CN106282951A - The substrate stationary fixture of a kind of magnetron sputtering coater and using method - Google Patents
The substrate stationary fixture of a kind of magnetron sputtering coater and using method Download PDFInfo
- Publication number
- CN106282951A CN106282951A CN201610758336.3A CN201610758336A CN106282951A CN 106282951 A CN106282951 A CN 106282951A CN 201610758336 A CN201610758336 A CN 201610758336A CN 106282951 A CN106282951 A CN 106282951A
- Authority
- CN
- China
- Prior art keywords
- tabletting
- base plate
- screw
- substrate
- positioning groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
A kind of substrate stationary fixture of magnetron sputtering coater, including base plate with several for the tabletting that substrate is fixed on base plate, base plate is rounded, its upper surface digs one or more for placing substrate and the annular positioning groove concentric with base plate, and tabletting annularly locating slot is uniformly arranged on above annular positioning groove；Tabletting is rectangle, axis on its length direction overlaps with the radial direction of annular positioning groove, a sputtering through hole is offered at the middle part of tabletting, sputtering through hole is positioned at the surface of annular positioning groove and the aperture width less than annular positioning groove, a tabletting screw is respectively offered in the tabletting part near two ends, being additionally provided with on base plate and tabletting screw base plate screw one to one, tabletting completes the connection with base plate by several screws passing tabletting screw and base plate screw.The present invention can be applicable to the plated film work of substrates of different, and the machining state that can keep substrate is stable, and safeguards simple.
Description
Technical field
The present invention relates to magnetic control sputtering device field, the substrate fixation clamp of a kind of magnetron sputtering coater
Tool and using method.
Background technology
Along with the application aborning of magnetron sputtering embrane method is more and more extensive, improve production efficiency, simplify production process
Seem more and more important.Can install multiple substrate on base plate is to improve efficiency, minimizing result accidentally deviation simultaneously
A kind of effective means.Additionally, simplify the installation process of substrate, the firmness etc. improving substrate is also improve plated film success rate one
Individual aspect.Reasonably use fixture can simplify coating process, reduce cost, shorten the time of whole process, carry on the whole
High efficiency.
Base plate can be heated while plated film by the magnetron sputtering coater that people commonly use now, it is achieved in difference
At a temperature of carry out coating operation, and the thin film of sputtering sedimentation can be carried out rational heat treatment, this just requires and thin film table
The tabletting that face directly contacts has gets well to obtain thermal stability, resistance to elevated temperatures.The most conventional fixture is mostly by T7 steel, middle carbon
Steel or high-carbon steel are made, although the fixture prepared by these materials disclosure satisfy that the requirement of general working condition, but
Under the conditions of the particular job such as hot conditions toward easily deforming upon, the problem such as surface contamination.Additionally, the most conventional fixture is often
Being that the monolateral of straight tabletting directly contacts with substrate, this can cause substrate contact surface unbalance stress, especially tilt at substrate,
It is not fixed easily when inversion, easily drops.
Therefore, in actual application, highly desirable one is simple to operate, practical and convenient fixture, and disclosure satisfy that with
Lower condition: 1, mounted substrate, plated film, take sheet etc. during, no matter the angle of inclination of base plate is in the range of 0 ° ~ 180 °, protect
Card substrate all will not loosen, and drops；2, ensure that substrate contacts with tabletting to contact into face, and surrounding contact area is identical, contacts good
Good, uniform force, it is possible to avoid substrate to occur because of local pressure not being fixed easily, one end tilts, easily loosen or contact surface stress
The phenomenons such as the tabletting fracture that inequality causes；3, can not only use under room temperature working condition, the most still meet
Use requirement, and film surface will not be polluted because of hot conditions.
Summary of the invention
In order to solve deficiency of the prior art, the present invention provide one propose a kind of simple to operate, serviceability is good
Good, and can normally use a kind of magnetron sputtering coater without affecting film surface quality under the working condition such as high temperature
The fixing fixture of substrate and using method.
