CN106273212A - Integral formation method in the mould of 3C electronic product - Google Patents
Integral formation method in the mould of 3C electronic product Download PDFInfo
- Publication number
- CN106273212A CN106273212A CN201510275693.XA CN201510275693A CN106273212A CN 106273212 A CN106273212 A CN 106273212A CN 201510275693 A CN201510275693 A CN 201510275693A CN 106273212 A CN106273212 A CN 106273212A
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- China
- Prior art keywords
- encapsulating
- mainboard
- mould
- formation method
- electronic product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The present invention provides integral formation method in the mould of a kind of 3C electronic product, comprise the following steps: the mainboard after being completed puts into encapsulating smelting tool, around surrounding's composition encapsulating region of described mainboard in described encapsulating smelting tool, injection ring epoxy resins in described encapsulating region, obtain the semi-finished articles of an epoxy resin layer cladding after cooling, complete encapsulation；After each interface of described semi-finished articles is inserted adaptive encapsulation plug, in being fixed on the die cavity of an injection mold, carry out High Temperature High Pressure injection, after injection casing is coated with whole semi-finished articles, take out product, pull out encapsulation plug, obtain finished parts.The present invention passes through a form and secondary injection molding, and two cover systems complete the one-body molded of semi-finished product and finished product, and whole processing procedure fastens without screw snap fit, reduces manual operation, overcomes the problem that 3C industry human cost increases and manpower money is in short supply.
Description
Technical field
The present invention relates to 3C electronic product；
Particularly relate to integral formation method in the mould of a kind of 3C electronic product.
Background technology
All the time, the commonly used traditional screw of 3C Product manufacture method, the man-made assembly mode of snap fit fastening, and similar use
It is mainly used for playing the effects such as waterproof, antidetonation to integrated technology.
Chinese invention patent 201410235833.6 discloses a kind of one-body molded manufacture method of 3C watertight construction of electronic product and system
Making equipment, the method comprises the following steps: the solid-state silica gel materials of scheduled volume is put in material hole by a.；B. described material feeding is extruded
Solid-state silica gel materials in hole is caused to flow, and by entering in the waterproof construction die cavity that glue passage flows in the mould being placed with product；
C. make mobility solid-state silica gel that vulcanization reaction is occurred by high temperature in described mould, on product, be finally integrally molded so as silica gel prevent
Water-bound part.This patent is for existing completed knocked down products, uses silicone filler waterproof construction, to reach waterproof effect.
Chinese utility model patent 01273003.3 discloses the casing of a kind of electronic product, and it applies to extensive electronics and produces
The outer covering layer structure of product, this electronic product at least has a tool and controls the composition organ such as circuit board of effect, and circuit board can position
In the accommodating groove void of mould, inject two-form polyurethane composition raw material, or the mixing of two-form silica gel materials at circuit board outer surface
The glue material constituted, can the most integrally be coated on the outer surface of circuit board, and form a soft enclosure structure after the solidification of glue material.This is special
The profit single dimensional packaged circuit board of main silica gel, waterproof to solve, anti-seismic problem, does not accounts for product appearance scheme and silica type produces
The resistance to compression of product, heatproof problem.
Above two scheme is required to repeatedly man-made assembly, and is to use similar silica gel to remove filling product surface or gap, silicon
The hardness of glue is relatively low, and resistance to elevated temperatures is poor simultaneously.
Therefore, day by day improve according to 3C industry human cost and present situation that human resources is in short supply, design a kind of efficiently, safety
Integral formation method, while meeting existing rhythm of production, do not increase investment in fixed assets, it has also become those skilled in the art
Technical barrier in the urgent need to address.
Summary of the invention
The technical problem to be solved is aiming at above-mentioned deficiency present in prior art, it is provided that a kind of 3C electronic product
Mould in integral formation method, reduce manual operation, it is to avoid human resources is not enough.
For achieving the above object and other relevant purposes, the present invention provides integral formation method in the mould of a kind of 3C electronic product, institute
Stating 3C electronic product and at least include mainboard, integral formation method comprises the following steps:
Mainboard after being completed puts into encapsulating smelting tool, around surrounding's composition encapsulating of described mainboard in described encapsulating smelting tool
Region, injection ring epoxy resins in described encapsulating region, obtain the semi-finished articles of an epoxy resin layer cladding after cooling, complete
Become encapsulation；
After each interface of described semi-finished articles is inserted adaptive encapsulation plug, in being fixed on the die cavity of an injection mold, carry out height
Temperature high-pressure injection moulding, after injection casing is coated with whole semi-finished articles, takes out product, pulls out encapsulation plug, obtains finished parts.
