CN106271064A - Improve the auxiliary device of Laser Processing ability and improve method - Google Patents
Improve the auxiliary device of Laser Processing ability and improve method Download PDFInfo
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- CN106271064A CN106271064A CN201510290656.6A CN201510290656A CN106271064A CN 106271064 A CN106271064 A CN 106271064A CN 201510290656 A CN201510290656 A CN 201510290656A CN 106271064 A CN106271064 A CN 106271064A
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- laser
- negative pressure
- spout
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention belongs to technical field of laser processing, especially relate to a kind of auxiliary device improving Laser Processing ability and raising method.It solve prior art and cannot discharge the problem such as processing waste and damage focus lamp in time.The auxiliary device of this raising Laser Processing ability includes the secondary process head having laser through passage, laser is laser beam entrance port through one end of passage, the other end is laser beam exit wound of bullet, secondary process head is provided with and is positioned at laser and through the laser beam entrance port end of passage and is able to receive that the laser optical unit that laser beam is incident, secondary process head is provided with and compound is discharged to mechanism.Raising method includes: the processing waste in A, tap or groove；B, it is sucked away from processing waste.It is an advantage of the current invention that: in time processing waste can be discharged and be avoided that processing waste damages focus lamp.
Description
Technical field
The invention belongs to technical field of laser processing, especially relate to a kind of laser that improves and add
The auxiliary device of work ability and raising method.
Background technology
Laser Processing is a kind of contactless processing method being widely used.It is typically
Low intensity parallel laser energy is focused into by condenser lens the high intensity energy of very small diameter
Amount field, acts on workpiece, by workpiece heat, fusing, or directly distils, thus reaches
Purpose is processed to deform, harden, weld, cut, punch or mark etc..One complete
Whole laser-processing system includes laser instrument, optic path unit, laser Machining head, fortune
Move and control system and other aid systems.Along with the development of laser technology, laser adds
Speed and the quality of work constantly improve, but laser is also met in the actual course of processing simultaneously
Some problems are arrived.Such as, when laser boring and microfabrication, due to laser energy
Act on work piece surface so that work piece be stripped matrix, formed the thinnest
Little granule.Tiny granule Laser Processing moment produce Impulse under with necessarily
Speed upwardly away from matrix, can fall the most again.When hole or groove
When the degree of depth reaches certain threshold value, the initial velocity that laser momentum produces is not enough so that fine particle
Overcoming action of gravity ejection aperture or groove, these granules will be deposited in hole or groove, be connect down
The pulse laser reprocessabilty come.So the laser energy that practical function is on workpiece substrate
To be substantially reduced, in this case, the efficiency of Laser Processing can decline to a great extent, and then
Limit the working depth of hole and groove.
It addition, the splash that Laser Processing produces has the biggest breaking to the eyeglass of focusing system
Bad effect.The way that traditional means is used at present is to increase by one after laser optical unit
The protective gas (coaxial interpolation protects gas) of individual malleation, or add one at laser head side
The protective gas of individual lateral malleation.Both approaches has they self problem, coaxially
The method adding protection gas is to have added an air-flow blown downwards, this gas below eyeglass
The downward thrust of miscarriage life is same direction with gravity, so makes pulsed laser energy
Act on matrix produce moment momentum to the active force of granule will less than or equal to gravity in
Airflow thrust sum, is not damaged by although so solving eyeglass, be unfavorable for granule from
Hole or groove are discharged, and reduce working (machining) efficiency and working depth the most to a certain extent.Laterally
Although the method adding protection gas can play in time by particulate matter tap in one direction or
Groove, but just seem unable to do what one wishes during to micropore, deep hole and the situation such as microflute, deep trouth.
Therefore to protection laser optical unit is from flue dust and the damage of splash, in time
The dust being deposited in hole or groove and nano-particle are discharged to greatest extent so that laser
Energy can act on the surface of work piece always, reduces because dust accumulation is at hole or groove
In can not discharge in time and affect the degree of depth and the quality of laser boring, it is necessary to propose one
The obvious method and apparatus of practical, effect, thus be greatly improved laser punching or
The degree of depth of groove, working (machining) efficiency, break through the limitation of the laser boring degree of depth.
Summary of the invention
It is an object of the invention to for the problems referred to above, it is provided that a kind of design is more reasonable, can improve
The auxiliary dress of the Laser Processing ability that improves of the punching degree of depth and working (machining) efficiency and length in service life
Put.
