CN106257656A - For cooling down the device of power model - Google Patents
For cooling down the device of power model Download PDFInfo
- Publication number
- CN106257656A CN106257656A CN201610423690.0A CN201610423690A CN106257656A CN 106257656 A CN106257656 A CN 106257656A CN 201610423690 A CN201610423690 A CN 201610423690A CN 106257656 A CN106257656 A CN 106257656A
- Authority
- CN
- China
- Prior art keywords
- region
- power model
- housing
- inner chamber
- inflow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Motor Or Generator Cooling System (AREA)
Abstract
The present invention relates to the device for cooling down power model, device especially for the power model (1) of cooling motor, it is with elongated receiving housing (2), wherein, power model (1) fastens as follows, i.e., make the region to be cooled of power model (1) towards the inner chamber by coolant percolation (3) accommodating housing (2), wherein, the first region, side accommodating housing (2) is associated with inflow region (4) as coolant entrance, and the second opposite region, side is associated with flowing out region (5) as coolant outlet, and wherein, inflow region (4) is connected with inner chamber (3) by the inlet opening (6) in the wall of receiving container (2), and flow out region (5) and connected with inner chamber (3) by the inlet opening (7) in the wall of receiving container (2).
Description
Technical field
The present invention relates to a kind of power of motor mould limiting type for cooling down preamble according to claim 1 in detail
The device of block.
Background technology
Such device is by well known to vehicle technology.The power model used is fastened to accommodate on housing, wherein, and power
The cooling duct flow through by coolant that the region to be cooled of module is stretched in cooling structure or stretched in holding shell intracoelomic cavity
In.The inflow of coolant is carried out by the cooling duct of the longitudinal direction along power model.Cooling duct geometry passes through shell
Large-area breach on body produces in cooling duct and opposite coldplate.At the passage geometry accommodating enclosure interior
Shape is embodied as at the downside of housing or the passage of intensification on the cooling plate.Housing and cooling surface must be sealed against one another.By
In large-area breach or multiple little breach are introduced and accommodated in housing, the rigidity of receiving housing is made substantially to weaken.Additionally,
The coolant pressure existed result in the deformation accommodating housing.Thus there will be non-hermetic, this causes coolant to be introduced into merit
In the electronic structure space of rate electronic device or power model.
Summary of the invention
The task of the present invention is, it is provided that a kind of device being initially mentioned type, wherein, and simple in construction and low cost ground
Improve the rigidity accommodating housing.
According to the present invention, this task is resolved by the feature of claim 1, wherein, favourable design and
Advantage is drawn by dependent claims and description and accompanying drawing.
Therefore, it is proposed to the device of a kind of power model for cooling down motor, it is with elongated receiving housing, its
In, power model fastens as follows, i.e. make cold towards this receiving housing of the region to be cooled of power model
But the inner chamber of agent percolation.
In order to realize rigidity and stabilized structure device, the first region, side accommodating housing is associated with inflow region work
For coolant entrance, and the second opposite region, side accommodating housing is associated with flowing out region as coolant outlet,
Wherein, inflow region is by accommodating the inlet opening in wall of a container and inner space, and flows out region by accommodating container
Outflow opening in wall and inner space.
By this way, it is achieved that the peviform with firm bottom section accommodates housing, thus in a longitudinal direction will not
Rigidity on recurring structure weakens, this is because only an inlet opening and an outflow opening are arranged on and accommodate each of housing
From side.Thus obtained accommodating bottom firm in the downside of rigidity of container or structure, wherein, do not have due to
The deformation that coolant pressure or similar reason occur.
Inlet opening and outflow opening are set to the portion that vacates in the wall accommodating housing, leave a blank portion or similar type.
It is preferably provided with the portion of leaving a blank of elongated hole-shape, in order to guarantee from inflow region to inner chamber and from inner chamber to flowing out the enough cold of region
But the percolation of agent.Such as portion of leaving a blank can be set by milling or similar approach low cost ground.
In order to realize coolant seals inflow region and flow out region, inflow region and outflow region are used in bottom side
Suitable lid seals.Can be provided that to expand the inner chamber in inflow region and outflow region, respective lid has deep-draw district
Territory or similar.
Accompanying drawing explanation
Hereinafter it is further elucidated with the present invention by accompanying drawing.In the accompanying drawings:
Fig. 1 be according to the present invention, for cooling down the schematic plan of power model；
Fig. 2 is the schematic sectional view along the line of cut A-A according to Fig. 1 of device；
Fig. 3 is the sectional view along the line of cut C-C according to Fig. 1 of device；
Fig. 4 is without power model, the schematic plan of the device for cooling according to the present invention；And
Fig. 5 is the sectional view along the line of cut B-B according to Fig. 4 of device.
