CN106252291B - A kind of integrated circuit squash type packaging system - Google Patents
A kind of integrated circuit squash type packaging system Download PDFInfo
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- CN106252291B CN106252291B CN201610865047.3A CN201610865047A CN106252291B CN 106252291 B CN106252291 B CN 106252291B CN 201610865047 A CN201610865047 A CN 201610865047A CN 106252291 B CN106252291 B CN 106252291B
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- packaging system
- integrated circuit
- base unit
- lid
- sealing ring
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- Condensed Matter Physics & Semiconductors (AREA)
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention discloses a kind of integrated circuit squash type packaging systems, including packaging system base unit, packaging system lid, sealing ring, fixed card buckle and integrated circuit firm banking, wherein packaging system base unit is located at the bottom end of integrated circuit squash type packaging system, packaging system lid lid is mounted in the top of packaging system base unit, it is provided with sealing ring between packaging system base unit and packaging system lid, fixed card buckle is arranged in the both sides of integrated circuit squash type packaging system, by packaging system base unit, packaging system lid and sealing ring are tightly secured together, integrated circuit firm banking is mounted on the bottom of packaging system base unit, integrated circuit is fixedly mounted on integrated circuit firm banking；Packaging system lid includes encapsulation cover plate.The packaging system of the present invention carries out elasticity to the integrated circuit board in packaging cartridge using elastic crushing block and squeezes positioning, avoids the movement of integrated circuit board, simple in structure, convenient for encapsulation.
Description
Technical field：
The present invention relates to integrated antenna package technical fields, and in particular to a kind of integrated circuit squash type packaging system.
Background technology：
Integrated antenna package is the development with integrated circuit, with aerospace, aviation, machinery, light industry, chemical industry
Etc. all trades and professions continuous development, complete machine also develops towards multi-functional, miniaturization.This requires integrated circuit integrated levels to get over
Come higher, function becomes increasingly complex.Require integrated antenna package density increasing accordingly, lead is more and more, and volume
Smaller and smaller, weight is more and more lighter, and update is getting faster, and the reasonability and science of encapsulating structure will directly affect integrated
The quality of circuit.
Integrated circuit board is contained in packaging cartridge by existing integrated antenna package, and the size of packaging cartridge can compare integrated circuit
The size of plate is slightly larger, and integrated circuit board may be happened at the problem moved in packaging cartridge.
Invention content：
The purpose of the present invention provides a kind of integrated circuit squash type packaging system aiming at the deficiencies in the prior art.
The technology solution of the present invention is as follows：
A kind of integrated circuit squash type packaging system includes packaging system base unit, packaging system lid, sealing ring, fixation
Buckle and integrated circuit firm banking, wherein packaging system base unit are located at the bottom of integrated circuit squash type packaging system
End, packaging system lid lid are mounted in the top of packaging system base unit, are set between packaging system base unit and packaging system lid
It is equipped with sealing ring, fixed card buckle is arranged in the both sides of integrated circuit squash type packaging system, by packaging system base unit, encapsulation
Appliance cover and sealing ring are tightly secured together, and integrated circuit firm banking is mounted on the bottom of packaging system base unit, collection
It is fixedly mounted on integrated circuit firm banking at circuit；Packaging system lid includes encapsulation cover plate, and the top of encapsulation cover plate is equipped with
Packaging system lid radiating block is equipped with packaging system lid mounting blocks at the bottom four corners of encapsulation cover plate, and the both sides of encapsulation cover plate open up
There is the second buckle mounting groove；In the inside of packaging system lid radiating block, there are two the slideway that cross section is T-type, each slideways for setting
There are two elastic crushing block, elastic crushing block lower part is Pop-up positioning column for upper adjustable installation, and Pop-up positions column bottom
It offers the T-type to match with slideway to slot, elastic crushing block top is buffer protection set；Packaging system lid is metal material,
Cap hollow cavity is offered in packaging system lid radiating block, filled with conduction oil in cap hollow cavity.
Packaging system base unit is metal material, and heat dissipation metal is evenly distributed in the lower part of packaging system base unit
Raised line is equipped with packaging system lid mounting hole, in packaging system base unit in the upper edge four corners of packaging system base unit
Both sides offer the first buckle mounting groove.
