CN106298864B - A kind of OLED display panel and preparation method thereof, method of testing - Google Patents
A kind of OLED display panel and preparation method thereof, method of testing Download PDFInfo
- Publication number
- CN106298864B CN106298864B CN201610974719.4A CN201610974719A CN106298864B CN 106298864 B CN106298864 B CN 106298864B CN 201610974719 A CN201610974719 A CN 201610974719A CN 106298864 B CN106298864 B CN 106298864B
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- adhesive tape
- display panel
- conductive
- oled display
- conductive adhesive
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
Abstract
The embodiment of the present invention provides a kind of OLED display panel and preparation method thereof, method of testing, is related to display technology field, can avoid during making OLED display panel, the scratch to circuit.The OLED display panel includes array base palte and encapsulation cover plate, and the array base palte includes viewing area and peripheral wiring region；The peripheral wiring region includes the conductive adhesive tape for being arranged on the circuit at the array base palte edge and being arranged on above the circuit；The direction extension on side of the conducting resinl along the close viewing area；Wherein, the conductive adhesive tape is conductive in z-direction, non-conductive on X, Y plane；The substrate of the vertical array base palte of the Z-direction.For OLED display.
Description
Technical field
The present invention relates to display technology field, more particularly to a kind of OLED display panel and preparation method thereof, method of testing.
Background technology
Organic electroluminescent LED (Organic Light Emitting Diode, abbreviation OLED) display is a kind of
Electroluminescent device of organic thin film, it has the advantages that, and preparation technology is simple, cost is low, easily formation flexible structure, visual angle is wide.Cause
This, the Display Technique of organic electroluminescent LED turns into a kind of important Display Technique.
OLED display includes array base palte and package substrate, and array base palte includes thin film transistor (TFT) (Thin Film
Transistor, abbreviation TFT) and the OLED luminescent devices that are made up of anode, organic material functional layer and negative electrode.It is wherein organic
Material function layer need to be formed by evaporation process.
Because, it is necessary to use mask plate, and mask plate is during contraposition easily in array substrate during evaporation
Circuit positioned at peripheral wiring region and close to the array base palte edge causes scratch, so as to cause to OLED display panel
When carrying out lighting test, there is concealed wire bad phenomenon.In addition, in encapsulation, according to the mode of Metal Packaging, during contraposition
Metal film edge is also easy on scratch array base palte positioned at peripheral wiring region and close to the circuit at the array base palte edge.
The content of the invention
Embodiments of the invention provide a kind of OLED display panel and preparation method thereof, method of testing, can avoid making
During OLED display panel, the scratch to circuit.
To reach above-mentioned purpose, embodiments of the invention adopt the following technical scheme that：
First aspect, there is provided a kind of OLED display panel, including array base palte and encapsulation cover plate, the array base palte include
Viewing area and peripheral wiring region；The peripheral wiring region includes being arranged on the circuit at the array base palte edge and is arranged on
Conductive adhesive tape above the circuit；The direction extension on side of the conductive adhesive tape along the close viewing area；Wherein, it is described
Conductive adhesive tape is conductive in z-direction, non-conductive on X, Y plane；The substrate of the vertical array base palte of the Z-direction.
Preferably, the peripheral wiring region also includes the conducting resinl being arranged between the conductive adhesive tape and the viewing area
Block；The conductive blob of viscose is arranged between the adjacent wire of the circuit.
Preferably, the thickness of the conductive adhesive tape is between 20~100 μm；Or the conductive adhesive tape and the conduction
The thickness of blob of viscose is identical, and between 20~100 μm.
Preferably, the width of the conductive adhesive tape is between 1~2mm.
Preferably, the material of conducting resinl includes resin, the conducting particles and insulating particle being entrained in the resin, described
Conducting particles and the insulating particle are uniformly distributed；Or the material of conducting resinl includes resin and is entrained in the resin
Conducting particles, the conducting particles wrapped up by insulating barrier.
