CN106304629A - Circuit board and manufacture method thereof - Google Patents
Circuit board and manufacture method thereof Download PDFInfo
- Publication number
- CN106304629A CN106304629A CN201510290845.3A CN201510290845A CN106304629A CN 106304629 A CN106304629 A CN 106304629A CN 201510290845 A CN201510290845 A CN 201510290845A CN 106304629 A CN106304629 A CN 106304629A
- Authority
- CN
- China
- Prior art keywords
- substrate
- hole
- time
- circuit board
- solid resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
Abstract
The present invention relates to a kind of circuit board and manufacture method thereof.The manufacture method of foregoing circuit plate comprises the steps: to hole on substrate, forms the through hole of the both sides of connection substrate；Substrate after boring is carried out electroless copper plating for the first time, makes the both sides of through hole conducting substrate；Carry out the substrate after first time electroless copper plating electroplating for the first time；Fill in liquid resin in through hole after plating for the first time, and liquid resin is cured as solid resin；The solid resin polishing that will protrude above substrate surface is evened out；The surface of the solid resin on substrate is carried out second time electroless copper plating, makes solid resin be sealed in through hole.Being filled in by liquid resin in through hole, consent plumpness is high, occurs the bad phenomenon such as bubble, be full of cracks, cavity in can avoiding hole.Solid resin polishing carries out second time electroless copper plating after evening out, make solid resin fully tamp through hole, be sealed in through hole by solid resin, good water-proof effect.
Description
Technical field
The present invention relates to the technical field that printed wiring board manufactures, particularly relate to a kind of circuit board and manufacture thereof
Method.
Background technology
The outer layer cable-through hole of printed circuit board needs to fill in implant, in preventing in the processing procedure of downstream or using
Corroded by chemical drugs and aqueous vapor.General circuit board uses ink plugging method to carry out consent, i.e. passes through
Certain technological process and the tool of production tamp ink in making cable-through hole.
But there will be following problem with ink plugging, one is that ink can shrink after overcuring, thus leads
In pore there is cavity or the phenomenon of be full of cracks in ink, and the consent plumpness of cable-through hole cannot meet requirement；Two are
Ink is high temperature resistant and the performance of acid-alkali-resistant degree is low, printed circuit board ink attachment in the processing procedure of downstream or in use
Power is poor, and its electric property and reliability cannot ensure.
Summary of the invention
Based on this, it is necessary to for the problems referred to above, it is provided that a kind of with liquid resin substitute ink carry out consent
Circuit board and manufacture method thereof.
The manufacture method of a kind of circuit board, comprises the steps:
Substrate is holed, forms the through hole of the both sides of connection substrate；
Substrate after boring is carried out for the first time electroless copper plating, makes through hole electrically conduct the both sides of substrate；
Carry out the substrate after first time electroless copper plating electroplating for the first time；
Fill in liquid resin in through hole after plating for the first time, and liquid resin is cured as solid resin；
The solid resin polishing that will protrude above substrate surface is evened out；And
The surface of the solid resin on substrate is carried out second time electroless copper plating, makes solid resin be sealed in logical
In hole.
Wherein in an embodiment, carry out second time chemistry on the described surface to the solid resin on substrate
Heavy copper, after making the step that solid resin is sealed in through hole, also includes that substrate carries out second time to be electroplated
Step.
Wherein in an embodiment, the plating of described first time and the plating of described second time are imposite plating.
Wherein in an embodiment, described substrate carried out the step that second time is electroplated after, also include
Figure transfer, image plating, outer layer etching and the step of welding resistance.
Wherein in an embodiment, the aperture of described through hole is 0.2mm to 0.4mm.
Wherein in an embodiment, in described through hole after plating for the first time, fill in liquid resin, and will
Liquid resin is cured as the step of solid resin, comprises the steps:
Polish-brush removes the foreign material of substrate surface；
Substrate is coated with glued membrane；
Consent is carried out by vacuum taphole machine；
Strike off the liquid resin of substrate surface；
Remove the glued membrane on substrate；And
Liquid resin is solidified, forms solid resin.
Wherein in an embodiment, the consent pressure of described vacuum taphole machine is 2bar to 4bar；Traversing plug
It is 8mm/s to 12mm/s that hole head moves down speed；Moving speed on traversing consent head is 60mm/s to 100mm/s；
Consent time delay is 0.5s to 1.5s；Consent head pressure is 2bar to 4bar；Vacuum pump pressure is 0.6bar
To 1bar；Traversing consent head displacement is 40mm to 60mm.
