CN106257656B - Device for cooling power modules - Google Patents

Device for cooling power modules Download PDF

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Publication number
CN106257656B
CN106257656B CN201610423690.0A CN201610423690A CN106257656B CN 106257656 B CN106257656 B CN 106257656B CN 201610423690 A CN201610423690 A CN 201610423690A CN 106257656 B CN106257656 B CN 106257656B
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China
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region
receiving housing
inflow
outflow
power module
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CN201610423690.0A
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Chinese (zh)
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CN106257656A (en
Inventor
理查德·弗里德
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ZF Friedrichshafen AG
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ZF Friedrichshafen AG
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3675Cooling facilitated by shape of device characterised by the shape of the housing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927Liquid coolant without phase change

Abstract

The invention relates to a device for cooling a power module, in particular a power module (1) of an electric machine, with an elongated receiving housing (2), wherein the power module (1) is fastened in such a way, i.e. such that the region of the power module (1) to be cooled is directed toward the interior (3) of the receiving housing (2) through which the coolant flows, wherein an inflow region (4) is associated with a first end region of the receiving housing (2) as a coolant inlet, and the opposite second end region is associated with an outflow region (5) as a coolant outlet, and wherein the inflow region (4) communicates with the interior (3) via an inflow opening (6) in the wall of the receiving container (2), while the outflow region (5) communicates with the interior (3) via an inflow opening (7) in the wall of the receiving container (2).

Description

Device for cooling power modules
Technical Field
The present invention relates to a device for cooling a power module of an electric machine of the type defined in detail in the preamble of claim 1.
Background
Such devices are well known from the vehicle art. The power module used is fastened to the receiving housing, wherein the region of the power module to be cooled protrudes into the cooling structure or into a cooling channel in the interior of the receiving housing through which a coolant flows. The inflow of the coolant takes place through cooling channels in the longitudinal direction of the power module. The cooling channel geometry is produced in the cooling channel and the opposite cooling plate by means of a large-area cutout in the housing. The channel geometry inside the receiving housing is embodied as a deepened channel on the underside of the housing or on the cooling plate. The housing and the cooling surface must be sealed from each other. The introduction of a large-area cutout or a plurality of small cutouts into the receiving housing significantly reduces the rigidity of the receiving housing. Furthermore, the existing coolant pressure causes a deformation of the receiving housing. This can lead to leaks, which lead to the introduction of coolant into the electronics space of the power electronics or power module.
Disclosure of Invention
The object of the present invention is to provide a device of the type mentioned at the outset, in which the rigidity of the receiving housing is increased in a structurally simple and cost-effective manner.
According to the invention, this object is achieved by the features of claim 1, wherein advantageous embodiments and advantages result from the dependent claims and the description and the drawings.
Therefore, a device for cooling a power module of an electric machine is proposed, having an elongated receiving housing, wherein the power module is fastened in such a way that the region of the power module to be cooled faces an interior of the receiving housing through which a coolant flows.
In order to achieve a rigid and structurally stable device, an inflow region is associated with a first end region of the receiving housing as a coolant inlet and an outflow region is associated with an opposite second end region of the receiving housing as a coolant outlet, wherein the inflow region communicates with the interior space via an inflow opening in the wall of the receiving housing and the outflow region communicates with the interior space via an outflow opening in the wall of the receiving housing.
In this way, a pot-shaped receiving housing with a stable bottom region is achieved, so that no structural weakening of the rigidity in the longitudinal direction occurs, since only one inflow opening and one outflow opening are provided at the respective end side of the receiving housing. A rigid underside or a structurally stable base of the receiving container is thus obtained, wherein no deformation due to coolant pressure or the like occurs.
The inflow opening and the outflow opening are provided as a recess, a recess or the like in the wall of the receiving housing. Preferably, a slot-like recess is provided in order to ensure sufficient coolant flow from the inflow region to the interior and from the interior to the outflow region. The recess can be provided inexpensively, for example, by milling or the like.
In order to achieve the inflow region and the outflow region in a sealed manner for the coolant, the inflow region and the outflow region are sealed at the bottom side with a suitable cover. In order to enlarge the interior of the inflow region and the outflow region, it can be provided that the respective cover has a deep-drawn region or the like.
Drawings
The invention is further elucidated hereinafter with the aid of the drawing. In the drawings:
fig. 1 is a schematic top view of a cooling power module according to the invention;
FIG. 2 is a schematic cross-sectional view of the device along the cutting line A-A according to FIG. 1;
FIG. 3 is a cross-sectional view of the device along the cutting line C-C according to FIG. 1;
fig. 4 is a schematic top view of an arrangement for cooling according to the invention without a power module; and is
Fig. 5 is a cross-sectional view of the device along the cutting line B-B according to fig. 4.
Fig. 1 to 5 show different views of possible embodiment variants of the device according to the invention for cooling a power module, for example an electric machine.
Detailed Description
The device according to the invention has an elongated receiving housing 2, wherein the power module 1 is fastened in the recess 8 of the receiving housing in such a way that the region of the power module 1 to be cooled faces the interior 3 of the receiving housing 2 through which the coolant flows. As can be seen from fig. 1 to 5, the power module 1 projects into the recess 8 on the upper side of the receiving housing 2 and is fastened to the upper side of the receiving housing 2 in a sealed manner with respect to the coolant.
In order to achieve a particularly stable design in the receiving housing 2, a first or end region of the receiving housing 2 is assigned an inflow region 4 as coolant inlet and an opposite second or end region is assigned an outflow region 5 as coolant outlet, wherein the inflow region 4 is in flow communication with the interior 3 via an inflow opening 6 in the wall of the receiving container 2, while the outflow region 5 is likewise in flow communication with the interior 3 via an outflow opening 7 in the wall of the receiving container 2
Figure BDA0001018767960000031
And (4) communicating.
In the wall of the receiving housing 2, there are provided in each case one elongated hole-like recess as an inflow opening 6 and an outflow opening 7, as can be seen in particular from fig. 2, 4 and 5. The inflow opening 6 and the outflow opening 7 extend overlapping a recess 8 provided for accommodating the power module 1. As can be seen in particular from fig. 4, the length of the inflow opening 6 and the outflow opening 7 corresponds to the width of the groove 8. By providing the recesses as inflow opening 6 and outflow opening 7 only at the end sides of the receiving housing 2, a structurally stable and rigid embodiment of the receiving housing 2 is obtained. In particular, fig. 3 shows a stable basin-shaped embodiment of the receiving housing 2.
The inflow region 4 and the outflow region 5 are coolant-tightly embodied in such a way that covers 9, 10 are provided on the bottom side. The inlet 11, which is an inflow region, and the outlet 12, which is an outflow region, are each provided with a bore which is oriented transversely with respect to the longitudinal direction of the receiving housing 2.
List of reference numerals
1 Power module
2 accommodating case
3 inner cavity
4 inflow region
5 outflow region
6 inflow opening
7 outflow opening
8 grooves
9 cover
10 cover
11 entry or bore hole
12 outlet or bore

