CN106298602B - The interface sealing device of semiconductor interface unit - Google Patents
The interface sealing device of semiconductor interface unit Download PDFInfo
- Publication number
- CN106298602B CN106298602B CN201510297496.8A CN201510297496A CN106298602B CN 106298602 B CN106298602 B CN 106298602B CN 201510297496 A CN201510297496 A CN 201510297496A CN 106298602 B CN106298602 B CN 106298602B
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- sealing
- interface
- interface unit
- frame
- sealing frame
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
Abstract
The invention belongs to semicon industry wafer puddle development production technical field, specifically a kind of interface sealing device of semiconductor interface unit.The interface sealing device is set to the interface unit two sides interface portion connecting with TRACK and litho machine, including sealing baffle, sealing frame and driving device, wherein sealing baffle is set to the interface portion edge of interface unit, driving device is set on the frame of interface unit, sealing frame is set in the interface portion of interface unit and connect with driving device, and sealing frame is stretched out or retracted by interface unit two sides interface portion by the driving of driving device；When sealing frame is stretched out by interface portion and inner end is abutted with sealing baffle, outboard end is abutted with TRACK and litho machine, thus the gap between sealed interface unit two sides interface portion and TRACK and litho machine.The present invention prevents outside air from entering inside equipment, keeps clean environment inside equipment, it is ensured that wafer-process process carries out in the environment for meeting cleanliness.
Description
Technical field
The invention belongs to semicon industry wafer puddle development production technical field, specifically a kind of semiconductor interface
The interface sealing device of unit.
Background technique
In semiconductor fabrication, the requirement to bad border cleanliness is very high, real in TRACK (coating developing machine) and litho machine
In the production process of border, interface unit is needed to carry out the transmission of wafer between TRACK and litho machine.At this stage interface unit with
TRACK or litho machine connection side opening be it is open, directly sudden and violent leakage causes in equipment runs in external environment, external
Air is easy to pollute the environment inside equipment, seriously affects the performance of process.
Summary of the invention
In view of the above-mentioned problems, the purpose of the present invention is to provide a kind of interface sealing devices of semiconductor interface unit.It should
Device prevents outside air from entering inside equipment, keep equipment inside clean environment, it is ensured that wafer-process process meet it is clean
It is carried out in the environment of cleanliness.
To achieve the goals above, the invention adopts the following technical scheme:
A kind of interface sealing device of semiconductor interface unit, the interface sealing device are set to and TRACK and litho machine
The interface unit two sides interface portion of connection, including sealing baffle, sealing frame and driving device, wherein sealing baffle is set to interface
The interface portion edge of unit, the driving device are set on the frame of interface unit, and the sealing frame is set to interface unit
Interface portion in and connect with driving device, the sealing frame passes through the driving of driving device by interface unit two sides interface portion
It stretches out or retracts；When sealing frame is stretched out by interface portion and inner end is abutted with sealing baffle, outboard end and TRACK and photoetching
Machine abuts, thus the gap between sealed interface unit two sides interface portion and TRACK and litho machine.
The sealing frame includes sealing frame substrate, sealing frame bending edges and sealing rubber strip, wherein the one of sealing frame substrate
Lateral edge is circumferentially with sealing frame bending edges, and the sealing rubber strip is set on sealing frame bending edges, the driving device with it is close
Seal the connection of frame substrate；The sealing frame is stretched out by the driving of driving device by interface unit two sides interface portion, and seal rubber is made
The appearance face contact of item and TRACK and litho machine, while the outer surface of the sealing frame substrate and the inner surface of sealing baffle support
It connects.
Offer sealing frame base openings on the sealing frame substrate, be used for wafer Transfer pipe, the sealing frame it is outer
Shape size is less than the frame openings of the frame of interface unit.
The driving device includes cylinder, air cylinder fixed plate and connecting plate, and wherein cylinder is mounted on by air cylinder fixed plate
On the frame of interface unit, the output end of the cylinder is connect by connecting plate with sealing frame.One end of the connecting plate and gas
The output end of cylinder connects, and the other end is connect by floating junction with sealing frame.
