CN106239701A - A kind of thermal sensitive ceramics substrate forming method - Google Patents
A kind of thermal sensitive ceramics substrate forming method Download PDFInfo
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- CN106239701A CN106239701A CN201610593897.2A CN201610593897A CN106239701A CN 106239701 A CN106239701 A CN 106239701A CN 201610593897 A CN201610593897 A CN 201610593897A CN 106239701 A CN106239701 A CN 106239701A
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- substrate
- thermal sensitive
- groove
- sensitive ceramics
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B3/00—Producing shaped articles from the material by using presses; Presses specially adapted therefor
- B28B3/02—Producing shaped articles from the material by using presses; Presses specially adapted therefor wherein a ram exerts pressure on the material in a moulding space; Ram heads of special form
- B28B3/021—Ram heads of special form
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B3/00—Producing shaped articles from the material by using presses; Presses specially adapted therefor
- B28B3/02—Producing shaped articles from the material by using presses; Presses specially adapted therefor wherein a ram exerts pressure on the material in a moulding space; Ram heads of special form
- B28B3/08—Producing shaped articles from the material by using presses; Presses specially adapted therefor wherein a ram exerts pressure on the material in a moulding space; Ram heads of special form with two or more rams per mould
- B28B3/086—The rams working in different directions
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/64—Burning or sintering processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/30—Apparatus or processes specially adapted for manufacturing resistors adapted for baking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Compositions Of Oxide Ceramics (AREA)
Abstract
The present invention relates to a kind of thermal sensitive ceramics substrate forming method, by designing the upper and lower mould surface configuration of dry pressing molding mould, make molding meron surface present latticed, thus reduce the contact area between substrate；Latticed for substrate wearing into is met the substrate that the smooth surface of customer demand is smooth again by abrasive disc operation.This manufacture method not only reduces substrate bonding rate in firing process, and zirconium powder consumption reduces, and final production cost reduces.
Description
Technical field
The invention belongs to thermal sensitive ceramics substrate and manufacture field, be applied to heat particularly to a kind of latticed substrate moulding process
Quick pottery manufactures.
Background technology
Sensitive ceramic resistor is a kind of to temperature or the element of current sense.Thermo-sensitive material is varied with temperature by resistivity
Rule can be divided into: positive temperature coefficient (being called for short PTC) thermistor material and negative temperature coefficient (being called for short NTC) thermistor material.
NTC sensitive ceramic resistor material is widely used in temperature-compensating, temperature test, prevents the fields such as power-on surge current, and PTC is warm
Quick ceramic resistor material has the functions such as constant temperature heating, temperature sensing, overcurrent protection, and two kinds of thermal sensitive ceramicses are all widely used in electricity
In son industry and daily life.For thermal sensitive ceramics sheet manufacturing process, general raw material after a ball milling pre-synthesis, then two
Secondary ball milling slurry mist projection granulating, the substrate of the most dry-pressing formed one-tenth surfacing, has padded zirconia powder and has cut off substrate loading oxidation
Aluminum saggar, burns till through high temperature, the technique such as abrasive disc, upper electrode is fabricated by.
At present, PTC thermal sensitive ceramics industry all uses liquid-phase sintering mode to produce, and which can reduce burns till temperature
Degree, saves production cost, and can also reduce lead volatility for leaded PTC-ceramic, reduce environmental pollution.But, producing
Cheng Zhong, owing to substrate is more containing sintering aid, and along with the rising of firing temperature, will make the high temp glass phase of PTC-ceramic
Increase, cause substrate bonding phenomenon relatively to increase.Mode even with Zirconium powder isolation substrate sinters, and also has 1 ~ 2%
Left and right substrate generation bonding die and cause waste product, the highest, such economic loss can not be despised.And zirconia powder disappears
Consumption is relatively big, and price is relatively costly, causes commercial production cost bigger.Temperature-sensitive for existing high standard, high efficiency, low cost is made pottery
For porcelain industry, it is necessary to reduce bonding phenomenon between substrate, improve yield rate, reduce zirconium powder utilization rate simultaneously, thus save life
Produce cost.
