CN106272085B - Grinding processing method after a kind of liquid crystal glass base thinning - Google Patents
Grinding processing method after a kind of liquid crystal glass base thinning Download PDFInfo
- Publication number
- CN106272085B CN106272085B CN201610718932.9A CN201610718932A CN106272085B CN 106272085 B CN106272085 B CN 106272085B CN 201610718932 A CN201610718932 A CN 201610718932A CN 106272085 B CN106272085 B CN 106272085B
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- Prior art keywords
- grinding
- fixed disk
- liquid crystal
- grinder
- glass base
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention belongs to liquid crystal glass base thinning technique grinding technique fields, the present invention is directed to the deficiency of existing thinning grinding technics technology, disclose grinding processing method after a kind of liquid crystal glass base thinning, include following steps: lapping liquid prepares, grinder cleaning and grinder grinding；The beneficial effects of the present invention are as follows: the present invention effectively can easily make mechanical scratch on liquid crystal glass base surface substantially reduce, liquid crystal glass base surface grain yield after grinding is improved, grinding is reduced and returns grinding again, improve production efficiency.
Description
Technical field
The invention belongs to liquid crystal glass base thinning technique grinding technique fields, and in particular to a kind of liquid crystal glass base is thin
Grinding processing method after change.
Background technique
Flat-panel monitor includes waiting liquid crystal displays (LCD), touch screen (TP), gas ions display (PDP) and Organic Electricity
Photoluminescence device (OLED).Liquid crystal display setting due to provide distinct image based on brilliant resolution ratio, little power consumption, can be relatively thin
The characteristic of ground production display picture, most attracts attention in FPD setting.Liquid crystal display is set using in including mobile phone, pen
Remember that the mobile of this type PC uses equipment and TV.
The thinning of liquid crystal glass base at present mainly uses chemical Milling Technique In The Microstructure Study, and technique includes: sealing solidification, and chemistry is thin
Change, cleaned after thinning, grinds, cleaned by hand after grinding, horizontal cleaning machine cleaning.With the development of technology, the ultra-thin liquid crystal of super large
The thinned of panel has become mainstream in industry, and lapping liquid is the main material of liquid crystal glass base thinning technique grinding and polishing, and
Lapping liquid becomes difficult point to crystal liquid substrate surface yield situation after grinding, and traditional lapping liquid is with tap water and partial size for 1.7 μm
Grounds travel configures, and filtering setting is generally filtered using antistatic gloves or silk stocking, and crystal liquid substrate surface is big after grinding
Have more it is mechanical scratch and supplied materials sags and crests are untreated clean, prevent crystal liquid substrate yield is from meeting customer need and counter throwing height
Influence production efficiency.
Summary of the invention
The purpose of the present invention is the deficiencies for existing thinning grinding technics technology, grind after providing liquid crystal glass base thinning
Processing method is ground, this method effectively can easily make mechanical scratch on liquid crystal glass base surface substantially reduce, and raising is ground
Grain yield in liquid crystal glass base surface after mill, reduces grinding and returns grinding again, improve production efficiency.
In order to achieve the above object, the present invention adopts the following technical scheme:
Grinding processing method after a kind of liquid crystal glass base thinning, includes the following steps:
(1) preparation of lapping liquid: lapping liquid is that ultrapure water and cerium rouge are mixed to form；
Ultrapure waterpipe is accessed to grinder station from power department；
First grinding drum is cleaned up, it is ensured that inner wall noresidue foreign matter or blocky polishing powder；Then 2/3 barrel of addition is ultrapure
Water is opened lapping liquid circulation, lapping liquid remaining in pipeline is washed away completely, then pure water remaining in grinding drum is outwelled, such as
There are also foreign matter in fruit grinding drum, need to continue to clean to clean；
It is added above ultrapure water to grinding drum at about 5cm, opens stirring, it is that 1.0 μm of cerium oxide are thrown that 2000mL partial size, which is added,
Light powder；
Short cylinder silk stocking are arranged in liquid outlet in grinding machine grinding fluid liquid outlet pipe, and one is once again set up outside silk stocking
Density is the filter bag of 200 mesh, after being provided with, gently pulls filter bag with hand, if it find that just being torn easily, then needs
Again filter bag is configured, to prevent it from falling during the grinding process, leads to quality abnormal；
(2) grinder cleans:
A) upper fixed disk is cleaned: board is first adjusted to manual operation state, upper fixed disk is then got to horizontal position manually,
Upper fixed disk surface is rinsed with hydraulic giant on the other hand, the other hand scrubs its surface with hairbrush, by the removable throwing in surface
Light powder remains cleaning；Notice whether upper fixed disk surface has glass residue or other hard objects, it must be by it if any such article
It removes, if there is agglomeration polishing powder residual brush in part not fall, upper fixed disk surface can be stayed at, this process need to be completed in 2min；
B) polishing pad cleans: after upper fixed disk cleaning, after being risen to highest point, lower fixed disk rotation is opened manually,
Pad interface is rinsed with hydraulic giant on the other hand, the other hand scrubs board surface with hairbrush, scrubs sequence by polishing
Pad middle position starts outward one by one to scrub entire pad interface, this process need to be completed in 1min；
C) grinder station clean: polishing pad cleaning after the completion of open external water pipe, with hose nozzle to board baffle and under
Price fixing bottom is rinsed, and the especially remaining polishing powder agglomeration in lower fixed disk bottom has to rinse out.After the completion of cleaning, close
Falling down price fixing rotation and external water pipe, this process need to complete in 2min；
(3) grinder is ground: after the completion of grinder station cleaning, grinder station being adjusted to auto state, according to different shaped
The requirement of number substrate polishing technological parameter adjusts the work that runs well after grinder station parameter.
