CN105461241A - Preparation method of high temperature-resisting electronic linkage - Google Patents
Preparation method of high temperature-resisting electronic linkage Download PDFInfo
- Publication number
- CN105461241A CN105461241A CN201510983117.0A CN201510983117A CN105461241A CN 105461241 A CN105461241 A CN 105461241A CN 201510983117 A CN201510983117 A CN 201510983117A CN 105461241 A CN105461241 A CN 105461241A
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- Prior art keywords
- glass
- preparation
- high temperature
- temperature resistant
- steps
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Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C29/00—Joining metals with the aid of glass
Abstract
The invention provides a preparation method of high temperature-resisting electronic linkage. The preparation method comprises the following steps of (a) preparing a glass biscuit; (b) carrying out purification and oxidation treatment on metal parts; (c) carrying out purification treatment on a graphite die; (d) carrying out die filling and vacuum positive-pressure sealing. The preparation method of the high temperature-resisting electronic linkage, provided by the invention is reasonable in material adoption, advanced in technology and low in production cost; the prepared electronic connector is excellent in high temperature resistance, has a very wide using temperature range and simultaneously has the excellent performances of good reliability, good sealability and high mechanical strength.
Description
Technical field
The present invention relates to a kind of preparation method, be specifically related to the preparation method that a kind of high temperature resistant electronics connects, belong to art of electrical connectors field.
Background technology
Electric power connector is used widely at many industrial circles, and it plays device and device, assembly and assembly, carry out between system and system being electrically connected and the vital role of signal transmission, is the important foundation element ensureing whole system reliable operation.Along with the development of industrial technology, special Working environment is had higher requirement to electric power connector, especially requires that electric power connector can have high reliability under high pressure, heavily stressed and high-temperature occasion.Existing plastics sealing-in electric power connector is difficult to adapt to the service requirements under some high temperature, low temperature, a particular job environment such as damp and hot, and glass sealing electric power connector is with its good physical strength, high thermal resistance, good stopping property, can safety, stable use under a particular job environment.
There is many deficiencies in the preparation technology of existing glass sealing electric power connector, as: sealing-in body raw material choose is reasonable not; Metal parts material and sealing-in mould do not carry out pre-treatment or pre-treatment is good not; Sealing-in treatment process parameters selection is improper, has that gas consumption is large, high in cost of production problem.Defect in above-mentioned preparation technology has seriously undermined the performance such as thermotolerance, reliability, stopping property, physical strength of electric power connector, causes electric power connector can not meet the service requirements under high temperature, high pressure, a particular job environment such as heavily stressed very well.
Summary of the invention
For the demand, the invention provides the preparation method that a kind of high temperature resistant electronics connects, these preparation method's materials are reasonable, technique is advanced, production cost is low, obtained electric power connector resistance to elevated temperatures is excellent, there is very wide use temperature scope, there is good reliability, good airproof performance, excellent properties that physical strength is high simultaneously.
The present invention is the preparation method that a kind of high temperature resistant electronics connects, and described preparation method comprises the steps: a) to prepare glass biscuit, b) purification and oxide treatment metal parts, c) purifying treatment graphite jig, d) die-filling and vacuum malleation sealing-in.
In a preferred embodiment of the present invention, in described step a), prepare glass biscuit and comprise the steps: 1) prepare the former powder of glass; 2) spray granulation prepares glass powder; 3) dry pressing and row burn.
In a preferred embodiment of the present invention, the former powder of described glass adopts borosilicate glass raw material to be prepared, and the preparation of the former powder of this glass comprises the steps: 1) molten glass metal processed under 1460 DEG C of high temperature, soaking time 4h condition; 2) by glass metal through shrend, pulverize, sieve after make the former powder of glass.
In a preferred embodiment of the present invention, described spray granulation is prepared glass powder and is comprised the steps: 1) appropriate tamanori polyvinyl alcohol to be added in the former powder of glass and to carry out ball milling; 2), at air pressure 0.8MPa, under temperature of inlet air 300 DEG C, temperature out 110 DEG C of conditions, atomizing granulating technology is adopted to make glass powder.
