CN105254286A - High-heat-conduction ceramic material and manufacturing method therefor - Google Patents
High-heat-conduction ceramic material and manufacturing method therefor Download PDFInfo
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- CN105254286A CN105254286A CN201510578760.5A CN201510578760A CN105254286A CN 105254286 A CN105254286 A CN 105254286A CN 201510578760 A CN201510578760 A CN 201510578760A CN 105254286 A CN105254286 A CN 105254286A
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Abstract
The invention discloses a high-heat-conduction ceramic material. Mixed powder composed of aluminum oxide powder and aluminum nitride is subjected to molding and then is subjected to sintering in a protection atmosphere and a high-heat-conduction ceramic material is prepared. The invention also discloses a manufacturing method for the high-heat-conduction ceramic material. The method comprises the following steps: a plain body after molding of mixed powder composed of aluminum oxide powder and aluminum nitride is placed in a high-temperature furnace, thermal insulation carried out in a protection atmosphere for predetermined time the high-heat-conduction ceramic material is prepared after sintering. The mass percent of the aluminum nitride powder is 10%-20%. The high-heat-conduction ceramic material has a thermal conductivity of higher than 30W/(m.K), the thermal conductivity is higher than that of pure aluminum oxide ceramic, the method is simple, and the technology cost is low.
Description
Technical field
The present invention relates to high heat-conducting ceramic field, particularly relate to a kind of high-heat-conductivity ceramic material and manufacture method thereof.
Background technology
LED illumination is day by day universal, and the light efficiency of LED lamp also rises year by year.In recent years, LED illumination is used widely at interior lighting, commercial illumination, street lamp, Landscape Lighting etc.Compare traditional lighting as incandescent light, fluorescent lamp etc., LED illumination has the advantages such as light efficiency is high, life-span length, environmental protection.But due to a variety of causes, the light efficiency of current LED also has obvious gap from its theoretical value, causes it to have a large amount of electric energy conversions to become heat energy when lighting.If these a large amount of heats can not leave timely and effectively, the life-span of LED lamp will be had influence on.Baseplate material has material impact to LED lamp heat radiation.The baseplate material of current main flow is aluminium base.This substrate has good thermal conductivity.But meanwhile, aluminium is heated and easily expands, thus the gold thread be communicated with for realizing LED electrical may be caused to come off, thus have influence on the life-span of LED lamp, particularly high-power LED light fixture.
For the gold thread avoiding baseplate material expanded by heating to cause comes off, people adopt ceramic substrate as the pottery such as aluminum oxide, aluminium nitride in great power LED.Opposing metallic aluminium, the stupalith coefficient of expansion is little.But the heat conductivility of alumina-ceramic is poor, be unfavorable for the heat radiation of LED chip, the life-span of LED lamp can be had a strong impact on equally.And though aluminium nitride ceramics has very high thermal conductivity, but it is with high costs, is not suitable for scale operation and application, and particularly LED product take price as the market of guiding at present.Therefore, it is possible to balance thermal conductivity energy, the coefficient of expansion and the low high baseplate material of cost is current LED illumination product, particularly high-power product is badly in need of.
Summary of the invention
In view of the deficiency that prior art exists, the invention provides the baseplate material that a kind of cost rationally has good thermal conductivity and lower thermal expansivity.
In order to realize above-mentioned object, present invention employs following technical scheme:
A kind of high-heat-conductivity ceramic material, sinters after the mixed powder be made up of is shaping form alumina powder jointed and aluminium nitride powder under protective atmosphere.
Wherein, in described mixed powder, the mass percent of described aluminium nitride powder is 10%-20%.
Wherein, in described mixed powder, the mass percent of described aluminium nitride powder is 10%-15%.
Wherein, described alumina powder jointed grain diameter is 10nm-500nm.
Wherein, described aluminium nitride powder grain diameter is 100nm-800nm.
Another object of the present invention is to the manufacture method that a kind of high-heat-conductivity ceramic material is provided; comprise and the plain embryo after shaping for the mixed powder of alumina powder jointed and aluminium nitride powder composition is placed in High Temperature Furnaces Heating Apparatus; under protective atmosphere, be incubated scheduled time sintering form, the mass percent of described aluminium nitride powder is 10%-20%.
Wherein, described protective atmosphere is nitrogen or rare gas element.
Wherein, described holding temperature is 1000-1500 DEG C.
Wherein, the described scheduled time is 4-20 hour.