It is further preferred that the conducting particles includes Ag particles, at least one of Cu particles and Ni particles.
Preferably, the conductive adhesive tape is arranged within the encapsulation cover plate；Or the conductive adhesive tape be arranged on it is described
Beyond encapsulation cover plate.
Second aspect, there is provided a kind of preparation method of OLED display panel, the OLED display panel include array base palte
And encapsulation cover plate, the array base palte include viewing area and peripheral wiring region；The peripheral wiring region includes being formed in the battle array
Circuit of the row substrate at marginal position and formed by way of inkjet printing or coating and printing on the circuit
The conductive adhesive tape of side；The direction extension on side of the conductive adhesive tape along the close viewing area；Wherein, the conductive adhesive tape exists
It is conductive in Z-direction, it is non-conductive on X, Y plane；The substrate of the vertical array base palte of the Z-direction.
Preferably, the preparation method of OLED display panel also includes by dispensing mode, the conductive adhesive tape with it is described
Conductive blob of viscose is formed between viewing area；The conductive blob of viscose is located between the adjacent wire of the circuit.
The third aspect, there is provided a kind of method of testing of OLED display panel, including：Metal probe and the OLED are shown
The conductive adhesive tape contact of panel, carries out lighting test to the OLED display panel.
The embodiment of the present invention provides a kind of OLED display panel and preparation method thereof, method of testing, by array base palte
Peripheral wiring region and positioned at array base palte edge circuit above set conductive adhesive tape, using the thickness of conductive adhesive tape, make
There is certain interval in the circuit, so that being deposited or making in z-direction with metal film when mask plate or Metal Packaging
During with Metal Packaging, mask plate or metal film during contraposition will not scratch be located at peripheral wiring region and close to the array
The circuit of substrate edges, hereby it is ensured that the normal work of the circuit, and then avoid carrying out lighting survey to OLED display panel
During examination, there is concealed wire bad phenomenon.Wherein,, can not in Z-direction beam conduction by making conductive adhesive tape non-conductive in X, Y plane
Influence the test carried out by circuit to the OLED display panel.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is a kind of schematic top plan view one of OLED display panel provided in an embodiment of the present invention；
Fig. 2 is a kind of schematic cross-sectional view of OLED display panel provided in an embodiment of the present invention；
Fig. 3 is a kind of schematic top plan view two of OLED display panel provided in an embodiment of the present invention；
Fig. 4 is a kind of schematic top plan view three of OLED display panel provided in an embodiment of the present invention；
Fig. 5 is a kind of schematic top plan view four of OLED display panel provided in an embodiment of the present invention.
Reference：
01- array base paltes；02- viewing areas；03- peripheries wiring region；04- encapsulation cover plates；10- substrates；21- anodes；22- has
Machine material function layer；23- negative electrodes；24-TFT；30- circuits；40- conductive adhesive tapes；41- conduction blob of viscoses.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
The embodiment of the present invention provides a kind of OLED display panel, as depicted in figs. 1 and 2, including array base palte 01 and encapsulation
Cover plate 04, array base palte 01 include viewing area 02 and peripheral wiring region 03；Peripheral wiring region 03 includes being arranged on array base palte 01
The circuit 30 at edge and the conductive adhesive tape 40 for being arranged on the top of circuit 30；The conductive adhesive tape 40 is along described in close
The direction extension on the side of viewing area 02；Wherein, conductive adhesive tape 40 is conductive in z-direction, non-conductive on X, Y plane；Z-direction is hung down
The substrate 10 of the straight array base palte 01.
