CN106257637A - Fastening assembly and there is its substrate board treatment - Google Patents

Fastening assembly and there is its substrate board treatment Download PDF

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Publication number
CN106257637A
CN106257637A CN201610421556.7A CN201610421556A CN106257637A CN 106257637 A CN106257637 A CN 106257637A CN 201610421556 A CN201610421556 A CN 201610421556A CN 106257637 A CN106257637 A CN 106257637A
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China
Prior art keywords
fastening
mentioned
gripper shoe
space
main body
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Granted
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CN201610421556.7A
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CN106257637B (en
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韩有东
朴真庆
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Hanna New Material Co Ltd
Semes Co Ltd
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Hanna New Material Co Ltd
Semes Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/3244Gas supply means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32798Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3288Maintenance

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)

Abstract

The present invention provides the device of more than 2 main bodys of fastening.Substrate board treatment, comprising: chamber, has process space inside it;Support unit, it is at above-mentioned process space support substrate;And gas feed unit, it supplies process gas in above-mentioned process space, and above-mentioned gas feed unit includes: shower nozzle, and it is relative with above-mentioned support unit;Gripper shoe, it supports above-mentioned shower nozzle;Fastening assembly, its above-mentioned shower nozzle of fastening and above-mentioned gripper shoe, above-mentioned fastening assembly includes: fastening main body, it is formed as holding the ring-type of above-mentioned gripper shoe, can pivot about with the central shaft of above-mentioned gripper shoe.Thus, the substrate board treatment of the present invention can perform rapidly the handling of shower nozzle.