The cerium rouge model that the present invention uses is covered sharp.
Preferably, the mass ratio of cerium rouge and ultrapure water is 8:100.
Preferably, the concentration range of lapping liquid is more than or equal to 1.02g/cm2。
The beneficial effects of the present invention are as follows:
(1) lapping liquid of the invention is that ultrapure water and cerium rouge are mixed to form, and cerium rouge has cutting
The advantages that power is strong, polishing time is short, long service life, polishing precision height, epigranular；Ultrapure water is conducive to improve liquid-crystalline glasses
The surface grinding effect of substrate；
(2) method of the invention can effectively improve and grind metacoxal plate surface machinery in liquid crystal glass base thinning technique
The surfaces such as scuffing are bad；Short cylinder silk stocking are provided in grinder liquid outlet, and being once again set up a density outside silk stocking is 200
Mechanical scratch of mesh filter bag, liquid crystal glass base surface substantially reduces, and liquid crystal glass base surface grain is good after improving grinding
Rate；
(3) present invention can reduce grinding and return grinding again, significantly reduce after grinding in liquid crystal glass base thinning technique
Anti- throwing rate, reduces grinder milling time, improves production efficiency.
Detailed description of the invention
Fig. 1 is process flow chart of the invention.
Specific embodiment
The present invention is further illustrated with reference to the accompanying drawings and examples.
Embodiment 1
Grinding processing method after a kind of liquid crystal glass base thinning, includes the following steps:
(1) preparation of lapping liquid: lapping liquid is that ultrapure water and cerium rouge are mixed to form；
Ultrapure waterpipe is accessed to grinder station from power department；
First grinding drum is cleaned up, it is ensured that inner wall noresidue foreign matter or blocky polishing powder；Then 2/3 barrel of addition is ultrapure
Water is opened lapping liquid circulation, lapping liquid remaining in pipeline is washed away completely, then pure water remaining in grinding drum is outwelled, such as
There are also foreign matter in fruit grinding drum, need to continue to clean to clean；
It is added above ultrapure water to grinding drum at about 5cm, opens stirring, it is that 1.0 μm of cerium oxide are thrown that 2000mL partial size, which is added,
Light powder；The cerium rouge model that the present invention uses is covered sharp；The mass ratio of cerium rouge and ultrapure water is 8:100；
The concentration range of lapping liquid is more than or equal to 1.02g/cm2。
Short cylinder silk stocking are arranged in two liquid outlets in grinding machine grinding fluid liquid outlet pipe, and are once again set up outside silk stocking
One density is 200 mesh, and the filter bag of long 150mm wide 90mm after being provided with, gently pulls filter bag with hand, if it find that
It is just torn easily, then needs again to be configured filter bag, to prevent it from falling during the grinding process, cause quality different
Often；
(2) grinder cleans:
A) upper fixed disk is cleaned: board is first adjusted to manual operation state, upper fixed disk is then got to horizontal position manually,
Upper fixed disk surface is rinsed with hydraulic giant on the other hand, the other hand scrubs its surface with hairbrush, by the removable throwing in surface
Light powder remains cleaning；Notice whether upper fixed disk surface has glass residue or other hard objects, it must be by it if any such article
It removes, if there is agglomeration polishing powder residual brush in part not fall, upper fixed disk surface can be stayed at, this process need to be completed in 2min；
B) polishing pad cleans: after upper fixed disk cleaning, after being risen to highest point, lower fixed disk rotation is opened manually,
Pad interface is rinsed with hydraulic giant on the other hand, the other hand scrubs board surface with hairbrush, scrubs sequence by polishing
Pad middle position starts outward one by one to scrub entire pad interface, this process need to be completed in 1min；
C) grinder station cleans: external water pipe is opened after the completion of polishing pad cleaning, water need to control in a certain range, if
Water is excessive, and waste water can overflow in polishing bucket from liquid mouth is cut after cleaning, causes the pollution of polishing fluid, influences product polishing product
Matter, if water is too small, board is unable to cleaning also and will affect product polishing quality.With hose nozzle to board baffle and lower fixed
Pan bottom is rinsed, and the especially remaining polishing powder agglomeration in lower fixed disk bottom has to rinse out.After the completion of cleaning, turn off
Lower fixed disk rotation and external water pipe, this process need to be completed in 2min；
(3) grinder is ground: after the completion of grinder station cleaning, grinder station being adjusted to auto state, according to different shaped
The requirement of number substrate polishing technological parameter adjusts the work that runs well after grinder station parameter.
