CN106303504B - image sensor testing device - Google Patents
image sensor testing device Download PDFInfo
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- CN106303504B CN106303504B CN201510287202.3A CN201510287202A CN106303504B CN 106303504 B CN106303504 B CN 106303504B CN 201510287202 A CN201510287202 A CN 201510287202A CN 106303504 B CN106303504 B CN 106303504B
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- pedestal
- outer region
- image sensor
- testing device
- probe
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Abstract
The present invention about a kind of image sensor testing device, including：One measuring head, a probe base, a light transmission piece and a pedestal.Measuring head has a test carrier plate；Probe base is fixedly arranged on test carrier plate, is had：One has the pedestal of multiple perforations, an insulation upper cover, an insulation lower cover and multiple probes；Insulation upper cover and the lower cover that insulate are fixedly arranged on the upper and lower surface of pedestal respectively, correspondence is located in multiple perforations multiple probes respectively, pedestal is in circular ring shape, include an endocyclic area and an outer region, endocyclic area forms a hollow port and is installed with a supporting part, and multiple probes are located in outer region.Light transmission piece is sheathed on supporting part；Pedestal has a probe card being electrically connected with multiple probes.Wherein, the outer region of pedestal has an at least interconnection to connect an extraneous compressed dry air to the room temperature area of hollow port, and compressed dry air enters to upper and lower two end of outer region, to the test carrier plate of dry measuring head and the probe card of pedestal.
Description
Technical field
The present invention relates to a kind of test device, espespecially a kind of test for being suitable for image sensor (Image Sensor)
Device.
Background technology
It is existing semiconductor test apparatus stereogram please refer to Fig. 1 and Fig. 2, Fig. 1, Fig. 2 is the measuring head position of Fig. 1
Schematic diagram when location A.Semiconductor test device 1 is shown in figure, semiconductor test apparatus 1 has a measuring head
(tester head) 11, and there is a test carrier plate (load board) 111, and in group on test carrier plate 111 on measuring head 11
Equipped with a probe base (pogo tower) 10.Wherein, probe base 10 is mainly by a probe probe card 12 in electrical contact, and to base
Wafer to be measured, semiconductor element or other electronic component (not shown) on seat 13 are tested.
Traditionally, the low-temperature test of image sensor (Image Sensor) is carried out using above-mentioned semiconductor test apparatus 1
When, for fear of kelvin relation high caused by light source, the excessive temperature differentials of high/low temperature can be caused, easily generate machinery equipment on condensate with
Frost so under conditions of low temperature, can not carry out the image test of irradiation.
During to solve to make low-temperature test, condensate and frost are easily generated in above-mentioned machinery equipment, it is existing to make low temperature survey
It is that a partition board is set in probe base 10 during examination, the phenomenon that reduce condensate and frosting, but partition board can cause light source to be isolated, certain
A little functional test projects can not then perform, not very good, still there is improved space.
Invention popularity is because in this, this urgently thinks one kind and can solve the above problem " image in the spirit of positive invention creation
Sensor detector ", several times research experiment is of the invention to completing eventually.
Invention content
The main object of the present invention is to provide a kind of image sensor testing device, to pass through the extraneous pressure of introduction
Contracting dry air enters the room temperature area of probe base, and when can effectively solve to perform low-temperature test, probe base easily generates condensate and frosting
The phenomenon that.In addition, the compressed dry air can also be used while dry test carrier plate and probe card, test carrier plate and probe card are prevented
Circuit board is burnt due to humidity.
It is another object of the present invention to provide a kind of image sensor testing device, so as to can be visible by penetrating human eye
The optical glass of spectrum can carry out the test event of specific irradiation image at low ambient temperatures.
To reach above-mentioned purpose, image sensor testing device of the invention, including：One measuring head (Tester Head),
One probe base (Pogo Tower), a light transmission piece and a pedestal.Measuring head has a test carrier plate (Load Board).Probe base
It is fixedly arranged on the test carrier plate, has：One has the pedestal of multiple perforations, an insulation upper cover, an insulation lower cover and multiple probes；
Insulation upper cover and the lower cover that insulate are fixedly arranged on the upper and lower surface of pedestal respectively, and correspondence is located in the multiple of pedestal to multiple probes respectively
In perforation, pedestal is in circular ring shape, includes an endocyclic area and an outer region, and the endocyclic area one hollow port of formation is simultaneously solid
Equipped with a supporting part, multiple probes are located in the outer region.Light transmission piece is sheathed on the supporting part of endocyclic area；Pedestal has
One probe card being electrically connected with multiple probe (Probe Card).Wherein, the outer region of pedestal has at least one laterally to lead to
To connect an extraneous compressed dry air to the room temperature area of the hollow port, which enters to the outer region in road
Upper and lower two end, to the test carrier plate of dry measuring head and the probe card of pedestal.