Another object of the present invention is for the problems referred to above, it is provided that a kind of method is simple
And the auxiliary device improving Laser Processing ability of the punching degree of depth and working (machining) efficiency can be improved.
For reaching above-mentioned purpose, present invention employs following technical proposal: this raising laser
The auxiliary device of working ability includes the secondary process head having laser through passage, laser
Being laser beam entrance port through one end of passage, the other end is laser beam exit wound of bullet, auxiliary
Help processing head to be provided with to be positioned at laser and through the laser beam entrance port end of passage and be able to receive that
The laser optical unit that laser beam is incident, when laser beam can be after laser optical unit
Process at least one hole or groove on workpiece, secondary process head is provided with and can will add in real time
The processing waste being trapped in hole or groove during work discharges and forces processing waste remote
From laser optical unit thus described processing waste is sucked away to laser outside passage
Compound it is discharged to mechanism.
In the above-mentioned auxiliary device improving Laser Processing ability, described compound row
Structure of disembarking includes through channel partition, described laser to be become malleation chamber and negative pressure cavity
Separation structure, described malleation chamber between laser optical unit and negative pressure cavity and this just
Pressure chamber connects the compound die cavity of formation with negative pressure cavity, is provided with and malleation chamber on secondary process head
At least one positive pressure protection gas entrance of connection, is additionally provided with and negative pressure on secondary process head
At least one negative pressure of chamber connection is sucked away from mouth.
In the above-mentioned auxiliary device improving Laser Processing ability, described separation structure
Including being arranged on laser spacer body in passage, the axial centre at spacer body is provided with
The first spout that malleation chamber connects can be made with negative pressure cavity.
In the above-mentioned auxiliary device improving Laser Processing ability, described spacer body is
Taper spacer body, and the external diameter of this spacer body is gradually reduced from lateral negative pressure cavity side, malleation chamber.
Taper spacer body has two effects separated with water conservancy diversion.
In the above-mentioned auxiliary device improving Laser Processing ability, described secondary process
Head has, away from one end of laser optical unit, the second spout that little the inner, outer end is big, and first
Spout and the second spout all big taper in the little the inner spout structure in outer end, described second spout
Axial line and the first spout axial line overlap and the little head end of the first spout bore less than or etc.
Bore in the second little head end of spout.
In the above-mentioned auxiliary device improving Laser Processing ability, described positive pressure protection
Gas entrance is arranged on the circumference of secondary process head and is supplied with positive pressure protection gas by the first pipeline
It is connected to parts；Described negative pressure is sucked away from mouthful quantity at least two and along secondary process head
Circumference is uniformly distributed, and described negative pressure is sucked away from mouth by the second pipeline and negative pressure generation part
It is connected, the second pipeline is provided with and is sucked away between mouth and negative pressure generation part in negative pressure
The aspiration of negative pressure parts.The aspiration of negative pressure parts are sucked away from mouth inhaling from negative pressure for filtering and precipitating
The processing waste taken, prevents processing waste from entering in negative pressure generation part.
In the above-mentioned auxiliary device improving Laser Processing ability, described secondary process
Head includes having the processing head upper cavity in malleation chamber and have the processing head cavity of resorption of negative pressure cavity
Body, detachably connects by first between described processing head upper cavity and processing head lower chamber
Access node structure or welding manner are connected；Or described secondary process head includes having compound
Chamber and be the integral type processing head matrix of integral type structure.
In the above-mentioned auxiliary device improving Laser Processing ability, described laser optics
Unit includes at least one focusing being arranged on laser through the laser beam entrance port end of passage
Eyeglass, by detachable attachment mechanism phase between described secondary process head and focusing lens
Even.Detachable attachment mechanism includes the laser beam entrance port end being arranged on laser through passage
Annular the shaft shoulder is installed, install in annular and be provided with annular mounting seat on the shaft shoulder, described is poly-
In focus lens is arranged on annular mounting seat and lower surface abuts in annular and installs on the shaft shoulder.Ring
Shape is installed the shaft shoulder and is connected with annular mounting seat screw thread, annular mounting seat and focusing lens screw thread
It is connected.Or described annular mounting seat is provided with the first flange, in annular mounting seat
It is provided with the second flange, the first described flange and the second flange to be bolted to by some
Together.