Description

Fastening assembly and there is its substrate board treatment
Technical field
The present invention relates to the device of more than 2 main bodys of a kind of fastening.
Background technology
In the manufacturing process of semiconductor device, perform photoetching, etching, thin film deposition, ion implanting and cleaning Etc. kinds of processes.In this technique, etching, thin film deposition and cleaning use and utilize plasma (plasma) Substrate board treatment.
Generally, in plasma-treating technology, in chamber (chamber), supply process gas, and profit The plasma produced with this process gas processes substrate.By gripper shoe and shower nozzle (shower head) Supply this process gas.
Especially, shower nozzle can be replaced according to the frequency of exposure of plasma or retain it.Therefore, Gripper shoe and shower nozzle can be loaded and unloaded continually.The process of handling gripper shoe 2 and shower nozzle 4 is as it is shown in figure 1, lead to Cross bolt 6 to fasten in the way of (Top-Down) by from top to bottom.
But, this simple bolt fastening means consumes the plenty of time during fastening.It addition, it is right For simple bolt fastening means, staff needs for fastening bolt such as screwdriver and spanner single-candidate Outer stage property.
[look-ahead technique document]
[patent documentation]
Korean Patent Publication No. 2007-0040639
Summary of the invention
Technical problem
It is an object of the invention to, it is provided that a kind of device that can perform rapidly to load and unload shower nozzle.
It addition, it is an object of the invention to, it is provided that a kind of staff of enabling is not having extra stage property In the case of perform handling shower nozzle device.
The means of solution problem
Embodiments of the invention provide the device of more than 2 main bodys of fastening.Substrate board treatment includes: chamber, There is inside it process space;Support unit, it is at above-mentioned process space support substrate;And gas supply Unit, it supplies process gas in above-mentioned process space, and above-mentioned gas feed unit includes: shower nozzle, its Relative with above-mentioned support unit;Gripper shoe, it supports above-mentioned shower nozzle;Fastening assembly, it fastens above-mentioned shower nozzle With above-mentioned gripper shoe, above-mentioned fastening assembly includes: fastening main body, its ring being formed as holding above-mentioned gripper shoe Shape, can pivot about with the central shaft of above-mentioned gripper shoe.
The sidepiece of above-mentioned gripper shoe forms the insertion groove that can be inserted into above-mentioned fastening main body, the following table of above-mentioned gripper shoe Face forms the screwed hole communicated with above-mentioned insertion groove, and above-mentioned fastening assembly may also include, fastening bolt, and this is tight Fixing bolt is immobly bound above-mentioned shower nozzle, and has and can be plugged into above-mentioned screwed hole and the head of above-mentioned insertion groove Portion.Above-mentioned fastening main body forms the round and smooth hole, crack towards circumferencial direction, and hole, above-mentioned crack can have can insert Insert space and the upper and lower that enter above-mentioned fastening bolt have the sliding space of different in width.Above-mentioned In sliding space, above-mentioned top can have the width bigger than above-mentioned bottom, and it is above-mentioned that above-mentioned bottom can have ratio The width that head is less.In above-mentioned sliding space, further away from above-mentioned insertion space, the degree of depth of above-mentioned bottom can The deepest.Above-mentioned fastening main body comprises the steps that multiple, is respectively formed with hole, above-mentioned crack, and be mutually combined and Formed ring-type, and above-mentioned gripper shoe can be formed and the above-mentioned screwed hole of above-mentioned multiple corresponding numbers.Above-mentioned Substrate board treatment may also include plasma source, and it utilizes the process gas being fed into above-mentioned process space Produce plasma.
The mutually fastening assembly of fastening upper plate and lower plate can include fastening main body, and this fastening main body is formed as bag Ring-type around above-mentioned upper plate or above-mentioned lower plate, can enter centered by the central shaft of above-mentioned upper plate or above-mentioned lower plate Row rotates.
The sidepiece of above-mentioned upper plate can form the insertion groove that can be inserted into above-mentioned fastening main body, the lower surface of above-mentioned upper plate Can form the screwed hole communicated with above-mentioned insertion groove, above-mentioned fastening assembly may also include fastening bolt, this fastening Bolt is immobly bound above-mentioned lower plate, and has and can be plugged into above-mentioned screwed hole and the head of above-mentioned insertion groove. The sidepiece of above-mentioned lower plate can form the insertion groove that can be inserted into above-mentioned fastening main body, and the upper surface of above-mentioned lower plate can shape Becoming the screwed hole communicated with above-mentioned insertion groove, above-mentioned fastening assembly may also include fastening bolt, this fastening bolt It is immobly bound above-mentioned upper plate, and has and can be plugged into above-mentioned screwed hole and the head of above-mentioned insertion groove.On Stating fastening main body and can form the round and smooth hole, crack towards circumferencial direction, hole, above-mentioned crack can have and can be inserted into The insertion space stating fastening bolt and the Part I with differing heights and Part II are formed as each other The sliding space of different in width.In above-mentioned sliding space, above-mentioned Part I can have than above-mentioned Part II Bigger width, above-mentioned Part II can have the width less than above-mentioned head.In above-mentioned sliding space, Further away from above-mentioned insertion space, the degree of depth of above-mentioned Part II can be the deepest.
The effect of invention
According to embodiments of the invention, by fastening the rotation of main body, it is possible to make shower nozzle and gripper shoe the tightest Gu.Therefore, it is possible to perform rapidly the handling of shower nozzle.
It addition, according to embodiments of the invention, staff can pass through in the case of not having extra stage property Rotational fastener main body loads and unloads shower nozzle.
Accompanying drawing explanation
Fig. 1 is the sectional view illustrating general gripper shoe and shower nozzle.
Fig. 2 is the sectional view illustrating substrate board treatment according to an embodiment of the invention.
Fig. 3 is the plane graph of the baffle plate illustrating Fig. 2.
Fig. 4 is the cross-sectional perspective view of the part illustrating gas feed unit.
Fig. 5 is the plane graph of the fastening main body illustrating Fig. 4.
Fig. 6 is the sectional view of the fastening main body observing Fig. 5 from a-a' direction.
Fig. 7 is the sectional view of the fastening main body observing Fig. 5 from b-b' direction.
Fig. 8 to Figure 10 is the figure of the process being shown through the secure component fastening support plate of Fig. 5 and shower nozzle.