Preferably, before encapsulation, both sides, mainboard preset interface portion, with lid split, constitute the time processing interface of direction of insertion opening.
Further, the space between lid and mainboard sidewall is sealed with gap filler.
Further, when mainboard puts into encapsulating smelting tool, the inwall that described time processing interface is had by described encapsulating smelting blocks.
Preferably, after mainboard puts into encapsulating smelting tool, the top that the opening of described interface has towards corresponding described encapsulating smelting.
Preferably, injection raw material is the thermoplastic plastic rubber or other plastic cement mixed by Merlon and polyacrylonitrile alloy.
By above technical scheme, the present invention has following technical effect that the present invention to pass through once compared to prior art and irrigates into
Type and secondary injection molding, two cover systems complete the one-body molded of semi-finished product and finished product, and whole processing procedure fastens without screw snap fit,
Reduce manual operation, overcome the problem that 3C industry human cost increases and human resources is in short supply.Take epoxy resin base material simultaneously
Sealing electronics mainboard, increases anti-high pressure, resistant to elevated temperatures effect, and in then putting injection machine mould into, forming covered goes out shell, reaches
One-body molded body, and then without man-made assembly, it is provided simultaneously with the functions such as waterproof, dust-proof, antidetonation.
Accompanying drawing explanation
Fig. 1 be 3C electronic product of the present invention mould in the flow chart of integral formation method.
Element numbers illustrates:
S1～S8 step
Detailed description of the invention
By particular specific embodiment, embodiments of the present invention being described below, those skilled in the art can be taken off by this specification
The content of dew understands other advantages and effect of the present invention easily.
Refer to Fig. 1.It should be clear that structure depicted in this specification institute accompanying drawings, ratio, size etc., the most only in order to coordinate
Content disclosed in bright book, understands for those skilled in the art and reads, being not limited to the enforceable restriction of the present invention
Condition, therefore do not have technical essential meaning, the modification of any structure, the change of proportionate relationship or the adjustment of size, at not shadow
Ring under the effect that can be generated by of the present invention and the purpose that can reach, all should still fall and obtain can contain at disclosed technology contents
In the range of lid.Meanwhile, in this specification cited as " on ", D score, "left", "right", " middle " and
The term of " one " etc., is merely convenient to understanding of narration, and is not used to limit the enforceable scope of the present invention, its relativeness
Be altered or modified, without essence change technology contents under, when being also considered as the enforceable category of the present invention.
Refering to shown in Fig. 1, it is shown as the flow chart of integral formation method in the mould of the present invention a kind of 3C electronic product, mainly includes
Following steps:
S1: before encapsulation, mainboard (MB) preset interface portion (I/O mouth) both sides, with lid split, constitute only remaining direction of insertion and open
The time processing interface of mouth.Then gap filler is used to seal each space between lid and mainboard sidewall.
S2: the mainboard after being completed puts into encapsulating smelting tool.After must ensureing that mainboard puts into encapsulating smelting tool, time processing interface quilt
The inwall closure of encapsulating smelting tool, during to ensure encapsulating, interface is not sealed.As a further improvement on the present invention, mainboard puts into filling
After glue smelting tool, the opening of interface is towards the top answering corresponding encapsulating smelting to have, and plugging effect is more preferably.
Around surrounding's composition encapsulating region of mainboard, injection ring epoxy resins in encapsulating region, room temperature state in S3: encapsulating smelting tool
Under can be without pressure injection.
S4: epoxy resin nature levelling cooling after obtain epoxy resin base material cladding semi-finished articles, possess can resistance to compression, shock resistance,
The characteristic such as high temperature resistant, completes encapsulation.
S5-S6: after each interface of semi-finished articles is inserted adaptive encapsulation plug, be fixed in the die cavity of an injection mold.
S7: carrying out High Temperature High Pressure injection, injection raw material is for be mixed by Merlon (PC) and polyacrylonitrile alloy (ABS)
Thermoplastic plastic rubber or other plastic cement.Above-mentioned mixing plastic cement combines the excellent specific property of bi-material, the mouldability of ABS material
Mechanicalness, impact strength and the character such as heatproof, uvioresistant with PC material.
After S8: injection casing is coated with whole semi-finished articles, take out product, pull out encapsulation plug, obtain the finished product possessing default outward appearance
Part.