In a preferred embodiment of the present invention, in described step b), the processing condition of purifying treatment metal parts are: vacuum tightness 4 × 10
-3pa, treatment temp 1050 DEG C, soaking time 50min.
In a preferred embodiment of the present invention, in described step b), the processing condition of oxide treatment metal parts are: treatment temp 700 DEG C, soaking time 10min.
In a preferred embodiment of the present invention, in described step c), purifying treatment graphite jig comprises the steps: 1) clean graphite jig with gasoline and alcohol and dry; 2) in vacuum tightness 4 × 10
-3pa, temperature 1050 DEG C, vacuum purification process graphite jig under soaking time 30min condition.
In a preferred embodiment of the present invention, in described step d), die-filling and vacuum malleation sealing-in comprises the steps: 1) glass biscuit, metal parts and graphite jig are assembled; 2) the electric power connector packaged piece assembled is put into vacuum oven, be evacuated to 2 × 10
-3pa, then be filled with 4 × 10
5pa high pure nitrogen; 3) encapsulation process 25min under 960 DEG C of package temperature; 4) anneal 100min at 510 DEG C of temperature; 5) come out of the stove after Temperature fall to 150 DEG C.
Present invention is disclosed the preparation method that a kind of high temperature resistant electronics connects, these preparation method's materials are reasonable, technique is advanced, production cost is low, obtained electric power connector resistance to elevated temperatures is excellent, there is very wide use temperature scope, there is good reliability, good airproof performance, excellent properties that physical strength is high simultaneously.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation:
Fig. 1 is the process figure of the preparation method that the high temperature resistant electronics of the embodiment of the present invention connects.
Embodiment
Below in conjunction with accompanying drawing, preferred embodiment of the present invention is described in detail, can be easier to make advantages and features of the invention be readily appreciated by one skilled in the art, thus more explicit defining is made to protection scope of the present invention.
Fig. 1 is the process figure of the preparation method that the high temperature resistant electronics of the embodiment of the present invention connects; This preparation method comprises the steps: a) to prepare glass biscuit, b) purification and oxide treatment metal parts, c) purifying treatment graphite jig, d) die-filling and vacuum malleation sealing-in.
Embodiment
Concrete preparation method is as follows:
A) prepare glass biscuit, concrete preparation process is: the preparation first carrying out the former powder of glass, first under 1460 DEG C of high temperature, soaking time 4h condition, makes glass metal by molten for borosilicate glass raw material; In order to enable the glass metal of molten system reach good clarification and homogenization, in frit, add appropriate sodium-chlor as finings, simultaneously at the continuous stirred glass liquid of the hot stage of molten system; Afterwards by the molten glass metal made through shrend, pulverize, sieve after make the former powder of glass that granularity is about 2mm.Then carry out the preparation of glass powder, first being added by tamanori polyvinyl alcohol in the former powder of glass and to carry out ball milling, obtain the glass powder that median size is about 20um, wherein, the addition of tamanori polyvinyl alcohol accounts for 5% of the former powder gross weight of glass; Adopt atomizing granulating technology afterwards, at air pressure 0.8MPa, under temperature of inlet air 300 DEG C, temperature out 110 DEG C of conditions, former for the glass after ball milling powder is made the glass powder that median size is about 160um.Finally glass powder is burnt after operation through dry pressing, row, make glass biscuit.
B) purification and oxide treatment metal parts, concrete treating processes is: first the metal partss such as the kovar alloy contact processed, kovar alloy housing are put into vacuum oven and carry out vacuum purification process, purification process technique condition is: vacuum tightness 4 × 10
-3pa, treatment temp 1050 DEG C, soaking time 50min, thus fully remove metal parts surface gas and impurity, eliminate machining stress.Then oxide treatment is carried out to metal parts, with the oxide film making piece surface form suitable thickness, so that glass infiltrates on it, reach the object of sealing-in; Oxidation processes is: be first placed in stainless steel case by the metal parts after purifying treatment, then is placed in 700 DEG C of box-type furnaces, takes out, rock rapidly air cooling to room temperature after insulation 10min.
