CN106281206B - Antistatic heat-conducting organic silicon adhesive - Google Patents

Antistatic heat-conducting organic silicon adhesive Download PDF

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CN106281206B
CN106281206B CN201610719542.3A CN201610719542A CN106281206B CN 106281206 B CN106281206 B CN 106281206B CN 201610719542 A CN201610719542 A CN 201610719542A CN 106281206 B CN106281206 B CN 106281206B
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heat
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graphene
organic silicon
antistatic
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CN106281206A (en
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李卫东
赵志国
张逸瑾
白永平
李夏倩
殷晓芬
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Shanghai Levsong Nano Technology Co ltd
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Shanghai Yixing High Molecular Material Co ltd
Wuxi Haite New Material Research Institute Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/06—Pretreated ingredients and ingredients covered by the main groups C08K3/00 - C08K7/00
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C08K2003/265—Calcium, strontium or barium carbonate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/017—Additives being an antistatic agent

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  • Organic Chemistry (AREA)
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  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention discloses an antistatic heat-conducting organic silicon adhesive which exists in a single-component form and consists of organopolysiloxane with hydrolyzable groups at two ends, heat-conducting filler, a crosslinking agent, a catalyst and other additives. The used heat-conducting filler contains graphene subjected to surface treatment, the overall heat conductivity is greatly improved after a small amount of the graphene is added, and the graphene has antistatic property. The single-component organic silicon adhesive still has good operability and thixotropy after a large amount of fillers are added, can be used for bonding materials with different thermal expansion rates, can prevent electronic components and the like from being damaged by static electricity due to antistatic property, and has wide industrial application prospect.