There are two magnetic switch, respectively bottom magnetic switch and top magnetic switch, the bottom magnetics for the cylinder band
Property switch be set to the piston rod of cylinder and retract corresponding position when in place, the top magnetic switch is set to the work of cylinder
Stopper rod position corresponding when stretching out in place.The host of the cylinder and TRACK, which connect and passes through the host of TRACK, controls it
Movement.
The frame and sealing frame of the interface unit are rectangular frame structure, are all connected with one on the quadrangle of the sealing frame
A driving device.
Advantages of the present invention and good effect are as follows:
1. the present invention has structure simple, it is convenient to realize, lower-price characteristic.
2. sealing frame of the present invention passes through the driving of four cylinders, moved to TRACK and litho machine direction, after movement in place,
Sealing rubber strip is seamless to be affixed on the outer surface of TRACK and litho machine, and sealing frame outer surface of substrate is tightly attached to sealing baffle inner surface,
Closed environment is formed before TRACK, interface unit and litho machine, guarantees the purity requirements of wafer-process process.
3. the connection of sealing frame of the present invention and connecting plate uses floating junction, flexibility is big.
4. interface unit both-side opening enters outside air and leads to inside in effectively solution equipment production process of the invention
The problem of cleanliness declines, improves the performance of process.
Detailed description of the invention
Fig. 1 is the structural diagram of the present invention；
Fig. 2 is A-A cross-sectional view in Fig. 1；
Fig. 3 is enlarged drawing at I in Fig. 2；
Fig. 4 is B-B cross-sectional view in Fig. 1；
Fig. 5 is the schematic diagram that driving device is connect with frame in the present invention；
Fig. 6 is C-C cross-sectional view in Fig. 5；
Fig. 7 is the structural schematic diagram of sealing frame in the present invention；
Fig. 8 is the left view of Fig. 7；
Fig. 9 is enlarged drawing at II in Fig. 8；
Figure 10 is the axis surveys view of sealing frame in the present invention；
Figure 11 is enlarged drawing at III in Figure 10；
Figure 12 is status diagram when the invention works；
Figure 13 is D-D cross-sectional view in Figure 12；
Figure 14 is enlarged drawing at IV in Figure 13；
Figure 15 is E-E cross-sectional view in Figure 12.
Wherein: 1 is the frame of interface unit, and 2 be frame openings, and 3 be outer metal plate, and 4 be sealing baffle, and 5 be sealing frame,
501 be sealing frame substrate, and 502 be sealing frame bending edges, and 503 be sealing rubber strip, and 504 be sealing frame base openings, and 6 be driving
Device, 601 be cylinder, and 602 be air cylinder fixed plate, and 603 be connecting plate, and 604 be floating junction, and 7 be litho machine.
Specific embodiment
The present invention is described in further detail below in conjunction with the accompanying drawings.
As shown in Figs 1-4, the present invention is set to the interface unit two sides interface portion connecting with TRACK and litho machine 7, including
Sealing baffle 4, sealing frame 5 and driving device 6, wherein sealing baffle 4 is set to the interface portion edge of interface unit, the driving
Device 6 is set on the frame 1 of interface unit, and the sealing frame 5 is set in the interface portion of interface unit and and driving device
6 connections.The sealing frame 5 is stretched out or is retracted by interface unit two sides interface portion by the driving of driving device 6；When sealing frame 5
By the stretching of interface unit two sides interface portion and when inner end is abutted with sealing baffle 4, outboard end is supported with TRACK and litho machine 7
It connects, thus the gap sealing between sealed interface unit two sides interface portion and TRACK and litho machine 7.
As illustrated in figures 7-11, the sealing frame 5 includes sealing frame substrate 501, sealing frame bending edges 502 and sealing rubber strip
503, sealing frame base openings 504 wherein are offered on sealing frame substrate 501, are used for wafer Transfer pipe.The sealing frame base
The side of plate 501 is set to sealing frame bending edges 502 circumferentially arranged with sealing frame bending edges 502, the sealing rubber strip 503
On, the driving device 6 is connect with sealing frame substrate 501.The sealing frame 5 is by the driving of driving device 6 by interface unit
Two sides interface portion is stretched out, make sealing rubber strip 503 with the outer surface of TRACK and litho machine 7 are seamless contacts, while the sealing frame
The outer surface of substrate 501 with the inner surface of sealing baffle 4 is seamless abuts.The outer dimension of the sealing frame 5 is less than interface unit
Frame 1 frame openings 2, convenient for the movement of sealing frame 5, the frame openings 2 for transmission wafer use.