Viewing area 02 includes multiple sub-pixels, as shown in Fig. 2 each sub-pixel can include setting over the substrate 10
TFT24 and the anode 21 electrically connected with TFT24 drain electrode, organic material functional layer 22 and negative electrode above anode 21
23。
Organic material functional layer 22 can include luminescent layer, electron transfer layer and hole transmission layer, on this basis in order to
The efficiency of electronics and hole injection luminescent layer can be improved, organic material functional layer 22 can also further include being arranged on negative electrode
Electron injecting layer between 23 and electron transfer layer, and the hole injection layer being arranged between hole transmission layer and anode 21.
Wherein, TFT24 can be non-crystalline silicon tft, multi-crystal TFT, metal oxide TFT, organic tft etc..It can be bottom
Grid-type or top gate type.
When anode 21 and all printing opacities of negative electrode 23, now the OLED display panel is double face display panel；When negative electrode 23 is saturating
Light, anode 21 is light tight, and now the OLED display panel is top light emitting display panel；When negative electrode 23 is light tight, anode 21 is saturating
Light, now the OLED display panel is bottom light emitting display panel.
It should be noted that first, because the present invention is mainly by setting conductive adhesive tape 40, to solve to be deposited organic material
Functional layer 22, or scratch during Metal Packaging to circuit 30 are expected, therefore, it will be recognized by those skilled in the art that conductive adhesive tape
40 should form after the circuit 30 is formed before evaporation organic material functional layer 22.
Second, the circuit 30 for being arranged on the peripheral wiring region 03 is not defined, such as can be TFT24 driving
Circuit etc..
3rd, the direction extension on side of the conductive adhesive tape 40 along the close viewing area 02, be：It is right with reference to shown in figure 1
Any side in viewing area 02, the bearing of trend of the conductive adhesive tape 40 of the side side is arranged on, it is consistent with the bearing of trend on the side.
Wherein, when being provided with the circuit 30 positioned at the peripheral wiring region 03 of the surrounding of viewing area 02, conductive adhesive tape 40
The surrounding of viewing area 02 is also disposed at, now, the conductive adhesive tape 40 can be connected as a single entity, or one section one section is independently arranged.
4th, in order to ensure that conductive adhesive tape 40 is conductive in z-direction, its specific insulation should be 0.1 × 10-3~1.5 ×
10-3Ω cm, such as specific insulation can be 10-3Ω·cm。
5th, as shown in Fig. 2 in order to which luminescent device is isolated with external environment, prevent moisture, pernicious gas etc. from influenceing
The performance of OLED display panel, using encapsulation technology by the anode 21 made on array base palte 01, negative electrode 23 and positioned at anode
Organic material functional layer 22 between 21 and negative electrode 23 is encapsulated in encapsulation cover plate 04, and encapsulation cover plate 04 can be metal film or glass
Glass substrate etc..
The embodiment of the present invention provides a kind of OLED display panel, by the peripheral wiring region 03 of array base palte 01 and position
Conductive adhesive tape 40 is set above the circuit 30 at the edge of array base palte 01, using the thickness of conductive adhesive tape 40, makes the circuit
30 have certain interval in z-direction with metal film when mask plate or Metal Packaging, so that being deposited or using metal
During encapsulation, mask plate or metal film during contraposition will not scratch be located at peripheral wiring region 03 and close to the array base palte
The circuit 30 at 01 edge, hereby it is ensured that the normal work of the circuit 30, and then avoid carrying out lighting to OLED display panel
During test, there is concealed wire bad phenomenon.Wherein, by making conductive adhesive tape 40 non-conductive in X, Y plane, in Z-direction beam conduction,
The test carried out by circuit 30 to the OLED display panel can not be influenceed.
In view of setting certain thickness conductive adhesive tape 40, it can both ensure circuit 30 with mask plate or metal film in Z-direction
On gap be present, without being scraped off, meanwhile, the thickness of conductive adhesive tape 40 will not cause shadow to the integral thickness of OLED display panel
Ring, it is therefore preferable that the thickness of conductive adhesive tape 40 is between 20~100 μm.
Example, the thickness of conductive adhesive tape 40 can be 40 μm, 50 μm, 60 μm, 80 μm.
