JPH06246719A - Laminate press bonding of ceramic green sheet - Google Patents

Abstract

PURPOSE:To provide a laminated ceramic electronic part not generating the deterioration of characteristics and the lowering of yield by forming a laminate free from the rupture or lamination shift of ceramic green sheets. CONSTITUTION:When the ceramic green sheet 5 held on a carrier film 4 and the ceramic green sheet 11 held on a carrier film 9 and having internal electrodes 10 formed thereto are stacked in a press mold in a mutual contact state to be bonded under pressure, an upper mold 8 having a metal mesh 7 attached to the surface coming into contact with the carrier film 4 or 9 thereof is lowered to be brought into contact with the carrier film 4 or 9 to bond the green sheets under pressure. Thereafter, the upper mold 8 is raised to a prescribed position and, next, operation peeling the carrier film 4 or 9 from the ceramic green sheet 5 or 11 is repeated over the number of times corresponding to the lamination number of green sheets.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for laminating and crimping a ceramic green sheet, which is an improved technique for laminating and crimping a ceramic green sheet in the process of manufacturing a laminated ceramic electronic component.

[0002]

2. Description of the Related Art Generally, as a means for forming a laminated body of a laminated ceramic electronic component such as a laminated ceramic capacitor, a laminated ceramic varistor and a laminated piezoelectric element, a green sheet having a predetermined thickness as an outermost package and an element functional portion are formed. A predetermined number of green sheets printed with internal electrodes are laminated and pressure-bonded, and a press die is used as a lamination pressure-bonding means, and a predetermined temperature and pressure are applied onto the green sheets,
The step of pressing the green sheets together is repeated to form a predetermined number of laminated bodies.

That is, a ceramic green sheet held by a carrier film (a simple ceramic green sheet as an outermost package and a ceramic green sheet on which internal electrodes are formed) is appropriately placed on a plate constituting a lower die of a press die. The ceramic green sheets are stacked one by one in a state of being in contact with each other, and the heated upper mold forming the press mold is lowered to be brought into contact with the carrier film holding the stacked ceramic green sheets, The ceramic green sheets that have been in contact with each other are heated and pressed for a predetermined period of time to be brought into close contact with each other, and then the upper die is raised to a predetermined position, and then the carrier film is peeled from the ceramic green sheets. It is repeated as many times as possible.

In the above-mentioned lamination pressure bonding technique, however, a carrier film holding the ceramic green sheets for the purpose of bringing the ceramic green sheets into close contact with each other with a uniform pressure and applying a pressure without stacking deviation. The surface of the upper mold to be brought into contact with this carrier film is finished to have a very high smoothness.

Therefore, since the contact surface between the carrier film and the upper mold is in a vacuum state during pressure bonding, it is difficult for the upper mold and the carrier film to be smoothly peeled off in the process of raising the upper mold to a predetermined position. When the upper mold rises, the ceramic green sheet is also pulled through the carrier film,
As a result, the ceramic green sheets are torn or misaligned, resulting in a decrease in yield as well as a factor that causes characteristic deterioration of the laminated ceramic electronic component.

[0006]

As described above, in the above-mentioned prior art, it is difficult to efficiently peel the carrier film without damaging the ceramic green sheets in the process of laminating the ceramic green sheets, resulting in the lamination. This is a factor that leads to deterioration of the characteristics of ceramic electronic components and a decrease in yield.

The present invention has been made to solve the above-mentioned problems, and an object thereof is to facilitate peeling of a carrier film when laminating and pressing ceramic green sheets, and to prevent the ceramic green sheets from being torn or displaced. Prevent,
It is an object of the present invention to provide a method for laminating and pressing a ceramic green sheet to obtain a laminated ceramic electronic component which is free from characteristic deterioration and has a stable yield.

[0008]

A method for laminating and pressing a ceramic green sheet according to the present invention comprises a ceramic green sheet which is held by a carrier film to have a predetermined thickness,
And a ceramic green sheet laminated and pressure-bonded by pressing and heating a predetermined number of ceramic green sheets which are held by a carrier film and have internal electrodes formed on the surface thereof, in the pressure-bonding method of ceramic green sheets, wherein the press die is in contact with the carrier film. It is characterized in that a mesh is attached to the surface.