Above-mentioned light transmission piece is the light transmission piece of a visible spectrum, so that Cryogenic air can be completely cut off by this optical glass, and
And the image test condition of irradiation can be reached.
Above-mentioned outer region has an at least interconnection, is six interconnections, and be angularly located on the outer region
On, so that compressed dry air can be made to be uniformly distributed in the room temperature area of hollow port.
Above-mentioned outer region also has an at least annular channel, and at least an interconnection connects with this, compresses dry sky to increase
The circulation area of gas, so that condensed water is effectively prevent to be generated between test carrier plate and probe card.
Above-mentioned supporting part is located on the inner surface of the endocyclic area, light transmission piece firmly to be fixed on endocyclic area
On.
Above-mentioned outer region have at least to channel, at least an interconnection connects with this always, this often passed through always to channel
Insulation upper cover and insulation lower cover are worn, a large amount of compressed dry airs to be accelerated to import the test carrier plate of measuring head and the probe card of pedestal,
Condensed water is more can effectively prevent to generate between test carrier plate and probe card.
Description of the drawings
Fig. 1 is the stereogram of existing semiconductor testing apparatus.
Fig. 2 is the schematic diagram when measuring head of Fig. 1 is located at location A.
Fig. 3 is the image sensor testing device floor map of the first preferred embodiment of the invention.
Fig. 4 is the probe base enlarged partial sectional view of the first preferred embodiment of the invention.
Fig. 5 is the pedestal top view of the probe base of the first preferred embodiment of the invention.
Fig. 6 is the probe base enlarged partial sectional view of the second preferred embodiment of the invention.
Fig. 7 is the pedestal top view of the probe base of third preferred embodiment of the present invention.
Symbol description
1 semiconductor test apparatus, 10 probe base
11 measuring head, 111 test carrier plate
12 probe card, 13 pedestal
2 image sensor testing device, 20,50 probe base
21 measuring head, 211 test carrier plate
23 pedestal, 231 probe card
30,55,60 pedestal, 31,61 perforation
32,56,62 interconnection, 35 supporting part
41, the 51 insulation insulation lower covers of upper covers 42,52
45 probe, 48 light transmission piece
57 directly to 63 annular channel of channel
I endocyclic area O outer regions
T1 room temperature area T2 high and low temperatures test section
Specific embodiment
Fig. 3, Fig. 4 and Fig. 5 are please referred to, the image sensor testing device of the first preferred embodiment respectively of the invention is put down
The pedestal top view of face schematic diagram, probe base enlarged partial sectional view and probe base.The image sensor test dress of the present embodiment
2 are put to include：One measuring head 21 (Tester Head), a probe base 20 (Pogo Tower), a light transmission piece 48 and one have one
The pedestal 23 of probe card 231 (Probe Card).
Measuring head 21 has a test carrier plate 211 (Load Board)；Probe base 20 is fixedly arranged on test carrier plate 211, is visited
Needle stand 20 includes：One has insulation upper cover 41, the one insulation lower cover 42 of pedestal 30, one of multiple perforations 31 and multiple probes 45.
Wherein, the upper cover 41 that insulate and the lower cover 42 that insulate are fixedly arranged on the upper and lower surface of pedestal 30 respectively, and correspondence is installed with multiple probes 45 respectively
In in multiple perforations 31, and the pedestal 30 includes an an endocyclic area region I and outer region O, the interior ring region in circular ring shape
Domain I forms a hollow port and is installed with a supporting part 35, and multiple probe 45 is located in the O of the outer region.
In addition, light transmission piece 48 is sheathed on the supporting part 35 of the endocyclic area I of pedestal 30；The probe card 231 of pedestal 23
(Probe Card) is electrically connected with multiple probes 45 of probe base 20.