C) purifying treatment graphite jig, concrete treating processes is: first repeatedly clean graphite jig with gasoline and alcohol, until clean, do not have graphite dust to fall down, then dries graphite jig; Then graphite jig is put into vacuum oven, in vacuum tightness 4 × 10
-3be incubated 30min at Pa, temperature 1050 DEG C, take out graphite jig afterwards.By purifying treatment graphite jig, fully can remove the greasy dirt, impurity and the moisture that are adsorbed on graphite mold surface, ensure sealing-in quality.
D) die-filling and vacuum malleation sealing-in, first assembles glass biscuit, metal parts and graphite jig according to assembling product figure, then the electric power connector packaged piece assembled is put into vacuum oven, and heating, vacuum stove to 850 DEG C, is evacuated to 2 × 10
-3pa, and be filled with 4 × 10
5pa high pure nitrogen; Then encapsulation process 25min under 960 DEG C of package temperature; Anneal 100min at 510 DEG C of temperature afterwards; Last Temperature fall to 150 DEG C, comes out of the stove and is cooled to room temperature, namely makes the electric power connector of resistance to elevated temperatures excellence.
Present invention is disclosed the preparation method that a kind of high temperature resistant electronics connects, these preparation method's materials are reasonable, technique is advanced, production cost is low, obtained electric power connector resistance to elevated temperatures is excellent, there is very wide use temperature scope, there is good reliability, good airproof performance, excellent properties that physical strength is high simultaneously.
The above; be only the specific embodiment of the present invention; but protection scope of the present invention is not limited thereto; any those of ordinary skill in the art are in the technical scope disclosed by the present invention; the change can expected without creative work or replacement, all should be encompassed within protection scope of the present invention.Therefore, the protection domain that protection scope of the present invention should limit with claims is as the criterion.
Claims (8)
1. a preparation method for high temperature resistant electronics connection, it is characterized in that, described preparation method comprises the steps: a) to prepare glass biscuit, b) purification and oxide treatment metal parts, c) purifying treatment graphite jig, d) die-filling and vacuum malleation sealing-in.
2. the preparation method of high temperature resistant electronics connection according to claim 1, is characterized in that, in described step a), prepare glass biscuit and comprise the steps: 1) prepare the former powder of glass; 2) spray granulation prepares glass powder; 3) dry pressing and row burn.
3. the preparation method of high temperature resistant electronics connection according to claim 2, it is characterized in that, the former powder of described glass adopts borosilicate glass raw material to be prepared, and the preparation of the former powder of this glass comprises the steps: 1) molten glass metal processed under 1460 DEG C of high temperature, soaking time 4h condition; 2) by glass metal through shrend, pulverize, sieve after make the former powder of glass.
4. the preparation method that connects of high temperature resistant electronics according to claim 2, it is characterized in that, described spray granulation is prepared glass powder and is comprised the steps: 1) appropriate tamanori polyvinyl alcohol to be added in the former powder of glass and to carry out ball milling; 2), at air pressure 0.8MPa, under temperature of inlet air 300 DEG C, temperature out 110 DEG C of conditions, atomizing granulating technology is adopted to make glass powder.
5. the preparation method of high temperature resistant electronics connection according to claim 1, it is characterized in that, in described step b), the processing condition of purifying treatment metal parts are: vacuum tightness 4 × 10
-3pa, treatment temp 1050 DEG C, soaking time 50min.
6. the preparation method of high temperature resistant electronics connection according to claim 1, it is characterized in that, in described step b), the processing condition of oxide treatment metal parts are: treatment temp 700 DEG C, soaking time 10min.
7. the preparation method of high temperature resistant electronics connection according to claim 1, it is characterized in that, in described step c), purifying treatment graphite jig comprises the steps: 1) clean graphite jig with gasoline and alcohol and dry; 2) in vacuum tightness 4 × 10
-3pa, temperature 1050 DEG C, vacuum purification process graphite jig under soaking time 30min condition.