To achieve these goals, the scheme that the present invention uses is:
The substrate stationary fixture of a kind of magnetron sputtering coater, including base plate with several for substrate is fixed on base plate
Tabletting,
Described base plate is rounded, and its upper surface digs one or more for placing substrate and the circular orientation concentric with base plate
Groove, tabletting annularly locating slot is uniformly arranged on above annular positioning groove；
Described tabletting is rectangle, and the axis on its length direction overlaps with the radial direction of annular positioning groove, at the middle part of tabletting
Offering a sputtering through hole, sputtering through hole is positioned at the surface of annular positioning groove and the aperture width less than annular positioning groove,
Respectively offer a tabletting screw in the tabletting part near two ends, base plate is additionally provided with tabletting screw one to one
Base plate screw, tabletting completes the connection with base plate by several screws passing tabletting screw and base plate screw.
The big 0.2-0.3mm of diameter of the width ratio substrate of described annular positioning groove, aperture ratio substrate straight of sputtering through hole
The little 0.5-1mm in footpath.
Described base plate screw is uniformly arranged.
In the often group base plate screw of one annular positioning groove both sides, two base plate screws and the distance of annular positioning groove
Equal.
Described screw part between tabletting and base plate is also arranged with packing ring.
The material of described packing ring is 65Mn steel, and its thickness is the difference of substrate thickness and circular orientation groove depth.
The material of described tabletting is hard alloy.
The using method of the substrate stationary fixture of a kind of magnetron sputtering coater as claimed in claim, including following
Step:
Step one, take a tabletting, with screw through the tabletting screw of tabletting side, be then screwed into base plate screw, when substrate is thick
The when that degree being higher than circular orientation groove depth, with screw through the tabletting screw of tabletting side, then sheathed packing ring on screw,
Then base plate screw is inserted screws into；
Step 2, substrate is placed in the annular positioning groove on base plate, promote from side substrate to the end described in step one
The position that plate screw is corresponding；
Step 3, rotary tablet compression, be arranged on the other end of tabletting on base plate by screw, tightens the screw connected, makes
Tabletting is in close contact with substrate, and contact surface is circular；
Step 4, repetition step one, to the method for step 3, install each substrate successively.
Beneficial effect:
1, use hard straight alloy as the material of tabletting, intensity high, wear-resisting by its hardness having and toughness is preferable, heat-resisting,
A series of premium properties such as corrosion-resistant, it is ensured that the most still can steady operation, substrate will not be produced and pollute；
2, tabletting is the face contact in circular with contacting of substrate, and contact area in all directions is essentially equal,
Ensure that substrate stress in all directions is identical, it is possible to and avoid substrate to occur being difficult to admittedly because of local pressure
Fixed, one end tilts, easily loosen or the phenomenon such as tabletting fracture that contact surface unbalance stress causes；
3, screw can have multiple choices as the most common parts, the thickness of its ailhead, when base plate needs at inverted shape
Under state during plated film, the distance between base plate and target can be controlled by ailhead thickness, to adapt to different process requirements；
4, base plate is circular slab, and the distribution of substrate is also in circular, so when base plate rotates, and the machining state of each substrate
Also will not change, it is possible to reduce the performance difference of thin film, improve the uniformity of thin film；
5, the height of tabletting can be adjusted by the packing ring of different-thickness, it is possible to the use meeting different size substrate is wanted
Ask；
6, multiple substrate can be fixed on one piece of base plate, it is possible to increase efficiency, minimizing result accidentally deviation.
Accompanying drawing explanation
Fig. 1 is tabletting structure schematic diagram；
Fig. 2 is base arrangement schematic diagram；
Fig. 3 is assembling result top view；
Fig. 4 is assembling result sectional view；
Fig. 5 is the tabletting structure schematic diagram of band baffle plate.
Reference: 1, base plate, 101, base plate screw, 2, packing ring, 3, screw, 4, tabletting, 401, sputtering through hole, 402, pressure
Sheet screw, 5, annular positioning groove, 6, baffle plate.
Detailed description of the invention
Embodiments of the present invention are illustrated below according to accompanying drawing.