Packaging system base unit is hollow structure, and the lower part of packaging system base unit offers lower hollow chamber,
Lower hollow intracavitary is filled with conduction oil.
Sealing ring material is hydrogenated nitrile-butadiene rubber, and the four corners of sealing ring are equipped with mounting blocks punched out, one side of sealing ring
Middle side part has notch.
Integrated circuit firm banking includes support plate, supporting seat and integrated circuit card seat, and the quadrangle of support plate opens up
There are connecting hole, supporting seat to be mounted in connecting hole, the bottom surface of supporting seat is fixed on the bottom of packaging system base unit,
Support plate top is symmetrically arranged with integrated circuit card seat, and being internally provided with for integrated circuit card seat can be from different scale integrated circuits
The ladder-like fixture block to match.
Integrated circuit is connect by lead with the external world, and lead is pierced by by notch in the middle part of sealing ring.
The beneficial effects of the present invention are：The packaging system of the present invention is using elastic crushing block to the integrated electricity in packaging cartridge
Road plate carries out elasticity and squeezes positioning, avoids the movement of integrated circuit board, simple in structure, convenient for encapsulation.
Description of the drawings：
Fig. 1 is the structural diagram of the present invention；
Fig. 2 is the structural schematic diagram of packaging system lid；
Fig. 3 is the structure sectional view of packaging system lid；
Fig. 4 is the structural schematic diagram for removing packaging system lid；
Fig. 5 is the structural schematic diagram of packaging system base unit；
Fig. 6 is the structure sectional view of packaging system base unit；
Fig. 7 is the structural schematic diagram of integrated circuit firm banking；
Fig. 8 is the structural schematic diagram at another visual angle of integrated circuit firm banking.
Specific implementation mode：
In order to keep the above objects, features and advantages of the present invention more obvious and easy to understand, below in conjunction with the accompanying drawings to this hair
Bright specific implementation mode is described in detail.
As shown in figures 1-8, a kind of integrated circuit squash type packaging system includes packaging system base unit 1, packaging system
Lid 2, sealing ring 4, fixed card buckle 3 and integrated circuit firm banking 5, wherein packaging system base unit 1 are located at integrated circuit
The bottom end of squash type packaging system, for the lid of packaging system lid 2 mounted in the top of packaging system base unit 1, packaging system bottom is single
It is provided with sealing ring 4 between member 1 and packaging system lid 2, fixed card buckle 3 is arranged the two of integrated circuit squash type packaging system
Packaging system base unit 1, packaging system lid 2 and sealing ring 4 are tightly secured together by side, and integrated circuit firm banking 5 is pacified
Mounted in the bottom of packaging system base unit 1, integrated circuit 6 is fixedly mounted on integrated circuit firm banking 5；Packaging system lid
2 include encapsulation cover plate 21, and the top of encapsulation cover plate 21 is equipped with packaging system lid radiating block 22, at the bottom four corners of encapsulation cover plate 21
Equipped with packaging system lid mounting blocks 23, the both sides of encapsulation cover plate 21 offer the second buckle mounting groove 24；It is dissipated in packaging system lid
There are two the slideways 25 that cross section is T-type for the inside setting of heat block 22, and there are two elasticity for adjustable installation on each slideway 25
Crushing block 26,26 lower part of elastic crushing block are Pop-up positioning column, and Pop-up positioning column bottom is offered to match with slideway 25
T-type fluting, 26 top of elastic crushing block be buffer protection cover 261；Packaging system lid 2 is metal material, and packaging system lid dissipates
Cap hollow cavity 221 is offered in heat block 22, filled with conduction oil in cap hollow cavity 221.
Packaging system base unit 1 is metal material, and being evenly distributed with metal in the lower part of packaging system base unit 1 dissipates
Hot raised line 11 is equipped with packaging system lid mounting hole 13, in packaging system bottom in the upper edge four corners of packaging system base unit 1
The both sides of unit 1 offer the first buckle mounting groove 14.