Wherein, the mode that described mixed powder is shaping is the one in dry-pressing formed, isostatic pressing, casting.
High-heat-conductivity ceramic material manufacture method of the present invention is simple and easy, and process costs is low.By aluminum oxide-Aluminum nitride composite ceramic that the method is prepared, there is the thermal conductivity higher than 30W/ (mK), higher than pure alumina pottery.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with embodiment, the present invention is described in more detail.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
High-heat-conductivity ceramic material of the present invention is mainly used in making LED illumination product ceramic substrate.This ceramic substrate is sintered by the mixed powder of aluminum oxide and aluminium nitride and forms after shaping.
Wherein, alumina powder jointed grain diameter is 10nm-500nm, preferably 100nm-500nm; Aluminium nitride powder grain diameter is 100nm-800nm, preferably 500nm-800nm; The mixed powder of aluminum oxide and aluminium nitride is by above-mentioned aluminum oxide and aluminium nitride powder being mixed by a certain percentage.Mixed powder in the mass percent of aluminium nitride for for 10%-20%, preferably 10%-15%.Mixed powder shaping can be the one in dry-pressing formed, isostatic pressing or casting, preferably casting.
Sintering process of the present invention is by the sample after shaping under certain protective atmosphere, naturally cooling after held for some time at a certain temperature in High Temperature Furnaces Heating Apparatus.This protective atmosphere is nitrogen or rare gas element, preferably nitrogen.This certain temperature is 1000-1500 DEG C, preferably 1300-1500 DEG C.This soaking time is 4-20 hour, preferably 5-10 hour.
High-heat-conductivity ceramic material preparation method of the present invention is simple and easy, and process costs is low.By aluminum oxide-Aluminum nitride composite ceramic that the method is prepared, there is the thermal conductivity higher than 30W/ (mK), higher than pure alumina pottery.
Embodiment 1
The aluminium nitride powder be the alumina powder jointed of 100nm by particle diameter being 500nm with particle diameter mixes, and wherein the mass percent of aluminium nitride is 10%.By dry-pressing formed for obtained mixed powder, obtain plain embryo.By plain embryo as in the High Temperature Furnaces Heating Apparatus of nitrogen protection, at 1200 DEG C of sintering after 6 hours, naturally cooling, obtains sample finally.Through surveying, it is 43W/ (mK) that this sample obtains thermal conductivity.
Embodiment 2
The aluminium nitride powder be the alumina powder jointed of 200nm by particle diameter being 700nm with particle diameter mixes, and wherein the mass percent of aluminium nitride is 12%.By obtained mixed powder isostatic pressing, obtain plain embryo.By plain embryo as in the High Temperature Furnaces Heating Apparatus of nitrogen protection, at 1300 DEG C of sintering after 5 hours, naturally cooling, obtains sample finally.Through surveying, it is 40W/ (mK) that this sample obtains thermal conductivity.
Embodiment 3
The aluminium nitride powder be the alumina powder jointed of 100nm by particle diameter being 600nm with particle diameter mixes, and wherein the mass percent of aluminium nitride is 15%.Obtained mixed powder is dry after cast molding, obtain plain embryo.By plain embryo as in the High Temperature Furnaces Heating Apparatus of argon shield, at 1500 DEG C of sintering after 4 hours, naturally cooling, obtains sample finally.Through surveying, it is 50W/ (mK) that this sample obtains thermal conductivity.
The above is only the embodiment of the application; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the application's principle; can also make some improvements and modifications, these improvements and modifications also should be considered as the protection domain of the application.
Claims (10)
1. a high-heat-conductivity ceramic material, is characterized in that, sinters form alumina powder jointed and aluminium nitride powder after the mixed powder be made up of is shaping under protective atmosphere.
2. high-heat-conductivity ceramic material according to claim 1, is characterized in that, in described mixed powder, the mass percent of described aluminium nitride powder is 10%-20%.
3. high-heat-conductivity ceramic material according to claim 1, is characterized in that, in described mixed powder, the mass percent of described aluminium nitride powder is 10%-15%.
4., according to the arbitrary described high-heat-conductivity ceramic material of claim 1-3, it is characterized in that, described alumina powder jointed grain diameter is 10nm-500nm.
5., according to the arbitrary described high-heat-conductivity ceramic material of claim 1-3, it is characterized in that, described aluminium nitride powder grain diameter is 100nm-800nm.
