CN106240088A - The preparation method of halogen-free copper-clad plate - Google Patents

The preparation method of halogen-free copper-clad plate Download PDF

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Publication number
CN106240088A
CN106240088A CN201610600610.4A CN201610600610A CN106240088A CN 106240088 A CN106240088 A CN 106240088A CN 201610600610 A CN201610600610 A CN 201610600610A CN 106240088 A CN106240088 A CN 106240088A
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Prior art keywords
glass felt
copper
clad plate
parts
preparation
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Pending
Application number
CN201610600610.4A
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Chinese (zh)
Inventor
李洪彬
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Chongqing Dekai Industry Ltd By Share Ltd
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Chongqing Dekai Industry Ltd By Share Ltd
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Priority to CN201610600610.4A priority Critical patent/CN106240088A/en
Publication of CN106240088A publication Critical patent/CN106240088A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/02—Coating on the layer surface on fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/558—Impact strength, toughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/22—Halogen free composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The present invention relates to the preparation method of a kind of halogen-free copper-clad plate, comprise the following steps: 1) prepare glass felt resin adhesive liquid: by weight, 85 90 parts of halogen-free epoxy resins, 10 14 parts of benzoxazine resin, 68 parts of Nitrogen-containing Phenolic Resins, 8 12 parts of curing accelerators and 5 10 parts of silicon dioxide are added in blender and stirs；2) by step 1) to be coated in glass felt two-sided for the resin adhesive liquid for preparing, and dry and prepare glass felt impregnation tablet；3) multiple steps 2 are taken) the glass felt impregnation tablet for preparing stacks together, and cuts, cut the leftover pieces obtained and be packed between glass felt impregnation tablet, be finally covered with a Copper Foil, hot pressing, cooling at single or double, prepare copper-clad plate.The copper-clad plate that this preparation method prepares, the advantage with good toughness.