8. the preparation method of high temperature resistant electronics connection according to claim 1, it is characterized in that, in described step d), die-filling and vacuum malleation sealing-in comprises the steps: 1) glass biscuit, metal parts and graphite jig are assembled; 2) the electric power connector packaged piece assembled is put into vacuum oven, be evacuated to 2 × 10
-3pa, then be filled with 4 × 10
5pa high pure nitrogen; 3) encapsulation process 25min under 960 DEG C of package temperature; 4) anneal 100min at 510 DEG C of temperature; 5) come out of the stove after Temperature fall to 150 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510983117.0A CN105461241A (en) | 2015-12-24 | 2015-12-24 | Preparation method of high temperature-resisting electronic linkage |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510983117.0A CN105461241A (en) | 2015-12-24 | 2015-12-24 | Preparation method of high temperature-resisting electronic linkage |
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| Publication Number | Publication Date |
|---|---|
| CN105461241A true CN105461241A (en) | 2016-04-06 |
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|---|---|---|---|
| CN201510983117.0A Pending CN105461241A (en) | 2015-12-24 | 2015-12-24 | Preparation method of high temperature-resisting electronic linkage |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106757275A (en) * | 2016-12-07 | 2017-05-31 | 四川华丰企业集团有限公司 | Low temperature glass process for sealing after a kind of titanium alloy electrochemical oxidation |
| CN109836055A (en) * | 2017-11-29 | 2019-06-04 | 辽宁法库陶瓷工程技术研究中心 | A kind of method of vacuum glass sealing device |
Citations (4)
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|---|---|---|---|---|
| US4702884A (en) * | 1986-07-03 | 1987-10-27 | The United States Of America As Represented By The Secretary Of The Navy | Glass-lined pipes |
| CN101195516A (en) * | 2006-12-06 | 2008-06-11 | 长沙理工大学 | Low-melting point leadless crystallizing glass for sealing high temperature electric heating tube and technique of preparing the same |
| CN101531474A (en) * | 2009-04-17 | 2009-09-16 | 西安华泰有色金属实业有限责任公司 | Process for sealing multipin connector for glass and metal |
| CN102070300A (en) * | 2010-11-26 | 2011-05-25 | 西安华泰有色金属实业有限责任公司 | Glass sealing material for thermal battery and preparation method thereof |
-
2015
- 2015-12-24 CN CN201510983117.0A patent/CN105461241A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4702884A (en) * | 1986-07-03 | 1987-10-27 | The United States Of America As Represented By The Secretary Of The Navy | Glass-lined pipes |
| CN101195516A (en) * | 2006-12-06 | 2008-06-11 | 长沙理工大学 | Low-melting point leadless crystallizing glass for sealing high temperature electric heating tube and technique of preparing the same |
| CN101531474A (en) * | 2009-04-17 | 2009-09-16 | 西安华泰有色金属实业有限责任公司 | Process for sealing multipin connector for glass and metal |
| CN102070300A (en) * | 2010-11-26 | 2011-05-25 | 西安华泰有色金属实业有限责任公司 | Glass sealing material for thermal battery and preparation method thereof |
Non-Patent Citations (2)
| Title |
|---|
| 李拓文: "玻璃封接电连接器的制备", 《材料与冶金学报》 * |
| 董红军，武全: "电连接器真空正压玻璃封接工艺", 《机电元件》 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106757275A (en) * | 2016-12-07 | 2017-05-31 | 四川华丰企业集团有限公司 | Low temperature glass process for sealing after a kind of titanium alloy electrochemical oxidation |
| CN106757275B (en) * | 2016-12-07 | 2018-11-02 | 四川华丰企业集团有限公司 | Low temperature glass process for sealing after a kind of titanium alloy electrochemical oxidation |
| CN109836055A (en) * | 2017-11-29 | 2019-06-04 | 辽宁法库陶瓷工程技术研究中心 | A kind of method of vacuum glass sealing device |
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Application publication date: 20160406 |