Claims (4)

1. Device for cooling a power module (1) of an electric machine, having an elongated receiving housing (2), wherein the power module (1) is fastened in such a way that the region of the power module (1) to be cooled faces an interior (3) of the receiving housing (2) through which a coolant flows, characterized in that a first end region of the receiving housing (2) in the longitudinal direction of the receiving housing is assigned an inflow region (4) as a coolant inlet and an opposite second end region is assigned an outflow region (5) as a coolant outlet, wherein the inflow region (4) communicates with the interior (3) via an inflow opening (6) in the wall of the receiving housing (2) and the outflow region (5) communicates with the interior (3) via an outflow opening (7) in the wall of the receiving housing (2), wherein, as an inflow opening (6) and as an outflow opening (7), a long-hole-like recess oriented transversely to the longitudinal direction is provided in each case in the wall of the receiving housing (2).
2. Device according to claim 1, characterized in that the inflow region (4) and the outflow region (5) are each closed on the bottom side with a cover (9, 10).
3. Device according to claim 2, characterized in that at least one of the covers (9, 10) is provided with a deep-drawn region for enlarging the inflow region (4) and/or the outflow region (5).
4. Device according to claim 1 or 2, characterized in that as an inlet (11) of the inflow region (4) and as an outlet (12) of the outflow region (5) a bore hole is provided, respectively, which is oriented transversely with respect to the longitudinal direction of the receiving housing (2).
CN201610423690.0A 2015-06-17 2016-06-15 Device for cooling power modules Active CN106257656B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015211160.1 2015-06-17
DE102015211160.1A DE102015211160A1 (en) 2015-06-17 2015-06-17 Arrangement for cooling a power module

Publications (2)

Publication Number Publication Date
CN106257656A CN106257656A (en) 2016-12-28
CN106257656B true CN106257656B (en) 2021-12-07

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DE (1) DE102015211160A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020207966A1 (en) * 2019-11-25 2021-05-27 Volkswagen Aktiengesellschaft Cooling arrangement for electronic components of a motor vehicle

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10038178A1 (en) * 2000-08-04 2002-02-21 Eupec Gmbh & Co Kg Cooling rail for direct fluid cooling of circuit modules, has at least one quiet zone, at least one slot and at least one chamber through which the cooling fluid flows
CN101523595A (en) * 2007-01-11 2009-09-02 爱信艾达株式会社 Heat generator cooling structure and driving apparatus fitted with the same
CN104425406A (en) * 2013-09-03 2015-03-18 赛米控电子股份有限公司 Power semiconductor device and method for producing power semiconductor device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995008844A1 (en) * 1993-09-21 1995-03-30 Siemens Aktiengesellschaft Cooling device for a power semiconductor module
DE102007002492A1 (en) * 2007-01-11 2008-09-25 Deutsche Mechatronics Gmbh Plate type heat exchanger with a fixing surface and a heat exchange and/or cooling useful in production of electrical and electronic components has increased heat exchange efficiency
JP5078630B2 (en) * 2008-01-15 2012-11-21 株式会社豊田自動織機 Liquid cooling system
US20110315367A1 (en) * 2010-06-25 2011-12-29 Romero Guillermo L Fluid cooled assembly and method of making the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10038178A1 (en) * 2000-08-04 2002-02-21 Eupec Gmbh & Co Kg Cooling rail for direct fluid cooling of circuit modules, has at least one quiet zone, at least one slot and at least one chamber through which the cooling fluid flows
CN101523595A (en) * 2007-01-11 2009-09-02 爱信艾达株式会社 Heat generator cooling structure and driving apparatus fitted with the same
CN104425406A (en) * 2013-09-03 2015-03-18 赛米控电子股份有限公司 Power semiconductor device and method for producing power semiconductor device

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