The possible different view implementing variant according to assembly of the invention is illustrated in Fig. 1 is to 5, should
Device is for cooling down the power model of such as motor.
Detailed description of the invention
Having elongated receiving housing 2 according to assembly of the invention, wherein, power model 1 is fastened on appearance as follows
Receive in the groove 8 of housing, i.e. make the region to be cooled of power model 1 towards accommodate housing 2 by coolant percolation
Chamber 3.By Fig. 1 to 5 it can be seen that power model 1 stretches in groove 8 in the upside accommodating housing 2, and to coolant seals ground
It is fastened on the upside accommodating housing 2.
For the make realizing consolidating especially in accommodating housing 2, accommodate the first region, side of housing 2 in other words
End regions is associated with inflow region 4 as coolant entrance, and the second opposite region, side end regions in other words
Be associated with flowing out region 5 as coolant outlet, wherein, inflow region 4 by accommodate inlet opening 6 in the wall of container 2 with
Inner chamber 3 connects in flowing, and flows out region 5 and flowing with inner chamber 3 likewise by the outflow opening 7 in the wall accommodating container 2
On DongConnection.
Opening 7 as inlet opening 6 and is flowed out in the portion of leaving a blank being respectively arranged with elongated hole-shape in the wall accommodating housing 2,
As especially by Fig. 2, seen by 4 and 5.Inlet opening 6 and flow out opening 7 and be provided for laying power model 1
Groove 8 extends overlappingly.The most as seen from Figure 4, the length of inlet opening 6 and outflow opening 7 is equivalent to the width of groove 8
Degree.By using as inlet opening 6 with flow out the portion of leaving a blank of opening 7 and be provided only on and accommodate the side of housing 2, having obtained holding shell
Firm and the embodiment of rigidity in body 2 structure.Particularly, Fig. 3 shows the embodiment party of the firm peviform accommodating housing 2
Case.
Inflow region 4 and with flowing out region 5 coolant seals as follows enforcement, i.e. be respectively arranged with in bottom side
Lid 9,10.As entrance 11 and the outlet 12 in outflow region of inflow region, it is respectively arranged with relative to accommodating the vertical of housing 2
Boring to direction horizontal orientation.
Reference numerals list
1 power model
2 accommodate housing
3 inner chambers
4 inflow regions
5 flow out region
6 inlet openings
7 flow out opening
8 grooves
9 lids
10 lids
11 entrances are holed in other words
12 outlets are holed in other words
Claims (5)
1., for cooling down the device of the power model (1) of motor, described device is with elongated receiving housing (2), wherein, described
Power model (1) fastens as follows, i.e. make the region to be cooled of described power model (1) towards described appearance
Receive the inner chamber by coolant percolation (3) of housing (2), it is characterised in that attach troops to a unit in the first region, side of described receiving housing (2)
There is inflow region (4) as coolant entrance, and the second opposite region, side is associated with flowing out region (5) as cooling
Agent exports, and wherein, described inflow region (4) is by the inlet opening (6) in the wall of described receiving container (2) and described inner chamber
(3) connection, and described outflow region (5) is by the outflow opening (7) in the wall of described receiving container (2) and described inner chamber (3)
Connection.
Device the most according to claim 1, it is characterised in that as inlet opening (6) and as flowing out opening (7),
The portion of leaving a blank of elongated hole-shape it is provided with respectively in the wall of described receiving housing (2).
3. according to the device described in any one in aforementioned claim, it is characterised in that described inflow region (4) and described stream
Go out region (5) to close in bottom side lid (9,10) respectively.
Device the most according to claim 3, it is characterised in that at least one described lid (9,10) is provided with deep-drawn area, uses
To expand described inflow region (4) and/or described outflow region (5).
