radiating substrate has 4 kinds: directly copper-clad plate (DBC), direct copper plating substrate (DPC), high Temperature burns multilager base plate (HTCC) and low temperature co-fired multilager base plate (LTCC) altogether.There is cost restriction, insulating properties in actual use Can wait shortcoming not, its manufacturing cost is higher, and heat dispersion is poor, and moisture resistance, corrosion resistance are bad, causes the use longevity of LED Order shorter, it is impossible to foot market demand, the formula of the most necessary improvement material, design the LED-baseplate of a kind of superior performance.
Summary of the invention
The present invention is directed to the problem of the existence in background technology and the LED corrosion resistance base of a kind of perfect heat-dissipating is provided The preparation technology of plate.
The technical scheme used to realize the object of the invention is: the preparation technology of a kind of LED corrosion resistance substrate, Concrete preparation process is as follows:
1) preparation of complex sintering aids
By alumina powder 65～75 parts, titanium valve 5～10 parts, kieselguhr 15～20 parts, titanium dioxide 5～10 parts, calcium fluoride 15 ～20 parts be scattered in dehydrated alcohol formation mixed slurry, the most i.e. prepare complex sintering aids, wherein, described alumina powder It is 1g:5mL with the mass volume ratio of dehydrated alcohol；
2) preparation of slurry
Be sequentially added into 50～60 parts silicon nitride powder, potassium fluoroaluminate 3～6 parts, vermiculite power 3～6 parts, zirconium acetate 3～5 parts, Glycolic 6～10 parts and step 1) complex sintering aids 6 for preparing～10 parts carry out wet ball grinding, ball milling 3～5 hours, carry out Vacuum stirring de-bubble, prepares slurry；
3) molding
By step 2) prepare slurry press-in die in, naturally placed gel process；Take out blank at 70～80 DEG C In temperature, it is dried process 3～5 hours；It is then placed in hot pressing die being sintered compacting, is 1200～1400 in temperature It is incubated 1～2 hour at DEG C, continues to improve temperature and be incubated 1～2 hour to 1400 DEG C～1700 DEG C, then cooling down obtains base Plate.
Beneficial effects of the present invention is as follows:
The present invention is by using suitable sintering method and choosing suitable sintering aid, it is achieved that the densification of sintered body Change, substantially increase the thermal conductivity of substrate；The sintering aid of the present invention can form the thing phase of low melting point, it is achieved liquid-phase sintering, fall Low firing temperature, promotes the densification of base substrate, adds hardness and the glossiness of substrate surface；The substrate heat conductivity of the present invention Greatly, heat resistance is excellent, and corrosion resistance is good, it is to avoid the phenomenons such as bending, warpage occur.
Detailed description of the invention
Below in conjunction with embodiment, the invention will be further described.
Embodiment 1:
The preparation technology of the embodiment of the present invention a kind of LED corrosion resistance substrate, concrete preparation process is as follows:
1) preparation of complex sintering aids
Alumina powder 65 parts, titanium valve 5 parts, 15 parts of kieselguhr, titanium dioxide 5 parts, 15 parts of calcium fluoride are scattered in dehydrated alcohol Middle formation mixed slurry, the most i.e. prepares complex sintering aids, wherein, described alumina powder and the quality volume of dehydrated alcohol Ratio is 1g:5mL；
2) preparation of slurry
It is sequentially added into silicon nitride powder, potassium fluoroaluminate 3 parts, vermiculite power 3 parts, zirconium acetate 3 parts, glycolic 6 parts and the step of 50 parts Rapid 1) complex sintering aids 6 parts prepared carries out wet ball grinding, ball milling 3 hours, carries out vacuum stirring de-bubble, prepares slurry；
3) molding
By step 2) prepare slurry press-in die in, naturally placed gel process；Take out blank at 70～80 DEG C In temperature, it is dried process 3 hours；It is then placed in hot pressing die being sintered compacting, is 1200～1400 DEG C in temperature Lower insulation 1 hour, continues to improve temperature and is incubated 1 hour to 1400 DEG C～1700 DEG C, then cooling down obtains substrate.
Embodiment 2:
The preparation technology of the embodiment of the present invention a kind of LED corrosion resistance substrate, concrete preparation process is as follows:
1) preparation of complex sintering aids
Alumina powder 75 parts, titanium valve 10 parts, 20 parts of kieselguhr, titanium dioxide 10 parts, 20 parts of calcium fluoride are scattered in anhydrous second Alcohol is formed mixed slurry, the most i.e. prepares complex sintering aids, wherein, described alumina powder and the mass body of dehydrated alcohol Long-pending ratio is 1g:5mL；
2) preparation of slurry
It is sequentially added into silicon nitride powder, potassium fluoroaluminate 6 parts, vermiculite power 6 parts, zirconium acetate 5 parts, glycolic 10 parts and the step of 60 parts Rapid 1) complex sintering aids 10 parts prepared carries out wet ball grinding, ball milling 5 hours, carries out vacuum stirring de-bubble, prepares slurry；
3) molding
By step 2) prepare slurry press-in die in, naturally placed gel process；Take out blank at 70～80 DEG C In temperature, it is dried process 5 hours；It is then placed in hot pressing die being sintered compacting, is 1200～1400 DEG C in temperature Lower insulation 2 hours, continues to improve temperature and is incubated 2 hours to 1400 DEG C～1700 DEG C, then cooling down obtains substrate.
The foregoing is only embodiments of the invention, not thereby limit the scope of the claims of the present invention, every utilize this Equivalent structure or equivalence flow process that bright description is made convert, or are directly or indirectly used in other relevant technology necks Territory, is the most in like manner included in the scope of patent protection of the present invention.