Wherein in an embodiment, the control point of described vacuum taphole machine is consent plumpness 100%.
A kind of circuit board, including substrate, implant, the first layers of copper and the second layers of copper；
It is provided with conductive layer in described substrate, described substrate offers the through hole of the both sides connecting described substrate；
Described implant is filled in described through hole；
Described first layers of copper between the inwall of described implant and described through hole, described first layers of copper and institute
State conductive layer connection；
Described second layers of copper covers the opening of described through hole, makes described implant be sealed in described through hole.
Wherein in an embodiment, described implant is the liquid resin after solidification.
Foregoing circuit plate and manufacture method thereof, fill in liquid resin in through hole, and consent plumpness is high, therefore
The bad phenomenon such as bubble, be full of cracks, cavity occur in can avoiding hole.Solid resin polishing carries out the after evening out
Secondary electroless copper plating, on the one hand can make solid resin fully tamp through hole, and solid resin is the closeest
Be enclosed in through hole, good water-proof effect, effectively reduce circuit board in the processing procedure of downstream or use in non-watertight
Risk.
Accompanying drawing explanation
Fig. 1 is the flow chart of the manufacture method of an embodiment circuit board；
Fig. 2 is the flow chart of step S400 of the manufacture method of circuit board shown in Fig. 1；
Fig. 3 is the flow chart of the manufacture method of another embodiment circuit board；
Fig. 4 is the terrace cut slice figure of the circuit board of the manufacture method manufacture of circuit board shown in Fig. 3；
Fig. 5 is the schematic diagram of an embodiment circuit board.
Detailed description of the invention
For the ease of understanding the present invention, below with reference to relevant drawings, circuit board and manufacture method thereof are carried out more
Comprehensively describe.Accompanying drawing gives the first-selected embodiment of circuit board and manufacture method thereof.But, circuit board
And manufacture method can realize in many different forms, however it is not limited to embodiment described herein.
On the contrary, providing the purpose of these embodiments is to make the disclosure to circuit board and manufacture method thereof more saturating
Thorough comprehensively.
Unless otherwise defined, all of technology used herein and scientific terminology and the technology belonging to the present invention
The implication that the technical staff in field is generally understood that is identical.Herein in circuit board and the description of manufacture method thereof
Used in term be intended merely to describe specific embodiment purpose, it is not intended that in limit the present invention.
As it is shown in figure 1, the manufacture method of the circuit board of an embodiment comprises the steps:
S100, holes on substrate, forms the through hole of the both sides of connection substrate.Hole after sawing sheet,
Through hole runs through the both sides of substrate, and then can form dual platen by following process.The aperture of through hole is excellent
Select 0.2mm to 0.4mm.
S200, carries out for the first time electroless copper plating to the substrate after boring, makes through hole electrically conduct the both sides of substrate.
Being typically provided with conductive layer in substrate, the layers of copper that electroless copper plating is formed for the first time can make conductive layer and substrate table
The layers of copper connection in face.
S300, carries out the substrate after first time electroless copper plating electroplating for the first time.Plating can be whole for the first time
Plate is electroplated, it is also possible to carry out parcel plating as required.
S400, fills in liquid resin in the through hole after plating for the first time, and liquid resin is cured as solid-state
Resin.The plug socket resin that liquid resin can select product type to be SKY2000HR-9P.
Concrete, referring also to Fig. 2, step S400 may include steps of:
S410, polish-brush removes the foreign material of substrate surface, i.e. brush board.In one embodiment, level can be passed through
Brush plate machine carries out brush board.
S420, is coated with glued membrane on substrate.Glued membrane can be coated with all or part of substrate, the glue being coated with
Film is usually blue glued membrane.Cladding glued membrane can avoid substrate during following step S430 and step S440
It is stained with liquid resin and affects subsequent operation.
S430, carries out consent by vacuum taphole machine.Vacuum taphole machine can be the vacuum stopper of Germany MASS
Hole machine.Parameter about vacuum taphole machine is arranged, and the control point of vacuum taphole machine can be consent plumpness
100%.In one embodiment, the consent pressure of vacuum taphole machine is 2bar to 4bar.Traversing consent head moves down
Speed is 8mm/s to 12mm/s.Moving speed on traversing consent head is 60mm/s to 100mm/s.Consent prolongs
Time is 0.5s to 1.5s late.Consent head pressure is 2bar to 4bar.Vacuum pump pressure is 0.6bar to 1bar.
Traversing consent head displacement is 40mm to 60mm.
