CN106269549B - Silicon chip sieves pipeline system and method for sieving - Google Patents

Silicon chip sieves pipeline system and method for sieving Download PDF

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Publication number
CN106269549B
CN106269549B CN201610704881.4A CN201610704881A CN106269549B CN 106269549 B CN106269549 B CN 106269549B CN 201610704881 A CN201610704881 A CN 201610704881A CN 106269549 B CN106269549 B CN 106269549B
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silicon chip
size
pipeline
unit
units
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CN106269549A (en
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陈爵彬
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Xiamen Jiayuan Electronic Technology Co Ltd
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Xiamen Jiayuan Electronic Technology Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07CPOSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/02Measures preceding sorting, e.g. arranging articles in a stream orientating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07BSEPARATING SOLIDS FROM SOLIDS BY SIEVING, SCREENING, SIFTING OR BY USING GAS CURRENTS; SEPARATING BY OTHER DRY METHODS APPLICABLE TO BULK MATERIAL, e.g. LOOSE ARTICLES FIT TO BE HANDLED LIKE BULK MATERIAL
    • B07B1/00Sieving, screening, sifting, or sorting solid materials using networks, gratings, grids, or the like
    • B07B1/28Moving screens not otherwise provided for, e.g. swinging, reciprocating, rocking, tilting or wobbling screens
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07CPOSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/04Sorting according to size
    • B07C5/10Sorting according to size measured by light-responsive means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07CPOSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/34Sorting according to other particular properties
    • B07C5/344Sorting according to other particular properties according to electric or electromagnetic properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07CPOSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/36Sorting apparatus characterised by the means used for distribution
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L31/00Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Abstract

The present invention provides the present invention and provides a kind of silicon chip screening pipeline system, including:Oscillatory type rotary strainer unit, pipelined units, visual detection unit, resistance detection unit and multiple recovery units;The oscillatory type rotary strainer unit is used to screen out the silicon chip of different size according to the size of silicon chip, and silicon chip is made to be tilted into the pipelined units;The visual detection unit is arranged in the front end of the pipelined units, and whether the size for detecting the silicon chip being obliquely installed meets the position that recycling requires and obtains the silicon chip being obliquely installed;The resistance detection unit is arranged at the middle part of the pipelined units, the resistance value for corresponding to silicon chip according to the position detection of the silicon chip;The recovery unit is set to the pipelined units rear end, for silicon chip to be diverted to different recovery units according to the resistance value of silicon chip.The present invention also provides a kind of silicon chip method for sieving.