The auxiliary device of this raising Laser Processing ability comprises the steps:
Processing waste in A, tap or groove: malleation chamber and negative pressure cavity are by the first spray
Mouth connection, positive pressure protection gas sequentially passes through positive pressure protection gas entrance, malleation chamber, the first spray
Mouth, negative pressure cavity and the second spout also blow to workpiece, by processing during positive pressure protection QI excess
During be trapped in hole or groove processing waste be expelled to outside hole or groove, and malleation chamber
Interior air pressure is more than the air pressure in negative pressure cavity thus prevents processing waste from entering to malleation chamber
In；Malleation chamber is prevented from the course of processing processing waste of splashing and is discharged to hole
Or the processing waste outside groove enters in malleation chamber.
B, it is sucked away from processing waste: the effect being sucked away from gas by negative pressure makes adding in negative pressure cavity
Work garbage is sucked away from mouth from negative pressure and is expelled to negative pressure cavity.Processing waste includes processed
Splashing processing waste in journey and the processing waste being discharged to outside hole or groove.
In the above-mentioned raising method improving Laser Processing ability, in above-mentioned step A
In, the first described spout is the structure that little the inner, outer end is big, and the second described spout is
The structure that little the inner, outer end is big, the first described spout axial line and the second spout axial line
The bore of coincidence and the little head end of the first spout is less than or equal to the mouth of the second little head end of spout
Footpath.
Compared with prior art, the auxiliary device of this raising Laser Processing ability and raising
The advantage of method is: 1, design is more reasonable, it is possible to effectively by the processing in hole or groove
Garbage is discharged, and improves punching or the degree of depth of groove, further increases scanning galvanometer
System processing hole or the working ability of groove, meanwhile, improve product processing quality and add
Work efficiency rate, reduces the production cost of enterprise virtually.2, can effectively prevent processing useless
Gurry damage laser optical unit, extends the service life of laser optical unit, secondly,
Also reducing follow-up maintenance cost, use cost reduces.3, simple in construction and be prone to system
Make, practical, it is easy to expanded application.4, the Developing Tendency of current social technology is met
Gesture.
Accompanying drawing explanation
The structural representation that Fig. 1 provides for the present invention.
The first structural representation of spout that Fig. 2 provides for the present invention.
Spout the second structural representation that Fig. 3 provides for the present invention.
Embodiment two structural representation that Fig. 4 provides for the present invention.
Embodiment three structural representation that Fig. 5 provides for the present invention.
In figure, laser optical unit 1, focusing lens 11, annular mounting seat 12, auxiliary
Processing head 2, laser through passage 21, malleation chamber 22, processing head upper cavity 22a, add
Foreman lower chamber 22b, negative pressure cavity 23, positive pressure protection gas entrance 24, negative pressure be sucked away from mouth 25,
Second spout 26, annular install the shaft shoulder 27, compound be discharged to mechanism 3, spacer body 31,
First spout the 32, first pipeline 41, positive pressure protection gas supply part the 42, second pipeline
43, negative pressure generation part 44, the aspiration of negative pressure parts 45, fixed support 5, workpiece a.
Detailed description of the invention
The following is the specific embodiment of invention and combine accompanying drawing, to technical scheme
It is further described, but the present invention is not limited to these embodiments.
Embodiment one
As it is shown in figure 1, the auxiliary device of this raising Laser Processing ability includes having laser
Through the secondary process 2 of passage 21, laser is laser beam through one end of passage 21
Entrance port, the other end is laser beam exit wound of bullet, secondary process 2 is provided be positioned at sharp
Light is through the laser beam entrance port end of passage 21 and is able to receive that the laser that laser beam is incident
Optical unit 1, when laser beam can be processed after laser optical unit 1 on workpiece a
Going out at least one hole or groove, specifically, the laser optical unit 1 of the present embodiment includes setting
Put at laser through at least one focusing lens 11 of the laser beam entrance port end of passage 21,
By detachable attachment mechanism phase between described secondary process 2 and focusing lens 11
Even.Here detachable attachment mechanism includes that being arranged on laser enters through the laser beam of passage
The annular of loophole end installs the shaft shoulder 27, installs in annular and is provided with annular mounting seat on the shaft shoulder
12, in described focusing lens is arranged on annular mounting seat and lower surface abuts in annular peace
On the dress shaft shoulder.Annular install the shaft shoulder with annular mounting seat screw thread be connected, annular mounting seat and
Focusing lens screw thread is connected.Or described annular mounting seat is provided with the first flange,
Annular mounting seat is provided with the second flange, if the first described flange and the second flange pass through
Bolt stem is fixed together.