In the present embodiment, supporting part 35 is located on the inner surface of the endocyclic area I of the pedestal 30, so as to can firmly by
Light transmission piece 48 is fixed on the endocyclic area I of pedestal 30.In addition, it is visible for one to be sheathed on light transmission piece 48 on the supporting part 35 of pedestal 30
The light transmission piece 48 of spectrum, so that by the light transmission piece 48 of this optical glass Cryogenic air can be completely cut off, and can reach irradiation
Image test condition.
In general, the endocyclic area I of its pedestal 30 of the image sensor testing device 2 of the present embodiment is to belong to room temperature area
T1, and 30 lower section of pedestal then belongs to high and low temperature test section T2.As shown in figure 3, the image sensor testing device 2 of the present embodiment is
An extraneous compressed dry air is introduced to the room temperature area T1 of the hollow port of the endocyclic area I of pedestal 30, that is, introduces the external world
Compressed dry air enters the room temperature area T1 of the pedestal 30 of probe base 20, and when can effectively solve to perform low-temperature test, probe base 20 holds
The phenomenon that being also easy to produce condensate and frosting.And the compressed dry air in the external world enters to the outer region O of the pedestal 30 of probe base 20
Upper and lower two end, can be used to the test carrier plate 211 of dry measuring head 21 and the probe card 231 of pedestal 23, prevent test carrier plate
211 and probe card 231 circuit board because humidity due to burn.
As shown in figure 5, the outer region O of pedestal 30 has an at least interconnection 32, the compression to connect extraneous is done
Air to the endocyclic area I of pedestal 30 hollow port room temperature area T1.In the present embodiment, this at least an interconnection 32 refers to
Six interconnections 32, and six interconnection 32 is the outer region O for being angularly located on pedestal 30, that is, is equipped with every 60 degree
One interconnection 32.
The present embodiment enters the room temperature area T1 of probe base 20 by introducing extraneous compressed dry air as a result, can effectively solve
When certainly performing image sensor low-temperature test, probe base 20 easily generates condensate and the phenomenon that frosting.In addition, the compression can also be used
Dry air while dry test carrier plate 211 and probe card 231, can prevent test carrier plate 211 and the circuit board of probe card 231 because of tide
It is wet and burn.In addition, the light transmission piece 48 of the present embodiment is to belong to the optical glass that can penetrate human eye visible spectrum, therefore image sensor
Test device 2 can also carry out the test event of the specific irradiation image of image sensor at low ambient temperatures.
The probe base enlarged partial sectional view that Fig. 6 is the second preferred embodiment of the invention is please referred to, and also referring to Fig. 3
With Fig. 5.The present embodiment is roughly the same with the structure of first embodiment, and difference is only that the outer zone of the pedestal 55 of the present embodiment
Domain O separately has multiple directly connected to channel 57 with interconnection 56, and per always to channel 57 through insulation upper cover 51 and insulation
Lower cover 52.
In details of the words, the measuring head 21 of the present embodiment has a test carrier plate 211 (Load Board)；Probe base 50 is fixed
In on test carrier plate 211, probe base 50 includes：One pedestal 55, one with multiple perforations 31 insulate under the insulation of upper cover 51, one
Lid 52 and multiple probes 45.Wherein, the upper cover 51 that insulate and the lower cover 52 that insulate are fixedly arranged on the upper and lower surface of pedestal 55 respectively, multiple
Correspondence is located in multiple perforations 31 probe 45 respectively, and the pedestal 55 includes an endocyclic area I and an outer shroud in circular ring shape
Region O, endocyclic area I form a hollow port and are installed with a supporting part 35, and multiple probe 45 is located at outer region O
It is interior.The present embodiment is compared with first embodiment because having multiple directly connected to channel 57 with interconnection 56, and per always to channel 57
Through insulation upper cover 51 and insulation lower cover 52, a large amount of compressed dry airs can be accelerated to import the test carrier plate 211 and base of measuring head 21
The probe card 231 of seat 23, more can effectively prevent condensed water and is generated between test carrier plate 211 and probe card 231, avoided therebetween
Circuit board is burnt due to humidity.
Please refer to the pedestal top view that Fig. 7 is the probe base of third preferred embodiment of the present invention, and also referring to Fig. 3 with
Fig. 4.The present embodiment is roughly the same with the structure of first embodiment, and difference is only that the outer region of the pedestal 60 of the present embodiment
O is simultaneously connected with three annular channels 63 with six interconnection 62.