Description

Silicon chip sieves pipeline system and method for sieving
Technical field
The present invention relates to a kind of silicon chip screening pipeline system and method for sieving.
Background technology
Solar cell is as emerging regenerative resource, clean energy resource, green energy resource, by more and more extensive concern. Most common solar cell is exactly crystal silicon solar energy battery.The prime cost of crystal silicon solar energy battery is silicon chip.But It is, since the production technology of crystal silicon solar cell sheet is complicated and harsh, can all there is defective products appearance in each stage.For The defective products in each stage, it is necessary to be recycled to retrieve a loss, otherwise directly scrap and not only pollute environment, but also greatly increase solar energy The production cost of battery.
However, there is no a kind of effective silicon chip screening systems and method effectively to be sieved to silicon chip for the prior art Point, to further be recycled to different silicon chips.
Invention content
In order to solve the above-mentioned technical problem, the technical solution adopted in the present invention is:
The present invention provides a kind of silicon chip screening pipeline system, including:Oscillatory type rotary strainer unit, pipelined units, vision Detection unit, resistance detection unit and multiple recovery units;The oscillatory type rotary strainer unit is used to sieve according to the size of silicon chip The silicon chip of different size is separated, and silicon chip is made to be tilted into the pipelined units;The visual detection unit is arranged described The front end of pipelined units, whether the size for detecting the silicon chip being obliquely installed, which meets recycling requirement and obtain the inclination, sets The position for the silicon chip set;The resistance detection unit is arranged at the middle part of the pipelined units, for according to the silicon chip Position detection corresponds to the resistance value of silicon chip;The recovery unit is set to the pipelined units rear end, for the resistance according to silicon chip Silicon chip is diverted to different recovery units by value.
As further improved, the pipelined units include endless conveyor belt and multiple silicon chip monitor stations, described Silicon chip monitor station is set to the surrounding of the endless conveyor belt.
As further improved, the angle of 30 °~80 ° of the silicon chip monitor station and horizontal plane formation.
As further improved, the visual detection unit includes video camera, image processor and judging unit, institute Video camera is stated for obtaining the picture of the silicon chip, described image processor be used for according to the picture obtain the size of silicon chip with And location information, the judging unit are used to judge whether the silicon chip meets recycling and require according to the dimension information of the silicon chip.
As further improved, the resistance detection unit is four probe resistance testers.
As further improved, the recovery unit includes sucked type mechanical arm and returnable.
The present invention also provides a kind of silicon chip method for sieving, include the following steps:
Silicon chip is obliquely installed by S1, and the silicon chip forms 30 °~80 ° of angle with horizontal plane;
The picture of silicon chip in S2, obtaining step S1, and obtain according to the picture location information and ruler of the silicon chip Very little information;
S3 judges whether to meet recycling size requirement according to the dimension information of the silicon chip, is to enter step S4, no, directly It connects as waste recovery;
S4 obtains the resistance value for meeting the silicon chip that recycling size requires, and is divided silicon chip according to different resistance values Class recycles.
As further improved, in step sl, the silicon chip forms 60 °~75 ° of angle with horizontal plane.
As further improved, in step s 4, the silicon chip for meeting that recycling size requires is obtained by four probe method Resistance value.
As further improved, in step s 2, pass through the picture of silicon chip in video camera obtaining step S1.
The present invention also provides the silicon chip screening pipeline system and method for sieving has the following advantages, first, described Silicon chip sieves pipeline system and method for sieving and can effectively be sieved to silicon chip according to the size and resistance value of silicon chip, from And be conducive to further recycle silicon chip;Second, the silicon chip screening pipeline system and method for sieving may be used also To carry out continuous productive process, it is suitable for industrial applications;Third, the silicon chip monitor station forms angle with horizontal plane, to be conducive to Subsequent pictures obtain and resistance detection, improve detection efficiency.
Description of the drawings
Fig. 1 is the structural schematic diagram of silicon chip screening pipeline system provided in an embodiment of the present invention.
Fig. 2 is the flow chart of silicon chip method for sieving provided in an embodiment of the present invention.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation describes, it is clear that the described embodiments are merely a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts all other Embodiment shall fall within the protection scope of the present invention.
Fig. 1 is please referred to, the embodiment of the present invention provides a kind of silicon chip screening pipeline system, including:Oscillatory type rotary strainer unit 10, pipelined units 11, visual detection unit 12, resistance detection unit 13 and multiple recovery units 14;The oscillatory type circle Sieve unit 10 is used to screen out the silicon chip of different size according to the size of silicon chip, and silicon chip is made to be tilted into the pipelined units 11;The visual detection unit 12 is arranged in the front end of the pipelined units 11, the ruler for detecting the silicon chip being obliquely installed The very little position for whether meeting recycling and requiring and obtaining the silicon chip being obliquely installed;The resistance detection unit 13 is arranged described The middle part of pipelined units 11, the resistance value for corresponding to silicon chip according to the position detection of the silicon chip;The recovery unit 14 is set It is placed in 11 rear end of the pipelined units, for silicon chip to be diverted to different recovery units 14 according to the resistance value of silicon chip.
The pipelined units 11 include endless conveyor belt 111 and multiple silicon chip monitor stations 112, the silicon chip monitor station 112 are set to the surrounding of the endless conveyor belt 111, to the system for forming a cycle.The silicon chip monitor station 112 and level Face forms angle, to be conducive to subsequent pictures acquisition and resistance detection, improves detection efficiency.Preferably, the silicon chip detection Platform 112 forms 30 °~80 ° of angle with horizontal plane.It is furthermore preferred that the silicon chip monitor station 112 and horizontal plane formed 60 °~ 75 ° of angle.In the present embodiment, the silicon chip monitor station 112 forms 65 ° or so of angle with horizontal plane.
The visual detection unit 12 includes video camera 121, image processor (not indicated in figure) and judging unit (figure In do not indicate).The video camera 121 is used to obtain the picture of the silicon chip.Described image processor is used for according to the picture Obtain the size and location information of silicon chip.The judging unit is used to judge that the silicon chip is according to the dimension information of the silicon chip No satisfaction recycling requires.When the size of the silicon chip, which is unsatisfactory for recycling, to be required, it is single to be diverted to the recycling directly as waste product It is recycled in member 14.
The resistance detection unit 13 is four probe resistance testers or other kinds of resistance tester, four probe Resistance tester is the prior art, then this is not stated tired.
The recovery unit 14 includes sucked type mechanical arm 142 and returnable 141.The sucked type mechanical arm 142 It is positioned in returnable 141 for absorbing the silicon chip of different resistance values from the silicon chip monitor station 112.Each recycling is single Member 14 respectively correspond to a different Standard resistance range, to be conducive to different resistance values silicon chip recycling.
The embodiment of the present invention also provides a kind of silicon chip method for sieving, and the silicon chip method for sieving can be sieved by the silicon chip It shunts line system to implement comprising following steps:
Silicon chip is obliquely installed by S1, and the silicon chip forms 30 °~80 ° of angle with horizontal plane;
The picture of silicon chip in S2, obtaining step S1, and obtain according to the picture location information and ruler of the silicon chip Very little information;
S3 judges whether to meet recycling size requirement according to the dimension information of the silicon chip, is to enter step S4, no, directly It connects as waste recovery;
S4 obtains the resistance value for meeting the silicon chip that recycling size requires, and is divided silicon chip according to different resistance values Class recycles.
In step sl, it is preferred that the silicon chip forms 60 °~75 ° of angle with horizontal plane.It is described in the present embodiment Silicon chip forms 65 ° or so of angle with horizontal plane.
In step s 2, the picture of silicon chip in 121 obtaining step S1 of video camera can be passed through.Further, can pass through Image processor obtains the size and location information of silicon chip according to the picture.
In step s3, it can judge whether the dimension information of the silicon chip meets recycling and require by judging unit.When The size of the silicon chip is unsatisfactory for recycling when requiring, and is diverted in the recovery unit 14 and recycles directly as waste product.
In step s 4, the resistance value for meeting the silicon chip that recycling size requires is obtained by four probe method.Furthermore it is possible to will The resistance value of silicon chip is divided into different ranges, when detecting the resistance value of different silicon chips, can be shunted according to its actual resistance value Into different recovery units 14.Each recovery unit 14 corresponds to a different Standard resistance range respectively.
Example the above is only the implementation of the present invention is not intended to limit the scope of the invention, every to utilize this hair Equivalent process transformation made by bright specification and accompanying drawing content is applied directly or indirectly in other relevant technical fields, Similarly it is included within the scope of the present invention.