Description

Antistatic heat-conducting organic silicon adhesive
Technical Field
The invention belongs to the field of materials, and particularly relates to an antistatic heat-conducting organic silicon adhesive.
Background
Gaps usually exist between the electronic components and the radiator, and the gaps can not timely and effectively dissipate heat of the electronic components, so that faults occur. The heat-conducting gasket can effectively fill the gaps and improve the heat dissipation efficiency, so that the heat-conducting gasket is a key component for heat dissipation of the electronic component. Currently, the heat conducting gasket is mostly prepared by using silica gel as a main material and adding heat conducting particles into the silica gel. However, the single particle has a problem of poor heat conduction.
In addition, the silica gel gasket has the shortcoming of easily adsorbing dust, and the existence of dust not only can influence electronic components's life to also can influence its heat conduction effect after long-time the use.
Graphene is the thinnest, hardest nanomaterial known to the world, and it is almost completely transparent, absorbing only 2.3% of light; the heat conductivity coefficient is as high as 5300W/m.K, higher than that of carbon nano tube and diamond, and its electron mobility is over 15000cm at normal temp2V.s, higher than carbon nanotubes or silicon crystal, and a resistivity of only about 10-6Omega cm, lower than copper or silver, is the material with the smallest resistivity in the world.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides an antistatic heat-conducting organic silicon adhesive. Specifically, firstly, aiming at the problem of poor heat conduction effect of single particles, heat conduction materials with different particle sizes, shapes and types are mixed and filled, so that the silica gel achieves a high degree of stacking degree, and the heat conductivity is improved. Secondly, a proper amount of antistatic particles are added into the silica gel to effectively improve the defect that the silica gel gasket is easy to adsorb dust. Finally, due to the fact that the resistivity of the graphene is extremely low and the speed of electron migration is extremely high, the graphene is used as a filler to be added into silica gel, and experimental tests show that the graphene subjected to surface modification treatment can effectively improve the heat conductivity of a product and can play a good antistatic role.
Therefore, the invention aims to provide an antistatic heat-conducting silicone adhesive.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows:
the antistatic heat-conducting organic silicon adhesive is prepared from the following raw materials in parts by weight: 100 parts of organopolysiloxane with hydrolyzable groups at both ends, 0.05-900 parts of heat conducting filler, 1-50 parts of cross-linking agent, 1-5 parts of catalyst, 30-100 parts of other fillers and 0-5 parts of other additives.
As a preferred embodiment of the present invention, the silicone adhesive is present in a one-component form.
As a preferred embodiment of the present invention, the organosiloxane having hydrolyzable groups at both ends is polydimethylsiloxane having terminal hydroxyl groups, preferably the polydimethylsiloxane having terminal hydroxyl groups is α, ω -dihydroxypolydimethylsiloxane, preferably α, the viscosity of ω -dihydroxypolydimethylsiloxane is 1000-.
As a preferable mode of the invention, the heat-conducting filler comprises at least one selected from the group consisting of alumina, zinc oxide, magnesium oxide, silicon nitride, boron nitride and aluminum nitride and modified carbon nanotubes and modified graphene, wherein the weight parts of the modified carbon nanotubes and the modified graphene are 0.05-5 parts (per 100 parts of organopolysiloxane having hydrolyzable groups at both ends), and the weight parts of the alumina, the zinc oxide, the magnesium oxide, the silicon nitride, the boron nitride and the aluminum nitride are 100-900 parts (per 100 parts of organopolysiloxane having hydrolyzable groups at both ends).
In a preferred embodiment of the present invention, the heat conductive filler is made of a combination of materials with different shapes and different particle sizes. Preferably, the particle size is 0.5 to 50 μm. Further, the particle size is 10 to 40 μm. The particle shape includes a spherical shape, a plate shape, a whisker shape, and the like. Preferably, spherical particles are used in combination with particles of other shapes.
In a preferred embodiment of the present invention, the modified carbon nanotubes and the modified graphene in the thermally conductive filler are obtained by subjecting carbon nanotubes and graphene to a modification treatment with at least one silane coupling agent selected from the group consisting of KH550, KH560 and KH 602. Preferably, the amount of the silane coupling agent added during the pretreatment is 1 to 20% by mass of the carbon nanotubes and the graphene, and further 2 to 10% by mass of the silane coupling agent added. Preferably, the modified carbon nanotube and graphene are present in an amount of 0.05 to 5 parts by weight (per 100 parts of organopolysiloxane having hydrolyzable groups at both ends), and further 0.5 to 3 parts by weight.
In a preferred embodiment of the present invention, the crosslinking agent includes a deketoxime type crosslinking agent, a dealcoholization type crosslinking agent, a deacetylation type crosslinking agent, a deacetonization type crosslinking agent, and a deamidation type or dehydroxylation type crosslinking agent. Preferably, the crosslinking agent is added in an amount of 1 to 50 parts per 100 parts of the organopolysiloxane having hydrolyzable groups at both ends, and further, in an amount of 5 to 25 parts.
Preferably, the ketoxime-removing crosslinking agent includes methyl tributyrinoxime silane, vinyl tributyrinoxime silane, phenyl tributyrinoxime silane, tetrabutoximino silane, methyl tripropionoxime silane, and the like. The dealcoholization type cross-linking agent comprises methyltrimethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, tetramethoxysilane and the like. The deacetylation type crosslinking agent comprises methyl triacetoxysilane, ethyl triacetoxysilane and propyl triacetoxysilane, and methyl triacetoxysilane and di-tert-butoxydiacetoxysilane can be used together to improve the adhesion with the substrate. The acetone-removing cross-linking agent is allyloxysilane. The deamidation type or deamidation type cross-linking agent is silane or siloxane containing more than three amide groups.
As a preferred embodiment of the present invention, the catalyst includes an organotin-based catalyst including dialkyltin dihydroxy acid, dialkyldiaryloxytin, stannous dihydroxy acid, dibutyltin dilaurate, etc., a titanate and its complex catalyst including monoalkoxy-type titanate, polyalkoxytitanate, dialkyltitanium bis (β -diketo ester) complex, titanate glycol β -dione complex, etc., and preferably, the catalyst is added in an amount of 1 to 10 parts per 100 parts of organopolysiloxane having hydrolyzable groups at both ends, further, in an amount of 1 to 5 parts.
In a preferred embodiment of the present invention, the other filler is nano calcium carbonate, diatomaceous earth, or silica powder.
As a preferred scheme of the invention, the other additives comprise a coloring agent, an adhesion promoter and a chain extender, the coloring agent comprises titanium dioxide, carbon black and the like, the adhesion promoter comprises N- (β -aminoethyl) -gamma-aminopropylmethyldimethoxysilane, KH560 and the like, and the chain extender is silane or siloxane containing two amido groups, so that the modulus of the silicone rubber can be reduced, and the elongation rate can be improved.
As a preferable embodiment of the present invention, the viscosity of the antistatic heat-conductive silicone adhesive of the present invention is not more than 300000mPa · s, further, the viscosity is 100000 and 200000mPa · s.
Has the advantages that:
1. the invention provides an antistatic heat-conducting organic silicon adhesive which exists in a single-component form and consists of organopolysiloxane with hydrolysable groups at two ends, heat-conducting filler, a cross-linking agent, a catalyst and other additives;