Summary of the invention
The present invention is directed to above-mentioned deficiency, it is provided that a kind of thermal sensitive ceramics substrate forming method, the method has higher finished product
Rate, zirconium powder utilization rate is reduced, and is substantially reduced production cost.
For realizing the object of the invention, it is provided that techniques below scheme: a kind of thermal sensitive ceramics substrate forming method, its feature exists
In comprising the following steps:
(1) molding of thermal sensitive ceramics substrate: using mould dry-pressing formed, use upper and lower mould Bidirectional-pressure, upper/lower die is relative
Motion, by controlling pressure, becomes latticed substrate by powder pressing, the Surface Machining of described upper and lower mould have at least 2 laterally, perpendicular
To and the surface of groove that cross section is V-type or upper and lower mould is uniformly laid with circle and cross section is the groove of V-type, by thermal sensitive ceramics base
Sheet is pressed into equally distributed latticed or circular protrusions；
(2) the heap sheet of thermal sensitive ceramics substrate: need the latticed substrate stack of sintering to be positioned in aluminium oxide saggar, only in oxidation
It is lined with a zirconia powder thin layer bottom aluminum saggar, between substrate, does not spread zirconia powder；
(3) abrasive disc of thermal sensitive ceramics substrate: the ceramic substrate after burning till, utilizes grinding machine that substrate surface is worn into smooth shape.
As preferably, cross section be the groove of V-type be linear type or shaped form or circle, thus constitute is latticed for small
Regular quadrilateral or irregular quadrilateral or circle.
As preferably, horizontal, the groove that vertical and cross section is V-type on dry pressing die set upper and lower mould surface or the cross section of circle are
The size of the groove of V-type and thermal sensitive ceramics substrate surface be latticed or circular protrusions size one_to_one corresponding.
As preferably, cross section be the groove width of the groove of V-type be 0.05 ~ 0.06mm, groove depth is 0.10 ~ 0.15mm.
The method have the benefit that the present invention, by designing the upper and lower mould surface configuration of dry pressing molding mould, makes base after molding
Sheet surface presents latticed or circular protrusions, thus reduces the contact area between substrate；Abrasive disc operation again by latticed for substrate or
Circular protrusions is worn into and is met the substrate that the smooth surface of customer demand is smooth.This manufacture method not only reduces substrate in firing process
Bonding rate, and zirconium powder consumption reduces, and final production cost is greatly reduced.
Accompanying drawing explanation
Fig. 1 is dry pressing die set upper and lower mould surface mesh trellis V-groove structural representation.
Fig. 2 is dry pressing die set upper and lower mould surface circular V-groove structural representation.
Fig. 3 is the substrate shape schematic diagram after the molding of Fig. 1.
Fig. 4 is the substrate shape schematic diagram after the molding of Fig. 2.
Fig. 5 is the substrate shape schematic diagram after abrasive disc.
Reference: L1, L2 are respectively length and the width on upper and lower mould surface；R is mould chamfering.
Detailed description of the invention
Embodiment 1: a kind of thermal sensitive ceramics substrate forming method, comprises the following steps: joined by PTC raw material good for pelletize
Rotary press charging aperture, dry-pressing formed through mould, Bidirectional-pressure.First design mould upper and lower mould surface: upper and lower mould surface is
Rectangle, size L1 be 27mm, L2 be 17mm, chamfering R is 0.5mm.Be evenly distributed with 3 laterally and cross section be the groove of V-type, 6
Bar is vertical and cross section is the groove of V-type, V-groove a size of groove width 0.05mm, groove depth 0.1mm, by upper and lower mould surface uniformly etc.
It is divided into several micro rectangle.Utilize press upper and lower mould relative motion, control pressure, powder pressing is become latticed substrate.?
Make to be shaped to 3 horizontal raised line of anti-V-type eventually, 6 anti-V-types erect the latticed ceramic substrate that raised line is formed, it would be desirable to
The latticed stack of substrates of sintering is put in aluminium oxide saggar, uses very thin one layer of zirconia powder, substrate bottom this process saggar
Between do not spread zirconia powder.Ceramic network lattice sheet after burning till, utilizes grinding machine that substrate surface is worn into smooth shape.
