CN106271188A - A kind of titanium cup Special vacuum solder and processing method thereof and soldering processes - Google Patents

A kind of titanium cup Special vacuum solder and processing method thereof and soldering processes Download PDF

Info

Publication number
CN106271188A
CN106271188A CN201610869329.0A CN201610869329A CN106271188A CN 106271188 A CN106271188 A CN 106271188A CN 201610869329 A CN201610869329 A CN 201610869329A CN 106271188 A CN106271188 A CN 106271188A
Authority
CN
China
Prior art keywords
solder
titanium cup
vacuum
incubated
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610869329.0A
Other languages
Chinese (zh)
Inventor
吕强
翁文武
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang Haers Vacuum Containers Co Ltd
Original Assignee
Zhejiang Haers Vacuum Containers Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhejiang Haers Vacuum Containers Co Ltd filed Critical Zhejiang Haers Vacuum Containers Co Ltd
Priority to CN201610869329.0A priority Critical patent/CN106271188A/en
Publication of CN106271188A publication Critical patent/CN106271188A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace

Abstract

The invention provides a kind of titanium cup Special vacuum solder, be made up of following component: PbO78%～85%；TiO25%～10%；B2O35%～10%；ZnO0.5%～1.5%；SiO20.5%～0.8%；Al2O30.5%～0.8%；CuO 0.1%～0.5%.The processing method of titanium cup Special vacuum solder is as follows: step one, weighs each component in proportion and is placed on melting in platinum Pt crucible, after waiting each component to melt completely, is incubated with 950 DEG C～1050 DEG C and carries out homogenization of composition process, preparing glass solder block；Step 2, being broken into suitable granular size, ball milling becomes powder, is molded into flat-shaped cylinder base substrate；Step 3, base substrate enter the continuous tunnel furnace of 400 DEG C～420 DEG C and heat 3 minutes, are shaped to finished product.When the solder of the present invention is welded at the vacuum interlayer bleeding point of titanium cup, stable firm.