The preferred embodiment of the present invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
Limitations on the scope of the patent of the present invention therefore cannot be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, several deformations can also be made, improves and substitutes, these belong to this hair
Bright protection scope.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (1)
1. grinding processing method after a kind of liquid crystal glass base thinning, which comprises the steps of:
(1) preparation of lapping liquid: lapping liquid is that ultrapure water and cerium rouge are mixed to form；
Ultrapure waterpipe is accessed to grinder station from power department；
First grinding drum is cleaned up, 2/3 barrel of ultrapure water is then added, lapping liquid circulation is opened, by grinding remaining in pipeline
Liquid washes away completely, then ultrapure water remaining in grinding drum is outwelled；
It is added above ultrapure water to grinding drum at 5cm, opens stirring, addition 2000mL partial size is 1.0 μm of cerium rouges；
The mass ratio of cerium rouge and ultrapure water is 8:100；The concentration range of lapping liquid is more than or equal to 1.02g/cm2；
Short cylinder silk stocking are arranged in liquid outlet in grinding machine grinding fluid liquid outlet pipe, and a density is once again set up outside silk stocking
For the filter bag of 200 mesh；
(2) grinder cleans:
A) upper fixed disk is cleaned: board being first adjusted to manual operation state, upper fixed disk is then got to horizontal position manually, on the other hand
Upper fixed disk surface is rinsed with hydraulic giant, the other hand scrubs its surface with hairbrush, by the removable polishing powder in surface
Cleaning is remained, this process need to be completed in 2min；
B) polishing pad cleans: after upper fixed disk cleaning, after being risen to highest point, opening lower fixed disk rotation manually, on the other hand
Pad interface is rinsed with hydraulic giant, the other hand scrubs board surface with hairbrush, scrubs sequence by polishing pad
Between position start outward one by one to scrub entire pad interface, this process need to be completed in 1min；
C) grinder station cleans: external water pipe is opened after the completion of polishing pad cleaning, with hose nozzle to board baffle and lower fixed disk
Bottom is rinsed, and the especially remaining polishing powder agglomeration in lower fixed disk bottom has to rinse out, after the completion of cleaning, under turning off
Price fixing rotation and external water pipe, this process need to be completed in 2min；
(3) grinder is ground: after the completion of grinder station cleaning, grinder station being adjusted to auto state, according to different model base
Plate polishing process parameter request runs well work after adjusting grinder station parameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610718932.9A CN106272085B (en) | 2016-08-24 | 2016-08-24 | Grinding processing method after a kind of liquid crystal glass base thinning |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610718932.9A CN106272085B (en) | 2016-08-24 | 2016-08-24 | Grinding processing method after a kind of liquid crystal glass base thinning |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106272085A CN106272085A (en) | 2017-01-04 |
| CN106272085B true CN106272085B (en) | 2019-01-04 |
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| CN201610718932.9A Active CN106272085B (en) | 2016-08-24 | 2016-08-24 | Grinding processing method after a kind of liquid crystal glass base thinning |
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| CN110076681B (en) * | 2018-09-12 | 2021-03-19 | 滁州盛诺电子科技有限公司 | Grinding treatment process for liquid crystal display screen |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1608800A (en) * | 2003-10-20 | 2005-04-27 | 碧悠国际光电股份有限公司 | Grinding apparatus and method for refining grinding glass substrate |
| CN101357450B (en) * | 2007-08-03 | 2011-03-23 | 中芯国际集成电路制造(上海)有限公司 | Chemically machinery grinding device and method for cleaning grinding pad and grinding head |
| CN101439494A (en) * | 2007-11-22 | 2009-05-27 | 上海华虹Nec电子有限公司 | Cleaner for CMP equipment grinding head |
| CN101457136A (en) * | 2007-12-13 | 2009-06-17 | 中芯国际集成电路制造(上海)有限公司 | Lapping liquid and chemical-mechanical lapping method |
| US20100258143A1 (en) * | 2009-04-13 | 2010-10-14 | Microchip Technology Incorporated | Scrubber clean before oxide chemical mechanical polish (cmp) for reduced microscratches and improved yields |
| JP5750877B2 (en) * | 2010-12-09 | 2015-07-22 | 株式会社Sumco | Wafer single-side polishing method, wafer manufacturing method, and wafer single-side polishing apparatus |
| CN102922409B (en) * | 2011-08-09 | 2014-12-10 | 劲耘科技股份有限公司 | Method for grinding surface of glass substrate |
| CN203141294U (en) * | 2013-03-04 | 2013-08-21 | 扬州百德光电有限公司 | Liquid crystal glass grinder |
| CN104308720A (en) * | 2014-08-27 | 2015-01-28 | 上海华力微电子有限公司 | Grinding head washing device, grinding equipment and washing method |
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