CN103965624B - A kind of halogen-free resin composition, prepreg prepared therefrom and laminate - Google Patents

A kind of halogen-free resin composition, prepreg prepared therefrom and laminate Download PDF

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CN103965624B
CN103965624B CN201410231711.XA CN201410231711A CN103965624B CN 103965624 B CN103965624 B CN 103965624B CN 201410231711 A CN201410231711 A CN 201410231711A CN 103965624 B CN103965624 B CN 103965624B
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halogen
resin
resin composition
epoxy resin
free
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CN103965624A (en
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崔春梅
戴善凯
肖升高
季立富
黄荣辉
谌香秀
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Suzhou Shengyi Technology Co Ltd
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Suzhou Shengyi Technology Co Ltd
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2363/00—Epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
    • C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/22—Halogen free composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets

Abstract

The invention discloses a kind of halogen-free resin composition and prepreg prepared therefrom and laminate.It is that in terms of 100 parts, halogen-free resin composition includes by solid weight sum: benzoxazine resin: 10 50 parts；Epoxy resin: 10 60 parts；Phosphorous active ester compound: 15 50 parts；Firming agent: 0 40 parts；Curing accelerator: 03 parts.Described phosphorous active ester compound is via organophosphorus compound and benzoic acid derivative, and at 90 ~ 130 DEG C, reaction prepares.The present invention is configured with a kind of has good thermostability, low-k and the halogen-free resin composition of low hydroscopicity, solves the problem that the dielectric properties that cause in prior art, moisture pick-up properties are poor due to halogen-free flameproof；The laminate prepared by this resin combination is applied to be applicable to high density interconnecting integrated circuit encapsulation high-performance printed wiring board.

Description

A kind of halogen-free resin composition, prepreg prepared therefrom and laminate
Technical field
The invention belongs to technical field of electronic materials, relate to a kind of halogen-free resin composition, and the said composition system of employing The prepreg made and laminate, be applied to the fields such as integrated antenna package, high-frequency high-speed and high density interconnection.
Background technology
Today that information technology makes rapid progress, electronic product constantly develops to lightening, high reliability direction, high density The main flow being applied to print circuit plates making technology of interconnection (HDI) technology, through hole microminiaturization, wire such as becomes more meticulous at the core skill The development of art, it is desirable to the base material making printed circuit board (PCB) must have high characteristic impedance, the lowest dielectric constant；From printing electricity The process conditions on road is seen, unleaded welding and the application of repeatedly pressing technology, it is also desirable to the base material of making possesses high glass Change transition temperature and good humidity resistance.Therefore, good thermostability, low dielectric constant, excellent processability become to be covered The Essential Performance Requirements of copper coin development.
Benzoxazine resin has certain fire resistance, can generate the structure of similar phenolic resin after open loop, can be effective Reduce the water absorption rate of curing system, and improve chemical resistance, the common resins matrix of modified epoxy when being making layer pressing plate. But, the problem that after the solidification of benzoxazine resin system, laminate exists toughness, wicking thermostability is not enough, making printed circuit Processing it is difficult to, it is difficult to reach sheet material wicking thermostability, humidity resistance, anti-flammability and the balance of processability during plate.
After the ROHS instruction (i.e. limit in electronic electric equipment and use some Hazardous Substances Directive) of European Union proposes, cover copper Plate substrate non-halogen, becomes the emphasis of research and development always, and in the resin matrix of preparation copper-clad plate, the introducing of phosphorus-containing compound, becomes The main technological route of copper-clad plate halogen-free flameproof.At present, on copper-clad plate field, widely used phosphorus flame retardant is broadly divided into instead Answer type and addition type two kinds.Response type is mainly DOPO compounds, based on phosphorous epoxy resin, phosphorus containing phenolic resin, phosphorus Content between 2-10%, but, actual application finds, DOPO compounds has bigger water absorption rate and higher dielectric Constant, and the humidity resistance of its sheet material made is low；Addition type is mainly phosphine nitrile and phosphate compounds, additive flame retardant Flame retarding efficiency the most on the low side, need to add more amount and can be only achieved flame-retardancy requirements, meanwhile, because its relatively low fusing point is (general Less than 150 DEG C), in the course of processing of laminate, easily " migration " is to the surface of sheet material, affects plate property.