Claims (10)

1. a kind of silicon chip sieves pipeline system, which is characterized in that including:Oscillatory type rotary strainer unit, pipelined units, vision inspection Survey unit, resistance detection unit and multiple recovery units;The oscillatory type rotary strainer unit is used to sieve according to the size of silicon chip Go out the silicon chip of different size, and silicon chip is made to be tilted into the pipelined units;The visual detection unit is arranged in the stream The front end of pipeline units, whether the size for detecting the silicon chip being obliquely installed, which meets recycling, requires and obtains described be obliquely installed Silicon chip position;The resistance detection unit is arranged at the middle part of the pipelined units, for the position according to the silicon chip Set the resistance value of the corresponding silicon chip of detection;The recovery unit is set to the pipelined units rear end, for the resistance value according to silicon chip Silicon chip is diverted to different recovery units.
2. silicon chip according to claim 1 sieves pipeline system, which is characterized in that the pipelined units include ring-type Conveyer belt and multiple silicon chip monitor stations, the silicon chip monitor station are set to the surrounding of the endless conveyor belt.
3. silicon chip according to claim 2 sieves pipeline system, which is characterized in that the silicon chip monitor station and horizontal plane Form 30 °~80 ° of angle.
4. silicon chip according to claim 1 sieves pipeline system, which is characterized in that the visual detection unit includes taking the photograph Camera, image processor and judging unit, the video camera are used to obtain the picture of the silicon chip, and described image processor is used In the size and location information that obtain silicon chip according to the picture, the judging unit is used to be believed according to the size of the silicon chip Breath judges whether the silicon chip meets recycling and require.
5. silicon chip according to claim 1 sieves pipeline system, which is characterized in that the resistance detection unit is four spies Needle resistance tester.
6. silicon chip according to claim 1 sieves pipeline system, which is characterized in that the recovery unit includes sucked type Mechanical arm and returnable.
7. a kind of silicon chip method for sieving, which is characterized in that include the following steps:
Silicon chip is obliquely installed by S1, and the silicon chip forms 30 °~80 ° of angle with horizontal plane;
The picture of silicon chip in S2, obtaining step S1, and according to the picture obtain the silicon chip location information and size believe Breath;
S3 judges whether to meet recycling size requirement according to the dimension information of the silicon chip, is to enter step S4, no, directly As waste recovery;
S4 obtains the resistance value for meeting the silicon chip that recycling size requires, and is classified back to silicon chip according to different resistance values It receives.
8. silicon chip method for sieving according to claim 7, which is characterized in that in step sl, the silicon chip and horizontal plane Form 60 °~75 ° of angle.
9. silicon chip method for sieving according to claim 7, which is characterized in that in step s 4, obtained by four probe method Meet the resistance value for the silicon chip that recycling size requires.
10. silicon chip method for sieving according to claim 7, which is characterized in that in step s 2, obtained and walked by video camera The picture of silicon chip in rapid S1.
CN201610704881.4A 2016-08-23 2016-08-23 Silicon chip sieves pipeline system and method for sieving Active CN106269549B (en)

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Publication number Priority date Publication date Assignee Title
CN107248497A (en) * 2017-06-26 2017-10-13 张兆民 Solar silicon wafers detecting system
CN108745921B (en) * 2018-03-26 2021-06-15 江苏金晖光伏有限公司 Sorting and testing method for single and polycrystalline silicon wafers cut by diamond wire saw

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