As shown in Figure 1, Figure 2 and Figure 3, the substrate stationary fixture of a kind of magnetron sputtering coater, including base plate 1 and some
The individual tabletting 4 for substrate being fixed on base plate 1, wherein base plate 1 is rounded, its upper surface dug one or more for
Placing substrate and the annular positioning groove 5 concentric with base plate 1, tabletting 4 annularly locating slot 5 is uniformly arranged on annular positioning groove 5
Side；Described tabletting 4 is rectangle, and the axis on its length direction overlaps with the radial direction of annular positioning groove 5, in tabletting 4
Portion offers a sputtering through hole 401, and sputtering through hole 401 is positioned at the surface of annular positioning groove 5 and aperture less than circular orientation
The width of groove 5, respectively offers a tabletting screw 402 in the tabletting 4 part near two ends, is additionally provided with and presses on base plate 1
Sheet screw 402 base plate screw 101 one to one, tabletting 4 by several through tabletting screw 402 and base plate screw 401
Screw 3 completes and the connection of base plate 1.
The big 0.2-0.3mm of diameter of the width ratio substrate of described annular positioning groove 5, the aperture ratio substrate of sputtering through hole 401
The little 0.5-1mm of diameter.
Described base plate screw 101 is uniformly arranged, and makes all of substrate be uniformly distributed in the form of a ring, even if base plate 1 rotates, also can
Keep stablizing of duty.
In the often group base plate screw 101 of one annular positioning groove 5 both sides, two base plate screws 101 and circular orientation
The distance of groove 5 is equal.
The described screw 3 part between tabletting 4 and base plate 1 is also arranged with packing ring 2.
The material of described packing ring 2 is 65Mn steel, and its thickness is the difference of substrate thickness and annular positioning groove 5 degree of depth, for not
The substrate of stack pile, can select packing ring 2 flexibly, and then the height adjusting tabletting 4 adapts to substrate, and packing ring 2 is as non-
Parts usually, it is changed simple, and easily buys, substantially increases the maintainability of device.
The material of described tabletting 4 is hard alloy, and, intensity high, wear-resisting by its hardness having and toughness are preferable, resistance to
A series of premium properties such as hot, corrosion-resistant, compared with traditional material, the most still can steady operation, will not be right
Substrate produces and pollutes.
The using method of the substrate stationary fixture of a kind of magnetron sputtering coater, comprises the following steps:
Step one, take a tabletting 4, with screw 3 through the tabletting screw 402 of tabletting 4 side, be then screwed into base plate screw 101,
When substrate thickness is higher than annular positioning groove 5 degree of depth when, with screw 3 through the tabletting screw 402 of tabletting 4 side, then exist
On screw 3, sheathed packing ring 2, is then screwed into base plate screw 101 by screw 3；
In step 2, the annular positioning groove 5 substrate being placed on base plate 1, from side promote substrate to described in step one
The position that base plate screw 101 is corresponding；
Step 3, rotary tablet compression 4, be arranged on the other end of tabletting 4 on base plate 1 by screw 3, tighten the screw connected
3, make tabletting 4 be in close contact with substrate, and contact surface is circular, now substrate stress in all directions is identical
, it is possible to avoid substrate to occur because of local pressure not being fixed easily, one end tilts, easily loosen or contact surface unbalance stress causes
The phenomenon such as tabletting fracture；；
Step 4, repetition step one, to the method for step 3, install each substrate successively.
Embodiment one.
As shown in Figure 3 and Figure 4, annular positioning groove 5 is preferably one, and its degree of depth is 0.2mm, and width is 10.2mm；Select
Substrate thickness be 0.5mm, a diameter of 10mm；The aperture of the sputtering through hole 401 at tabletting 4 center is 9mm；The thickness of packing ring 2 is
0.3mm.Operating process is as follows:
Step one, take a tabletting 4 and a screw 3, screw 3 is sequentially passed through after hard alloy tabletting 4, packing ring 2 with base plate 1
Couple together, be in slight loosening state；
Step 2, substrate is placed on lightly in the groove on base plate 1, promote gently from side substrate to described in step one
The corresponding position of base plate screw 101；
Step 3, rotary tablet compression 4, install the screw 3 of tabletting 4 other end, press lightly on tabletting 4, it is ensured that tabletting 4 and substrate
Closely, and contact surface is circular in contact, the most slowly tightens the screw 3 connected, but screw 3 can not be screwed onto tension or
Cross pine state, it is ensured that tabletting 4 directly contacts with substrate.