In details of the words, the outer region O of the pedestal 60 of the present embodiment has at least six interconnections 62, to connect the external world
Compressed dry air to pedestal 60 endocyclic area I hollow port room temperature area T1.On pedestal 60 in addition to multiple perforations 61,
And connected with three annular channels 63 with six interconnection 62, the circulation area of compressed dry air can be increased, and then effectively anti-
Only condensed water generates between test carrier plate 211 and probe card 231, and circuit board therebetween is avoided to be burnt due to humidity.
It is only for the sake of illustration for above-described embodiment, and the interest field that the present invention is advocated certainly should be with right
Subject to described in claimed range, not just the above examples.
Claims (6)
1. a kind of image sensor testing device, it is characterised in that including：
One measuring head has a test carrier plate；
One probe base is fixedly arranged on the test carrier plate, includes：One has the pedestal of multiple perforations, an insulation upper cover, an insulation
Lower cover and multiple probes, the insulation upper cover and the insulation lower cover are fixedly arranged on the upper and lower surface of the pedestal, multiple probe point respectively
It Dui Ying not be located in multiple perforation, which is in circular ring shape, includes an endocyclic area and an outer region, the interior ring region
Domain forms a hollow port and is installed with a supporting part, and multiple probe is located in the outer region；
One light transmission piece is the light transmission piece of a visible spectrum, is sheathed on the supporting part；
One pedestal has a probe card being electrically connected with multiple probe；Wherein, which has an at least interconnection
To connect an extraneous compressed dry air to the room temperature area of the hollow port, which enters to the outer region
Upper and lower two end, to the dry test carrier plate and the probe card.
2. image sensor testing device as described in claim 1, which is characterized in that an at least interconnection is lateral for six
Channel, and angularly it is located on the outer region.
3. image sensor testing device as described in claim 1, which is characterized in that the supporting part is located on the endocyclic area
Inner surface.
4. image sensor testing device as described in claim 1, which is characterized in that the outer region have at least always to
At least an interconnection connects channel with this, this is per always to channel through the insulation upper cover.
5. image sensor testing device as claimed in claim 4, which is characterized in that this is per always to channel through the insulation
Lower cover.
6. image sensor testing device as described in claim 1, which is characterized in that the outer region has at least one ring-type
At least an interconnection connects channel with this.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510287202.3A CN106303504B (en) | 2015-05-29 | 2015-05-29 | image sensor testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510287202.3A CN106303504B (en) | 2015-05-29 | 2015-05-29 | image sensor testing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106303504A CN106303504A (en) | 2017-01-04 |
| CN106303504B true CN106303504B (en) | 2018-06-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510287202.3A Active CN106303504B (en) | 2015-05-29 | 2015-05-29 | image sensor testing device |
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| Country | Link |
|---|---|
| CN (1) | CN106303504B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7129261B2 (en) * | 2018-07-27 | 2022-09-01 | キオクシア株式会社 | test equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101424705A (en) * | 2007-10-29 | 2009-05-06 | 京元电子股份有限公司 | Probe column, wafer testing seat and wafer testing system |
| CN101650374A (en) * | 2008-08-12 | 2010-02-17 | 中茂电子(深圳)有限公司 | Semiconductor component test base provided with temperature-changing device and test machine platform |
| CN101738575A (en) * | 2008-11-11 | 2010-06-16 | 京元电子股份有限公司 | Integrated card (IC) tester capable of changing with different probe cards |
| CN101968518A (en) * | 2009-07-27 | 2011-02-09 | 京元电子股份有限公司 | Semiconductor testing apparatus with concentric probe seats |
-
2015
- 2015-05-29 CN CN201510287202.3A patent/CN106303504B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101424705A (en) * | 2007-10-29 | 2009-05-06 | 京元电子股份有限公司 | Probe column, wafer testing seat and wafer testing system |
| CN101650374A (en) * | 2008-08-12 | 2010-02-17 | 中茂电子(深圳)有限公司 | Semiconductor component test base provided with temperature-changing device and test machine platform |
| CN101738575A (en) * | 2008-11-11 | 2010-06-16 | 京元电子股份有限公司 | Integrated card (IC) tester capable of changing with different probe cards |
| CN101968518A (en) * | 2009-07-27 | 2011-02-09 | 京元电子股份有限公司 | Semiconductor testing apparatus with concentric probe seats |
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| Publication number | Publication date |
|---|---|
| CN106303504A (en) | 2017-01-04 |
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