Description

The preparation method of halogen-free copper-clad plate
Technical field
The present invention relates to copper-clad plate and produce preparation field, be specifically related to the preparation method of a kind of halogen-free copper-clad plate.
Background technology
Copper-clad plate is widely used in and manufactures all kinds of household electrical appliance, electronics and IT products and the electricity of the printing used by industrial electronics Road plate (is called for short PCB).It is as the baseplate material of printed circuit board, plays carrying dress connection electronic devices and components, forms conducting wire Figure and the three zones insulated between interlayer and circuit, be a kind of important basic electronic material.
The anti-flammability of copper-clad plate is one of important security performance of electronic product.Halogen fire proofing (containing Cl, Br) with And antimony class fire proofing is with its economy and reliability, applies for many years, but Halogen product exists in printed circuit base material industry In combustion process, the amount of being fuming is very big, can discharge extremely toxic substance hydrogen halides, serious threat health.The most halogen-free copper-clad plate It is widely used, current halogen-free copper-clad plate, the shortcoming that there is poor toughness.
Summary of the invention
In view of this, it is an object of the invention to provide the preparation method of a kind of halogen-free copper-clad plate, made by the method Copper-clad plate, the advantage with good toughness.
For achieving the above object, the preparation method of the halogen-free copper-clad plate of the present invention, comprise the following steps:
1) prepare glass felt resin adhesive liquid: by weight, 85-90 part halogen-free epoxy resin, 10-14 part benzo are disliked Piperazine resin, 6-8 part Nitrogen-containing Phenolic Resins, 8-12 part curing accelerator and 5-10 part silicon dioxide add in blender, at 25-30 DEG C stirring 3-4h；
2) by step 1) to be coated in glass felt two-sided, under conditions of vacuum and 200-250 DEG C for the resin adhesive liquid for preparing Dry 2-4 minute, prepare glass felt impregnation tablet；
3) according to the thickness needed for the copper-clad plate of final preparation and shape and structure, multiple steps 2 are taken) the glass felt leaching for preparing Sizing material sheet stacks together, and cuts, and cuts the leftover pieces obtained and is packed between glass felt impregnation tablet, finally at list Face or two-sided be covered with a Copper Foil, hot pressing 90-130min under the conditions of 10-15MPa, 170-180 DEG C, cooling, prepare copper-clad plate.
Further, step 1) described in curing accelerator include by weight: phosphate dialkyl ester 4-7 part, tungsten powder 1-3 Part, nitrogenous base and hydroxy functional solvents's 10-12 part.
Further, step 1) in, under weightlessness, material is stirred.
The method have the benefit that: the copper-clad plate using the preparation method of the present invention to prepare, have the advantage that Benzoxazine resin and curing accelerator add the toughness of copper-clad plate, make the advantage that copper-clad plate has good toughness；Fully profit With leftover pieces, reduce production cost.
Detailed description of the invention
Elaborating embodiments of the invention below, the present embodiment is carried out under premised on technical solution of the present invention Implement, give detailed embodiment and concrete operating process, but the scope of application of the present invention is not limited to following enforcement Example.
Embodiment 1
1) glass felt resin adhesive liquid is prepared: by weight, by 85 parts of halogen-free epoxy resins, 10 parts of benzoxazine trees Fat, 6 parts of Nitrogen-containing Phenolic Resins, 8 parts of curing accelerators and 5 parts of silicon dioxide add in blender, stir 3h at 25 DEG C；
2) by step 1) to be coated in glass felt two-sided for the resin adhesive liquid for preparing, dries 2 under conditions of vacuum and 200 DEG C Minute, prepare glass felt impregnation tablet；
3) according to the thickness needed for the copper-clad plate of final preparation and shape and structure, multiple steps 2 are taken) the glass felt leaching for preparing Sizing material sheet stacks together, and cuts, and cuts the leftover pieces obtained and is packed between glass felt impregnation tablet, finally at list Face or two-sided be covered with a Copper Foil, in 10MPa, hot pressing 90min, cooling under the conditions of 170 DEG C, prepares copper-clad plate.
Step 1) described in curing accelerator include by weight: phosphate dialkyl ester 4 parts, tungsten powder 1 part, nitrogenous base and Hydroxy functional solvents 10 parts.
Step 1) in, under weightlessness, material is stirred, material stirring can be made to obtain more uniform.
Embodiment 2
1) glass felt resin adhesive liquid is prepared: by weight, by 87 parts of halogen-free epoxy resins, 12 parts of benzoxazine trees Fat, 7 parts of Nitrogen-containing Phenolic Resins, 10 parts of curing accelerators and 7 parts of silicon dioxide add in blender, stir 3.5h at 28 DEG C；
2) by step 1) to be coated in glass felt two-sided for the resin adhesive liquid for preparing, dries 3 under conditions of vacuum and 220 DEG C Minute, prepare glass felt impregnation tablet；
3) according to the thickness needed for the copper-clad plate of final preparation and shape and structure, multiple steps 2 are taken) the glass felt leaching for preparing Sizing material sheet stacks together, and cuts, and cuts the leftover pieces obtained and is packed between glass felt impregnation tablet, finally at list Face or two-sided be covered with a Copper Foil, in 12MPa, hot pressing 110min, cooling under the conditions of 175 DEG C, prepares copper-clad plate.
Step 1) described in curing accelerator include by weight: phosphate dialkyl ester 6 parts, tungsten powder 2 parts, nitrogenous base and Hydroxy functional solvents 11 parts.
Step 1) in, under weightlessness, material is stirred, material stirring can be made to obtain more uniform.
Embodiment 3
1) glass felt resin adhesive liquid is prepared: by weight, by 90 parts of halogen-free epoxy resins, 14 parts of benzoxazine trees Fat, 8 parts of Nitrogen-containing Phenolic Resins, 12 parts of curing accelerators and 10 parts of silicon dioxide add in blender, stir 4h at 30 DEG C；
2) by step 1) to be coated in glass felt two-sided for the resin adhesive liquid for preparing, dries 4 under conditions of vacuum and 250 DEG C Minute, prepare glass felt impregnation tablet；
3) according to the thickness needed for the copper-clad plate of final preparation and shape and structure, multiple steps 2 are taken) the glass felt leaching for preparing Sizing material sheet stacks together, and cuts, and cuts the leftover pieces obtained and is packed between glass felt impregnation tablet, finally at list Face or two-sided be covered with a Copper Foil, in 15MPa, hot pressing 130min, cooling under the conditions of 180 DEG C, prepares copper-clad plate.
Step 1) described in curing accelerator include by weight: phosphate dialkyl ester 7 parts, tungsten powder 3 parts, nitrogenous base and Hydroxy functional solvents 12 parts.
Step 1) in, under weightlessness, material is stirred, material stirring can be made to obtain more uniform.
Finally illustrating, above example is only in order to illustrate technical scheme and unrestricted, although with reference to relatively The present invention has been described in detail by good embodiment, it will be understood by those within the art that, can be to the skill of the present invention Art scheme is modified or equivalent, and without deviating from objective and the scope of technical solution of the present invention, it all should be contained at this In the middle of the right of invention.