Secondary process 2 is provided with and can will the course of processing be trapped in hole or groove in real time
Processing waste discharge and force processing waste away from laser optical unit 1 thus will
Described processing waste is sucked away to compound outside passage 21 of laser being discharged to mechanism 3.
Processing waste processing waste including dust, flue dust and nano-particle etc..
Owing to being provided with the compound mechanism 3 that is discharged to, the compound mechanism 3 that is discharged to has: 1. can
The processing waste being trapped in hole or groove is expelled to outside hole or groove；2. processing can be prevented
During processing waste outside the processing waste that splashes and tap or groove upwards
Splash thus damage laser optical unit 12；3. processing waste can be discharged to auxiliary
Three effects outside processing head 2.
Specifically, the compound mechanism 3 that is discharged to of the present embodiment includes being swashed by described
Light is separated into malleation chamber 22 and the separation structure of negative pressure cavity 23, malleation chamber through passage 21
22 between laser optical unit 12 and negative pressure cavity 23 and this malleation chamber 22 and negative pressure
Chamber 23 connection forms compound die cavity, malleation chamber 22 here in funnel-shaped structure, negative pressure
The V-shaped structure in chamber 23.Prioritization scheme, this separation structure includes that being arranged on laser passes through
Spacer body 31 in passage 21, the axial centre at spacer body 31 is provided with and can make malleation chamber
22 the first spouts 32 connected with negative pressure cavity 23.Secondly, spacer body 31 separates for taper
Body, and the external diameter of this spacer body 31 is gradually reduced from lateral negative pressure cavity 23 side, malleation chamber 22.
The outer surface of taper spacer body is an annular slant leading surface, this annular slant leading surface energy
Enough improve the smoothness that processing waste is discharged to, be also greatly improved simultaneously and be discharged to efficiency.
Spacer body 31 is connected as a single entity structure with secondary process 2.
In order to improve absorbability and be discharged to speed, in secondary process 2 away from swashing
One end of light optical unit 12 has the second spout 26 that little the inner, outer end is big, the first spray
Mouth 32 and the second spout 26 all big taper in little the inner spout structures in outer end, described second
Spout 26 axial line and the first spout 32 axial line overlap and the first little head end of spout 32
Bore is less than the bore of the second little head end of spout 26.This structure is possible not only to prevent processing useless
Gurry enters in malleation chamber, simultaneously, additionally it is possible to that improves negative pressure cavity is sucked away from ability, separately
Outward, axial line overlaps and can be easy to manufacture and assemble, and can also improve simultaneously and be sucked away from efficiency.
Further, the first spout 32 is identical with the cross sectional shape of the second spout 26, it is possible to further
Improve the high efficiency being discharged to.First spout 32 and the cross sectional shape of the second spout 26 and chi
Very little size is according to the size of the scanning galvanometer sweep limits needed for conventional workpiece laser processing
Form a series, in actual laser processing procedure, may be selected by suitable cross section
Shape and size, i.e. described secondary process 2 can be changed.Such as Fig. 2-3
Shown in, it addition, the cross sectional shape of the first spout 32 and the second spout 26 include rectangle,
Square and circle in any one, can also is that various irregular shape equally,
And laser beam range of movement and direction require to be set according to actual Product processing.
Connect at least as it is shown in figure 1, be provided with in secondary process 2 with malleation chamber 22
One positive pressure protection gas entrance 24, positive pressure protection gas entrance 24 is arranged on secondary process 2
Circumference and be connected with positive pressure protection gas supply part 42 by the first pipeline 41.First
Spout 32 can improve positive pressure protection gas entrance 24 and enter to negative pressure cavity from malleation chamber 22
Air pressure pressure in 23.Positive pressure protection gas bag includes any one in nitrogen and argon.Just
Pressure protection gas forms malleation P after entering to malleation chamber 22 in malleation chamber 221.?
Malleation P1Effect under make processing waste upwards cannot pass the first spout 32.