Claims (1)

1. the LED preparation technology of corrosion resistance substrate, it is characterised in that concrete preparation technology is as follows:
1) preparation of complex sintering aids
By alumina powder 65～75 parts, titanium valve 5～10 parts, kieselguhr 15～20 parts, titanium dioxide 5～10 parts, calcium fluoride 15～20 Part is scattered in dehydrated alcohol formation mixed slurry, the most i.e. prepares complex sintering aids, wherein, described alumina powder and nothing The mass volume ratio of water-ethanol is 1g:5mL；
2) preparation of slurry
It is sequentially added into silicon nitride powder, potassium fluoroaluminate 3～6 parts, vermiculite power 3～6 parts, zirconium acetate 3～5 parts, the ethanol of 50～60 parts Acid 6～10 parts and step 1) prepare complex sintering aids 6～10 parts carry out wet ball grinding, ball milling 3～5 hours, carry out vacuum Stirring de-bubble, prepares slurry；
3) molding
By step 2) prepare slurry press-in die in, naturally placed gel process；Take out blank 70～80 DEG C of temperature In, it is dried process 3～5 hours；It is then placed in hot pressing die being sintered compacting, at temperature is 1200～1400 DEG C It is incubated 1～2 hour, continues to improve temperature and be incubated 1～2 hour to 1400 DEG C～1700 DEG C, then cooling down obtains substrate.
CN201610654579.2A 2016-08-11 2016-08-11 Preparation technology of anti-corrosive substrate for LED Withdrawn CN106316406A (en)

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Application Number Priority Date Filing Date Title
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104072150A (en) * 2014-06-12 2014-10-01 安徽安尔达机电有限公司 Preparation process of silicon nitride ceramic material for water seal of water pump
CN104529470A (en) * 2014-12-08 2015-04-22 北京中材人工晶体研究院有限公司 Silicon nitride powder material preparation method
CN105254308A (en) * 2015-11-04 2016-01-20 苏州知瑞光电材料科技有限公司 Preparation method of ceramic cooling composite material
CN105272176A (en) * 2015-11-04 2016-01-27 苏州知瑞光电材料科技有限公司 High-power LED (Light-Emitting Diode) heat dissipation ceramic substrate
CN105304795A (en) * 2015-11-04 2016-02-03 苏州知瑞光电材料科技有限公司 Ceramic radiating substrate for light-emitting diode (LED)

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104072150A (en) * 2014-06-12 2014-10-01 安徽安尔达机电有限公司 Preparation process of silicon nitride ceramic material for water seal of water pump
CN104529470A (en) * 2014-12-08 2015-04-22 北京中材人工晶体研究院有限公司 Silicon nitride powder material preparation method
CN105254308A (en) * 2015-11-04 2016-01-20 苏州知瑞光电材料科技有限公司 Preparation method of ceramic cooling composite material
CN105272176A (en) * 2015-11-04 2016-01-27 苏州知瑞光电材料科技有限公司 High-power LED (Light-Emitting Diode) heat dissipation ceramic substrate
CN105304795A (en) * 2015-11-04 2016-02-03 苏州知瑞光电材料科技有限公司 Ceramic radiating substrate for light-emitting diode (LED)

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
黄伟九: "《刀具材料速查手册》", 28 February 2011, 机械工业出版社 *

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Application publication date: 20170111