Phosphorous active ester is the reactive flame retardant that a class is novel, can be as the firming agent of epoxy resin, because it solidified Cheng Zhong, will not generate, with epoxy reaction, the hydroxyl that polarity is higher, and therefore, the resin system after its solidification has relatively low water suction Rate and relatively low dielectric constant.Disclosing a kind of resin combination in Chinese patent application CN102838841A, it comprises activity Ester, nitrogen-containing epoxy thermoset and phosphor-containing halogen-free fire retardant, have preferable fire resistance, but active ester therein only play solid The effect of agent, owing to which employs the phosphonium flame retardants such as phosphate ester, phosphorus-containing phenolic aldehyde or phosphonitrile, result in the decline of electrical property, And add the hydroscopicity of system.
Accordingly, it would be desirable to research and develop the phosphorous active ester of compound of a kind of new phosphor-containing flame-proof so that it is improving resin group On the premise of compound anti-flammability, compositions is kept to have relatively low hydroscopicity, preferable humidity resistance and the dielectric properties of excellence.
Summary of the invention
The goal of the invention of the present invention is to provide a kind of halogen-free resin composition, and uses its prepreg made and lamination Plate, to improve the fire resistance of laminate, thermostability and dielectric properties.
To achieve the above object of the invention, the technical solution used in the present invention is:
A kind of halogen-free resin composition, it is characterised in that: it is in terms of 100 parts by solid weight sum, including:
Benzoxazine resin 10-50 part
Epoxy resin 10-60 part
Phosphorous active ester compound 15-50 part
Firming agent 0-40 part
Curing accelerator 0-3 part.
In technique scheme, described benzoxazine resin is bisphenol A-type benzoxazine resin, bisphenol-f type benzoxazine Resin, 4,4 ' MDA benzoxazine resin, diaminodiphenyl ether benzoxazine resin, DADPS benzo Oxazines resin, one or more mixture of pi-allyl bisphenol A benzoxazine resin.
Described epoxy resin is selected from: bisphenol A epoxide resin, bisphenol F epoxy resin, o-cresol formaldehyde epoxy resin, bisphenol-A phenol Formaldehyde epoxy resin, phenol novolac epoxy resins, trifunctional phenol-type epoxy resin, tetraphenyl ethane epoxy resin, biphenyl type epoxy Resin, naphthalene nucleus type epoxy resin, dicyclopentadiene type epoxy resin, aralkyl novolac epoxy resin, glycidic amine type Epoxy resin, one or more mixture of glycidyl ester type epoxy resin.
The structural formula of described phosphorous active ester compound is,
,
In formula, R1 is methyl, ethyl or the tert-butyl group；
Y is H or CH3；
Z isOr, wherein R is phenyl, naphthyl or C1～C5Alkyl；
N is the integer of 1～10；
X is:
、、Or。
The preparation method of above-mentioned active ester compound, by phosphorus compound and hydroxy benzaldehyde, addition 50～70% mass are dense The H of degree2SO4In, heat at 90～130 DEG C, condensing reflux 3～8hr, then product is washed by 3～10 alcohol, 95 ～under the vacuum condition of 105 DEG C, be dried 3～6hr, obtain pre-product；Above-mentioned gained pre-product is dissolved in aromatic series organic solution In, add benzoic acid or naphthyl, benzene alkylbenzoic acid compound, under the temperature conditions of 100～120 DEG C, add catalyst, cold Solidifying backflow 2～8hr, is dried 3～6hr under the vacuum condition of 95～105 DEG C after washing, i.e. obtain required phosphorous active esterifying Compound, esterification yield is 65～85%；Wherein, described phosphorus compound is selected from 9, and 10-dihydro-9-oxy miscellaneous-10-phospho hetero phenanthrene-10-aoxidizes Thing, 10-(2,5-dihydroxy phenyl)-10-hydrogen-9-oxa--10-phospho hetero phenanthrene-10-oxide, 10-(2,5-dihydroxy naphthyl)- 10-hydrogen-9-oxa--10-phospho hetero phenanthrene-10-oxide or 10-(2,5-dihydroxybiphenyl base)-10-hydrogen-9-oxa--10-phospha One or more mixture in the phospho hetero phenanthrene compounds such as phenanthrene-10-oxide.