Packaging system base unit 1 is hollow structure, and the lower part of packaging system base unit 1 offers lower hollow chamber
12, filled with conduction oil in lower hollow chamber 12.
4 material of sealing ring is hydrogenated nitrile-butadiene rubber, and the four corners of sealing ring 4 are equipped with mounting blocks punched out, the one of sealing ring 4
There is notch in the middle part of avris.
Integrated circuit firm banking 5 includes support plate 51, supporting seat 52 and integrated circuit card seat 53, support plate 51
Quadrangle offers connecting hole, and supporting seat 52 is mounted in connecting hole, and the bottom surface of supporting seat 52 is fixed on packaging system bottom
The bottom of unit 1 is symmetrically arranged with integrated circuit card seat 53 on 51 top of support plate, and integrated circuit card seat 53 is internally provided with
The ladder-like fixture block 531 that can be matched from different scale integrated circuits.
Integrated circuit 6 is connect by lead 61 with the external world, and lead 61 is pierced by by notch in the middle part of sealing ring.
The embodiment is to be illustrated the present invention, and is not intended to limit the present invention.Any those skilled in the art
It can modify without violating the spirit and scope of the present invention to the embodiment, therefore the rights protection model of the present invention
It encloses, it should be as listed by the claim of the present invention.
Claims (6)
1. a kind of integrated circuit squash type packaging system, it is characterised in that：Including packaging system base unit (1), packaging system
Cover (2), sealing ring (4), fixed card buckle (3) and integrated circuit firm banking (5), wherein packaging system base unit (1) position
In the bottom end of integrated circuit squash type packaging system, packaging system lid (2) lid is mounted in the top of packaging system base unit (1),
Sealing ring (4) is provided between packaging system base unit (1) and packaging system lid (2), fixed card buckle (3) setting is in integrated electricity
Packaging system base unit (1), packaging system lid (2) and sealing ring (4) are tightly fastened by the both sides of road squash type packaging system
Together, integrated circuit firm banking (5) is mounted on the bottom of packaging system base unit (1), and integrated circuit (6) is fixedly mounted
On integrated circuit firm banking (5)；Packaging system lid (2) includes encapsulation cover plate (21), and the top of encapsulation cover plate (21) is equipped with
Packaging system lid radiating block (22) is equipped with packaging system lid mounting blocks (23), cap at the bottom four corners of encapsulation cover plate (21)
The both sides of plate (21) offer the second buckle mounting groove (24)；In the inside of packaging system lid radiating block (22), there are two horizontal for setting
Section is the slideway (25) of T-type, and there are two elastic crushing block (26), elastic crushing blocks for adjustable installation on each slideway (25)
(26) lower part is Pop-up positioning column, and Pop-up positioning column bottom offers the T-type to match with slideway (25) and slots, and elasticity is squeezed
Briquetting (26) top is buffer protection set (261)；Packaging system lid (2) is metal material, and packaging system lid radiating block (22) is interior
Cap hollow cavity (221) is offered, filled with conduction oil in cap hollow cavity (221).
2. a kind of integrated circuit squash type packaging system according to claim 1, it is characterised in that：Packaging system bottom is single
First (1) is metal material, is evenly distributed with heat dissipation metal raised line (11) in the lower part of packaging system base unit (1), is encapsulating
The upper edge four corners of bottom of device unit (1) are equipped with packaging system lid mounting hole (13), the two of packaging system base unit (1)
Side offers the first buckle mounting groove (14).
3. a kind of integrated circuit squash type packaging system according to claim 1, it is characterised in that：Packaging system bottom is single
First (1) is hollow structure, and the lower part of packaging system base unit (1) offers lower hollow chamber (12), in lower hollow chamber
(12) filled with conduction oil in.
4. a kind of integrated circuit squash type packaging system according to claim 1, it is characterised in that：Sealing ring (4) material
Four corners for hydrogenated nitrile-butadiene rubber, sealing ring (4) are equipped with mounting blocks punched out, and one side middle side part of sealing ring (4), which has, to be lacked
Mouthful.