Description

A kind of titanium cup Special vacuum solder and processing method thereof and soldering processes
Technical field
The present invention relates to vacuum brazing field, be specifically related to a kind of titanium cup Special vacuum solder and processing method thereof and soldering Technique.
Background technology
Vacuum brazing refers to that workpiece heat is carried out in being welded on vacuum chamber.Double-layer vacuum titanium cup is accomplished by exhausting vacuum In the case of, the bleeding point after vacuum interlayer evacuation is welded.The vacuum brazing material used at present mostly typically is glass Solder, owing to the thermal coefficient of expansion of glass solder is at (11.5-12.5) * 10-6Between/K, compared to titanium material swollen making titanium cup Swollen coefficient difference is more.The titanium material of making titanium cup thermal coefficient of expansion at different temperatures is as shown in the table:
Temperature/DEG C Thermal coefficient of expansion/10-6/K
20 7.6
100 7.6
200 8.9
300 9.5
400 9.6
500 9.7
During so existing glass solder to be directly applied to the soldering processes of titanium cup, easily occur that soldering is insecure, unstable Situation.
Summary of the invention
The present invention is to solve double-layer vacuum titanium cup in anury vacuum process sealed with brazing problem, and provides a kind of titanium cup Special vacuum solder and processing method thereof and soldering processes.
The technical solution used in the present invention is as follows:
A kind of titanium cup Special vacuum solder, is made up of by following mass percent following component:
PbO 78%～85%；
TiO25%～10%；
B2O35%～10%；
ZnO 0.5%～1.5%；
SiO20.5%～0.8%；
Al2O30.5%～0.8%；
CuO 0.1%～0.5%.
As preferably, the titanium cup Special vacuum solder of the present invention, it is made up of by following mass percent following component:
PbO 80%～82%；
TiO28%～10%；
B2O38%～10%；
ZnO 0.5%～1.5%；
SiO20.5%～0.8%；
Al2O30.5%～0.8%；
CuO 0.1%～0.5%.
As preferably, the titanium cup Special vacuum solder of the present invention, it is made up of by following mass percent following component:
PbO 81%；
TiO29%；
B2O38%；
ZnO 0.5%；
SiO20.5%；
Al2O30.5%；
CuO 0.5%。
The processing method of a kind of titanium cup Special vacuum solder, specifically comprises the following steps that
Step one, prepare solder: by PbO, TiO2、B2O3、ZnO 、SiO2、Al2O3、CuO each component weighs in proportion and is placed on platinum Melting in gold Pt crucible, after waiting each component to melt completely, is incubated with 950 DEG C～1050 DEG C and carries out homogenization of composition process 40 points Clock, prepares glass solder block；
Step 2, glass solder block are broken into suitable granular size, and ball milling becomes powder, use mo(u)ldenpress to be molded into flat-shaped circle Post base substrate；
Step 3, base substrate enter the continuous tunnel furnace of 400 DEG C～420 DEG C and heat 3 minutes, are shaped to vacuum brazing material product.
The vacuum brazing technique of a kind of titanium cup Special vacuum solder, specifically comprises the following steps that
Step one, by according to claim 2 processing method prepare vacuum brazing material product be positioned over the solder at the end in titanium cup anury At concave station；
After step 2, furnace temperature are less than 150 DEG C, ready titanium cup to be processed in step one are moved in vacuum drying oven, close fire door；
Step 3, bleed about 10min, and in stove, vacuum reaches below 100Pa, is initially powered up heating；
Step 4, intensification 5min reach 280 DEG C, are incubated 10min；
Step 5, intensification 5min reach 380 DEG C, are incubated 15min；
Step 6, intensification 5min reach 420 DEG C, are incubated 10min；
Step 7, intensification 10min reach 520 DEG C, are incubated 15min；
Step 8, intensification 10min reach 600 DEG C, are incubated 20min；
Step 9, power-off cooling, treat that the temp. in vacuum furnace is down to 150 DEG C, and blow-on door takes out titanium cup after cooling down completely.
The method have the advantages that the finished product prepared by the solder formula of the present invention, at 400 DEG C～420 DEG C of models Enclosing thermal expansion coefficient is (9.5-9.7) * 10-6/ K, the titanium material with titanium cup has the expansion system being sufficiently close at the corresponding temperature Number, thus when vacuum welding is at the vacuum interlayer bleeding point of titanium cup, stable performance, the most firmly.Compared to existing Brazing material is more applicable for the soldering of titanium cup.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is described in further detail.
Embodiment 1
Weigh the material of following component:
PbO 78.4KG；
TiO210KG；
B2O310KG；
ZnO 0.5KG；
SiO20.5KG；
Al2O30.5KG；
CuO 0.1KG。
Weighing is placed on melting in platinum Pt crucible, after waiting each component to melt completely, goes forward side by side with 950 DEG C～1050 DEG C of insulations Row homogenization of composition processes 40 minutes, prepares glass solder block；Then glass solder block is broken into suitable granular size, ball Wear into powder (black pigment can also be added after being milled to powder as required), use mo(u)ldenpress to be molded into flat-shaped cylindrical blank Body；The continuous tunnel furnace finally flat-shaped cylinder base substrate entering 400 DEG C～420 DEG C heats 3 minutes, is shaped to vacuum brazing material product.This Embodiment makes the thermal coefficient of expansion of the solder obtained at a temperature of 400 DEG C～420 DEG C for (9.5-9.7) * 10-6/K。
The vacuum brazing technique of a kind of titanium cup Special vacuum solder, specifically comprises the following steps that
Step one, the vacuum brazing material product of above-mentioned preparation is positioned in titanium cup anury at the solder concave station at the end；
After step 2, furnace temperature are less than 150 DEG C, ready titanium cup to be processed in step one are moved in vacuum drying oven, close fire door；
Step 3, bleed about 10min, and in stove, vacuum reaches below 100Pa, is initially powered up heating；
Step 4, intensification 5min reach 280 DEG C, are incubated 10min；
Step 5, intensification 5min reach 380 DEG C, are incubated 15min；
Step 6, intensification 5min reach 420 DEG C, are incubated 10min；
Step 7, intensification 10min reach 520 DEG C, are incubated 15min；
Step 8, intensification 10min reach 600 DEG C, are incubated 20min；
Step 9, power-off cooling, treat that the temp. in vacuum furnace is down to 150 DEG C, and blow-on door takes out titanium cup.
Take out the titanium cup that soldering is good, it can be observed that the bleeding point weld after vacuum interlayer evacuation seals bright and clean and steady Gu.Through using for a long time, this bleeding point weld is the most firm.Illustrate that the solder of the present invention is very suitable for the weldering of titanium cup Connect.
Embodiment 2
Weigh the material of following component:
PbO 85KG；
TiO25KG；
B2O37.5KG；
ZnO 1.5KG；
SiO20.8KG；
Al2O30.8KG；
CuO 0.4KG。
Weighing is placed on melting in platinum Pt crucible, after waiting each component to melt completely, goes forward side by side with 950 DEG C～1050 DEG C of insulations Row homogenization of composition processes 40 minutes, prepares glass solder block；Then glass solder block is broken into suitable granular size, ball Wear into powder, use mo(u)ldenpress to be molded into flat-shaped cylinder base substrate；Finally flat-shaped cylinder base substrate is entered 400 DEG C～420 DEG C Continuous tunnel furnace heats 3 minutes, is shaped to vacuum brazing material product.
The soldering processes of the present embodiment are with embodiment 1.
Embodiment 3
Weigh the material of following component:
PbO 81.5KG；
TiO210KG；
B2O35KG；
ZnO 1.5KG；
SiO20.8KG；
Al2O30.8KG；
CuO 0.4KG。
Weighing is placed on melting in platinum Pt crucible, after waiting each component to melt completely, goes forward side by side with 950 DEG C～1050 DEG C of insulations Row homogenization of composition processes 40 minutes, prepares glass solder block；Then glass solder block is broken into suitable granular size, ball Wear into powder, use mo(u)ldenpress to be molded into flat-shaped cylinder base substrate；Finally flat-shaped cylinder base substrate is entered 400 DEG C～420 DEG C Continuous tunnel furnace heats 3 minutes, is shaped to vacuum brazing material product.
The soldering processes of the present embodiment are with embodiment 1.
Embodiment 4
Weigh the material of following component:
PbO 81KG；
TiO29KG；
B2O38KG；
ZnO 0.5KG；
SiO20.5KG；
Al2O30.5KG；
CuO 0.5KG。
Weighing is placed on melting in platinum Pt crucible, after waiting each component to melt completely, goes forward side by side with 950 DEG C～1050 DEG C of insulations Row homogenization of composition processes 40 minutes, prepares glass solder block；Then glass solder block is broken into suitable granular size, ball Wear into powder, use mo(u)ldenpress to be molded into flat-shaped cylinder base substrate；Finally flat-shaped cylinder base substrate is entered 400 DEG C～420 DEG C Continuous tunnel furnace heats 3 minutes, is shaped to vacuum brazing material product.
The soldering processes of the present embodiment are with embodiment 1.
Embodiment 5
Weigh the material of following component:
PbO 80KG；
TiO27.5KG；
B2O39.5KG；
ZnO 1KG；
SiO20.7KG；
Al2O30.8KG；
CuO 0.5KG。
Weighing is placed on melting in platinum Pt crucible, after waiting each component to melt completely, goes forward side by side with 950 DEG C～1050 DEG C of insulations Row homogenization of composition processes 40 minutes, prepares glass solder block；Then glass solder block is broken into suitable granular size, ball Wear into powder, use mo(u)ldenpress to be molded into flat-shaped cylinder base substrate；Finally flat-shaped cylinder base substrate is entered 400 DEG C～420 DEG C Continuous tunnel furnace heats 3 minutes, is shaped to vacuum brazing material product.
The soldering processes of the present embodiment are with embodiment 1.

Claims (5)

1. a titanium cup Special vacuum solder, it is characterised in that be made up of by following mass percent following component:
PbO 78%～85%；
TiO25%～10%；
B2O35%～10%；
ZnO 0.5%～1.5%；
SiO20.5%～0.8%；
Al2O30.5%～0.8%；
CuO 0.1%～0.5%.
2. titanium cup Special vacuum solder as claimed in claim 1, it is characterised in that:
It is made up of by following mass percent following component:
PbO 80%～82%；
TiO28%～10%；
B2O38%～10%；
ZnO 0.5%～1.5%；
SiO20.5%～0.8%；
Al2O30.5%～0.8%；
CuO 0.1%～0.5%.
3. titanium cup Special vacuum solder as claimed in claim 2, it is characterised in that:
It is made up of by following mass percent following component:
PbO 81%；
TiO29%；
B2O38%；
ZnO 0.5%；
SiO20.5%；
Al2O30.5%；
CuO 0.5%。
4. the processing method of titanium cup Special vacuum solder described in a claim 1, it is characterised in that specifically comprise the following steps that step One, solder is prepared: by PbO, TiO2、B2O3、ZnO 、SiO2、Al2O3、CuO each component weighs in proportion and is placed on platinum Pt crucible Middle melting, after waiting each component to melt completely, is incubated with 950 DEG C～1050 DEG C and carries out homogenization of composition process 40 minutes, preparing Glass solder block；
Step 2, glass solder block are broken into suitable granular size, and ball milling becomes powder, use mo(u)ldenpress to be molded into flat-shaped circle Post base substrate；
Step 3, base substrate enter the continuous tunnel furnace of 400 DEG C～420 DEG C and heat 3 minutes, are shaped to vacuum brazing material product.
5. the vacuum brazing technique of a titanium cup Special vacuum solder, it is characterised in that specifically comprise the following steps that
Step one, by according to claim 2 processing method prepare vacuum brazing material product be positioned over the solder at the end in titanium cup anury At concave station；
After step 2, furnace temperature are less than 150 DEG C, ready titanium cup to be processed in step one are moved in vacuum drying oven, close fire door；
Step 3, bleed about 10min, and in stove, vacuum reaches below 100Pa, is initially powered up heating；
Step 4, intensification 5min reach 280 DEG C, are incubated 10min；
Step 5, intensification 5min reach 380 DEG C, are incubated 15min；
Step 6, intensification 5min reach 420 DEG C, are incubated 10min；
Step 7, intensification 10min reach 520 DEG C, are incubated 15min；
Step 8, intensification 10min reach 600 DEG C, are incubated 20min；
Step 9, power-off cooling, treat that the temp. in vacuum furnace is down to 150 DEG C, and blow-on door takes out titanium cup.
CN201610869329.0A 2016-09-30 2016-09-30 A kind of titanium cup Special vacuum solder and processing method thereof and soldering processes Pending CN106271188A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610869329.0A CN106271188A (en) 2016-09-30 2016-09-30 A kind of titanium cup Special vacuum solder and processing method thereof and soldering processes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610869329.0A CN106271188A (en) 2016-09-30 2016-09-30 A kind of titanium cup Special vacuum solder and processing method thereof and soldering processes

Publications (1)

Publication Number Publication Date
CN106271188A true CN106271188A (en) 2017-01-04

Family

ID=57716740

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610869329.0A Pending CN106271188A (en) 2016-09-30 2016-09-30 A kind of titanium cup Special vacuum solder and processing method thereof and soldering processes

Country Status (1)

Country Link
CN (1) CN106271188A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107498211A (en) * 2017-10-18 2017-12-22 镇江市锶达合金材料有限公司 A kind of pb-free solder material and preparation method thereof
CN109171389A (en) * 2018-10-30 2019-01-11 江苏希诺实业有限公司 A kind of titanium vacuum cup and preparation method thereof
CN109182937A (en) * 2018-11-05 2019-01-11 浙江飞剑科技有限公司 A kind of titanium cup surface crystallization processing method
CN109465601A (en) * 2018-11-13 2019-03-15 西安庄信新材料科技有限公司 A kind of method of titanium seamless tubes production titanium vacuum cup

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000003956A1 (en) * 1998-07-17 2000-01-27 Sarnoff Corporation Embossed plasma display back panel
CN1587147A (en) * 2004-07-30 2005-03-02 京东方科技集团股份有限公司 Low melting point, low expanding coefficient solder glass seal powder and its preparing method
CN1833574A (en) * 2006-02-21 2006-09-20 吴秀杰 Dual-layer vacuum glass cup and its mfg. technique
CN101092308A (en) * 2006-06-23 2007-12-26 肖特股份公司 Glass frit free of alkaline, lead and cadmium and its use to produce coloured enamels
CN103405104A (en) * 2013-07-23 2013-11-27 吴海荣 Titanium metal vacuum cup and manufacturing method thereof
CN104556680A (en) * 2014-12-31 2015-04-29 贵州省轻工业科学研究所 Glass for tailless sealing of stainless steel vacuum insulation container and preparation method for glass