Described aromatic organic solvent is selected from toluene, dimethylbenzene, ethylbenzene, isopropylbenzene.
Described catalyst is AlCl3。
Further technical scheme, in described phosphorous active ester compound, in mass, phosphorus content is 5.2～7.2%.
In technique scheme, described phosphorous active ester content is preferably 15-40 part.
In technique scheme, described firming agent is dicyandiamide, linear phenolic resin, maleic anhydride of styrene, 3,3 ', 4,4 '-oxydiphthalic, 2,3,3', 4'-diphenyl ether tetraformic dianhydride, 3,3', 4,4'-bibenzene tetracarboxylic dianhydrides, 2,3, 3', 4'-bibenzene tetracarboxylic dianhydride, 3,3 ', 4,4 '-benzophenone tetracarboxylic dianhydride, Bisphenol A Type Diether Dianhydride, 1,2,4,5-equal benzene four One or more mixture in acid dianhydride and DADPS, its content is preferential 0-30 part.
Described curing accelerator is selected from 2-methylimidazole, 2-ethyl-4-methylimidazole and 2-phenylimidazole or triphenyl One or more mixture in phosphorus compound, its content is preferential 0.01-1.5 part.
Preferably technical scheme, described resin combination is possibly together with inorganic filler, and the consumption of described inorganic filler is Halogen The 0～35% of resin combination solid gross mass；Described inorganic filler is aluminium hydroxide, magnesium hydroxide, wollastonite, silicon dioxide In micropowder, magnesium oxide, calcium silicates, calcium carbonate, clay, Kaolin, glass dust, mica powder, titanium dioxide, Firebrake ZB, zinc molybdate One or more mixture.Particle diameter is 0.3～20 μm, preferential selection 0.5～5 μm.Above-mentioned inorganic filler can be straight Connect input or previously prepared filler dispersion liquid or make in mastic input resin combination.
The prepreg that the halogen-free resin composition of the present invention makes, dissolves system by above-mentioned halogen-free resin composition solvent Become glue, then reinforcing material is immersed in above-mentioned glue；By the reinforcing material heat drying after dipping, it is thus achieved that described preimpregnation Material.
Described solvent selected from acetone, butanone, methylisobutylketone, N, dinethylformamide, N, N-dimethyl acetylamide, The mixture of one or more in ethylene glycol monomethyl ether, propylene glycol monomethyl ether；Described reinforcing material is natural fiber, organic synthesis Fiber, organic fabric or inorganic fabric；The drying temperature of described prepreg is 130～190 DEG C, and the time is 3～20min.
The laminate of the present invention, the single or double at least one above-mentioned prepreg is covered with metal forming, hot forming, obtains To described laminate.
Pressure condition during described laminate pressing is 5～35kg/cm2, pressing-in temp is 180～210 DEG C, pressing time It is 70～200min；The quantity of described prepreg is that the laminate thickness according to customer requirement determines, available one or more； Described metal forming, can be Copper Foil, it is also possible to be aluminium foil, and their thickness is not particularly limited.
Owing to technique scheme is used, the present invention compared with prior art has the advantage that
1, the present invention utilize phosphorous active ester compound as fire retardant, when it reacts with epoxy resin, not polarization Bigger hydroxyl, imparts the preferable dielectric properties of resin system, and the most phosphorous active ester compound humidity resistance is good, significantly carries The high wet-hot aging performance of resin system；
2, the glue homogeneity made by the halogen-free resin composition of the present invention is good, and the laminate base material made has Halogen Fire-retardant, excellent thermostability and low dielectric constant.
Accompanying drawing explanation
Fig. 1 be synthesis example one product nmr spectrum (13C)；
Fig. 2 be synthesis example one product nmr spectrum (1H)。
Detailed description of the invention
Below in conjunction with embodiment, the invention will be further described:
First carry out the synthesis of raw material.