As Figure 4-Figure 6, the driving device 6 includes cylinder 601, air cylinder fixed plate 602 and connecting plate 603, wherein gas
Cylinder 601 is mounted on the frame 1 of interface unit by air cylinder fixed plate 602, one end and the cylinder 601 of the connecting plate 603
Output end connection, the other end are connect by floating junction 604 with sealing frame substrate 501.
The cylinder 601 is with there are two magnetic switch, respectively bottom magnetic switch and top magnetic switch, the bottoms
The piston rod that magnetic switch is set to cylinder 601 position corresponding when retracting in place, the top magnetic switch are set to gas
The piston rod of cylinder 601 position corresponding when stretching out in place.The cylinder 601 connect with the host of TRACK and passes through TRACK
Host control its movement.
In the present embodiment, the frame 1 and sealing frame 5 of the interface unit are rectangular frame structure.The sealing frame 5
A driving device 6 is all connected on quadrangle, because four cylinders 601 move at the same time, each 601 actuation time of cylinder in order to prevent
Difference, and sealing frame 5 is caused to generate stuck phenomenon when moving, therefore floating junction 604 is used to connect.
The working principle of the invention is:
Original state of the invention, as shown in Figs 1-4, the piston rod of four cylinders 601 are in retracted mode, interface list
It is not sealed between first two sides interface portion and TRACK and litho machine 7, there are gap, i.e. sealing rubber strip 503 leaves TRACK and light
Quarter machine 7 outer surface, sealing frame substrate 501 leaves sealing baffle 4.When TRACK host is connected to equipment run signal, TRACK
Host gives four 601 signals of cylinder and controls the piston rod stretching of four cylinders 601, stops after reaching the intrinsic stroke of cylinder.
Cylinder 601 have magnetic switch, piston rod in place after, a signal can be fed back and give TRACK host.Sealing rubber strip 503 at this time
It is tightly attached to the outer surface of TRACK and litho machine, the inner surface of sealing baffle 4 is tightly attached in the outer surface of sealing frame substrate 501, i.e., originally
Sealed environment is formed between the interface unit and TRACK and litho machine 7 of invention, for the needs of wafer transmission, such as Figure 12-15 institute
Show.
When TRACK host is connected to equipment stop signal, TRACK host gives four 601 signals of cylinder and controls four
The piston rod of cylinder retracts, and cylinder 601 has a magnetic switch, piston rod in place after, a signal can be fed back and give TRACK host,
Apparatus of the present invention return to original state at this time.
Claims (7)
1. a kind of interface sealing device of semiconductor interface unit, which is characterized in that the interface sealing device is set to and gluing
Developing machine TRACK and the interface unit two sides interface portion of litho machine (7) connection, including sealing baffle (4), sealing frame (5) and drive
Dynamic device (6), wherein sealing baffle (4) is set to the interface portion edge of interface unit, and the driving device (6) is set to interface
On the frame (1) of unit, the sealing frame (5) is set in the interface portion of interface unit and connect with driving device (6), institute
The driving of sealing frame (5) by driving device (6) is stated to be stretched out or retracted by interface unit two sides interface portion；When sealing frame (5) by
When interface portion is stretched out and inner end is abutted with sealing baffle (4), outboard end is supported with coating developing machine TRACK and litho machine (7)
It connects, thus the gap between sealed interface unit two sides interface portion and coating developing machine TRACK and litho machine (7)；
The sealing frame (5) includes sealing frame substrate (501), sealing frame bending edges (502) and sealing rubber strip (503), wherein
The side of sealing frame substrate (501) is set to close circumferentially arranged with sealing frame bending edges (502), the sealing rubber strip (503)
It seals on frame bending edges (502), the driving device (6) connect with sealing frame substrate (501)；The sealing frame (5) passes through driving
The driving of device (6) is stretched out by interface unit two sides interface portion, makes sealing rubber strip (503) and coating developing machine TRACK and light
The appearance face contact of quarter machine (7), while the outer surface of the sealing frame substrate (501) is abutted with the inner surface of sealing baffle (4).