6. the manufacture method of a high-heat-conductivity ceramic material; it is characterized in that; comprise and the plain embryo after shaping for the mixed powder of alumina powder jointed and aluminium nitride powder composition is placed in High Temperature Furnaces Heating Apparatus; under protective atmosphere, be incubated scheduled time sintering form, the mass percent of described aluminium nitride powder is 10%-20%.
7. the manufacture method of high-heat-conductivity ceramic material according to claim 6, is characterized in that, described protective atmosphere is nitrogen or rare gas element.
8. the manufacture method of high-heat-conductivity ceramic material according to claim 6, is characterized in that, described holding temperature is 1000-1500 DEG C.
9. the manufacture method of high-heat-conductivity ceramic material according to claim 6, is characterized in that, the described scheduled time is 4-20 hour.
10. the manufacture method of high-heat-conductivity ceramic material according to claim 6, is characterized in that, the shaping mode of described mixed powder is the one in dry-pressing formed, isostatic pressing, casting.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510578760.5A CN105254286A (en) | 2015-09-11 | 2015-09-11 | High-heat-conduction ceramic material and manufacturing method therefor |
| HK16107843.6A HK1219716A1 (en) | 2015-09-11 | 2016-07-06 | High-heat-conduction ceramic material and manufacturing method therefor |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510578760.5A CN105254286A (en) | 2015-09-11 | 2015-09-11 | High-heat-conduction ceramic material and manufacturing method therefor |
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| CN105254286A true CN105254286A (en) | 2016-01-20 |
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| CN201510578760.5A Pending CN105254286A (en) | 2015-09-11 | 2015-09-11 | High-heat-conduction ceramic material and manufacturing method therefor |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109369158A (en) * | 2018-11-15 | 2019-02-22 | 广东省新材料研究所 | A kind of insulating heat-conductive composite ceramic powder and the preparation method and application thereof, insulating heat-conductive coating |
| CN110467443A (en) * | 2019-09-19 | 2019-11-19 | 广东工业大学 | A kind of aluminium nitride/Toughened Alumina Ceramics and preparation method thereof |
| WO2022095597A1 (en) * | 2020-11-09 | 2022-05-12 | 广东工业大学 | Alumina composite ceramic, preparation method therefor, and application therefor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103011777A (en) * | 2012-12-06 | 2013-04-03 | 赵建光 | Low-temperature aluminium oxide powder and multifunctional aluminium oxide ceramic heat sink as well as manufacturing method thereof |
| CN103435334A (en) * | 2013-08-12 | 2013-12-11 | 唐山市科硕特种陶瓷制造有限公司 | Composite ceramic material for LED energy-saving lamp base |
| CN104072144A (en) * | 2014-07-16 | 2014-10-01 | 苏州立瓷电子技术有限公司 | High heat-conducting aluminium nitride ceramics and preparation method thereof |
-
2015
- 2015-09-11 CN CN201510578760.5A patent/CN105254286A/en active Pending
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2016
- 2016-07-06 HK HK16107843.6A patent/HK1219716A1/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103011777A (en) * | 2012-12-06 | 2013-04-03 | 赵建光 | Low-temperature aluminium oxide powder and multifunctional aluminium oxide ceramic heat sink as well as manufacturing method thereof |
| CN103435334A (en) * | 2013-08-12 | 2013-12-11 | 唐山市科硕特种陶瓷制造有限公司 | Composite ceramic material for LED energy-saving lamp base |
| CN104072144A (en) * | 2014-07-16 | 2014-10-01 | 苏州立瓷电子技术有限公司 | High heat-conducting aluminium nitride ceramics and preparation method thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109369158A (en) * | 2018-11-15 | 2019-02-22 | 广东省新材料研究所 | A kind of insulating heat-conductive composite ceramic powder and the preparation method and application thereof, insulating heat-conductive coating |
| CN109369158B (en) * | 2018-11-15 | 2021-07-09 | 广东省新材料研究所 | Insulating and heat-conducting composite ceramic powder, preparation method and application thereof, and insulating and heat-conducting coating |
| CN110467443A (en) * | 2019-09-19 | 2019-11-19 | 广东工业大学 | A kind of aluminium nitride/Toughened Alumina Ceramics and preparation method thereof |
| WO2022095597A1 (en) * | 2020-11-09 | 2022-05-12 | 广东工业大学 | Alumina composite ceramic, preparation method therefor, and application therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| HK1219716A1 (en) | 2017-04-13 |
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