Embodiment 2: a kind of thermal sensitive ceramics substrate forming method, comprises the following steps: joined by PTC raw material good for pelletize
Rotary press charging aperture, dry-pressing formed through mould, Bidirectional-pressure.First design mould upper and lower mould surface: upper and lower mould surface is
Rectangle, size L1 be 42mm, L2 be 15mm, chamfering R is 0.5mm.Be evenly distributed with 4 laterally and cross section be the groove of V-type, 8
Bar is vertical and cross section is the groove of V-type, cross section be the groove dimensions of V-type be groove width 0.06mm, groove depth 0.15mm, by upper and lower mould
Surface is uniformly divided into several micro rectangle.Utilize press upper and lower mould relative motion, control pressure, powder pressing is become grid
Shape substrate.Finally make to be shaped to 4 horizontal raised line of anti-V-type, 8 anti-V-types erect the latticed ceramic base that raised line is formed
Sheet, it would be desirable to the latticed stack of substrates of sintering is put in aluminium oxide saggar, uses very thin one layer of oxidation bottom this process saggar
Zirconium powder, does not spread zirconia powder between substrate.Ceramic network lattice sheet after burning till, utilizes grinding machine to be worn into by substrate surface smooth
Shape.
Embodiment 3: a kind of thermal sensitive ceramics substrate forming method, comprises the following steps: joined by PTC raw material good for pelletize
Rotary press charging aperture, dry-pressing formed through mould, Bidirectional-pressure.First design mould upper and lower mould surface: upper and lower mould surface is
Rectangle, size L1 be 28mm, L2 be 15mm, chamfering R is 0.5mm.Laterally uniform 3 circles and groove that cross section is V-type,
Vertical 6 circles and cross section are the groove of V-type, cross section be the groove dimensions of V-type be groove width 0.05mm, groove depth 0.15mm, make,
Lower mold surface is evenly distributed with several small circles.Utilize press upper and lower mould relative motion, control pressure, powder pressing is become
Equally distributed horizontal 3 anti-V-type circular protrusions, the ceramic substrate of vertical 6 anti-V-type circular protrusions, it would be desirable to the circle of sintering
Shape convex shape stack of substrates is put in aluminium oxide saggar, uses very thin one layer of zirconia powder, between substrate bottom this process saggar
Do not spread zirconia powder.Circular protrusions shape ceramic substrate after burning till, utilizes grinding machine that substrate surface is worn into smooth shape.
Above-described is only the preferred embodiments of the invention, it is noted that for a person skilled in the art,
On the premise of without departing from the framework of this art inventions, it is also possible to make some deformation and improvement, these also should be considered as this
Bright protection domain, these do not affect effect and the practical applicability that the present invention implements.
Claims (4)
1. a thermal sensitive ceramics substrate forming method, it is characterised in that comprise the following steps:
(1) molding of thermal sensitive ceramics substrate: using mould dry-pressing formed, use upper and lower mould Bidirectional-pressure, upper/lower die is relative
Motion, by controlling pressure, becomes latticed substrate by powder pressing, the Surface Machining of described upper and lower mould have at least 2 laterally, perpendicular
To and the surface of groove that cross section is V-type or upper and lower mould is uniformly laid with circle and cross section is the groove of V-type, by thermal sensitive ceramics base
Sheet is pressed into equally distributed latticed or circular protrusions；
(2) the heap sheet of thermal sensitive ceramics substrate: need the latticed substrate stack of sintering to be positioned in aluminium oxide saggar, only in oxidation
It is lined with a zirconia powder thin layer bottom aluminum saggar, between substrate, does not spread zirconia powder；
(3) abrasive disc of thermal sensitive ceramics substrate: the ceramic substrate after burning till, utilizes grinding machine that substrate surface is worn into smooth shape.
A kind of thermal sensitive ceramics substrate forming method the most according to claim 1, it is characterised in that cross section is that the groove of V-type is
Linear type or shaped form or circle, thus constitute is latticed for small regular quadrilateral or irregular quadrilateral or circle.