Step 4, repetition step one, to the method for step 3, install remaining substrate successively.
Embodiment two.
The substrate thickness selected is 0.2m, now need not use packing ring 2.Operating process is as follows:
Step one, take a tabletting 4, with screw 3 through the tabletting screw 402 of tabletting 4 side, be then screwed into base plate screw 101；
In step 2, the annular positioning groove 5 substrate being placed on base plate 1, from side promote substrate to described in step one
The position that base plate screw 101 is corresponding；
Step 3, rotary tablet compression 4, be arranged on the other end of tabletting 4 on base plate 1 by screw 3, tighten the screw connected
3, make tabletting 4 be in close contact with substrate, and contact surface is circular；
Step 4, repetition step one, to the method for step 3, install each substrate successively.
Embodiment three.
When substrate thickness is identical with the degree of depth of annular positioning groove 5, the tabletting 4 adding baffle plate 6, baffle plate 6 can be used
Being arranged on the middle part on the long limit of tabletting 4, have two pieces, its width is less than diameter, height and the annular positioning groove 5 of sputtering through hole 401
Deep equality, it is possible to avoid completely substrate occur loosen and be moved in annular positioning groove 5.
Claims (8)
1. a substrate stationary fixture for magnetron sputtering coater, including base plate (1) with several are for being fixed on substrate
Tabletting (4) on base plate (1), it is characterised in that:
Described base plate (1) is rounded, and its upper surface digs one or more for placing substrate and the ring concentric with base plate (1)
Shape locating slot (5), tabletting (4) annularly locating slot (5) is uniformly arranged on annular positioning groove (5) top；
Described tabletting (4) is rectangle, and the axis on its length direction overlaps with the radial direction of annular positioning groove (5), in tabletting (4)
Middle part offer sputtering through hole (401), sputtering through hole (401) is positioned at the surface of annular positioning groove (5) and aperture is little
In the width of annular positioning groove (5), respectively offer a tabletting screw (402), at base plate in the tabletting (4) part near two ends
(1) being additionally provided with on and tabletting screw (402) base plate screw (101) one to one, tabletting (4) passes tabletting by several
The screw (3) of screw (402) and base plate screw (401) completes the connection with base plate (1).
The substrate stationary fixture of a kind of magnetron sputtering coater the most as claimed in claim 1, it is characterised in that: described annular
The big 0.2-0.3mm of diameter of the width ratio substrate of locating slot (5), the little 0.5-of diameter of the aperture ratio substrate of sputtering through hole (401)
1mm。
The substrate stationary fixture of a kind of magnetron sputtering coater the most as claimed in claim 1, it is characterised in that: described base plate
Screw (101) is uniformly arranged.
The substrate stationary fixture of a kind of magnetron sputtering coater the most as claimed in claim 1, it is characterised in that: one
In often group base plate screw (101) of annular positioning groove (5) both sides, two base plate screws (101) and the distance of annular positioning groove (5)
Equal.
The substrate stationary fixture of a kind of magnetron sputtering coater the most as claimed in claim 1, it is characterised in that: described screw
(3) part being positioned between tabletting (4) and base plate (1) is also arranged with packing ring (2).
The substrate stationary fixture of a kind of magnetron sputtering coater the most as claimed in claim 5, it is characterised in that: described packing ring
(2) material is 65Mn steel, and its thickness is the difference of substrate thickness and annular positioning groove (5) degree of depth.
The substrate stationary fixture of a kind of magnetron sputtering coater the most as claimed in claim 1, it is characterised in that: described tabletting
(4) material is hard alloy.