Claims (3)

1. the preparation method of a halogen-free copper-clad plate, it is characterised in that comprise the following steps:
1) glass felt resin adhesive liquid is prepared: by weight, by 85-90 part halogen-free epoxy resin, 10-14 part benzoxazine tree Fat, 6-8 part Nitrogen-containing Phenolic Resins, 8-12 part curing accelerator and 5-10 part silicon dioxide add in blender, stir at 25-30 DEG C Mix 3-4h；
2) by step 1) to be coated in glass felt two-sided for the resin adhesive liquid for preparing, dry under conditions of vacuum and 200-250 DEG C 2-4 minute, prepare glass felt impregnation tablet；
3) according to the thickness needed for the copper-clad plate of final preparation and shape and structure, multiple steps 2 are taken) the glass felt impregnation material for preparing Sheet stacks together, and cuts, and cuts the leftover pieces obtained and is packed between glass felt impregnation tablet, finally at one side or Two-sided it is covered with a Copper Foil, hot pressing 90-130min under the conditions of 10-15MPa, 170-180 DEG C, cooling, prepare copper-clad plate.
Preparation method the most according to claim 1, it is characterised in that: step 1) described in curing accelerator by weight Including: phosphate dialkyl ester 4-7 part, tungsten powder 1-3 part, nitrogenous base and hydroxy functional solvents's 10-12 part.
Preparation method the most according to claim 1, it is characterised in that: step 1) in, under weightlessness, material is carried out Stirring.
CN201610600610.4A 2016-07-27 2016-07-27 The preparation method of halogen-free copper-clad plate Pending CN106240088A (en)

Priority Applications (1)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101376735A (en) * 2008-09-26 2009-03-04 广东生益科技股份有限公司 Halogen-free flame-proof epoxy resin composition and bonding sheet and copper clad laminate prepared thereby
CN102051025A (en) * 2010-12-11 2011-05-11 宏昌电子材料股份有限公司 Halogen-free flame-retardant epoxy resin composition and application thereof
CN102433001A (en) * 2011-09-13 2012-05-02 华烁科技股份有限公司 Halogen-free flame-retarding material composition and application thereof in bonding sheets, copper clad laminates and laminates
CN103443185A (en) * 2011-03-24 2013-12-11 阿克佐诺贝尔化学国际公司 Accelerator for curing resins

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101376735A (en) * 2008-09-26 2009-03-04 广东生益科技股份有限公司 Halogen-free flame-proof epoxy resin composition and bonding sheet and copper clad laminate prepared thereby
CN102051025A (en) * 2010-12-11 2011-05-11 宏昌电子材料股份有限公司 Halogen-free flame-retardant epoxy resin composition and application thereof
CN103443185A (en) * 2011-03-24 2013-12-11 阿克佐诺贝尔化学国际公司 Accelerator for curing resins
CN102433001A (en) * 2011-09-13 2012-05-02 华烁科技股份有限公司 Halogen-free flame-retarding material composition and application thereof in bonding sheets, copper clad laminates and laminates

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
辜信实 主编: "《印制电路用覆铜箔层压板》", 28 February 2002, 化学工业出版社 *

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