Preferably, as shown in figure 3, peripheral wiring region 03 also includes being arranged on leading between conductive adhesive tape 40 and viewing area 02
Electric blob of viscose 41；Conductive blob of viscose 41 is arranged between the adjacent wire of circuit 30.
It should be noted that first, the width of conductive blob of viscose 41 is not defined, if ensure conductive blob of viscose 41 not with
The wiring contact of circuit 30.Conductive blob of viscose 41 can be formed by dispensing mode.
Second, in order to simplify technique, the material of conductive blob of viscose 41 is preferably identical with the material of conductive adhesive tape 40.
, can be further by setting conductive blob of viscose 41 between conductive adhesive tape 40 and viewing area 02 in the embodiment of the present invention
The circuit 30 on array base palte 01 positioned at peripheral wiring region 03 and close to the edge of negative electrode 23 is protected not to be scraped off.Wherein, conduction is worked as
When blob of viscose 41 is identical with the material of conductive adhesive tape 40, technique can be simplified.
It is further preferred that conductive adhesive tape 40 is identical with the thickness of conductive blob of viscose 41, and between 20~100 μm.
Preferably, the width of conductive adhesive tape 40 is between 1~2mm.So, circuit 30 and mask plate or metal film are being ensured
On the basis of certain interval being present in z-direction, process costs can be saved.
Above-mentioned conductive adhesive tape 40, or conductive adhesive tape 40 and conductive blob of viscose 41 are made of conducting resinl, based on this, it is preferred that
The material of conducting resinl includes resin, the conducting particles and insulating particle being entrained in the resin, conducting particles and insulating particle
It is uniformly distributed；Or the material of conducting resinl includes resin and the conducting particles being entrained in resin, conducting particles is by insulating barrier
Parcel.
Wherein, the resin can be epoxy resin.
Example, conducting resinl for example can be with anisotropic anisotropic conductive film (Anisotropic
Conductive Film, abbreviation ACF), conducting particles therein is uniformly distributed in binder, is not in contact with each other, and conducting particles
Surface wrapped up by insulating barrier, therefore ACF is nonconducting.
When applying pressure to ACF, the insulating barrier on conducting particles surface is crushed, along the direction conducting particles extruding of extruding
Together, and formed and turned on circuit 30, while be avoided that on X, Y plane between adjacent circuit 30 and turn on short circuit, and reached only
The purpose turned in z-direction.
In the embodiment of the present invention, by using conducting particles and insulating materials so that conducting resinl has leads in z-direction
Electricity, the property to insulate on X, Y plane.
In view of Ag particles, Cu particles and Ni particles, are good conductive materials, and cost is relatively low, therefore, the present invention
The preferred conducting particles of embodiment includes Ag particles, at least one of Cu particles and Ni particles.
Preferably, as shown in figure 4, conductive adhesive tape 40 is arranged within encapsulation cover plate 04；Or as shown in figure 5, conducting resinl
Bar 40 is arranged on beyond the encapsulation cover plate 04.
Herein, due to the size of encapsulation cover plate 04 conductive adhesive tape 40 smaller than array base palte 01, and being arranged on circuit 30
Positioned at the marginal position of array base palte 01, therefore conductive adhesive tape 40 may be packaged cover plate 04 and cover, positioned at encapsulation cover plate 04 with
It is interior, it is also possible to which that not packed cover plate 04 covers.
In the embodiment of the present invention, because manufacture craft is different, the relative position of conductive adhesive tape 40 and encapsulation cover plate 04 is not yet
Together, wherein, when conductive adhesive tape 40 is arranged within encapsulation cover plate 04, conductive adhesive tape 40 can also play a part of blocking water, right
Luminescent device plays certain protective role.