Secondary process 2 is additionally provided with at least one negative pressure connected with negative pressure cavity 23 inhale
From mouth 25.The negative pressure of the present embodiment is sucked away from mouth 25 quantity at least two and along secondary process
The circumference of 2 is uniformly distributed, described negative pressure be sucked away from mouth 25 by the second pipeline 43 with
Negative pressure generation part 44 is connected, and is provided with and is positioned at negative pressure and is sucked away from mouth 25 on the second pipeline 43
And the aspiration of negative pressure parts 45 between negative pressure generation part 44.Negative pressure generation part 44 opens
Time dynamic, negative pressure cavity 23 forms negative pressure P2, workpiece a produces in Laser Processing
The processing waste given birth to and be discharged to outside hole or groove is in negative pressure P2Under adsorption, processing
Garbage is sucked away from mouth 25 by negative pressure and is sucked from outside secondary process 2.It addition, by adjusting
Whole negative pressure P2Size so that processing waste can be sucked away from mouth 25 by negative pressure to be had
Effect is sucked away from.And the aspiration of negative pressure parts 45 are sucked away from mouth 25 from negative pressure for filtering and precipitating
The processing waste drawn, prevents processing waste from entering in negative pressure generation part 44.
First spout 32 is pyramidal structure, first spout 32 under negative pressure is sucked away from the effect of mouth 25
Absorbability can be improved.The equally distributed negative pressure of circumference is sucked away from mouth 25 and ensure that and be sucked away from
High efficiency.
Prioritization scheme, for the ease of dismounting, the secondary process 2 of the present embodiment includes tool
There is the processing head upper cavity 22a in malleation chamber 22 and there is the processing head cavity of resorption of negative pressure cavity 23
Body 22b, passes through between described processing head upper cavity 22a and processing head lower chamber 22b
First Detachable connection structure is connected.First Detachable connection structure includes being arranged on processing
External screw thread on head upper cavity 22a, is provided with described on processing head lower chamber 22b
The female thread that external screw thread screw thread is connected.Certainly, external screw thread here can also be arranged on and add
On foreman lower chamber 22b, female thread then can be arranged on processing head upper cavity 22a.
Can be designed manufacturing according to actual requirement.First Detachable connection structure also includes
The flange cooperated.
The operation principle of the present embodiment is as follows: the incoming laser beam warp successively of the laser instrument come
Cross the laser of laser optical unit 1 and secondary process 2 through passage 21, then beat
On workpiece a, by the effect of laser optical unit 1 thus process on workpiece a and portal
Or groove；
When hole or groove depth are constantly deepened, by positive pressure protection gas supply part 42
Start, by crossing the first pipeline 41, positive pressure protection gas is defeated from positive pressure protection gas entrance 24
Enter to malleation chamber 22, in malleation chamber 22, form malleation P1, meanwhile, malleation
The processing waste being trapped in hole or groove is expelled to outside hole or groove by protection gas,
Malleation P1Effect under make processing waste upwards cannot pass the first spout 32；
Start negative pressure generation part 44 and make negative pressure cavity 23 is formed negative pressure P2, workpiece a
In Laser Processing, produce and be discharged to the processing waste outside hole or groove in negative pressure P2Inhale
Under attached effect, processing waste is sucked away from mouth 25 by the second pipeline 43 and negative pressure and is sucked from
Outside secondary process 2, in order to prevent processing waste from entering into negative pressure generation part 44
Neutralizing the environment ensureing production operation, being provided with the aspiration of negative pressure parts 45 can effectively prevent
Processing waste enters in negative pressure generation part 44, meanwhile, by periodically cleaning
The aspiration of negative pressure parts 45 disclosure satisfy that the requirement of the production order.
Separate and two effects of water conservancy diversion it addition, taper spacer body has.
The raising method of this raising scanning galvanometer system working ability comprises the steps:
Processing waste in A, tap or groove: malleation chamber 22 and negative pressure cavity 23 pass through
First spout 32 connects, and positive pressure protection gas sequentially passes through positive pressure protection gas entrance 24, just
Pressure chamber the 22, first spout 32, negative pressure cavity 23 and the second spout 26 also blow to workpiece, logical
The processing waste row being trapped in the course of processing in hole or groove when crossing positive pressure protection QI excess
Go out outside hole or groove, and the air pressure in malleation chamber 22 more than the air pressure in negative pressure cavity 23 from
And prevent processing waste from entering in malleation chamber 22；Malleation chamber is prevented from the course of processing
The processing waste of middle splashing and the processing waste being discharged to outside hole or groove just enter to
In pressure chamber.