2. the interface sealing device of semiconductor interface unit according to claim 1, which is characterized in that the sealing frame substrate
(501) sealing frame base openings (504) are offered on, are used for wafer Transfer pipe, and the outer dimension of the sealing frame (5) is less than
The frame openings (2) of the frame (1) of interface unit.
3. the interface sealing device of semiconductor interface unit according to claim 1, which is characterized in that the driving device
It (6) include cylinder (601), air cylinder fixed plate (602) and connecting plate (603), wherein cylinder (601) passes through air cylinder fixed plate
(602) it is mounted on the frame (1) of interface unit, the output end of the cylinder (601) passes through connecting plate (603) and sealing frame
(5) it connects.
4. the interface sealing device of semiconductor interface unit according to claim 3, which is characterized in that the connecting plate
(603) one end is connect with the output end of cylinder (601), and the other end is connect by floating junction (604) with sealing frame (5).
5. the interface sealing device of semiconductor interface unit according to claim 3, which is characterized in that the cylinder (601)
There are two magnetic switch, respectively bottom magnetic switch and top magnetic switch, the bottom magnetic switches to be set to cylinder for band
(601) piston rod position corresponding when retracting in place, the piston rod that the top magnetic switch is set to cylinder (601) are stretched
Corresponding position when out in place.
6. the interface sealing device of semiconductor interface unit as described in claim 5, which is characterized in that the cylinder (601)
It is connect with the host of coating developing machine TRACK and the host for passing through coating developing machine TRACK controls its movement.
7. pressing the interface sealing device of semiconductor interface unit of any of claims 1-6, which is characterized in that described
The frame (1) and sealing frame (5) of interface unit are rectangular frame structure, are all connected with one on the quadrangle of the sealing frame (5)
Driving device (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510297496.8A CN106298602B (en) | 2015-06-03 | 2015-06-03 | The interface sealing device of semiconductor interface unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510297496.8A CN106298602B (en) | 2015-06-03 | 2015-06-03 | The interface sealing device of semiconductor interface unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106298602A CN106298602A (en) | 2017-01-04 |
| CN106298602B true CN106298602B (en) | 2019-02-15 |
Family
ID=57656274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510297496.8A Active CN106298602B (en) | 2015-06-03 | 2015-06-03 | The interface sealing device of semiconductor interface unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106298602B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103794466A (en) * | 2012-10-30 | 2014-05-14 | 沈阳芯源微电子设备有限公司 | Apparatus for maintaining internal cleanliness of interface unit |
| CN103811378A (en) * | 2012-11-14 | 2014-05-21 | 沈阳芯源微电子设备有限公司 | Automatic moving device of semiconductor fabrication device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG171468A1 (en) * | 2002-12-10 | 2011-06-29 | Nikon Corp | Exposure apparatus and method for producing device |
-
2015
- 2015-06-03 CN CN201510297496.8A patent/CN106298602B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103794466A (en) * | 2012-10-30 | 2014-05-14 | 沈阳芯源微电子设备有限公司 | Apparatus for maintaining internal cleanliness of interface unit |
| CN103811378A (en) * | 2012-11-14 | 2014-05-21 | 沈阳芯源微电子设备有限公司 | Automatic moving device of semiconductor fabrication device |
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| Publication number | Publication date |
|---|---|
| CN106298602A (en) | 2017-01-04 |
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| CP03 | Change of name, title or address |
Address after: 110168 No. 16 Feiyun Road, Hunnan District, Shenyang City, Liaoning Province Patentee after: Shenyang Core Source Microelectronic Equipment Co., Ltd. Address before: 110168 No. 16 Feiyun Road, Hunnan New District, Shenyang City, Liaoning Province Patentee before: Shenyang Siayuan Electronic Equipment Co., Ltd. |