Figure 11 is the cross-sectional perspective view of other embodiments illustrating Fig. 5.
Detailed description of the invention
Embodiments of the invention can deform in a variety of forms, and the scope of the present invention should not be construed as following The embodiment of narration limits.The present embodiment is common in order to intactly the present invention be illustrated to having in this area The personnel of knowledge and provide.Thus, the shape etc. of the structural element of accompanying drawing is to emphasize to illustrate accurately And exaggerated.
In the present embodiment, the substrate board treatment of the plasma etch process substrate utilized in chamber is made It is that an example illustrates.But, the present invention is not limited to this, as long as utilize at plasma The device of reason substrate, is i.e. applicable to various technique.
Hereinafter, referring to figs. 2 to Figure 11, the present invention is described.
Fig. 2 is the sectional view illustrating substrate board treatment according to an embodiment of the invention.With reference to Fig. 2, substrate Processing means 10 include chamber 100, substrate supporting unit 200, plasma source 400, baffle plate 500, with And gas feed unit 600.
The process space being internally formed process substrate W of chamber 100.Chamber 100 is formed as circular tubbiness. Housing 100 is formed as metal material.Such as, chamber 100 is formed as aluminum.The side of chamber 100 Wall forms opening.Opening is arranged to take out of or move into the gateway of substrate.Gateway can be realized by door Opening and closing.The bottom surface of chamber 100 forms steam vent 150.Steam vent 150 is connected to decompression member by exhaust line 160.Decompression member 160 provides vacuum pressure by aerofluxus alignment steam vent 150.Technique carries out middle generation In by-product and chamber 100, the plasma of residual is expelled to the outside of chamber 100 by vacuum pressure.
Substrate supporting unit 200 is processing space support substrate W.Substrate supporting unit 200 is formed as profit The electrostatic chuck 200 of substrate W is supported with electrostatic force.Optionally, substrate supporting unit 200 can be by such as The various ways such as mechanical clamp (clamping) support substrate W.
Electrostatic chuck 200 includes dielectric plate 210, focusing ring 250 and pedestal 230.Dielectric plate 210 Upper surface directly place substrate W.Dielectric plate 210 is formed as disc.Dielectric plate 210 can have The diameter less than substrate W.The inside of dielectric plate 210 arranges internal electrode 212.Internal electrode 212 is even Connect power supply (not shown), and receive electric power from power supply (not shown).Internal electrode 212 is by the electricity received Power (not shown) provides electrostatic force so that substrate W is adsorbed onto dielectric plate 210.Dielectric plate 210 interior Portion arranges the heater 214 heating substrate W.Heater 214 may be disposed at internal electrode 212 Downside.Heater 214 is formed as spiral coil.Such as, dielectric plate 210 is formed as pottery Material.
Pedestal 230 supports dielectric plate 210.Pedestal 230 is positioned at downside and the electrolyte of dielectric plate 210 Plate 210 secure bond.The upper surface of pedestal 230 has by middle section higher than being formed in the way of marginal area The shape of section difference.The middle section of the upper surface of pedestal 230 has the lower surface corresponding to dielectric plate 210 Area.Pedestal 230 be internally formed cooling duct 232.Cooling duct 2332 is arranged to make cooling The passage of fluid circulation.Cooling duct 232 is formed as spiral type in the inside of pedestal 230.Pedestal and position Connect in outside high frequency electric source 234.High frequency electric source 234 applies electric power to pedestal 230.Put on pedestal The plasma that the electric power of 230 produces in making chamber 100 guides in the way of moving towards pedestal 230. Pedestal 230 is formed as metal material.
Plasma is focused on substrate W by focusing ring 250.Focusing ring 250 includes interior side ring 252 and outside Ring 254.Interior side ring 252 is formed as the ring-type of the circle of encirclement dielectric plate 210.Interior side ring 252 is positioned at base The marginal area of seat 230.The upper surface of interior side ring 252 is formed as having and the upper surface of dielectric plate 210 Identical height.The upper surface medial part of interior side ring 252 supports the lower surface edge region of substrate W.Such as, Interior side ring 252 can be conductive material.Outer side ring 254 is formed as surrounding the circular ring-type of interior side ring 252. Outer side ring 254 is adjacent with interior side ring 252 at the marginal position of pedestal 230.The upper surface of outer side ring 254 Height is higher compared to the height of the upper surface of interior side ring 254.Outer side ring 254 can be megohmite insulant.
Process gas in chamber 100 is excited into plasmoid by plasma source 400.According to one Example, as plasma source 400, can use capacitance coupling plasma (CCP:Capacitively coupled plasma).Plasma source 400 can include upper electrode (not shown) and lower electrode (not in chamber interior Illustrate).Upper electrode and lower electrode can configure in the way of being parallel to each other up and down in the inside of chamber 100. Any one electrode in two electrodes can be applied in RF power, and another electrode can ground connection.Between two electrodes Space formed electromagnetic field, the process gas being fed into this space can be provoked into plasmoid.Root According to an example, upper electrode may be placed at the inside of shower nozzle 650, and lower electrode may be placed at pedestal Inside.Lower electrode can be applied in RF power, and upper electrode can ground connection.In contrast, upper electrode RF power can be all applied in lower electrode.Thus, electromagnetic field is produced between upper electrode and lower electrode. The process gas being provided within chamber 100 is excited into plasmoid by the electromagnetic field produced.
Baffle plate 500 discharges plasma in the process space equably according to region.Fig. 3 is to illustrate Fig. 2's The plane graph of baffle plate.With reference to Fig. 2, baffle plate 500 is processing the medial wall being spatially located at chamber 100 and substrate props up Between support unit 200.Baffle plate 500 is formed as the ring-type of circle.Baffle plate 500 is formed with multiple through hole 502. Through hole 502 is arranged with above-below direction.Through hole 502 arranges along the circumferencial direction of baffle plate 500.Through Hole 502 has fracture shape, and length direction is towards the radial direction of baffle plate 500.