Further, in a specific embodiment, equipment consent pressure is in the range of 0bar to 4bar, real
Border controls consent pressure position 3bar.Equipment traversing consent head moves down speed in the range of 1mm/s to 60mm/s,
It is 10mm/s that actual control traversing consent head moves down speed.On equipment traversing consent head move speed in the range of
1mm/s to 100mm/s, it is 80mm/s that actual control traversing consent head moves speed.When equipment consent postpones
Between in the range of 0s to 30s, it is actual that to control consent time delay be 1s.Equipment consent head pressure in the range of
0bar to 4bar, the actual consent head pressure that controls is 3bar.Equipment vacuum engine pressure is in the range of 0bar extremely
1bar, the actual vacuum pump pressure that controls is 0.8bar.Equipment traversing consent head displacement is in the range of 15mm
To 100mm, the actual traversing consent head displacement that controls is 50mm.
S440, strikes off the liquid resin of substrate surface, i.e. scraper plate.Scraper plate can be by filling holes with resin machine
Scraper realizes.
S450, removes the glued membrane on substrate.In one embodiment, can directly glued membrane be torn.Carry out
Before next step, the step of inspection can be increased.
S460, solidifies liquid resin, forms solid resin.Now have part solid resin and protrude from base
Plate surface.Not having in influential embodiment at glued membrane on solidification process, step S450 and step S460 are adjustable
Change.
After step S400 completes, can carry out being tested by slice analysis.During inspection, it is necessary to check
The plumpness of consent, uses whether present gloss shape on Radix Achyranthis Bidentatae sem observation hole, does slice analysis, really after solidification
Protect the planarization in hole bubble-free, be full of cracks, cavity and the aperture filled in.
S500, the solid resin polishing that will protrude above substrate surface is evened out.Before carrying out next step, permissible
Increase the step checked, to guarantee that substrate surface is the most smooth.
S600, carries out second time electroless copper plating to the surface of the solid resin on substrate, makes solid resin close
It is enclosed in through hole.
S700, carries out second time and electroplates substrate.Second time plating can be imposite plating, it is also possible to according to
Need to carry out parcel plating.Step S700 can be decided whether according to the needs of subsequent handling step.
Being filled in by liquid resin in through hole, consent plumpness is high, bubble, Testudinis occurs in therefore can avoiding hole
Split, cavity etc. bad phenomenon.Solid resin polishing carries out second time electroless copper plating after evening out, the most permissible
Make solid resin fully tamp through hole, on the other hand solid resin be sealed in through hole, good water-proof effect,
Effectively reduce circuit board in the processing procedure of downstream or use in non-water-tight risk.
Referring also to Fig. 3, in one embodiment, after step S700, it is also possible to comprise the steps:
S800, figure shifts.
S900, image plating:
S110, outer layer etches.
S120, welding resistance.Can test during carrying out before welding resistance.
After step S120, it is also possible to include that text printout, surface process and the step of terminal test.
Referring to Fig. 4, Fig. 4 is 8 layers of aperture just having used the manufacture method of foregoing circuit plate to be formed around board
For the terrace cut slice figure of the cable-through hole of 0.3mm, in hole, resin (at the A in Fig. 4) filled in effect is preferable,
Without be full of cracks, bubble or cavity, aperture is more smooth, and without serious depression, waterproof action is good.
As it is shown in figure 5, the circuit board 100 of an embodiment includes substrate 110, implant the 120, first bronze medal
Layer 130 and the second layers of copper 140.Foregoing circuit plate 100 is by the manufacture method manufacture of foregoing circuit plate 100
Become.It is provided with conductive layer 112 in substrate 110, substrate 110 offers both sides logical of connection substrate 110
Hole.Implant 120 is filled in through hole.In one embodiment, the liquid tree after implant 120 is solidification
Fat.Being filled in by liquid resin in through hole, consent plumpness is high, bubble, Testudinis occurs in therefore can avoiding hole
Split, cavity etc. bad phenomenon.
First layers of copper 130 between implant 120 and the inwall of through hole, the first layers of copper 130 and conductive layer
112 connections.First layers of copper 130 can be formed by electroless copper plating for the first time.Second layers of copper 140 covers through hole
Opening, make implant 120 be sealed in through hole.The second layers of copper 140 is formed by second time electroless copper plating,
On the one hand solid resin can be made fully to tamp through hole, on the other hand solid resin is sealed in through hole, anti-
Water is effective, effectively reduce circuit board 100 in the processing procedure of downstream or use in non-water-tight risk.