Synthesis example one: the preparation of phosphorous active ester compound
Weigh 0.6mol 10-(2,5-dihydroxy phenyl)-10-hydrogen-9-oxa--10-phospho hetero phenanthrene-10-oxide with The hydroxy benzaldehyde of 0.6mol, adds the H of 65% mass concentration2SO4, condensing reflux 3～5hr under 100 DEG C of heating conditions, then This mixture is washed by 4～6 alcohol, obtains pre-product；Above-mentioned gained pre-product is dissolved in toluene solution, adds 0.2mol Benzoic acid, under the temperature conditions of 120 DEG C, adds the catalyst (AlCl of 0.05mol3), condensing reflux 4hr, it is then passed through number After secondary washing, under the vacuum condition of 105 DEG C, being dried 4hr, i.e. obtain required phosphorous active ester compound, esterification yield is 70 ～80%, phosphorus content is the phosphorous active ester compound of 6.4%, is designated as C1, and concrete structure is as follows:
X=, Y=H, Z=, R is phenyl, R1=CH3, n be 3～ 5。
The nmr spectrum of above-mentioned product (13C) as it is shown in figure 1, at 165ppm peak position relatively strong, show in resin containing tool Activated ester composition, nmr spectrum (1H) as in figure 2 it is shown, 7-8ppm is mainly on phenyl ring corresponding peak position, 3- 4ppm is mainly DOPO and CH2The peak position of the correspondence that is connected, this synthesis compound described above meets phosphorous active ester compound Architectural feature.
The preparation 2 of phosphorous active ester compound:
Weigh the 9,10-dihydro-9-oxy miscellaneous-10-phospho hetero phenanthrene-10-oxide of 0.6mol and the para hydroxybenzene first of 0.6mol Aldehyde, adds the H of 65% mass concentration2SO4, condensing reflux 3～5hr under 105 DEG C of heating conditions, then by this mixture by 4～8 Secondary alcohol is washed, and obtains pre-product；Above-mentioned gained pre-product is dissolved in toluene solution, adds 0.2mol benzoic acid, the temperature of 120 DEG C Under the conditions of degree, add the catalyst (AlCl of 0.05mol3), condensing reflux 4hr, after being then passed through washing for several times, at 105 DEG C Under vacuum condition, being dried 4hr, i.e. obtain required phosphorous active ester compound, esterification yield is 75～85%, and phosphorus content is 7.2% Phosphorous active ester compound, be designated as C2, concrete structure is as follows:
X=, Y=H, Z=, R is phenyl, R1=CH3, n is 3 ~ 5.
Embodiment:
According to weight ratio shown in table 1 by benzoxazine resin, epoxy resin, phosphorous active ester compound, firming agent, solidification Accelerator and inorganic filler and solvent join in mixed glue still, and controlling glue solids content is 65%, stirs, and ripening 8h, Make resin combination composition glue liquid；Then glass cloth is immersed in above-mentioned resin combination composition glue liquid；Then by the glass after dipping Cloth forms prepreg after 160 DEG C of baking 5min；After prepreg is cut to certain size, 8 prepreg superpositions are formed folded Structure, respectively places an electrolytic copper foil at folded structure, sends into pressing in vacuum press, and program is 150 DEG C/60min+200 DEG C/ 120min, prepares laminate.
Comparative example
According to weight ratio shown in table 1 by benzoxazine resin, epoxy resin, phosphonium flame retardant, firming agent, curing accelerator And inorganic filler and solvent join in mixed glue still, controlling glue solids content is 65%, stirs, and ripening 8h, makes tree Oil/fat composition glue；Then glass cloth is immersed in above-mentioned resin combination composition glue liquid；Then by the glass cloth after dipping through 160 DEG C baking 5min after formed prepreg；After prepreg is cut to certain size, 8 prepreg superpositions are formed folded structure, at folded structure Respectively placing an electrolytic copper foil, send into pressing in vacuum press, program is 150 DEG C/60min+200 DEG C/120min, prepares Laminate.
Table 1 halogen-free resin composition formula
Note: A represents epoxy resin, A1: biphenyl type epoxy resin, A2: dicyclopentadiene type epoxy resin；
B represents benzoxazine resin, B1: bisphenol A-type benzoxazine resin, B2: bisphenol-f type benzoxazine resin；
C represents phosphorous active ester compound, sees synthesis example one；
D represents firming agent, linear phenolic resin, holy well chemical industry, PF8020；
E represents existing phosphonium flame retardant, E1: phosphorous epoxy resin, CHIN YEE, DPE 325, phosphorus content be 3.4%wt, E2: phosphorus containing phenolic resin, Dow 92741, phosphorus content is 9.4%wt, E3: phosphazene compound, and Huizhou flourishing age reaches scientific and technological limited public affairs Department, SPB 100, phosphorus content is 13.4%wt；
F represents curing accelerator, 2-methylimidazole.
G represents inorganic filler, silicon dioxide, particle diameter 0.5 ~ 5 μm.
The method of testing of laminate characteristic prepared by above-described embodiment and comparative example is as follows:
(1) glass transition temperature (Tg):
According to differential scanning calorimetry, it is measured according to the DSC method of IPC-TM-650 2.4.25 defined；
(2) peel strength (PS):
According to " after the thermal stress " experiment condition in IPC-TM-650 2.4.8 method, the stripping of test metallic cover layer is strong Degree；
(3) wicking thermostability:
Use the two sides band copper sample of 50 × 50mm, immerse in the scolding tin of 288 DEG C, the time of record sample layering bubble；
(4) wicking thermostability and water absorption rate after moist process:
By the substrate coupons of 3 pieces of 100 × 100mm 121 DEG C, keep 2hr in the pressure cooking processing means of 105Kpa after, Immersing 2min in the solder bath of 288 DEG C, observe whether sample occurs to be layered the phenomenons such as bubbling, 3 pieces all do not occur to be layered bubbling note Being 3/3,2 pieces does not occurs layering bubbling to be designated as 2/3, and 1 piece does not occurs to be layered bubbling and is designated as 1/3, and 0 piece does not occurs to be layered bubbling and is designated as 0/3；Meanwhile, weigh the quality done before and after humidity processes, calculate sheet material mass ratio of increase before and after processing, be water suction Rate；
(5) heat decomposition temperature Td:
It is measured according to IPC-TM-650 2.4.26 method；
(6) dielectric constant:
Use flat band method according to IPC-TM-650 2.5.5.9, measure the dielectric constant under 1GHz；
(7) dielectric loss angle tangent:
Use flat band method according to IPC-TM-650 2.5.5.9, measure the dielectric loss factor under 1GHz；
(8) drop impact toughness (laminate fragility):
Use Apparatus for Impacting at low-temp, Apparatus for Impacting at low-temp height of the fall 45cm, whereabouts weight weight 1kg；
The judge that toughness is good and bad: cross is clear, illustrates that the toughness of product is the best, represents with character ☆；Cross mould Stick with paste, illustrate that the poor toughness of product, fragility are big, represent with character ◎；The explanation between clear and fuzzy of cross readability Toughness of products is general, represents with character ◇；
(9) thermally stratified layer time T-300:
It is measured according to IPC-TM-650 2.4.24 method；
(10) thermal coefficient of expansion Z axis CTE(TMA):
It is measured according to IPC-TM-650 2.4.24 method；
(11) flame resistance (flame retardancy):
Measure according to UL94 method.
Table 2 is embodiment one to five and the test result of comparative example one to four laminate, as shown in data in table, in nothing Halogen resin combination introduces phosphorous active ester compound, can react with the epoxy resin in resin combination, can be as resin A part for firming agent in compositions；The laminate prepared by the halogen-free resin composition of the present invention has relatively low dielectric constant Value, relatively low water absorption rate, good mechanical performance and preferable wet-hot aging performance；Avoid phosphorous resin in prior art The existence of (such as phosphorous epoxy resin and phosphorus containing phenolic resin) and the water absorption rate that causes increases, humidity resistance declines, and dielectric is normal The problem that number is higher.
To sum up, the introducing of phosphorous active ester compound, halogen-free resin composition can be kept when meeting flame-retardancy requirements, have There are relatively low dielectric constant, relatively low water absorption rate, excellent humidity resistance and good mechanical performance.