Gas feed unit 600 is to processing space supply process gas.Such as, process gas can be etching Gas.Fig. 4 is the cross-sectional perspective view of the part illustrating gas feed unit.With reference to Fig. 2, gas supply is single Unit 600 includes air inlet 610, support member, shower nozzle and fastening assembly.Air inlet 610 is arranged at chamber The top wall of 100.Air inlet 610 is positioned at the opposite of substrate supporting unit 200.According to an example, air inlet Mouth 610 may be disposed at the center of the top wall of chamber 100.Support member 630 is processing space support shower nozzle. Support member 630 is formed as the circular tubbiness of open-top.The upper end of support member 630 is fixedly combined to The top wall of chamber 100.Thus, the top wall of support member 630 and chamber 100 be mutually combined and including Portion forms gas allocation space.
Support member 630 includes support ring and gripper shoe 640.Support ring has the ring-type of circle.Support ring Upper end is fixedly combined to the top wall 640 of chamber 100.Gripper shoe 640 has the tabular of circle.Gripper shoe Multiple dispensing orifice 642 is formed on 640.Dispensing orifice 642 is formed as circle or fracture shape.Gripper shoe 640 Sidepiece formed insertion groove 644.Insertion groove 644 is formed along the circumferencial direction of gripper shoe 640.Such as, insert Enter groove 644 and can be inserted into the ring-type fastening main body 740 with circle.The sidepiece lower surface of gripper shoe 640 is formed Screwed hole 646.Screwed hole 646 is provided with multiple, and is respectively formed as communicating with insertion groove 644.According to one Example, screwed hole 646 can be 2.Screwed hole 646 can be centered by the central shaft of gripper shoe 640 Relatively put.Optionally, screwed hole 646 can be 4 or 8.
Shower nozzle 650 is formed as circular tabular.Shower nozzle 650 has the diameter corresponding with gripper shoe 640.Spray 650 form multiple taps 652.Tap 652 has the less big of or ratio identical with dispensing orifice 642 Little.Spread configuration between tap 652 is identical with dispensing orifice 642.Shower nozzle 650 is in gripper shoe 640 Downside in the way of making tap 652 and dispensing orifice 642 toward each other, be fastened to gripper shoe 640.Enter gas The process gas of body allocation space is supplied to process space by dispensing orifice 642 and tap 652.
Fastening assembly 700 makes gripper shoe 640 and shower nozzle 650 mutually realize fastening.Fastening assembly 700 includes Fastening bolt 720 and fastening main body 740.Fastening bolt 720 has and screwed hole 646 number one to one. Such as, fastening bolt 720 can be 2.Fastening bolt 720 is fixedly combined to the upper surface of shower nozzle 650. Fastening bolt 720 projects upwards from the upper surface of shower nozzle 650.Fastening bolt 720 has main part 722 He Head 724.Main part 722 has drum, and its length direction configures along the vertical direction.Main part 722 There is identical diameter along its length.Head 724 extends from the upper end of main part 722.Head 724 There is the diameter bigger than main part 722.
Fig. 5 is the plane graph of the fastening main body illustrating Fig. 4, and Fig. 6 is the fastening master observing Fig. 5 from a-a' direction The sectional view of body, Fig. 7 is the sectional view of the fastening main body observing Fig. 5 from b-b' direction.With reference to Fig. 5 to Fig. 7, Fastening main body 740 is formed as the ring-type of circle.Fastening main body 740 is inserted into insertion groove 644, and can insert Enter groove 644 to rotate.Fastening main body 740 includes multiple (bar) 740a, 740b.Bar 740a, 740b that This combination shape is conglobate ring-type.Bar 740a, 740b have and screwed hole 646 number one to one.Often Individual bar 740a, 740b can be fixed to one another combination by screw (not shown).Bar 740a, 740b are formed respectively Hole, crack 750.Hole, crack 750 is provided with the opening 750 towards above-below direction.Hole, crack 750 is along fastening The circumferencial direction of main body 740 has the length direction of bending.When observing from top, hole, crack 750 has slotting Enter space 754 and sliding space 752.Inserting space 754 is the region that can be inserted into fastening bolt 720.Insert Space 754 has the width bigger than head 724.Sliding space 752 is for from inserting space 754 along splitting The region that the length direction of slot apertures 750 extends in long way.Sliding space 752 is formed as having width different from each other The upper area 752a and lower area 752b of degree.Sliding space 752 is formed as upper area 752a to be had The width bigger than lower area 752b.According to an example, the upper area 752a of sliding space 752 Can have the width bigger than the diameter of head 724.The lower area 752b of sliding space 752 can have ratio The width that the diameter of main part 722 is big, less than the diameter of head 724.Lower area 752b is toward each other The first protuberance 760a and the second protuberance 760b between clearance space.First protuberance 760a be from The part that first medial surface of fastening main body 740 is prominent, the second protuberance 760b be from the first medial surface phase To the prominent part of the second medial surface.First protuberance 760a and the second protuberance 760b is along hole, crack The length direction of 750 extends in long way.First protuberance 760a and the second protuberance 760b is respectively set to more Away from inserting space 754, then there is the biggest height.Thus, the width of lower area 752b be first dash forward Going out the spacing between portion 760a and the second protuberance 760b, the degree of depth of lower area 752b is the first protuberance 760a Height with the second protuberance 760b.
Below, illustrate to utilize the secure component 700 fastening support plate 640 described in detail and the process of shower nozzle 650. With reference to Fig. 8 to Figure 10, shower nozzle 650 is positioned at the lower section of gripper shoe 640, and makes tap 652 and dispensing orifice 642 is consistent along above-below direction.Shower nozzle 650 is so that fastening bolt 720 is inserted into insertion by screwed hole 646 The mode in space 754 moves up.When the head 724 of fastening bolt 720 is completely inserted into insertion space 754 Time, rotational fastener main body 740.The head 724 of fastening bolt 750 is pivoted away from along with fastening main body 740 Insert space 754, and its height is uprised by the effect of each protuberance 760a, 760b.Thus, shower nozzle 650 its positions move upwardly together with fastening bolt 720, contact gripper shoe 640 and realize fastening.
The above embodiments illustrate fastening assembly 700 fastening support plate 640 and the device of shower nozzle 650. But, for fastening assembly 700, as long as the upper plate the most vertically arranged and lower plate, can fit Use various ways.
It addition, the above embodiments illustrating, gripper shoe 640 above forms insertion groove 644, is positioned at The situation of secure bond fastening bolt 720 on shower nozzle 650 on the downside of this gripper shoe.But it is not limited to this, As shown in figure 11, lower plate 640 ' can form insertion groove 644 ', and upper plate 650 ' can secure bond fastening bolt 720. In this case, the head 724 of fastening bolt 720 preferably extends from the lower end of main part 722, and prominent Portion 760a, 760b are arranged at the upper area 752a of sliding space 752.
The explanation of reference
640: gripper shoe 644: insertion groove
646: screw hole 650: shower nozzle
700: fastening assembly 720: fastening bolt
740: fastening main body 754: insert space
752: sliding space

Claims (13)

1. a substrate board treatment, it is characterised in that including:
Chamber, has process space inside it;
Support unit, it is at described process space support substrate;
Gas feed unit, it supplies process gas in described process space,
Wherein, described gas feed unit includes:
Shower nozzle, it is relative with described support unit;
Gripper shoe, it supports described shower nozzle;
Fastening assembly, its described shower nozzle of fastening and described gripper shoe,
Further, described fastening assembly includes:
Fastening main body, it is formed as holding the ring-type of described gripper shoe, it is possible to the central shaft of described gripper shoe Pivot about.
Substrate board treatment the most according to claim 1, it is characterised in that
The sidepiece of described gripper shoe forms the insertion groove being inserted into described fastening main body,
The lower surface of described gripper shoe forms the screwed hole communicated with described insertion groove,
Described fastening assembly also includes:
Fastening bolt, it is immobly bound described shower nozzle, and has and be inserted into described screwed hole and institute State the head of insertion groove.
Substrate board treatment the most according to claim 2, it is characterised in that
Described fastening main body forms the hole, crack of the bending towards circumferencial direction,
Hole, described crack has insertion space that described fastening bolt is inserted into and upper and lower has The sliding space of different in width.
Substrate board treatment the most according to claim 3, it is characterised in that
In described sliding space, described top has the width bigger than described bottom,
Described bottom has the width less than described head.
Substrate board treatment the most according to claim 4, it is characterised in that
In described sliding space, further away from described insertion space, the degree of depth of described bottom is the deepest.
6. according to the substrate board treatment described in any one in claim 3 to 5, it is characterised in that
Described fastening main body includes:
Multiple, it is respectively formed with hole, described crack, and is mutually combined and is formed ring-type,
Described gripper shoe forms the described screwed hole of number corresponding with the plurality of bar.
7. according to the substrate board treatment described in any one in claim 1 to 5, it is characterised in that
Described substrate board treatment also includes:
Plasma source, it utilizes the process gas being fed into described process space to produce plasma.
8. a fastening assembly, it mutually fastens upper plate and lower plate, it is characterised in that including:
Fastening main body, it is formed as holding the ring-type of described upper plate or described lower plate, it is possible to described upper plate or The central shaft of described lower plate pivots about.
Fastening assembly the most according to claim 8, it is characterised in that
The sidepiece of described upper plate forms the insertion groove being inserted into described fastening main body,
The lower surface of described upper plate forms the screwed hole communicated with described insertion groove,
Described fastening assembly also includes:
Fastening bolt, it is immobly bound described lower plate, and has and be inserted into described screwed hole and institute State the head of insertion groove.
Fastening assembly the most according to claim 8, it is characterised in that
The sidepiece of described lower plate forms the insertion groove being inserted into described fastening main body,
The upper surface of described lower plate forms the screwed hole communicated with described insertion groove,
Described fastening assembly also includes:
Fastening bolt, it is immobly bound described upper plate, and has and be inserted into described screwed hole and institute State the head of insertion groove.
11. according to the fastening assembly described in claim 9 or 10, it is characterised in that
Described fastening main body forms the round and smooth hole, crack towards circumferencial direction,
What hole, described crack had that described fastening bolt is inserted into inserts space and has differing heights Part I and Part II are formed as the sliding space of width different from each other.
12. fastening assemblies according to claim 11, it is characterised in that
In described sliding space, described Part I has the width bigger than described Part II,
Described Part II has the width less than described head.
13. fastening assemblies according to claim 12, it is characterised in that
In described sliding space, further away from described insertion space, the degree of depth of described Part II is the deepest.
CN201610421556.7A 2015-06-17 2016-06-13 Fastening assembly and substrate board treatment with it Active CN106257637B (en)

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KR10-2015-0086015 2015-06-17

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113302729A (en) * 2019-01-29 2021-08-24 周星工程股份有限公司 Shower head and substrate processing apparatus including the same

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102258145B1 (en) * 2019-06-25 2021-05-28 세메스 주식회사 Apparatus and Method for treating substrate
KR102567507B1 (en) * 2020-12-31 2023-08-16 세메스 주식회사 Apparatus for treating substrate and assembly for distributing gas
JP7203262B1 (en) 2022-03-31 2023-01-12 Sppテクノロジーズ株式会社 Plasma processing equipment

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1643666A (en) * 2002-03-29 2005-07-20 东京毅力科创株式会社 Plasma processor electrode and plasma processor
TW200539348A (en) * 2004-05-24 2005-12-01 Shinetsu Chemical Co Shower plate for plasma processing apparatus and plasma processing apparatus
KR20070004063A (en) * 2004-04-26 2007-01-05 이데미쓰 고산 가부시키가이샤 Catalyst for bisphenol production
JP2013046002A (en) * 2011-08-26 2013-03-04 Tokyo Electron Ltd Ring-shaped shield member, component thereof, and substrate placement stage equipped with ring-shaped shield member

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100780366B1 (en) 2005-10-12 2007-11-29 세메스 주식회사 Semiconductor manufacturing apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1643666A (en) * 2002-03-29 2005-07-20 东京毅力科创株式会社 Plasma processor electrode and plasma processor
KR20070004063A (en) * 2004-04-26 2007-01-05 이데미쓰 고산 가부시키가이샤 Catalyst for bisphenol production
TW200539348A (en) * 2004-05-24 2005-12-01 Shinetsu Chemical Co Shower plate for plasma processing apparatus and plasma processing apparatus
JP2013046002A (en) * 2011-08-26 2013-03-04 Tokyo Electron Ltd Ring-shaped shield member, component thereof, and substrate placement stage equipped with ring-shaped shield member

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113302729A (en) * 2019-01-29 2021-08-24 周星工程股份有限公司 Shower head and substrate processing apparatus including the same

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