B, it is sucked away from processing waste: the effect being sucked away from gas by negative pressure is made in negative pressure cavity 23
Processing waste be sucked away from mouth 25 from negative pressure and be expelled to negative pressure cavity 23.
In above-mentioned step A, the first described spout 32 is the knot that little the inner, outer end is big
Structure, the second described spout 26 is the structure that little the inner, outer end is big, the first described spout
32 axial lines and the second spout 26 axial line overlap and the bore of the first little head end of spout 32
Bore less than the second little head end of spout 26.
Embodiment two
As shown in Figure 4, the present embodiment is essentially identical with structure and the principle of embodiment one,
Gu therefore not to repeat here, and different place is: processing head upper cavity 22a and adding
It is connected by welding manner between foreman lower chamber 22b.
Embodiment three
As it is shown in figure 5, the present embodiment is essentially identical with structure and the principle of embodiment one,
Gu therefore not to repeat here, and different place is: secondary process 2 includes having
Compound die cavity and be the integral type processing head matrix of integral type structure.
Embodiment four
The present embodiment is essentially identical with structure and the principle of embodiment one, Gu do not go to live in the household of one's in-laws on getting married at this
State, and different place is: the bore of the first little head end of spout 32 is equal to the second spray
The bore of mouth 26 little head ends.
Specific embodiment described herein is only to present invention spirit theory for example
Bright.Those skilled in the art can be to described specific embodiment
Make various amendment or supplement or use similar mode to substitute, but without departing from
The spirit of the present invention or surmount scope defined in appended claims.
Although the most more employing laser optical unit 1, focusing lens 11, annular
Mounting seat 12, secondary process 2, laser are through passage 21, malleation chamber 22, processing head
Upper cavity 22a, processing head lower chamber 22b, negative pressure cavity 23, positive pressure protection gas entrance 24,
Negative pressure is sucked away from mouth the 25, second spout 26, annular installs the shaft shoulder 27, compound be discharged to machine
Structure 3, spacer body the 31, first spout the 32, first pipeline 41, positive pressure protection gas supply unit
Part the 42, second pipeline 43, negative pressure generation part 44, the aspiration of negative pressure parts 45, fixing
The terms such as support 5, workpiece a, but it is not precluded from using the probability of other term.Make
It is only used to describe and explain more easily the essence of the present invention with these terms；It
To be construed to any additional restriction be all contrary with spirit of the present invention.
Claims (10)
1. the auxiliary device improving Laser Processing ability, it is characterised in that this auxiliary
Device includes the secondary process head (2) having laser through passage (21), and laser passes through
One end of passage (21) is laser beam entrance port, and the other end is laser beam exit wound of bullet,
Secondary process head (2) is provided with the laser beam entrance port being positioned at laser through passage (21)
Hold and be able to receive that the laser optical unit (1) that laser beam is incident, when laser beam is through too drastic
At least one hole or groove can be processed on workpiece (a) after light optical unit (1),
Secondary process head (2) is provided with and can will be trapped in adding in hole or groove in the course of processing in real time
Work garbage discharges and forces processing waste away from laser optical unit (1) thus by institute
State processing waste to be sucked away to laser being discharged to mechanism (3) through passage (21) outward compound.
The auxiliary device of raising Laser Processing ability the most according to claim 1, its
Be characterised by, described compound be discharged to that mechanism (3) includes can be by described laser warp
Cross passage (21) and be separated into malleation chamber (22) and the separation structure of negative pressure cavity (23),
Described malleation chamber (22) is positioned between laser optical unit (1) and negative pressure cavity (23)
And this malleation chamber (22) connects the compound die cavity of formation with negative pressure cavity (23), add in auxiliary
Foreman (2) is provided with at least one the positive pressure protection gas entrance connected with malleation chamber (22)
(24), secondary process head (2) is additionally provided with connects at least with negative pressure cavity (23)
One negative pressure is sucked away from mouth (25).
The auxiliary device of raising Laser Processing ability the most according to claim 2, its
Being characterised by, described separation structure includes being arranged on laser in passage (21)
Spacer body (31), the axial centre at spacer body (31) is provided with and can make malleation chamber (22)
The first spout (32) connected with negative pressure cavity (23).