The using method of the substrate stationary fixture of a kind of magnetron sputtering coater the most as claimed in claim 5, its feature exists
In: comprise the following steps:
Step one, take a tabletting (4), with screw (3) through the tabletting screw (402) of tabletting (4) side, be then screwed into base plate
Screw (101), when substrate thickness is higher than annular positioning groove (5) degree of depth when, passes the pressure of tabletting (4) side with screw (3)
Sheet screw (402), then at the upper sheathed packing ring (2) of screw (3), is then screwed into base plate screw (101) by screw (3)；
In step 2, the annular positioning groove (5) substrate being placed on base plate (1), promote from side substrate to institute step one
The position that the base plate screw (101) stated is corresponding；
Step 3, rotary tablet compression (4), be arranged on the other end of tabletting (4) on base plate (1) by screw (3), tighten and connected
The screw (3) connect, makes tabletting (4) be in close contact with substrate, and contact surface is circular；
Step 4, repetition step one, to the method for step 3, install each substrate successively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610758336.3A CN106282951B (en) | 2016-08-30 | 2016-08-30 | The substrate stationary fixture and application method of a kind of magnetron sputtering coater |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610758336.3A CN106282951B (en) | 2016-08-30 | 2016-08-30 | The substrate stationary fixture and application method of a kind of magnetron sputtering coater |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106282951A true CN106282951A (en) | 2017-01-04 |
| CN106282951B CN106282951B (en) | 2018-07-06 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610758336.3A Active CN106282951B (en) | 2016-08-30 | 2016-08-30 | The substrate stationary fixture and application method of a kind of magnetron sputtering coater |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106282951B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110066983A (en) * | 2019-05-17 | 2019-07-30 | 南京邮电大学 | Film preparation auxiliary device and method for manufacturing thin film |
| CN110106482A (en) * | 2019-06-17 | 2019-08-09 | 浙江晶驰光电科技有限公司 | Film coating jig and film plating process |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3993018A (en) * | 1975-11-12 | 1976-11-23 | International Business Machines Corporation | Centrifugal support for workpieces |
| JPS6153426B2 (en) * | 1982-04-07 | 1986-11-18 | Hitachi Ltd | |
| JPH11185308A (en) * | 1997-12-25 | 1999-07-09 | Nikon Corp | Optical disk, manufacturing device therefor and manufacture thereof |
| JP2010040919A (en) * | 2008-08-07 | 2010-02-18 | Hitachi Kokusai Electric Inc | Substrate processing apparatus |
| CN203728922U (en) * | 2014-01-24 | 2014-07-23 | 常熟理工学院 | Carrier structure for magnetron sputtering film-coating device |
| CN104369113A (en) * | 2013-08-16 | 2015-02-25 | 宁波江丰电子材料股份有限公司 | Target material sand blasting clamp and target material sand blasting method |
-
2016
- 2016-08-30 CN CN201610758336.3A patent/CN106282951B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3993018A (en) * | 1975-11-12 | 1976-11-23 | International Business Machines Corporation | Centrifugal support for workpieces |
| JPS6153426B2 (en) * | 1982-04-07 | 1986-11-18 | Hitachi Ltd | |
| JPH11185308A (en) * | 1997-12-25 | 1999-07-09 | Nikon Corp | Optical disk, manufacturing device therefor and manufacture thereof |
| JP2010040919A (en) * | 2008-08-07 | 2010-02-18 | Hitachi Kokusai Electric Inc | Substrate processing apparatus |
| CN104369113A (en) * | 2013-08-16 | 2015-02-25 | 宁波江丰电子材料股份有限公司 | Target material sand blasting clamp and target material sand blasting method |
| CN203728922U (en) * | 2014-01-24 | 2014-07-23 | 常熟理工学院 | Carrier structure for magnetron sputtering film-coating device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110066983A (en) * | 2019-05-17 | 2019-07-30 | 南京邮电大学 | Film preparation auxiliary device and method for manufacturing thin film |
| CN110106482A (en) * | 2019-06-17 | 2019-08-09 | 浙江晶驰光电科技有限公司 | Film coating jig and film plating process |
| CN110106482B (en) * | 2019-06-17 | 2023-11-03 | 浙江晶驰光电科技有限公司 | Coating jig and coating method |
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| Publication number | Publication date |
|---|---|
| CN106282951B (en) | 2018-07-06 |
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