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000003956A1 (en) * 1998-07-17 2000-01-27 Sarnoff Corporation Embossed plasma display back panel
CN1587147A (en) * 2004-07-30 2005-03-02 京东方科技集团股份有限公司 Low melting point, low expanding coefficient solder glass seal powder and its preparing method
CN1833574A (en) * 2006-02-21 2006-09-20 吴秀杰 Dual-layer vacuum glass cup and its mfg. technique
CN101092308A (en) * 2006-06-23 2007-12-26 肖特股份公司 Glass frit free of alkaline, lead and cadmium and its use to produce coloured enamels
CN103405104A (en) * 2013-07-23 2013-11-27 吴海荣 Titanium metal vacuum cup and manufacturing method thereof
CN104556680A (en) * 2014-12-31 2015-04-29 贵州省轻工业科学研究所 Glass for tailless sealing of stainless steel vacuum insulation container and preparation method for glass

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
缪宏等: ""PbO-TiO2-SiO2-RxOy真空玻璃焊料封接性能"", 《材料热处理学报》 *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107498211A (en) * 2017-10-18 2017-12-22 镇江市锶达合金材料有限公司 A kind of pb-free solder material and preparation method thereof
CN109171389A (en) * 2018-10-30 2019-01-11 江苏希诺实业有限公司 A kind of titanium vacuum cup and preparation method thereof
CN109182937A (en) * 2018-11-05 2019-01-11 浙江飞剑科技有限公司 A kind of titanium cup surface crystallization processing method
CN109182937B (en) * 2018-11-05 2020-04-07 浙江飞剑科技有限公司 Titanium cup surface crystallization treatment method
CN109465601A (en) * 2018-11-13 2019-03-15 西安庄信新材料科技有限公司 A kind of method of titanium seamless tubes production titanium vacuum cup

Similar Documents

Publication Publication Date Title
CN106271188A (en) A kind of titanium cup Special vacuum solder and processing method thereof and soldering processes
CN103752971A (en) Method for connecting TC4 titanium alloy with silicon nitride ceramic by brazing connection with solders of titanium-silver-copper
RU2012118975A (en) METHOD FOR COMPOSITE SEALING FOR VACUUM GLASS
CN108461380A (en) A kind of control structure and control method of large scale integrated circuit chip sintering voidage
CN101229602B (en) Method of welding thermistance chip and down lead
CN103382079B (en) The method for sealing of toughened vacuum glass, preparation method and toughened vacuum glass
CN101531474B (en) Process for sealing multipin connector for glass and metal
CN108640522A (en) A kind of devitrified glass solder and the method using solder welding porous silicon nitride and compact silicon nitride
CN110551918B (en) Titanium alloy high-temperature brazing filler metal and preparation method thereof
EP2291334B1 (en) Glass ceramic composite structure and method for generating a glass ceramic composite structure
CN110330356A (en) A kind of silicon carbide ceramics soldering connecting method
CN103056468A (en) Method for brazing in vacuum state
CN105921840B (en) A kind of soldering processes
CN103100825A (en) Manufacturing method for pre-alloying gold-tin pre-forming soldering lug
TW201609037A (en) Vacuum flask with tin phosphorus oxide sealing glass
CN110625223B (en) Argon arc welding repair method for TiAl-based casting defects
CN1247143C (en) Metal vacuum double-layer container and its producing method, composition for sealing
CN104889519A (en) Highly-efficient, energy-saving and environmentally-friendly manufacturing method of metal ceramic X ray tube
CN110950538A (en) Preparation method of low-expansion high-temperature-resistant environment-friendly medium-low-temperature transparent glass glaze
US20150144615A1 (en) Brazing method and device for glass kovar combination and oxygen-free copper
EP3829265A1 (en) Ceramic heater and preparation method and use of ceramic heater
CN101723700B (en) Glaze for ceramic-to-metal sealing and preparation method thereof
US20160102914A1 (en) Modular heat treatment system
CN104276838B (en) Pottery vitrified method for sealing two with metal
CN105461241A (en) Preparation method of high temperature-resisting electronic linkage

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20170104