2. the heat-conducting filler is filled by mixing heat-conducting materials with different particle sizes, shapes and types, so that the heat-conducting filler achieves a higher degree of stacking degree in silica gel, and the heat conductivity can be effectively improved compared with single heat-conducting particles;
3. the heat-conducting filler contains carbon nano tubes subjected to surface modification treatment, the heat conductivity is further effectively improved after the heat-conducting filler is added, and the heat-conducting filler has certain antistatic property;
4. the heat-conducting filler contains graphene subjected to surface modification treatment, the overall heat conductivity can be greatly improved after a small amount of the heat-conducting filler is added, the resistivity is low, and the antistatic property is good;
5. the single-component organic silicon adhesive disclosed by the invention still has good operability and thixotropy after a large amount of filler is added, can be used for bonding materials with different thermal expansion rates, can prevent electronic components and the like from being damaged by static electricity due to antistatic property, and has wide industrial application prospects.
Detailed Description
The present invention will be further described with reference to the following specific examples. It should be understood that the following examples are illustrative only and are not intended to limit the scope of the present invention.
The starting materials used in the following examples are commercially available unless otherwise noted.
The modification methods of carbon nanotubes and graphene used in the following examples are conventional methods in the art, and specifically are as follows:
1) weighing 1g of carbon nano tube or graphene, placing the carbon nano tube or graphene in 200mL of mixed acid solution of concentrated sulfuric acid and concentrated nitric acid (the volume ratio is 3:1) for oxidation, heating to 60 ℃, stirring for 8-10h, performing vacuum filtration, washing to neutrality, and drying in a vacuum oven for later use;
2) weighing 1g of oxidized carbon nanotube or graphene, placing the carbon nanotube or graphene in 200mL of deionized water, dispersing for 30min, adding 0.025-0.5g of silane coupling agent methanol solution (the silane coupling agent can be KH550, KH560, KH602 and the like, the solvent is methanol, the mass fraction of solute is 40%), stirring uniformly, stirring at the room temperature at the speed of 80-100r/min for 24h, removing the upper layer liquid after centrifugal separation to obtain black precipitate, washing with deionized water for 3 times, washing with anhydrous methanol for 2 times, and drying in a vacuum drying oven at the temperature of 60-70 ℃ for 12h to obtain the carbon nanotube or graphene.
Unless otherwise noted,% referred to in the following examples are mass percentages.
Example 1
Adding α with the viscosity of 5000 mPas and 20000 mPas, 100 parts of omega-dihydroxy polydimethylsiloxane (the mass ratio is 1:1), 50 parts of nano calcium carbonate and 600 parts of spherical alumina with the particle size of 40 mu m into a planetary stirrer, vacuumizing at room temperature, dewatering, mixing for 20min, adding 2.5 parts of crosslinking agent methyl tributyrinoxime silane and 12.5 parts of vinyl tributyrinoxime silane, continuously vacuumizing, dewatering and stirring for 10min, adding 3.5 parts of adhesion promoter N- (β -aminoethyl) -gamma-aminopropyl methyl dimethoxysilane and 1 part of catalyst dibutyltin dilaurate, and continuously stirring for 10min to obtain the single-component heat-conducting organic silicon adhesive.
Example 2
The difference from the embodiment 1 is that the heat-conducting filler is prepared by mixing 40 mu m spherical alumina and 10 mu m spheroidal alumina according to the mass ratio of 4: 1.
Example 3
The difference from the embodiment 1 is that the heat-conducting filler is prepared by mixing 40 mu m spherical alumina, 10 mu m spherical alumina and 2 mu m spheroidal alumina according to the mass ratio of 2:2: 1.
Example 4
The difference from the example 1 is that the heat-conducting filler is prepared by mixing 40 μm spherical alumina, 10 μm spherical alumina and 2 μm spheroidal alumina in a mass ratio of 2:2:1, and adding 3 parts of 5% KH550 modified carbon nanotubes.
Example 5
The difference from the example 1 is that the heat-conducting filler is prepared by mixing 40 μm spherical alumina, 10 μm spherical alumina and 2 μm spheroidal alumina in a mass ratio of 2:2:1, and adding 0.5 part of 5% KH550 modified graphene.
Example 6
The difference from example 1 is that 40 μm spherical alumina, 10 μm spheroidal alumina and 2 μm spheroidal alumina are mixed in a mass ratio of 2:2:1, and 1.5 parts of 5% KH550 modified graphene is added.
Example 7
The difference from the example 1 is that 40 μm spherical alumina, 10 μm spherical-like alumina and 2 μm spherical-like alumina are mixed according to the mass ratio of 2:2:1, and 0.5 part of unmodified graphene is added.
Examples 8 to 14
The one-component heat conductive silicone adhesives obtained in the above examples 1 to 6 were tested for their performance according to the following methods, and the results are shown in table 1.
The adhesive viscosity was tested according to GB/T1232.1-2000 using a Brookfield DV-S digital display viscometer. Filling the prepared single-component heat-conducting organic silicon adhesive into a forming die, placing for 24 hours in an environment with the humidity of 60% at 25 ℃ to obtain a sample sheet with the thickness of 2mm, and further placing for 7 days, and then using a Shore A hardness tester to obtain the hardness of the sample sheet. The sample piece cut into 50 x 50mm square is tested for thermal conductivity by a NETZSCH LFA 447 laser thermal conductivity instrument. The surface resistivity of the sample was measured using a dr.schneidersl-030 surface resistance tester.
Table 1 results of performance testing
Figure BDA0001089712990000061
Comparing examples 1-3, it can be seen from the data in table 1 that the viscosity of the heat conductive filler of example 1 is higher when only a single spherical alumina is added, and after the heat conductive particles with different particle sizes and shapes are used in examples 2 and 3, a higher degree of packing can be formed in the system, so that the overall viscosity is reduced and the heat conductivity is improved.
In comparative examples 3 to 4, it can be seen from the data in table 1 that, although the viscosity is slightly increased, the thermal conductivity is increased to 2.4W/m · K more and the surface resistivity is also decreased after a small amount of modified carbon nanotubes are added in example 4, and thus the antistatic effect is primarily achieved.
In comparative examples 5 to 6, as can be seen from the data in table 1, in example 5, the thermal conductivity and the surface resistivity were greatly improved even though the addition amount was only 0.5 part by adding the modified graphene. In example 6, the surface resistivity is reduced to 10 by continuing to add the modified graphene to 1.5 parts6-107Omega, the resistance value is lower, static can be better discharged, and the antistatic effect is good.
Comparing examples 6 to 7, it can be seen from the data in table 1 that the silica gel obtained in example 7 by using unmodified graphene has a higher viscosity and relatively poorer thermal conductivity and antistatic property than those of example 6. The above results indicate that the unmodified graphene cannot be distributed in a nano size in the sizing material, and the modified graphene can form an "isolated distribution state" in the matrix, and forms a better heat conduction channel together with the alumina.
The above description is not to be construed as limiting the design concept of the present invention. Those skilled in the art of the present invention can modify the technical idea of the present invention in various forms, and such modifications and changes are understood to fall within the scope of the present invention.