5. a kind of integrated circuit squash type packaging system according to claim 1, it is characterised in that：Integrated circuit fixes bottom
Seat (5) includes support plate (51), supporting seat (52) and integrated circuit card seat (53), and the quadrangle of support plate (51) offers company
Hole is connect, supporting seat (52) is mounted in connecting hole, and the bottom surface of supporting seat (52) is fixed on packaging system base unit (1)
Bottom is symmetrically arranged with integrated circuit card seat (53) on support plate (51) top, and integrated circuit card seat (53) are internally provided with
The ladder-like fixture block (531) that can be matched from different scale integrated circuits.
6. a kind of integrated circuit squash type packaging system according to claim 1, it is characterised in that：Integrated circuit (6) is logical
It crosses lead (61) to connect with the external world, lead (61) is pierced by by notch in the middle part of sealing ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610865047.3A CN106252291B (en) | 2016-09-25 | 2016-09-25 | A kind of integrated circuit squash type packaging system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610865047.3A CN106252291B (en) | 2016-09-25 | 2016-09-25 | A kind of integrated circuit squash type packaging system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106252291A CN106252291A (en) | 2016-12-21 |
| CN106252291B true CN106252291B (en) | 2018-09-14 |
Family
ID=57611953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610865047.3A Active CN106252291B (en) | 2016-09-25 | 2016-09-25 | A kind of integrated circuit squash type packaging system |
Country Status (1)
| Country | Link |
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| CN (1) | CN106252291B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109649836B (en) * | 2018-11-09 | 2020-12-25 | 惠州市华星光电技术有限公司 | Liquid crystal panel packaging box with buffer piece |
| CN111128924A (en) * | 2019-12-20 | 2020-05-08 | 天津智安微电子技术有限公司 | Integrated circuit packaging structure |
| CN113471150B (en) * | 2021-07-08 | 2022-07-22 | 上海芯龙光电科技股份有限公司 | Integrated circuit package |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010038723B4 (en) * | 2010-07-30 | 2014-08-14 | Semikron Elektronik Gmbh & Co. Kg | Power semiconductor module with at least one positioning device for a substrate |
| CN102364676B (en) * | 2011-11-30 | 2013-10-30 | 江苏宏微科技有限公司 | Packaging shell structure for semiconductor power module |
| JP2014207389A (en) * | 2013-04-15 | 2014-10-30 | 株式会社東芝 | Semiconductor package |
| CN103208463A (en) * | 2013-04-24 | 2013-07-17 | 湖南大学 | Heat sink material element with box-type structure and manufacturing method thereof |
| CN104810328B (en) * | 2014-01-28 | 2018-07-06 | 台达电子企业管理（上海）有限公司 | Package casing and the power module with the package casing |
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2016
- 2016-09-25 CN CN201610865047.3A patent/CN106252291B/en active Active
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| Publication number | Publication date |
|---|---|
| CN106252291A (en) | 2016-12-21 |
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Effective date of registration: 20181228 Address after: 221113 Huangji Town Industrial Park, Tongshan District, Xuzhou City, Jiangsu Province Patentee after: Xuzhou Guhan Fragrance Industry Co., Ltd. Address before: 523000 productivity building 406, high tech Industrial Development Zone, Songshan Lake, Dongguan, Guangdong Patentee before: Dongguan Lianzhou Intellectual Property Operation Management Co.,Ltd. |
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Effective date of registration: 20191113 Address after: 221000 room c506a-18, University Business Park, No. 99, University Road, Xuzhou high tech Industrial Development Zone, Jiangsu Province Patentee after: Xuzhou rongchuangda Electronic Technology Co., Ltd Address before: 221113 Huangji Town Industrial Park, Tongshan District, Xuzhou City, Jiangsu Province Patentee before: Xuzhou Guhan Fragrance Industry Co., Ltd. |
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Effective date of registration: 20210422 Address after: 221000 Liuqiao Industrial Park, Dalong lake, Xuzhou City, Jiangsu Province Patentee after: Xuzhou Weinuo Electrical Equipment Co.,Ltd. Address before: 221000 room c506a-18, University Business Park, No. 99, University Road, Xuzhou high tech Industrial Development Zone, Jiangsu Province Patentee before: Xuzhou rongchuangda Electronic Technology Co.,Ltd. |