5. according to the device described in any one in aforementioned claim, it is characterised in that as entering of described inflow region (4)
Mouth (11) and the outlet (12) as described outflow region (5), be respectively arranged with the longitudinal direction relative to described receiving housing (2)
The boring of direction horizontal orientation.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102015211160.1 | 2015-06-17 | ||
| DE102015211160.1A DE102015211160A1 (en) | 2015-06-17 | 2015-06-17 | Arrangement for cooling a power module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106257656A true CN106257656A (en) | 2016-12-28 |
| CN106257656B CN106257656B (en) | 2021-12-07 |
Family
ID=57467191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610423690.0A Active CN106257656B (en) | 2015-06-17 | 2016-06-15 | Device for cooling power modules |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106257656B (en) |
| DE (1) | DE102015211160A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112833698A (en) * | 2019-11-25 | 2021-05-25 | 大众汽车股份公司 | Cooling assembly for electronic components of a motor vehicle |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995008844A1 (en) * | 1993-09-21 | 1995-03-30 | Siemens Aktiengesellschaft | Cooling device for a power semiconductor module |
| DE10038178A1 (en) * | 2000-08-04 | 2002-02-21 | Eupec Gmbh & Co Kg | Cooling rail for direct fluid cooling of circuit modules, has at least one quiet zone, at least one slot and at least one chamber through which the cooling fluid flows |
| CN101489371A (en) * | 2008-01-15 | 2009-07-22 | 株式会社丰田自动织机 | Liquid-cooled-type cooling device |
| CN101523595A (en) * | 2007-01-11 | 2009-09-02 | 爱信艾达株式会社 | Heat generator cooling structure and driving apparatus fitted with the same |
| US20110315367A1 (en) * | 2010-06-25 | 2011-12-29 | Romero Guillermo L | Fluid cooled assembly and method of making the same |
| CN104425406A (en) * | 2013-09-03 | 2015-03-18 | 赛米控电子股份有限公司 | Power semiconductor device and method for producing power semiconductor device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102007002492A1 (en) * | 2007-01-11 | 2008-09-25 | Deutsche Mechatronics Gmbh | Plate type heat exchanger with a fixing surface and a heat exchange and/or cooling useful in production of electrical and electronic components has increased heat exchange efficiency |
-
2015
- 2015-06-17 DE DE102015211160.1A patent/DE102015211160A1/en active Pending
-
2016
- 2016-06-15 CN CN201610423690.0A patent/CN106257656B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995008844A1 (en) * | 1993-09-21 | 1995-03-30 | Siemens Aktiengesellschaft | Cooling device for a power semiconductor module |
| DE10038178A1 (en) * | 2000-08-04 | 2002-02-21 | Eupec Gmbh & Co Kg | Cooling rail for direct fluid cooling of circuit modules, has at least one quiet zone, at least one slot and at least one chamber through which the cooling fluid flows |
| CN101523595A (en) * | 2007-01-11 | 2009-09-02 | 爱信艾达株式会社 | Heat generator cooling structure and driving apparatus fitted with the same |
| CN101489371A (en) * | 2008-01-15 | 2009-07-22 | 株式会社丰田自动织机 | Liquid-cooled-type cooling device |
| US20110315367A1 (en) * | 2010-06-25 | 2011-12-29 | Romero Guillermo L | Fluid cooled assembly and method of making the same |
| CN104425406A (en) * | 2013-09-03 | 2015-03-18 | 赛米控电子股份有限公司 | Power semiconductor device and method for producing power semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112833698A (en) * | 2019-11-25 | 2021-05-25 | 大众汽车股份公司 | Cooling assembly for electronic components of a motor vehicle |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106257656B (en) | 2021-12-07 |
| DE102015211160A1 (en) | 2016-12-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5423998B2 (en) | Electronic component cooling unit and power conversion device | |
| KR102291151B1 (en) | Cooling flow channel module for power changing device and power changing device having the same | |
| JP6457678B1 (en) | Power converter | |
| US8601997B2 (en) | Water pump with integrated oil cooler | |
| CN103155735A (en) | Cooling structure | |
| CN109585727B (en) | Battery box | |
| JP6582468B2 (en) | Rotating electrical machine structure | |
| US20220232733A1 (en) | Cooling device for heat exchange of cpu radiator | |
| US20040257757A1 (en) | Housing with device for electronic control units, in particular in motor vehicles | |
| US10158273B2 (en) | Liquid-cooled motor device | |
| CN108138687A (en) | The cooling construction of water-cooled engine | |
| CN101536245A (en) | Modular battery unit | |
| CN106257656A (en) | For cooling down the device of power model | |
| US20220154628A1 (en) | Reservoir tank | |
| CN203301352U (en) | Frequency converter heat dissipation structure and frequency converter | |
| CN114449836A (en) | Electrical component housing with cooling channels | |
| CN210224141U (en) | Battery pack assembly and vehicle with same | |
| CN205829363U (en) | Water cooling motor housing | |
| US20060048924A1 (en) | Fluid reservoir for modular systems | |
| CN217129634U (en) | Expansion kettle and vehicle with same | |
| JP2006336575A (en) | Radiator | |
| CN205430862U (en) | Closed electric vehicle controller water cooling casing | |
| CN214273796U (en) | Prevent coolant liquid splash structure and expansion tank | |
| KR102280706B1 (en) | Cooling device for vacuum mold | |
| CN101629510A (en) | Integrated module of automobile engine thermostat seat and engine oil filter seat |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |