A kind of handling process of low-grade cupro-nickel electroplating sludge
Technical field
The invention belongs to technical field of sludge treatment, and in particular to a kind of handling process of low-grade cupro-nickel electroplating sludge.
Background technology
There is the cupro-nickel sludge of substantial amounts of low content in the current country, it has not been convenient to dispose, have a strong impact on the environment-protecting clean in region
Health.
In the prior art, there is major defect in the handling process of the cupro-nickel electroplating sludge of low content.For example in the prior art
The multi stage precipitation method of nickel electroplating sludge, including sludge acidleach are processed, sulfate leachate are purified using various intermediate processings so that
Collectively reside in the impurity in nickel electroplating sludge such as iron, copper, cadmium, aluminium, zinc, magnesium, calcium, lead, manganese to be removed, in afterbody precipitation
In separated from purified solution in the form of hydroxide.Although the nickel metal precipitates for obtaining reach certain purity,
Can directly be utilized in metallurgical industry, but the method not only have ignored the problem of secondary pollution, and also the method is brought
Acid solution can cause substantial amounts of pollution to environment.In addition, the method is higher due to processing cost, applicability is poor, typically
It is only suitable for the use that made a search in small-sized laboratory.
Also exist in the prior art and the technique of electroplating sludge is processed using microorganism, from electroplating sludge, waste water and lower water
Separated in road, screened, domestication obtains the SR compound functional bacterias for efficiently removing removing heavy metals.Using SR compound functional bacterias to electroplating wastewater
The metals such as middle chromium, zinc, copper, nickel and lead are purified, although the method does not use chemical reagent, will not cause strong acid, highly basic pair
The pollution that environment is caused, but separated from electroplating sludge, waste water and sewer, screened, tamed to obtain and efficiently remove removing heavy metals
SR compound functional bacterias job requirement it is higher, those skilled in the art be difficult operation.And, the SR compound functional bacterias of gained
Whether human body or animals and plants are caused harm and need further textual criticism.
On the whole, the handling process in the prior art about electroplating sludge is always too high because of processing cost, it is impossible to long
Phase operation production, and electroplating sludge is still innoxious to realize its with stabilisation/curing process, and greatly waste is caused to resource.
The content of the invention
It is an object of the invention to provide a kind of handling process of low-grade cupro-nickel electroplating sludge, choosing-smelting is combined, comprehensive to return
The low-grade cupro-nickel electroplating sludge that this difficulty is put is received, realizes turning waste into wealth.
To achieve the above object, the handling process of low-grade cupro-nickel electroplating sludge of the present invention is comprised the following steps:
Revolution kiln drying:By aqueous 50%-85%, cupric 1%-2.5%, nickeliferous 0.8%-2.5% low-grade cupro-nickel
Sludge feeding rotary kiln is dried;
Chamber type sintering machine burning knot:To be sintered by turning round kiln seasoned low-grade cupro-nickel sludge feeding chamber type sintering machine
Blocking, the cupro-nickel metal particle diameter in sludge is by the way that after sintering, metallic compound particle diameter becomes big, is easy to next step ore dressing;
Crusher in crushing:To be crushed by the blocking sludge feeding disintegrating machine of chamber type sintering;
Ball mill ball milling:Ball milling will be carried out by the sludge of crusher in crushing feeding ball mill;
Screw classifying:Screw classifying will be carried out by the sludge of ball mill ball milling feeding spiral classifier;
Flotation:Flotation will be carried out by the sludge of screw classifying feeding flotation cell;
Filtering:To be filtered by the sludge of flotation cell flotation feeding filter, obtained copper-nickel concentrate and tailings.
Preferably, the copper-nickel concentrate cupric 11.5%, nickeliferous 12.6%, copper recovery is 85%, and nickel recovery is
80%.
The low-grade cupro-nickel sludge is dehydrated granulation after turning round kiln drying, aqueous to reach 45% or so.
The rotary kiln includes Φ 2.6m × 2,22m rotary kilns, and the chamber type sintering machine includes the box burnings of 2.0m × 41m
1, knot machine.
The disintegrating machine includes 1 250mm × 150mm jaw crusher and 1 250mm × 400mm jaw crusher.
The ball mill includes 2 Φ 1500mm × 3000mm ball mills.
The spiral classifier includes 2 Φ 750mm spiral classifiers.
The flotation cell includes 5A flotation cells 20, is first fed into before flotation cell is sent into by the sludge of screw classifying
2 Φ 1500mm agitators are stirred, and being then fed into 1 Φ 6000mm concentrator carries out separation of solid and liquid.
