CN106316407A - Preparation technology of high-hardness substrate for LED - Google Patents

Preparation technology of high-hardness substrate for LED Download PDF

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Publication number
CN106316407A
CN106316407A CN201610654596.6A CN201610654596A CN106316407A CN 106316407 A CN106316407 A CN 106316407A CN 201610654596 A CN201610654596 A CN 201610654596A CN 106316407 A CN106316407 A CN 106316407A
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Prior art keywords
parts
substrate
slurry
led
preparation technology
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CN201610654596.6A
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陈加根
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Wave Island Anhui Recreation Facility Co Ltd
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Wave Island Anhui Recreation Facility Co Ltd
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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/584—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon nitride
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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/6303—Inorganic additives
    • C04B35/6306—Binders based on phosphoric acids or phosphates
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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/632—Organic additives
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3427—Silicates other than clay, e.g. water glass
    • C04B2235/3436—Alkaline earth metal silicates, e.g. barium silicate
    • C04B2235/3454—Calcium silicates, e.g. wollastonite
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/44—Metal salt constituents or additives chosen for the nature of the anions, e.g. hydrides or acetylacetonate
    • C04B2235/447—Phosphates or phosphites, e.g. orthophosphate, hypophosphite
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/44—Metal salt constituents or additives chosen for the nature of the anions, e.g. hydrides or acetylacetonate
    • C04B2235/449—Organic acids, e.g. EDTA, citrate, acetate, oxalate
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance

Abstract

The invention relates to a preparation technology of a high-hardness substrate for an LED. The technology comprises the steps of 1 preparing of a composite sintering aid, 2 preparing of slurry and 3 molding. The preparation technology has the following advantages that by adopting an appropriate sintering method and selecting the appropriate sintering aid, compactness of a sintered body is achieved, and the heat conductivity of the substrate is greatly improved; the sintering aid can form a low-melting-point phase, achieve liquid-phase sintering, lower the firing temperature, promote compactness of a green body and improve the hardness and glossiness of the substrate surface; the substrate is high in heat conductivity coefficient, excellent in heat resistance, high in bending strength and capable of avoiding the phenomena such as bending and warping.