In sum, the present invention passes through a form and secondary injection molding, and two cover systems complete the one of semi-finished product and finished product
Body formed, whole processing procedure fastens without screw snap fit, reduces manual operation, overcomes 3C industry human cost to increase and manpower money
Problem in short supply.Take epoxy resin base material sealing electronics mainboard simultaneously, increase anti-high pressure, resistant to elevated temperatures effect, then put into
In injection machine mould, forming covered goes out shell, reaches one-body molded body, and then without man-made assembly, is provided simultaneously with waterproof, anti-
Dirt, the function such as antidetonation.
The principle of above-described embodiment only illustrative present invention and effect thereof, not for limiting the present invention.Any it is familiar with this skill
Above-described embodiment all can be modified under the spirit and the scope of the present invention or change by the personage of art.Therefore, such as
All that in art, tool usually intellectual is completed under without departing from disclosed spirit and technological thought etc.
Effect is modified or changes, and must be contained by the claim of the present invention.
Claims (6)
1. an integral formation method in the mould of 3C electronic product, described 3C electronic product at least includes mainboard, it is characterised in that
Integral formation method comprises the following steps:
Mainboard after being completed puts into encapsulating smelting tool, around surrounding's composition encapsulating of described mainboard in described encapsulating smelting tool
Region, injection ring epoxy resins in described encapsulating region, obtain the semi-finished articles of an epoxy resin layer cladding after cooling, complete
Become encapsulation；
After each interface of described semi-finished articles is inserted adaptive encapsulation plug, in being fixed on the die cavity of an injection mold, carry out height
Temperature high-pressure injection moulding, after injection casing is coated with whole semi-finished articles, takes out product, pulls out encapsulation plug, obtains finished parts.
Integral formation method in the mould of 3C electronic product the most according to claim 1, it is characterised in that before encapsulation, mainboard is pre-
If interface portion both sides are with lid split, constitute the time processing interface of direction of insertion opening.
Integral formation method in the mould of 3C electronic product the most according to claim 2, it is characterised in that seal lid with gap filler
Space between son and mainboard sidewall.
Integral formation method in the mould of 3C electronic product the most according to claim 2, it is characterised in that mainboard puts into encapsulating smelting
During tool, the inwall that described time processing interface is had by described encapsulating smelting blocks.
Integral formation method in the mould of 3C electronic product the most according to claim 1, it is characterised in that mainboard puts into encapsulating smelting
After tool, the top that the opening of described interface has towards corresponding described encapsulating smelting.
Integral formation method in the mould of 3C electronic product the most according to claim 1, it is characterised in that injection raw material is for by gathering
Thermoplastic plastic rubber that carbonic ester and polyacrylonitrile alloy mix or other plastic cement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510275693.XA CN106273212A (en) | 2015-05-27 | 2015-05-27 | Integral formation method in the mould of 3C electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510275693.XA CN106273212A (en) | 2015-05-27 | 2015-05-27 | Integral formation method in the mould of 3C electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106273212A true CN106273212A (en) | 2017-01-04 |
Family
ID=57635009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510275693.XA Pending CN106273212A (en) | 2015-05-27 | 2015-05-27 | Integral formation method in the mould of 3C electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106273212A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107124492A (en) * | 2017-07-07 | 2017-09-01 | 广东远华电信科技有限公司 | Mobile phone complete machine method for waterproofing |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0078934A2 (en) * | 1981-11-06 | 1983-05-18 | PREH, Elektrofeinmechanische Werke Jakob Preh Nachf. GmbH & Co. | Method of producing a contact mat |
| US20030003357A1 (en) * | 2001-06-29 | 2003-01-02 | Mikitaka Tamai | Battery pack and its method of manufacture |
| CN102088130A (en) * | 2009-12-03 | 2011-06-08 | 深圳富泰宏精密工业有限公司 | Shell of electronic device and manufacturing method thereof |
-
2015
- 2015-05-27 CN CN201510275693.XA patent/CN106273212A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0078934A2 (en) * | 1981-11-06 | 1983-05-18 | PREH, Elektrofeinmechanische Werke Jakob Preh Nachf. GmbH & Co. | Method of producing a contact mat |
| US20030003357A1 (en) * | 2001-06-29 | 2003-01-02 | Mikitaka Tamai | Battery pack and its method of manufacture |
| CN102088130A (en) * | 2009-12-03 | 2011-06-08 | 深圳富泰宏精密工业有限公司 | Shell of electronic device and manufacturing method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107124492A (en) * | 2017-07-07 | 2017-09-01 | 广东远华电信科技有限公司 | Mobile phone complete machine method for waterproofing |
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| C10 | Entry into substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170104 |
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| RJ01 | Rejection of invention patent application after publication |