The invention has the advantages that:The handling process and prior art of low-grade cupro-nickel electroplating sludge of the present invention
Compare, the new technology combined using choosing-smelting is pelletized by rotary kiln drying and dewatering, then forms block by chamber type sintering machine burning,
The particle diameter of metallic compound is become big, then it is floating by broken, ball milling, screw classifying, choosing, output copper-nickel concentrate, copper-nickel concentrate contains
Copper 11.5%, nickeliferous 12.6%, copper recovery 85%, nickel recovery 80%, the low-grade copper that synthetical recovery this difficulty is put
Nickel electroplating sludge, realizing turns waste into wealth.
Brief description of the drawings
Fig. 1 is the process equipment configuration figure of the handling process of low-grade cupro-nickel electroplating sludge of the present invention.
Specific embodiment
Following examples are used to illustrate the present invention, but are not limited to the scope of the present invention.
As shown in figure 1, the handling process of low-grade cupro-nickel electroplating sludge of the present invention is comprised the following steps:
Revolution kiln drying:By aqueous 50%-85%, cupric 1%-2.5%, nickeliferous 0.8%-2.5% low-grade cupro-nickel
Sludge feeding rotary kiln is dried;
Chamber type sintering machine burning knot:To be sintered by turning round kiln seasoned low-grade cupro-nickel sludge feeding chamber type sintering machine
Blocking, the cupro-nickel metal particle diameter in sludge is by the way that after sintering, metallic compound particle diameter becomes big, is easy to next step ore dressing;
Crusher in crushing:To be crushed by the caked sludge feeding disintegrating machine of chamber type sintering machine burning;
Ball mill ball milling:Ball milling will be carried out by the sludge of crusher in crushing feeding ball mill;
Screw classifying:Screw classifying will be carried out by the sludge of ball mill ball milling feeding spiral classifier;
Flotation:Flotation will be carried out by the sludge of screw classifying feeding flotation cell;
Filtering:To be filtered by the sludge of flotation cell flotation feeding filter, obtained copper-nickel concentrate and tailings.
Preferably, the copper-nickel concentrate cupric 11.5%, nickeliferous 12.6%, copper recovery is 85%, and nickel recovery is
80%.
The low-grade cupro-nickel sludge is dehydrated granulation after turning round kiln drying, aqueous to reach 45% or so.
The rotary kiln includes Φ 2.6m × 2,22m rotary kilns, and the chamber type sintering machine includes the box burnings of 2.0m × 41m
1, knot machine.
The disintegrating machine includes 1 250mm × 150mm jaw crusher and 1 250mm × 400mm jaw crusher.
The ball mill includes 2 Φ 1500mm × 3000mm ball mills.
The spiral classifier includes 2 Φ 750mm spiral classifiers.
The flotation cell includes 5A flotation cells 20, is first fed into before flotation cell is sent into by the sludge of screw classifying
2 Φ 1500mm agitators are stirred, and being then fed into 1 Φ 6000mm concentrator carries out separation of solid and liquid.
The handling process of low-grade cupro-nickel electroplating sludge of the present invention is respectively adopted smelting system and ore-sorting system reality
Show choosing-smelting to combine.In smelting system, aqueous 50%-85%, cupric 1%-2.5%, the low product of nickeliferous 0.8%-2.5%
Position cupro-nickel sludge sequentially passes through revolution kiln drying and chamber type sintering machine burning knot, after cupro-nickel metal particle diameter in sludge is by sintering,
Metallic compound particle diameter becomes big, is easy to next step ore dressing.
The grade yield of the metallic compound of sintered material is as shown in the table after sintering:
Result in upper table shows that material particular diameter accounts for 87% more than 0.1mm after sintering, and material particular diameter is more than before sintering
0.1mm's accounts for 35%, and this is the foundation that the present invention takes this technique.
It is floating by broken, ball milling, screw classifying, choosing by the caked sludge of chamber type sintering machine burning in ore-sorting system,
Output copper-nickel concentrate, copper-nickel concentrate cupric 11.5%, nickeliferous 12.6%, copper recovery is 85%, and nickel recovery is 80%.
Although the present invention is described in detail above to have used general explanation and specific embodiment, at this
On the basis of invention, it can be made some modifications or improvements, this will be apparent to those skilled in the art.Therefore,
These modifications or improvements, belong to the scope of protection of present invention without departing from theon the basis of the spirit of the present invention.