The auxiliary device of raising Laser Processing ability the most according to claim 3, its
Being characterised by, described spacer body (31) is taper spacer body, and this spacer body (31)
External diameter be gradually reduced from malleation chamber (22) lateral negative pressure cavity (23) side.
5. according to the auxiliary device improving Laser Processing ability described in claim 3 or 4,
It is characterized in that, described secondary process head (2) is away from laser optical unit (1)
One end be provided with the second spout (26), the first spout (32) and the second spout (26) all in
The big taper in little the inner, outer end spout structure, described second spout (26) axial line and first
Spout (32) axial line overlap and the first spout (32) little head end bore less than or etc.
Bore in the second spout (26) little head end.
6. according to the auxiliary improving Laser Processing ability described in Claims 2 or 3 or 4
Device, it is characterised in that described positive pressure protection gas entrance (24) is arranged on auxiliary and adds
The circumference of foreman (2) and by the first pipeline (41) and positive pressure protection gas supply part (42)
It is connected；Described negative pressure is sucked away from mouth (25) quantity at least two and along secondary process head (2)
Circumference be uniformly distributed, described negative pressure is sucked away from mouth (25) by the second pipeline (43)
It is connected with negative pressure generation part (44), the second pipeline (43) is provided with and is positioned at negative pressure
The aspiration of negative pressure parts (45) being sucked away between mouth (25) and negative pressure generation part (44).
7. according to the auxiliary improving Laser Processing ability described in Claims 2 or 3 or 4
Device, it is characterised in that described secondary process head (2) includes having malleation chamber (22)
Processing head upper cavity (22a) and there is the processing head lower chamber (22b) of negative pressure cavity (23),
By the between described processing head upper cavity (22a) and processing head lower chamber (22b)
One Detachable connection structure or welding manner are connected；Or described secondary process head (2)
Including having compound die cavity and the integral type processing head matrix for integral type structure.
The auxiliary device of raising Laser Processing ability the most according to claim 7, its
Being characterised by, described laser optical unit (1) includes being arranged on laser through passage (21)
At least one focusing lens (11) of laser beam entrance port end, described secondary process head
(2) and it is connected by detachable attachment mechanism between focusing lens (11).
9. the raising method improving Laser Processing ability, it is characterised in that this method
Comprise the steps:
Processing waste in A, tap or groove: malleation chamber (22) and negative pressure cavity (23)
Being connected by the first spout (32), positive pressure protection gas sequentially passes through positive pressure protection gas entrance
(24), malleation chamber (22), the first spout (32), negative pressure cavity (23) and the second spout
And blow to workpiece, by the course of processing being trapped in hole during positive pressure protection QI excess (26)
Or the processing waste in groove is expelled to outside hole or groove, and the air pressure in malleation chamber (22)
More than the air pressure in negative pressure cavity (23) thus prevent processing waste from entering to malleation chamber (22)
In；
B, it is sucked away from processing waste: the effect being sucked away from gas by negative pressure makes negative pressure cavity (23)
In processing waste be sucked away from mouth (25) from negative pressure and be expelled to negative pressure cavity (23).
The raising method of raising Laser Processing ability the most according to claim 9, its
Being characterised by, in above-mentioned step A, described the first spout (32) is that outer end is little
Inner big structure, described the second spout (26) is the structure that little the inner, outer end is big,
Described the first spout (32) axial line and the second spout (26) axial line overlap and the
The bore of one spout (32) little head end is less than the bore of the second spout (26) little head end.