Table 2 halogen-free resin composition formula

Claims (9)

1. a halogen-free resin composition, it is characterised in that: it is in terms of 100 parts by solid weight sum, including:
Benzoxazine resin 10-50 part
Epoxy resin 10-60 part
Phosphorous active ester compound 15-50 part
Firming agent 0-40 part
Curing accelerator 0-3 part；
The structural formula of described phosphorous active ester compound is,
,
In formula, R1 is methyl, ethyl or the tert-butyl group；
Y is H or CH3；
Z isOr, wherein R is phenyl, naphthyl or C1～C5Alkyl；
N is 1；
X is:、、Or。
Halogen-free resin composition the most according to claim 1, it is characterised in that: described benzoxazine resin is bisphenol A-type Benzoxazine resin, bisphenol-f type benzoxazine resin, 4,4 '-MDA benzoxazine resin, diaminodiphenyl ether Benzoxazine resin, DADPS benzoxazine resin, pi-allyl bisphenol A benzoxazine resin one or more Mixture.
3. according to the halogen-free resin composition described in claim 1, it is characterised in that: described epoxy resin is selected from: bisphenol-A ring Epoxy resins, bisphenol F epoxy resin, o-cresol formaldehyde epoxy resin, bisphenol-A phenolic epoxy resin, phenol novolac epoxy resins, three officials Can phenol-type epoxy resin, tetraphenyl ethane epoxy resin, biphenyl type epoxy resin, naphthalene nucleus type epoxy resin, dicyclopentadiene type Epoxy resin, glycidyl amine type epoxy resin, one or more mixture of glycidyl ester type epoxy resin.
4. according to the halogen-free resin composition described in claim 1, it is characterised in that: in described phosphorous active ester compound, In mass, phosphorus content is 5.2～7.2%.
5. according to the halogen-free resin composition described in claim 1, it is characterised in that: described firming agent is dicyandiamide, line Property phenolic resin, maleic anhydride of styrene, 3,3 ', 4,4 '-oxydiphthalic, 2,3,3', 4'-diphenyl ether tetraformic two Acid anhydride, 3,3', 4,4'-bibenzene tetracarboxylic dianhydrides, 2,3,3', 4'-bibenzene tetracarboxylic dianhydride, 3,3 ', 4,4 '-benzophenone tetracid two Acid anhydride, Bisphenol A Type Diether Dianhydride, one or more the mixing in 1,2,4,5-pyromellitic acid dianhydride and DADPS Thing.
6. according to the halogen-free resin composition described in claim 1, it is characterised in that: described curing accelerator is selected from 2-first One or more mixing in base imidazoles, 2-ethyl-4-methylimidazole and 2-phenylimidazole or triphenyl phosphorus compound Thing.
7. according to the halogen-free resin composition described in claim 1, it is characterised in that: described resin combination is possibly together with inorganic Filler, the consumption of described inorganic filler is the 0～35% of halogen-free resin composition solid gross mass；Described inorganic filler is hydrogen-oxygen Change aluminum, magnesium hydroxide, wollastonite, fine silica powder, magnesium oxide, calcium silicates, calcium carbonate, clay, Kaolin, glass dust, cloud One or more mixture in female powder, titanium dioxide, Firebrake ZB, zinc molybdate.
8. one kind uses the prepreg that halogen-free resin composition as claimed in claim 1 makes, it is characterised in that: right is wanted Ask the halogen-free resin composition solvent described in 1 to dissolve and make glue, then reinforcing material is immersed in above-mentioned glue；Will leaching Reinforcing material heat drying after stain, it is thus achieved that described prepreg.
9. one kind uses the laminate that halogen-free resin composition as claimed in claim 1 makes, it is characterised in that: at least one The single or double opening the prepreg obtained by claim 8 is covered with metal forming, hot forming, obtains described laminate.
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CN104761870A (en) * 2015-04-03 2015-07-08 广东汕头超声电子股份有限公司覆铜板厂 Halogen-free low-dielectric-loss epoxy resin composition and prepreg and laminated board prepared by using halogen-free low-dielectric-loss epoxy resin composition
CN109071918B (en) * 2016-04-28 2022-04-15 Jxtg能源株式会社 Composition for curing resin and cured product thereof
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TW201904929A (en) * 2017-06-28 2019-02-01 日商迪愛生股份有限公司 Active ester composition and semiconductor sealing material
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