[0009]

With the above structure, when the ceramic green sheets are laminated and pressure-bonded, the mesh between the upper mold and the carrier film is provided by the mesh of the mesh attached to the surface of the upper mold that comes into contact with the carrier film holding the ceramic green sheets. A space is created in the upper mold so that the upper mold surface and the carrier film are not completely adhered to each other.Therefore, the upper mold and the carrier film are smoothly peeled off in the process of raising the upper mold to its original position after heating and pressure bonding. The carrier film is also lifted following the rise of the upper die, which greatly contributes to eliminating the risk of damaging the ceramic green sheet.

[0010]

Embodiments of the present invention will be described below with reference to the drawings.

That is, as shown in FIG. 1, on the plate 3 constituting the lower mold 2 of the press mold 1, for example, as shown in FIG. 2, the outermost ceramic green is held by the carrier film 4. The sheet 5 is placed, and the upper die 8 having the metal mesh 7 attached to the surface, which is heated by, for example, a heater 6 which constitutes the press die 1, is lowered to come into contact with the carrier film 4 and press it. Then, the upper die 8 is raised to peel the carrier film 4 from the ceramic green sheet 5.

Next, the ceramic green sheet 5
Then, for example, as shown in FIG. 3, the ceramic green sheets 11 which are held by the carrier film 9 and on which the internal electrodes 10 are formed are stacked by bringing the surfaces of the ceramic green sheets 11 into contact with each other. 9, the upper mold 8 is lowered and brought into contact with and pressed, then the upper mold 8 is raised to a predetermined position in the same manner as described above, and then the ceramic green sheet 11 is pressed.
The operation of peeling the carrier film 9 from the substrate is repeated a number of times according to the number of laminated ceramic green sheets 11,
Finally, the ceramic green sheet 5 held by the carrier film 4 is arranged and pressure-bonded in the same manner as described above, and as a result, the ceramic green sheet 5 and the ceramic green sheet 1 which are contacted by heating and pressurizing for a predetermined time.
1 or the ceramic green sheets 11 are brought into close contact with each other to obtain a ceramic laminated body (not shown).

According to the method for laminating and pressing the ceramic green sheets having the above structure, the carrier film 4 holding the ceramic green sheet 5 or the carrier film 9 holding the ceramic green sheet 11 is formed.
Since the metal mesh 7 is attached to the surface of the upper die 8 that comes into contact with the mesh 7, the mesh 7 is placed on the carrier film 4.
The surface of the carrier film 4 becomes a mesh shape in a state where the parts are in contact with each other, and a plurality of fine spaces are formed between the upper mold 8 and the carrier film 4 or the carrier film 9, and the carrier film 4 or 9 and the upper mold 8 are Adhesion can be prevented, and when the upper die 8 is raised, the upper die 8 and the carrier film 4
Or 9 is peeled off smoothly, and the carrier film 4 or 9 is not lifted following the rise of the upper mold 8, and the ceramic green sheet 5 or the ceramic green sheet 11 is removed.
The risk of breakage and stacking deviation is eliminated, a desired laminate can be formed, and it is possible to obtain an excellent effect that can greatly contribute to elimination of characteristic deterioration and yield reduction of laminated ceramic electronic components.

Although the metal mesh is used as the mesh in the above embodiment, the present invention is not limited to this, and the same effect can be obtained even if the material is made of other material such as resin or ceramic. be able to.

[0015]

According to the present invention, when the ceramic green sheets are laminated and pressure-bonded, it is possible to perform the laminated pressure-bonding without tearing of the ceramic green sheets and misalignment of the layers. It is possible to obtain a method of laminating and crimping ceramic green sheets having a high biological value.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of a method for laminating and pressing a ceramic green sheet according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a ceramic green sheet according to an embodiment of the present invention.

FIG. 3 is a perspective view showing a ceramic green sheet having a configuration different from that of FIG. 2 according to an embodiment of the present invention.

[Explanation of symbols]

 1 Press Mold 2 Lower Mold 3 Plate 4 Carrier Film 5 Ceramic Green Sheet 6 Heater 7 Metal Mesh 8 Upper Mold 9 Carrier Film 10 Internal Electrode 11 Ceramic Green Sheet

Claims (1)

[Claims] 1. A ceramic green sheet held by a carrier film and having a predetermined thickness, and a predetermined number of ceramic green sheets held by a carrier film and having internal electrodes formed on the surface thereof are heated and pressed by a press die to be laminated. A method for laminating and crimping a ceramic green sheet, which comprises performing a method of laminating and crimping a ceramic green sheet to be crimped by attaching a mesh to the surface of the press die in contact with the carrier film.