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| CN201510290656.6A CN106271064A (en) | 2015-05-30 | 2015-05-30 | Improve the auxiliary device of Laser Processing ability and improve method |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110449735A (en) * | 2019-07-04 | 2019-11-15 | 包头市三泰激光科技有限公司 | Back flushing type laser protector and its application method |
| CN111604596A (en) * | 2020-05-28 | 2020-09-01 | 华北水利水电大学 | Welding method and clamping tool for bilateral rotation laser-TIG electric arc of cross joint |
| CN113427124A (en) * | 2020-03-05 | 2021-09-24 | 海纳光电股份有限公司 | High-temperature environment processing device and method for hard and brittle plates |
| CN116352259A (en) * | 2023-03-27 | 2023-06-30 | 海目星激光科技集团股份有限公司 | Laser welding dust collector |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0618037A1 (en) * | 1993-04-02 | 1994-10-05 | International Business Machines Corporation | Optics and environmental protection device for laser processing applications |
| DE29504457U1 (en) * | 1995-03-16 | 1995-05-18 | Haas Laser GmbH & Co. KG, 78713 Schramberg | Device for protecting the processing optics of a laser processing device against contamination |
| JPH09192870A (en) * | 1996-01-10 | 1997-07-29 | Sumitomo Heavy Ind Ltd | Laser beam machining head, device, and method |
| US6019599A (en) * | 1997-08-08 | 2000-02-01 | Degussa-Huls Aktiengesellschaft | Suction system for the laser processing of work pieces in dental technology |
| DE19840934B4 (en) * | 1998-09-08 | 2005-03-24 | Hell Gravure Systems Gmbh | Arrangement for removing material that is removed by a laser radiation source in the processing of material from a processing surface |
| CN1927520A (en) * | 2005-09-07 | 2007-03-14 | 株式会社迪斯科 | Laser beam processing machine |
| JP2007260708A (en) * | 2006-03-28 | 2007-10-11 | Denso Corp | Laser light irradiation nozzle |
| JP2009028762A (en) * | 2007-07-27 | 2009-02-12 | Takei Electric Industries Co Ltd | Dust collection device for laser beam machining |
| CN101772397A (en) * | 2007-08-03 | 2010-07-07 | 三菱电机株式会社 | Laser working nozzle |
| CN202684334U (en) * | 2012-01-19 | 2013-01-23 | 昆山思拓机器有限公司 | Coaxial water jetting device for thin-wall tube laser micromachining |
-
2015
- 2015-05-30 CN CN201510290656.6A patent/CN106271064A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0618037A1 (en) * | 1993-04-02 | 1994-10-05 | International Business Machines Corporation | Optics and environmental protection device for laser processing applications |
| DE29504457U1 (en) * | 1995-03-16 | 1995-05-18 | Haas Laser GmbH & Co. KG, 78713 Schramberg | Device for protecting the processing optics of a laser processing device against contamination |
| JPH09192870A (en) * | 1996-01-10 | 1997-07-29 | Sumitomo Heavy Ind Ltd | Laser beam machining head, device, and method |
| US6019599A (en) * | 1997-08-08 | 2000-02-01 | Degussa-Huls Aktiengesellschaft | Suction system for the laser processing of work pieces in dental technology |
| DE19840934B4 (en) * | 1998-09-08 | 2005-03-24 | Hell Gravure Systems Gmbh | Arrangement for removing material that is removed by a laser radiation source in the processing of material from a processing surface |
| CN1927520A (en) * | 2005-09-07 | 2007-03-14 | 株式会社迪斯科 | Laser beam processing machine |
| JP2007260708A (en) * | 2006-03-28 | 2007-10-11 | Denso Corp | Laser light irradiation nozzle |
| JP2009028762A (en) * | 2007-07-27 | 2009-02-12 | Takei Electric Industries Co Ltd | Dust collection device for laser beam machining |
| CN101772397A (en) * | 2007-08-03 | 2010-07-07 | 三菱电机株式会社 | Laser working nozzle |
| CN202684334U (en) * | 2012-01-19 | 2013-01-23 | 昆山思拓机器有限公司 | Coaxial water jetting device for thin-wall tube laser micromachining |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110449735A (en) * | 2019-07-04 | 2019-11-15 | 包头市三泰激光科技有限公司 | Back flushing type laser protector and its application method |
| CN113427124A (en) * | 2020-03-05 | 2021-09-24 | 海纳光电股份有限公司 | High-temperature environment processing device and method for hard and brittle plates |
| CN111604596A (en) * | 2020-05-28 | 2020-09-01 | 华北水利水电大学 | Welding method and clamping tool for bilateral rotation laser-TIG electric arc of cross joint |
| CN116352259A (en) * | 2023-03-27 | 2023-06-30 | 海目星激光科技集团股份有限公司 | Laser welding dust collector |
| CN116352259B (en) * | 2023-03-27 | 2024-01-09 | 海目星激光科技集团股份有限公司 | Laser welding dust collector |
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Application publication date: 20170104 |