Each technical characteristic of embodiment described above can combine arbitrarily, for making description succinct, the most right
The all possible combination of each technical characteristic in above-described embodiment is all described, but, if these skills
There is not contradiction in the combination of art feature, is all considered to be the scope that this specification is recorded.
Embodiment described above only have expressed the several embodiments of the present invention, and it describes more concrete and detailed,
But can not therefore be construed as limiting the scope of the patent.It should be pointed out that, for this area
For those of ordinary skill, without departing from the inventive concept of the premise, it is also possible to make some deformation and change
Entering, these broadly fall into protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be with appended power
Profit requires to be as the criterion.
Claims (10)
1. the manufacture method of a circuit board, it is characterised in that comprise the steps:
Substrate is holed, forms the through hole of the both sides of connection substrate；
Substrate after boring is carried out for the first time electroless copper plating, makes through hole electrically conduct the both sides of substrate；
Carry out the substrate after first time electroless copper plating electroplating for the first time；
Fill in liquid resin in through hole after plating for the first time, and liquid resin is cured as solid resin；
The solid resin polishing that will protrude above substrate surface is evened out；And
The surface of the solid resin on substrate is carried out second time electroless copper plating, makes solid resin be sealed in logical
In hole.
The manufacture method of circuit board the most according to claim 1, it is characterised in that described to substrate
On the surface of solid resin carry out second time electroless copper plating, make the step that solid resin is sealed in through hole
Afterwards, also include substrate carries out the step that second time is electroplated.
The manufacture method of circuit board the most according to claim 2, it is characterised in that electricity of described first time
Plating and the plating of described second time are imposite plating.
The manufacture method of circuit board the most according to claim 2, it is characterised in that described to substrate
After carrying out the step that second time is electroplated, also include figure transfer, image plating, outer layer etching and welding resistance
Step.
The manufacture method of circuit board the most according to claim 1, it is characterised in that the hole of described through hole
Footpath is 0.2mm to 0.4mm.
6. according to the manufacture method of the circuit board described in any one of claim 1 to 5, it is characterised in that institute
Fill in liquid resin in stating the through hole after plating for the first time, and liquid resin is cured as the step of solid resin
Suddenly, comprise the steps:
Polish-brush removes the foreign material of substrate surface；
Substrate is coated with glued membrane；
Consent is carried out by vacuum taphole machine；
Strike off the liquid resin of substrate surface；
Remove the glued membrane on substrate；And
Liquid resin is solidified, forms solid resin.
The manufacture method of circuit board the most according to claim 6, it is characterised in that described vacuum taphole
The consent pressure of machine is 2bar to 4bar；It is 8mm/s to 12mm/s that traversing consent head moves down speed；Traversing
Moving speed on consent head is 60mm/s to 100mm/s；Consent time delay is 0.5s to 1.5s；Consent head pressure
Power is 2bar to 4bar；Vacuum pump pressure is 0.6bar to 1bar；Traversing consent head displacement is 40mm
To 60mm.
The manufacture method of circuit board the most according to claim 6, it is characterised in that described vacuum taphole
The control point of machine is consent plumpness 100%.
9. a circuit board, it is characterised in that include substrate, implant, the first layers of copper and the second layers of copper；
It is provided with conductive layer in described substrate, described substrate offers the through hole of the both sides connecting described substrate；
Described implant is filled in described through hole；
Described first layers of copper between the inwall of described implant and described through hole, described first layers of copper and institute
State conductive layer connection；
Described second layers of copper covers the opening of described through hole, makes described implant be sealed in described through hole.