The embodiment of the present invention also provides a kind of preparation method of OLED display panel, as depicted in figs. 1 and 2, the OLED
Display panel includes array base palte 01 and encapsulation cover plate 04, and array base palte 01 includes viewing area 02 and peripheral wiring region 03；Periphery
Wiring region 03 includes being formed in circuit 30 of the array base palte 01 at marginal position and passes through inkjet printing or coating print
The conductive adhesive tape 40 that the mode of brush is formed above the circuit 30；The conductive adhesive tape 40 is along the viewing area 02 being adjacent to
The direction extension on side；Wherein, conductive adhesive tape 40 is conductive in z-direction, non-conductive on X, Y plane；Z-direction orthogonal array substrate
01 substrate 10.
It should be noted that after conducting resinl is by inkjet printing or coating and printing, also need to be heated, and then shape
Into conductive adhesive tape 40.
The embodiment of the present invention provides a kind of preparation method of OLED display panel, is connected up by the periphery in array base palte 01
Area 03 and the top of circuit 30 for being located at the edge of array base palte 01, conduction is formed by way of inkjet printing or coating and printing
Adhesive tape 40, using the thickness of conductive adhesive tape 40, make the circuit 30 with metal film when mask plate or Metal Packaging in Z-direction
On certain interval be present so that be deposited or using Metal Packaging when, mask plate or metal film will not during contraposition
Scratch is located at the circuit 30 at peripheral wiring region 03 and the close edge of array base palte 01, hereby it is ensured that the circuit 30
Normal work, so avoid to OLED display panel carry out lighting test when, there is concealed wire bad phenomenon.Wherein, by making to lead
Electric adhesive tape 40 is non-conductive in X, Y plane, in Z-direction beam conduction, can not influence by circuit 30 to the OLED display panel
The test of progress.
Preferably, as shown in figure 3, the preparation method of display panel also includes by dispensing mode, conductive adhesive tape 40 with
Conductive blob of viscose 41 is formed between viewing area 02；Conductive blob of viscose 41 is located between the adjacent wire of the circuit 30.
In the embodiment of the present invention, on the one hand, because conductive blob of viscose 41 is formed by dispensing mode, thus can avoid being deposited
During negative electrode 23, make negative electrode 23 that short circuit occur with conductive blob of viscose 41, on the other hand, formed between conductive adhesive tape 40 and viewing area 02
Conductive blob of viscose 41, can further protect on array base palte 01 positioned at peripheral wiring region 03 and close to the edge of negative electrode 23 circuit 30 not
It is scraped off.
Preferably, when conductive blob of viscose 41 is identical with the material of conductive adhesive tape 40, technique can so be simplified.
Wherein, conductive adhesive tape 40 and conductive blob of viscose 41 can be made of conducting resinl, based on this, it is preferred that the material of conducting resinl
Expect the conducting particles and insulating particle for including resin, being entrained in the resin, conducting particles and insulating particle are uniformly distributed；Or
Person, the material of conducting resinl includes resin and the conducting particles being entrained in resin, conducting particles are wrapped up by insulating barrier.
The embodiment of the present invention also provides a kind of method of testing of OLED display panel, including：By metal probe with it is described
The conductive adhesive tape 40 of OLED display panel is contacted, and the OLED display panel is carried out to light test.
Herein, because conductive adhesive tape 40 is conductive in z-direction, therefore even if the circuit 30 positioned at the edge of array base palte 01 exists
The lower section of conductive adhesive tape 40, does not interfere with the test to OELD display panels yet.Wherein, in test, metal probe can be made with leading
Electric adhesive tape 40 is contacted, and so, along Z-direction, metal probe can be connected by conductive adhesive tape 40 with circuit 30, so as to detect display
The luminous situation of panel.