Description

A kind of preparation technology of LED high rigidity substrate
Technical field
The invention belongs to LED matrix technique field, be specifically related to the preparation technology of a kind of LED high rigidity substrate.
Background technology
LED mainly include LED chip and Lamp cup, usual LED chip be with LED luminescent wafer with beat gold thread, eutectic or The mode of flip is connected on heat-radiating substrate formation, then LED chip is fixed on the circuit board of system, and heat-radiating substrate is played the part of Heat radiation, conduct electricity, insulate triple role, existing heat-radiating substrate is mainly metal basal board, but this kind of metal basal board connects LED The technology of luminescent wafer also exists the drawback of poor radiation, poor insulativity.
Along with the demand of LED illumination is increasingly urgent, the heat dissipation problem of great power LED comes into one's own (too high temperature increasingly LED luminous efficiency can be caused to decay)；If LED uses produced used heat effectively to shed, then the life-span of LED can be caused Fatefulue impact.Present stage more universal heat-radiating substrate has 4 kinds: directly copper-clad plate (DBC), direct copper plating substrate (DPC), high Temperature burns multilager base plate (HTCC) and low temperature co-fired multilager base plate (LTCC) altogether.There is cost restriction, insulating properties in actual use Can wait shortcoming not, its manufacturing cost is higher, and heat dispersion is poor, and moisture resistance, corrosion resistance are bad, causes the use longevity of LED Order shorter, it is impossible to foot market demand, the formula of the most necessary improvement material, design the LED-baseplate of a kind of superior performance.
Summary of the invention
The present invention is directed to the problem of the existence in background technology and the LED high rigidity substrate of a kind of perfect heat-dissipating is provided Preparation technology.
The technical scheme used to realize the object of the invention is: the preparation technology of a kind of LED high rigidity substrate, tool Preparation step is as follows:
1) preparation of complex sintering aids
By alumina powder 65～75 parts, zinc powder 5～10 parts, kieselguhr 15～20 parts, Pulvis Talci 5～10 parts, calcium fluoride 15 ～20 parts be scattered in dehydrated alcohol formation mixed slurry, the most i.e. prepare complex sintering aids, wherein, described alumina powder It is 1g:5mL with the mass volume ratio of dehydrated alcohol；
2) preparation of slurry
It is sequentially added into silicon nitride powder, sodium hypophosphite 3～6 parts, wollastonite in powder 3～6 parts, the aluminum phosphate 3～5 of 50～60 parts Part, glycolic 6～10 parts and step 1) complex sintering aids 6 for preparing～10 parts carry out wet ball grinding, ball milling 3～5 hours, enter Row vacuum stirring de-bubble, prepares slurry；
3) molding
By step 2) prepare slurry press-in die in, naturally placed gel process；Take out blank at 70～80 DEG C In temperature, it is dried process 3～5 hours；It is then placed in hot pressing die being sintered compacting, is 1200～1400 in temperature It is incubated 1～2 hour at DEG C, continues to improve temperature and be incubated 1～2 hour to 1400 DEG C～1700 DEG C, then cooling down obtains base Plate.
Beneficial effects of the present invention is as follows:
The present invention is by using suitable sintering method and choosing suitable sintering aid, it is achieved that the densification of sintered body Change, substantially increase the thermal conductivity of substrate；The sintering aid of the present invention can form the thing phase of low melting point, it is achieved liquid-phase sintering, fall Low firing temperature, promotes the densification of base substrate, adds hardness and the glossiness of substrate surface；The substrate heat conductivity of the present invention Greatly, heat resistance is excellent, and bending strength is high, it is to avoid the phenomenons such as bending, warpage occur.
Detailed description of the invention
Below in conjunction with embodiment, the invention will be further described.
Embodiment 1:
The preparation technology of the embodiment of the present invention a kind of LED high rigidity substrate, concrete preparation process is as follows:
1) preparation of complex sintering aids
Alumina powder 65 parts, zinc powder 5 parts, 15 parts of kieselguhr, Pulvis Talci 5 parts, 15 parts of calcium fluoride are scattered in dehydrated alcohol Middle formation mixed slurry, the most i.e. prepares complex sintering aids, wherein, described alumina powder and the quality volume of dehydrated alcohol Ratio is 1g:5mL；
2) preparation of slurry
Be sequentially added into 50 parts silicon nitride powder, sodium hypophosphite 3 parts, wollastonite in powder 3 parts, aluminum phosphate 3 parts, glycolic 6 parts and Step 1) prepare complex sintering aids 6 parts carry out wet ball grinding, ball milling 3 hours, carry out vacuum stirring de-bubble, prepare slurry；
3) molding
By step 2) prepare slurry press-in die in, naturally placed gel process；Take out blank at 70～80 DEG C In temperature, it is dried process 3 hours；It is then placed in hot pressing die being sintered compacting, is 1200～1400 DEG C in temperature Lower insulation 1 hour, continues to improve temperature and is incubated 1 hour to 1400 DEG C～1700 DEG C, then cooling down obtains substrate.
Embodiment 2:
The preparation technology of the embodiment of the present invention a kind of LED high rigidity substrate, concrete preparation process is as follows:
1) preparation of complex sintering aids
Alumina powder 75 parts, zinc powder 10 parts, 20 parts of kieselguhr, Pulvis Talci 10 parts, 20 parts of calcium fluoride are scattered in anhydrous second Alcohol is formed mixed slurry, the most i.e. prepares complex sintering aids, wherein, described alumina powder and the mass body of dehydrated alcohol Long-pending ratio is 1g:5mL；
2) preparation of slurry
Be sequentially added into 60 parts silicon nitride powder, sodium hypophosphite 6 parts, wollastonite in powder 6 parts, aluminum phosphate 5 parts, glycolic 10 parts and Step 1) prepare complex sintering aids 10 parts carry out wet ball grinding, ball milling 5 hours, carry out vacuum stirring de-bubble, prepare slurry；
3) molding
By step 2) prepare slurry press-in die in, naturally placed gel process；Take out blank at 70～80 DEG C In temperature, it is dried process 5 hours；It is then placed in hot pressing die being sintered compacting, is 1200～1400 DEG C in temperature Lower insulation 2 hours, continues to improve temperature and is incubated 2 hours to 1400 DEG C～1700 DEG C, then cooling down obtains substrate.
The foregoing is only embodiments of the invention, not thereby limit the scope of the claims of the present invention, every utilize this Equivalent structure or equivalence flow process that bright description is made convert, or are directly or indirectly used in other relevant technology necks Territory, is the most in like manner included in the scope of patent protection of the present invention.