Circuit board the most according to claim 9, it is characterised in that after described implant is solidification
Liquid resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510290845.3A CN106304629A (en) | 2015-05-29 | 2015-05-29 | Circuit board and manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510290845.3A CN106304629A (en) | 2015-05-29 | 2015-05-29 | Circuit board and manufacture method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106304629A true CN106304629A (en) | 2017-01-04 |
Family
ID=57655659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510290845.3A Pending CN106304629A (en) | 2015-05-29 | 2015-05-29 | Circuit board and manufacture method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106304629A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109257885A (en) * | 2018-10-31 | 2019-01-22 | 广州兴森快捷电路科技有限公司 | Wiring board method for plugging and wiring board hole plugging equipment |
| CN109936917A (en) * | 2019-03-08 | 2019-06-25 | 广合科技（广州）有限公司 | A kind of smart home inductor wiring board and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7383770B2 (en) * | 2004-01-14 | 2008-06-10 | Tokai Shoji Co., Ltd. | Printing device for electronic parts having a roller and a squeegee arrangement |
| CN101662893A (en) * | 2009-09-04 | 2010-03-03 | 东莞美维电路有限公司 | Manufacturing method for printed wiring board with dense disk holes |
| CN103002672A (en) * | 2012-12-04 | 2013-03-27 | 南昌欧菲光科技有限公司 | Hole plugging device of base material and application thereof |
| CN104349589A (en) * | 2013-08-02 | 2015-02-11 | 北大方正集团有限公司 | Printed circuit board and manufacturing methods of printed circuit board and plate hole of printed circuit board |
| CN104427767A (en) * | 2013-08-27 | 2015-03-18 | 江苏同昌电路科技有限公司 | Circuit board manufacturing process and resin hole plugging process |
-
2015
- 2015-05-29 CN CN201510290845.3A patent/CN106304629A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7383770B2 (en) * | 2004-01-14 | 2008-06-10 | Tokai Shoji Co., Ltd. | Printing device for electronic parts having a roller and a squeegee arrangement |
| CN101662893A (en) * | 2009-09-04 | 2010-03-03 | 东莞美维电路有限公司 | Manufacturing method for printed wiring board with dense disk holes |
| CN103002672A (en) * | 2012-12-04 | 2013-03-27 | 南昌欧菲光科技有限公司 | Hole plugging device of base material and application thereof |
| CN104349589A (en) * | 2013-08-02 | 2015-02-11 | 北大方正集团有限公司 | Printed circuit board and manufacturing methods of printed circuit board and plate hole of printed circuit board |
| CN104427767A (en) * | 2013-08-27 | 2015-03-18 | 江苏同昌电路科技有限公司 | Circuit board manufacturing process and resin hole plugging process |
Non-Patent Citations (1)
| Title |
|---|
| PENGFEI220751: "真空树脂塞孔知识培训", 《百度文库：HTTPS://WENKU.BAIDU.COM/VIEW/F073E780B9D528EA81C77939.HTML》 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109257885A (en) * | 2018-10-31 | 2019-01-22 | 广州兴森快捷电路科技有限公司 | Wiring board method for plugging and wiring board hole plugging equipment |
| CN109257885B (en) * | 2018-10-31 | 2020-03-27 | 广州兴森快捷电路科技有限公司 | Circuit board hole plugging method and circuit board hole plugging equipment |
| CN109936917A (en) * | 2019-03-08 | 2019-06-25 | 广合科技（广州）有限公司 | A kind of smart home inductor wiring board and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103796449B (en) | The manufacture method of high thickness to diameter ratio wiring board plated hole consent | |
| US9005456B2 (en) | Method for manufacturing printed circuit board | |
| CN107241876B (en) | A kind of no core plate single side is sunken cord the processing method of printed circuit board | |
| CN107484356A (en) | A kind of preparation method of the sandwich aluminium base of thick copper | |
| CN106717137A (en) | Embedded traces | |
| CN101868122A (en) | PCB manufacturing process and hole plugging process thereof | |
| CN106304629A (en) | Circuit board and manufacture method thereof | |
| CN105122956B (en) | Semi-finished product for producing printed circuit board and the method for producing it | |
| CN105228375A (en) | A kind of manufacture method of flexible and hard combined circuit board filling holes with resin | |
| CN110402026A (en) | Wiring board and its screen printing method | |
| CN107835590A (en) | A kind of preparation method of buried via hole circuit board | |
| JP6305578B2 (en) | Conductive path structure with plastic injection coating and manufacturing method of conductive path structure with plastic injection coating | |
| US20150212114A1 (en) | Printed Circuits With Sacrificial Test Structures | |
| CN108541339B (en) | Metal wiring repairing method | |
| CN105359633B (en) | The electronic component electrical connection that will be embedded in printed circuit board and the method for rewiring | |
| CN107949188A (en) | Connect the circuit board processing method in hole with NPTH | |
| CN108575056A (en) | flexible circuit board manufacturing method | |
| CN110944454A (en) | Circuit board production process | |
| CN207097810U (en) | Packaging system and its carrying board structure | |
| CN106971982B (en) | Redistributing layer structure | |
| CN104968158A (en) | Thick copper foil fine line fine pitch circuit board outer line processing method | |
| US10910300B1 (en) | Method for manufacturing interposer | |
| CN101360398B (en) | Circuit board construction of inner fovea type conductive column and preparation thereof | |
| CN103855099A (en) | Substrate structure with component arrangement area and manufacturing technology thereof | |
| CN107591381A (en) | The manufacture method of circuit redistribution structure and circuit redistribution structure unit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170104 |