Claims (3)

1. The antistatic heat-conducting organic silicon adhesive is characterized by comprising the following raw materials, by weight, 1:1 of α with the viscosity of 5000mPa & s and 20000mPa & s, 100 parts of omega-dihydroxy polydimethylsiloxane, 50 parts of nano calcium carbonate, 2:2:1 of 40-micron spherical alumina, 10-micron spherical alumina, 600 parts of 2-micron spherical alumina, 1.5 parts of 5% KH550 modified graphene, 2.5 parts of a crosslinking agent methyl tributyl ketoxime silane, 12.5 parts of vinyl tributyloxime silane, 3.5 parts of an adhesion promoter N- (β -aminoethyl) -gamma-aminopropyl methyl dimethoxysilane and 1 part of a catalyst dibutyltin dilaurate.
2. The antistatic heat-conductive silicone adhesive according to claim 1, wherein the silicone adhesive is present in a one-component form.
3. The antistatic heat-conductive silicone adhesive according to claim 1, wherein the viscosity of the silicone adhesive is not greater than 300000 mPa-s.
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CN110951446A (en) * 2019-12-19 2020-04-03 新纳奇材料科技江苏有限公司 Preparation method of silicone sealant modified based on carbon nanotube-titanium oxide hybrid filler
CN114507379B (en) * 2020-10-28 2024-02-13 中国石油化工股份有限公司 Heat-conducting composite filler, preparation method thereof, heat-conducting thermoplastic resin composite material and application thereof
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