The foregoing is only a specific embodiment of the invention, but protection scope of the present invention is not limited thereto, any
Those familiar with the art the invention discloses technical scope in, change or replacement can be readily occurred in, should all be contained
Cover within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (8)
1. a kind of OLED display panel, including array base palte and encapsulation cover plate, the array base palte includes viewing area and outer cloth
Line area；Characterized in that, the peripheral wiring region includes being arranged on the circuit at the array base palte edge, is arranged on the circuit
The conductive adhesive tape of top and the conductive blob of viscose being arranged between the conductive adhesive tape and the viewing area；The conductive adhesive tape
Direction along the side of the close viewing area extends, and the conductive blob of viscose is arranged between the adjacent wire of the circuit；
Wherein, the conductive adhesive tape is conductive in z-direction, non-conductive on X, Y plane；The vertical array base of the Z-direction
The substrate of plate.
2. OLED display panel according to claim 1, it is characterised in that the thickness of the conductive adhesive tape is in 20~100 μ
Between m；Or
The conductive adhesive tape is identical with the thickness of the conductive blob of viscose, and between 20~100 μm.
3. OLED display panel according to claim 1, it is characterised in that the width of the conductive adhesive tape 1~2mm it
Between.
4. OLED display panel according to claim 1, it is characterised in that the material of conducting resinl includes resin, is entrained in
Conducting particles and insulating particle in the resin, the conducting particles and the insulating particle are uniformly distributed；
Or the material of conducting resinl includes resin and the conducting particles being entrained in the resin, the conducting particles are exhausted
Edge layer is wrapped up.
5. OLED display panel according to claim 4, it is characterised in that the conducting particles includes Ag particles, Cu grains
At least one of son and Ni particles.
6. OLED display panel according to claim 1, it is characterised in that the conductive adhesive tape is arranged on the cap
Within plate；Or
The conductive adhesive tape is arranged on beyond the encapsulation cover plate.
7. a kind of preparation method of OLED display panel, the OLED display panel includes array base palte and encapsulation cover plate, described
Array base palte includes viewing area and peripheral wiring region；Characterized in that, the peripheral wiring region includes being formed in the array base
Circuit of the plate at marginal position, the conduction formed by way of inkjet printing or coating and printing above the circuit
Adhesive tape and the conductive blob of viscose formed by dispensing mode between the conductive adhesive tape and the viewing area；The conducting resinl
The direction extension on side of the bar along the close viewing area, the conductive blob of viscose are located between the adjacent wire of the circuit；
Wherein, the conductive adhesive tape is conductive in z-direction, non-conductive on X, Y plane；The vertical array base of the Z-direction
The substrate of plate.
A kind of 8. method of testing of the OLED display panel as described in claim any one of 1-6, it is characterised in that including：
Metal probe is contacted with the conductive adhesive tape of the OLED display panel, the OLED display panel is carried out to light survey
Examination.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610974719.4A CN106298864B (en) | 2016-11-04 | 2016-11-04 | A kind of OLED display panel and preparation method thereof, method of testing |
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| CN201610974719.4A CN106298864B (en) | 2016-11-04 | 2016-11-04 | A kind of OLED display panel and preparation method thereof, method of testing |
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| CN106298864A CN106298864A (en) | 2017-01-04 |
| CN106298864B true CN106298864B (en) | 2018-01-12 |
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| CN110047804B (en) * | 2019-04-30 | 2021-08-03 | 京东方科技集团股份有限公司 | Array substrate, manufacturing method, display panel and spliced screen |
| CN114185208B (en) * | 2021-12-21 | 2024-02-20 | 豪威半导体（上海）有限责任公司 | LCOS display and manufacturing method thereof |
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| KR102125464B1 (en) * | 2013-10-17 | 2020-06-23 | 삼성디스플레이 주식회사 | Display device having an anisotropic conductive film and manufactring method thereof |
| CN204010623U (en) * | 2014-07-29 | 2014-12-10 | 四川虹视显示技术有限公司 | A kind of OLED display is lighted proving installation |
| CN104253149A (en) * | 2014-09-25 | 2014-12-31 | 信利半导体有限公司 | OLED (Organic Light Emitting Diode) display |
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