Claims (1)

1. the LED preparation technology of high rigidity substrate, it is characterised in that concrete preparation technology is as follows:
1) preparation of complex sintering aids
By alumina powder 65～75 parts, zinc powder 5～10 parts, kieselguhr 15～20 parts, Pulvis Talci 5～10 parts, calcium fluoride 15～20 Part is scattered in dehydrated alcohol formation mixed slurry, the most i.e. prepares complex sintering aids, wherein, described alumina powder and nothing The mass volume ratio of water-ethanol is 1g:5mL；
2) preparation of slurry
It is sequentially added into silicon nitride powder, sodium hypophosphite 3～6 parts, wollastonite in powder 3～6 parts, aluminum phosphate 3～5 parts, the second of 50～60 parts Alkyd 6～10 parts and step 1) complex sintering aids 6 for preparing～10 parts carry out wet ball grinding, ball milling 3～5 hours, carry out true Empty stirring de-bubble, prepares slurry；
3) molding
By step 2) prepare slurry press-in die in, naturally placed gel process；Take out blank 70～80 DEG C of temperature In, it is dried process 3～5 hours；It is then placed in hot pressing die being sintered compacting, at temperature is 1200～1400 DEG C It is incubated 1～2 hour, continues to improve temperature and be incubated 1～2 hour to 1400 DEG C～1700 DEG C, then cooling down obtains substrate.
CN201610654596.6A 2016-08-11 2016-08-11 Preparation technology of high-hardness substrate for LED Withdrawn CN106316407A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112552055A (en) * 2021-01-14 2021-03-26 威海圆环先进陶瓷股份有限公司 Method for high-temperature co-firing of metal and silicon nitride ceramic composite substrate

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101260488A (en) * 2008-04-18 2008-09-10 哈尔滨工业大学 Silicon nitride ceramic particles enhancement aluminum-base composite material and preparing method thereof
CN102795841A (en) * 2011-05-24 2012-11-28 比亚迪股份有限公司 Alumina-based ceramic, ceramic radiating substrate and preparation method for ceramic radiating substrate
CN105254308A (en) * 2015-11-04 2016-01-20 苏州知瑞光电材料科技有限公司 Preparation method of ceramic cooling composite material
CN105272176A (en) * 2015-11-04 2016-01-27 苏州知瑞光电材料科技有限公司 High-power LED (Light-Emitting Diode) heat dissipation ceramic substrate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101260488A (en) * 2008-04-18 2008-09-10 哈尔滨工业大学 Silicon nitride ceramic particles enhancement aluminum-base composite material and preparing method thereof
CN102795841A (en) * 2011-05-24 2012-11-28 比亚迪股份有限公司 Alumina-based ceramic, ceramic radiating substrate and preparation method for ceramic radiating substrate
CN105254308A (en) * 2015-11-04 2016-01-20 苏州知瑞光电材料科技有限公司 Preparation method of ceramic cooling composite material
CN105272176A (en) * 2015-11-04 2016-01-27 苏州知瑞光电材料科技有限公司 High-power LED (Light-Emitting Diode) heat dissipation ceramic substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112552055A (en) * 2021-01-14 2021-03-26 威海圆环先进陶瓷股份有限公司 Method for high-temperature co-firing of metal and silicon nitride ceramic composite substrate

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