A kind of thermal sensitive ceramics substrate forming method the most according to claim 1, it is characterised in that dry pressing die set upper and lower mould table
Face horizontal, vertical, cross section is size and the thermal sensitive ceramics substrate surface grid of the groove that cross section is V-type of the groove of V-type or circle
Shape or circular protrusions size one_to_one corresponding.
A kind of thermal sensitive ceramics substrate forming method the most according to claim 1, it is characterised in that cross section is the groove of V-type
Groove width is 0.05 ~ 0.06mm, and groove depth is 0.10 ~ 0.15mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610593897.2A CN106239701B (en) | 2016-07-26 | 2016-07-26 | A kind of thermal sensitive ceramics substrate forming method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610593897.2A CN106239701B (en) | 2016-07-26 | 2016-07-26 | A kind of thermal sensitive ceramics substrate forming method |
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| Publication Number | Publication Date |
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| CN106239701A true CN106239701A (en) | 2016-12-21 |
| CN106239701B CN106239701B (en) | 2018-10-09 |
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| CN201610593897.2A Active CN106239701B (en) | 2016-07-26 | 2016-07-26 | A kind of thermal sensitive ceramics substrate forming method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108627080A (en) * | 2017-03-20 | 2018-10-09 | 上海敏传智能科技有限公司 | A kind of strain transducer and strain transducer composite material of included temperature compensation function |
| CN113317564A (en) * | 2021-06-15 | 2021-08-31 | 深圳波顿香料有限公司 | Preparation method of ceramic atomization assembly, atomization assembly and electronic cigarette |
| CN113880574A (en) * | 2021-10-26 | 2022-01-04 | 海鹰企业集团有限责任公司 | PZT-5 type ceramic wafer stacking and sintering method |
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| JPH06246719A (en) * | 1993-02-25 | 1994-09-06 | Marcon Electron Co Ltd | Laminate press bonding of ceramic green sheet |
| JPH07315954A (en) * | 1994-05-23 | 1995-12-05 | Natl House Ind Co Ltd | Production of porous ceramic board and device therefor |
| CN102798653A (en) * | 2012-08-16 | 2012-11-28 | 宁波大学 | Automobile sheet-structured oxygen sensor and its preparation method |
| CN104888269A (en) * | 2015-05-05 | 2015-09-09 | 上海大学 | Method for increasing interface bonding force of HA/ZrO2 layered composite biological ceramic material |
-
2016
- 2016-07-26 CN CN201610593897.2A patent/CN106239701B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06246719A (en) * | 1993-02-25 | 1994-09-06 | Marcon Electron Co Ltd | Laminate press bonding of ceramic green sheet |
| JPH07315954A (en) * | 1994-05-23 | 1995-12-05 | Natl House Ind Co Ltd | Production of porous ceramic board and device therefor |
| CN102798653A (en) * | 2012-08-16 | 2012-11-28 | 宁波大学 | Automobile sheet-structured oxygen sensor and its preparation method |
| CN104888269A (en) * | 2015-05-05 | 2015-09-09 | 上海大学 | Method for increasing interface bonding force of HA/ZrO2 layered composite biological ceramic material |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108627080A (en) * | 2017-03-20 | 2018-10-09 | 上海敏传智能科技有限公司 | A kind of strain transducer and strain transducer composite material of included temperature compensation function |
| CN113317564A (en) * | 2021-06-15 | 2021-08-31 | 深圳波顿香料有限公司 | Preparation method of ceramic atomization assembly, atomization assembly and electronic cigarette |
| CN113880574A (en) * | 2021-10-26 | 2022-01-04 | 海鹰企业集团有限责任公司 | PZT-5 type ceramic wafer stacking and sintering method |
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| Publication number | Publication date |
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| CN106239701B (en) | 2018-10-09 |
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| CB02 | Change of applicant information |
Inventor after: Pu Yida Inventor after: Xu Xiaojing Inventor after: Zuo Zhenguo Inventor after: Shen Anjun Inventor before: Pu Yida Inventor before: Zuo Zhenguo |
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| CB03 | Change of inventor or designer information | ||
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| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
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